JPH07223090A - Brazing filler metal for joining aluminum alloy with copper, and composite material joined thereby - Google Patents
Brazing filler metal for joining aluminum alloy with copper, and composite material joined therebyInfo
- Publication number
- JPH07223090A JPH07223090A JP6018538A JP1853894A JPH07223090A JP H07223090 A JPH07223090 A JP H07223090A JP 6018538 A JP6018538 A JP 6018538A JP 1853894 A JP1853894 A JP 1853894A JP H07223090 A JPH07223090 A JP H07223090A
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- Prior art keywords
- aluminum alloy
- copper
- brazing
- brazing material
- composite material
- Prior art date
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、アルミニウム合金と銅
を接合するのに好適なろう材と、このろう材によって接
合された複合材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a brazing material suitable for joining an aluminum alloy and copper, and a composite material joined by this brazing material.
【０００２】[0002]
【従来の技術】アルミニウム合金と銅を接合する手段と
して、以下に述べる従来例１〜４が知られている。 ［従来例１］ アルミニウム合金と銅をＰｂ−Ｓｎ系の
はんだ材によってろう付けする。その場合、アルミニウ
ム合金側に、Ｎｉめっき、ＣｕめっきなどのようにＰｂ
−Ｓｎ系のはんだに対する濡れ性を有する金属をめっき
し、その後、めっきされたアルミニウム合金と銅をはん
だ付けする。 ［従来例２］ 摩擦圧接、爆圧接着等のように機械的な
圧力によってアルミニウム合金と銅を接合する。 ［従来例３］ フラックスを用いてアルミニウム合金表
面の酸化膜を破壊して溶融金属に対する濡れ性を改善
し、Ａｌ−Ｚｎ系のはんだ材によってはんだ付けを行
う。 ［従来例４］ アルミニウム合金同志のろう付けに用い
られていた従来のＡｌ−Ｓｉ系フラックスレスろう付け
用ろう材によって、アルミニウム合金と銅をろう付けす
る。2. Description of the Related Art As a means for joining an aluminum alloy and copper, the following conventional examples 1 to 4 are known. [Conventional Example 1] An aluminum alloy and copper are brazed with a Pb-Sn based solder material. In that case, Pb on the aluminum alloy side such as Ni plating, Cu plating, etc.
-Plating a metal having wettability to Sn-based solder, and then soldering the plated aluminum alloy and copper. [Prior art example 2] Aluminum alloy and copper are joined by mechanical pressure such as friction welding and explosive adhesion. [Prior art example 3] The oxide film on the surface of the aluminum alloy is destroyed by using a flux to improve the wettability with respect to the molten metal, and soldering is performed with an Al-Zn based solder material. [Conventional Example 4] An aluminum alloy and copper are brazed by a conventional Al-Si-based fluxless brazing filler metal used for brazing aluminum alloys.
【０００３】[0003]
【発明が解決しようとする課題】上述した従来例１の場
合、アルミニウム合金にめっきを施す必要があるため工
程が複雑化し、ろう付けコストが高い。また、接合には
んだ（軟ろう）を用いるため、接合部の継手強度がアル
ミニウム合金および銅のいずれに対しても著しく劣る。In the case of the above-mentioned conventional example 1, since it is necessary to plate the aluminum alloy, the process is complicated and the brazing cost is high. Further, since solder (soft solder) is used for joining, the joint strength of the joint is significantly inferior to that of aluminum alloy and copper.
【０００４】従来例２の場合、大きな機械的圧力が必要
とされるため、被接合部材に変形がおこる。また、単一
方向の圧力を利用するために、任意の形状の接合体が得
られない。従来例３は、フラックスの塗布および除去を
行う必要がある。また、高価なフラックスを多量に使用
する必要がある。従来例４の場合は、６００℃程度以上
の高温でろう付けを行う必要があるが、このような高温
でろう付けを行うと、アルミニウム合金と銅との間に厚
さ数μｍ以上のアルミニウム−銅化合物層（Ａｌ−Ｃｕ
金属間化合物）が生成する。この化合物は、非常に脆性
であるため、実用に供し得る強靭な接合を得ることがで
きない。In the case of the conventional example 2, since a large mechanical pressure is required, the members to be joined are deformed. Moreover, since a pressure in a single direction is used, a bonded body having an arbitrary shape cannot be obtained. In Conventional Example 3, it is necessary to apply and remove the flux. In addition, it is necessary to use a large amount of expensive flux. In the case of Conventional Example 4, it is necessary to perform brazing at a high temperature of about 600 ° C. or higher, but when brazing is performed at such a high temperature, an aluminum alloy having a thickness of several μm or more is formed between the aluminum alloy and copper. Copper compound layer (Al-Cu
Intermetallic compound) is generated. Since this compound is very brittle, it is impossible to obtain a tough joint that can be put to practical use.
【０００５】従って本発明の目的は、アルミニウム合金
と銅のろう付けにおいて、アルミニウム合金にめっきを
施したりフラックスを用いることなく、任意の形状のア
ルミニウム合金および銅の部材を比較的低温で接合する
ことができ、継手強度の高いろう付けが可能なろう材
と、ろう付けされた複合材を提供することにある。Therefore, an object of the present invention is to braze an aluminum alloy and copper at a relatively low temperature without brazing the aluminum alloy or using a flux without brazing the aluminum alloy and copper. And a brazing material having high joint strength and capable of brazing, and a brazed composite material.
【０００６】[0006]
【課題を解決するための手段】上記の目的を果たすため
に開発された本発明のろう材は、Ａｌを主成分とするも
のであり、次の２系統の化学成分をもつ。第１のろう材
は、Ａｌ：３０〜８０wt％，添加成分としてＣｕ：１０
〜４０wt％，Ａｇ：１０〜４０wt％，Ｓｉ：０〜１０wt
％を含んでいる。このろう材に、必要に応じてＭｇ，Ｂ
ｉ，Ｚｎ，Ｍｎのうちの１種以上を合計で１５wt％以内
添加してもよい。The brazing material of the present invention, which was developed to achieve the above object, contains Al as a main component and has the following two chemical components. The first brazing filler metal is Al: 30 to 80 wt% and Cu: 10 as an additive component.
~ 40wt%, Ag: 10 ~ 40wt%, Si: 0 ~ 10wt%
% Is included. If necessary, Mg, B
One or more of i, Zn and Mn may be added within 15 wt% in total.
【０００７】第２のろう材は、Ａｌ：３０〜８０wt％，
添加成分としてＧｅ：１０〜４０wt％，Ａｇ：１０〜４
０wt％，Ｓｉ：０〜１０wt％を含んでいる。このろう材
に、必要に応じてＭｇ，Ｂｉ，Ｚｆ，Ｍｎのうちの１種
以上を合計で１５wt％以内添加してもよい。The second brazing filler metal is Al: 30-80 wt%,
As additive components, Ge: 10 to 40 wt%, Ag: 10 to 4
0 wt% and Si: 0 to 10 wt% are included. If necessary, one or more of Mg, Bi, Zf, and Mn may be added to the brazing material within a total of 15 wt%.
【０００８】上記第１のろう材または第２のろう材によ
ってアルミニウム合金部材と銅部材を接合することによ
り、アルミニウム合金と銅からなる複合材が得られる。
この明細書でいう銅部材は、工業用純銅（無酸素銅）の
ように実質的な純銅をはじめとして、例えばアルミナを
含有した銅やクロム銅などのように添加成分を含む銅合
金も含まれる。By joining the aluminum alloy member and the copper member with the first brazing material or the second brazing material, a composite material made of aluminum alloy and copper can be obtained.
The copper member referred to in this specification includes not only substantially pure copper such as industrial pure copper (oxygen-free copper) but also copper alloys containing additive components such as copper containing alumina and chromium copper. .
【０００９】[0009]
【作用】第１のろう材は、Ａｌ−Ｃｕ−Ａｇの３元共晶
反応の作用によって、５００℃程度までろう材の融点を
下げることができる。これにＳｉを添加することによっ
て、更に融点を下げることも可能である。この場合、５
２０℃〜４９０℃程度の比較的低温でろう付けを行うこ
とができる。添加成分としてのＣｕは入手が容易であ
り、コストも安い。The first brazing material can lower the melting point of the brazing material up to about 500 ° C. by the action of the ternary eutectic reaction of Al-Cu-Ag. The melting point can be further lowered by adding Si to this. In this case, 5
Brazing can be performed at a relatively low temperature of about 20 ° C to 490 ° C. Cu as an additive component is easily available and the cost is low.
【００１０】第２のろう材は、Ａｌ−Ｇｅ−Ａｇの３元
共晶反応の作用によって、４７０℃程度までろう材の融
点を下げることができる。これにＳｉを添加することに
よって、更に４００℃程度まで融点を下げることも可能
である。この場合、５００℃〜４５０℃程度の比較的低
温でろう付けを行うことができる。The second brazing material can lower the melting point of the brazing material up to about 470 ° C. by the action of the ternary eutectic reaction of Al-Ge-Ag. It is possible to further lower the melting point to about 400 ° C. by adding Si to this. In this case, brazing can be performed at a relatively low temperature of about 500 ° C to 450 ° C.
【００１１】いずれのろう材においても、５２０℃を越
えるあたりからアルミニウム合金と銅によるＡｌ−Ｃｕ
金属間化合物が生成されるようになる。特に、５４８℃
を越えると上記金属間化合物の生成が顕著になるため、
好ましくは５２０℃〜５００℃の温度域でろう付けを行
うとよい。更に好ましくは、５２０℃を越える直前の温
度でろう付けを行うと好結果が得られる。In any of the brazing filler metals, the aluminum alloy and the copper-based Al--Cu from around 520 ° C.
An intermetallic compound will be generated. Especially 548 ° C
If it exceeds, the formation of the intermetallic compound becomes remarkable,
Brazing is preferably performed in a temperature range of 520 ° C to 500 ° C. More preferably, good results can be obtained by brazing at a temperature immediately before 520 ° C.
【００１２】Ｃｕ，Ｇｅ，Ａｇは、いずれも、Ａｌに添
加することによってろう材の融点を下げる効果がある。
これらは単独で添加しても融点の降下幅は小さく、単独
の添加ではろう付け温度を５５０℃以上にする必要があ
り、その場合には金属間化合物の生成が著しくなるため
本発明の目的を果たすことができない。そこで、本発明
では、前述のＣｕ−ＡｇまたはＧｅ−Ａｇを組合わせて
添加することにより、融点を更に下げるようにしてい
る。Cu, Ge, and Ag all have the effect of lowering the melting point of the brazing filler metal when added to Al.
Even if they are added alone, the range of melting point drop is small, and it is necessary to raise the brazing temperature to 550 ° C. or more by adding them alone. I can't fulfill. Therefore, in the present invention, the melting point is further lowered by adding the above-mentioned Cu-Ag or Ge-Ag in combination.
【００１３】第１のろう材において、Ｃｕの添加量が１
０wt％未満では融点降下の程度が小さすぎてこの発明の
目的を達成できない。Ｃｕが４０wt％を越えると融点が
かえって上昇してしまう。第２のろう材において、Ｇｅ
の添加量が１０wt％未満では融点降下の程度が小さすぎ
てこの発明の目的を達成できない。Ｇｅが４０wt％を越
えると融点がかえって上昇してしまう。これらのろう材
において、Ａｇの含有量が１０wt％未満では融点降下の
程度が小さすぎてこの発明の目的を達成できない。Ａｇ
が４０wt％を越えると融点がかえって上昇してしまう。In the first brazing material, the addition amount of Cu is 1
If it is less than 0 wt%, the degree of melting point decrease is too small to achieve the object of the present invention. If Cu exceeds 40 wt%, the melting point rather rises. In the second brazing material, Ge
If the addition amount of is less than 10 wt%, the degree of melting point decrease is too small to achieve the object of the present invention. When Ge exceeds 40 wt%, the melting point rather rises. In these brazing materials, if the Ag content is less than 10 wt%, the degree of melting point decrease is too small to achieve the object of the present invention. Ag
If it exceeds 40 wt%, the melting point will rise rather.
【００１４】Ｓｉも融点を降下させるために添加する
が、Ｃｕ，Ｇｅ，Ａｇの添加量によっては、必要のない
場合がある。但し、Ｓｉを添加すると融点が降下するの
で、より、ろう付けが実施しやすくなる。本発明では被
接合部材の一方がアルミニウム合金であることから、ろ
う材の主成分はＡｌが望ましい。Ａｌの量は上記各添加
成分の残量であるが、３０〜８０wt％の範囲とする。更
に好ましいＡｌの範囲は、４０〜４９wt％である。Ａｌ
が３０wt％を下回ると、母材とろう材との主成分の違い
が大きすぎて継手強度が低下する原因になることがあ
る。Si is also added to lower the melting point, but it may not be necessary depending on the amounts of Cu, Ge and Ag added. However, when Si is added, the melting point is lowered, so that brazing becomes easier. In the present invention, since one of the members to be joined is an aluminum alloy, the main component of the brazing material is preferably Al. The amount of Al, which is the remaining amount of each of the above-mentioned added components, is in the range of 30 to 80 wt%. A more preferable range of Al is 40 to 49 wt%. Al
If less than 30 wt%, the difference in the main components between the base material and the brazing material is too large, which may cause a decrease in joint strength.
【００１５】ろう付けを行う場合には、ろうが母材に濡
れることと、ろうが流れることが必要である。しかし、
これらの性質にも適切な範囲があり、ろうが濡れすぎた
り流れすぎる場合には、母材を汚染したり、ろう付けし
たい部分にろうが適切に在留しないなどの問題を生じ
る。従って、母材の表面状況やろう付け条件、ろう付け
対象物の形状などによってろうの濡れ性と流動性を適宜
調整する必要がある。When brazing is performed, it is necessary that the wax be wet with the base material and that the wax flow. But,
These properties also have a proper range, and when the wax is too wet or flows too much, problems occur such as contaminating the base metal and not properly staying in the portion to be brazed. Therefore, it is necessary to properly adjust the wettability and fluidity of the brazing material depending on the surface condition of the base metal, brazing conditions, the shape of the brazing object, and the like.
【００１６】本発明のろう材にＭｇを添加した場合に
は、ろう付け時の真空中でのＭｇの揮発および揮発した
ＭｇによるＡｌ合金表面の酸化物の還元がおこるため、
フラックスを用いずにＡｌ合金表面の清浄化をおこさせ
ることができ、これによって、ろう材の濡れがおこる。
ろう付け時の雰囲気がＡｌの表面酸化膜を生じにくい場
合にはＭｇの添加量が０．１％程度でも効果があるが、
ろう付け条件によってはＭｇは数％程度必要である。但
し、Ｍｇを多量に添加することはろう付け炉の汚染につ
ながるため、Ｍｇの上限は５％までとする。When Mg is added to the brazing filler metal of the present invention, the vaporization of Mg in the vacuum during brazing and the reduction of the oxide on the Al alloy surface by the vaporized Mg occur.
The surface of the Al alloy can be cleaned without using the flux, which causes the wetting of the brazing material.
When the atmosphere during brazing is unlikely to produce an Al surface oxide film, even if the amount of Mg added is about 0.1%, it is effective.
Depending on the brazing conditions, Mg needs to be about several%. However, addition of a large amount of Mg leads to contamination of the brazing furnace, so the upper limit of Mg is limited to 5%.
【００１７】Ｂｉは、ろうの母材に対する濡れ性と流動
性を向上させる効果がある。Ｍｎはろうの流動性を抑制
する効果がある。Ａｌを主成分とするろうは一般に流動
性が良すぎることがあるため、ろう付け部の隙間にろう
が十分に残留しないことがある。この点を改善するのに
Ｍｎは効果がある。Ｚｎは蒸気圧が低いため蒸発しやす
く、ろう付け部の表面酸化膜を破壊する効果があること
から、ろうの濡れ性を改善する効果がある。このよう
に、添加可能元素であるＭｇ，Ｂｉ，Ｚｎ，Ｍｎをろう
付け雰囲気等に応じて適宜に組合わせるとよい。Bi has the effect of improving the wettability and fluidity of the base metal of the wax. Mn has the effect of suppressing the fluidity of the wax. In general, a braze containing Al as a main component may have too good fluidity, and thus the braze may not sufficiently remain in the gap of the brazing part. Mn is effective in improving this point. Since Zn has a low vapor pressure, it easily evaporates and has an effect of destroying the surface oxide film of the brazing portion, and therefore has an effect of improving the wettability of the brazing material. In this way, it is advisable to appropriately combine the addable elements Mg, Bi, Zn, and Mn according to the brazing atmosphere and the like.
【００１８】本発明のろう材は、アルミニウム合金表面
の酸化膜を破壊する効果をもたせることができ、これま
でフラックスの使用なしには困難であったＡ５０００系
あるいはＡ６０００系のアルミニウム合金と銅をフラッ
クスレスろう付けすることができる。The brazing material of the present invention can have an effect of destroying an oxide film on the surface of an aluminum alloy, and fluxes A5000 series or A6000 series aluminum alloy and copper which have been difficult until now without the use of flux. Less brazable.
【００１９】Ａ５０００系アルミニウム合金は、ＪＩＳ
Ｈ４０００に準拠する合金番号５００５〜５０８６の合
金であり、表１に掲げた化学成分からなる。Ａ５０００
系アルミニウム合金には一定量以上のＭｇが含まれてい
るため、従来のフラックスレスろう付け用Ａｌ−Ｓｉ系
ろう材ではろう付けが不可能であった。A5000 series aluminum alloy is JIS
It is an alloy of alloy number 5005 to 5086 based on H4000, and consists of the chemical components listed in Table 1. A5000
Since the aluminum-based alloy contains a certain amount or more of Mg, brazing cannot be performed with the conventional Al—Si brazing material for fluxless brazing.
【００２０】[0020]
【表１】 [Table 1]
【００２１】Ａ６０００系アルミニウム合金（合金番号
６０６１）の成分は、Ｓｉ：０．４〜０．８wt％，Ｆ
ｅ：０．７wt％以下，Ｃｕ：０．１５〜０．４wt％，Ｍ
ｎ：０．１５wt％以下，Ｍｇ：０．８〜１．２wt％，Ｃ
ｒ：０．０４〜０．３５wt％，Ｚｎ：０．２５wt％以
下，Ｔｉ：０．１５wt％以下，残部がＡｌである。The components of the A6000 series aluminum alloy (alloy number 6061) are Si: 0.4 to 0.8 wt%, F
e: 0.7 wt% or less, Cu: 0.15-0.4 wt%, M
n: 0.15 wt% or less, Mg: 0.8 to 1.2 wt%, C
r: 0.04 to 0.35 wt%, Zn: 0.25 wt% or less, Ti: 0.15 wt% or less, and the balance being Al.
【００２２】[0022]
【実施例】以下に本発明の実施例について説明する。図
１に示す複合材１０の試作品は、アルミニウム合金製の
部材１１と銅製の部材１２をろう付けによって接合した
ものである。ろう付けは次表２に示す化学成分のろう材
を用いて行い、各々について、ろう付け部１５の継手強
度（引張り強度）を調べた。アルミニウム合金部材１１
は、実用合金として多用されているＡ１０５０とＡ６０
６１の２種類を使用し、銅部材１２に工業用純銅（無酸
素銅）を使用した。ろう付け接合はいずれも１×１０-4
Torr台の真空中で、５２０℃、６０分間保持で行った。
ろう材の形態は箔であり、このろう材を部材１１，１２
の間に挟み、ろう付け炉に収容して前記温度まで加熱し
た。EXAMPLES Examples of the present invention will be described below. The prototype of the composite material 10 shown in FIG. 1 is a member 11 made of an aluminum alloy and a member 12 made of copper joined by brazing. Brazing was performed using a brazing material having the chemical composition shown in Table 2 below, and the joint strength (tensile strength) of the brazing part 15 was examined for each. Aluminum alloy member 11
Is A1050 and A60, which are widely used as practical alloys.
Two types of 61 were used, and the industrial pure copper (oxygen-free copper) was used for the copper member 12. 1 × 10 -4 for brazing
It was carried out at 520 ° C. for 60 minutes in vacuum on a Torr table.
The form of the brazing filler metal is foil, and this brazing filler metal is used for the members 11, 12
It was placed in a brazing furnace and heated to the above temperature.
【００２３】Ａ１０５０の化学成分は、ＪＩＳＨ４００
０に示されているように、Ｓｉ：０．２５wt％以下，Ｆ
ｅ：０．４０wt％以下，Ｃｕ：０．０５wt％以下，Ｍ
ｎ：０．０５wt％以下、Ｍｇ：０．０５wt％以下，Ｚ
ｎ：０．０５wt％以下，Ｔｉ：０．０３wt％以下，Ａ
ｌ：９９．５０wt％以上である。The chemical composition of A1050 is JIS 400.
0, Si: 0.25 wt% or less, F
e: 0.40 wt% or less, Cu: 0.05 wt% or less, M
n: 0.05 wt% or less, Mg: 0.05 wt% or less, Z
n: 0.05 wt% or less, Ti: 0.03 wt% or less, A
1: 99.50 wt% or more.
【００２４】[0024]
【表２】 [Table 2]
【００２５】例えば表２中のＮｏ．３のろう材によって
接合された複合材のろう付け部は、４ｋｇｆ／ｍｍ2
（３９ＭＰａ）程度の引張り強度を有しており、この継
手強度は、母材としてのアルミニウム合金（Ａ１０５
０）の降伏強度に匹敵する値である。For example, in Table 2 No. The brazing part of the composite material joined by the brazing material of No. 3 is 4 kgf / mm 2
It has a tensile strength of about (39 MPa), and this joint strength has an aluminum alloy (A105
It is a value comparable to the yield strength of 0).
【００２６】上記ろう材を使用したアルミニウム合金と
銅の接合は、例えば図２に示すようなコンピュータの電
源接続用ブスバー（ｂｕｓ ｂａｒ）２０において、端
子本体２１と電極板２２との接合に適用される。端子本
体２１には、軽量化を目的として、アルミニウム合金
（Ａ１０５０）を使用し、電極板２２には電源接続部の
接触抵抗を減らすために工業用純銅を使用した。端子本
体２１と電極板２２を、表２中のＮｏ．４のろう材によ
って接合した。ろう付け温度は５２０℃、ろう付け保持
時間は６０分である。ろう付け部２５の継手強度（引張
り強度）は、３８ＭＰａであった。なお本発明は、上記
実施例以外のアルミニウム合金部材と銅部材との接合に
も適用できる。The joining of aluminum alloy and copper using the above brazing material is applied to the joining of the terminal body 21 and the electrode plate 22 in the bus bar 20 for connecting the power source of the computer as shown in FIG. 2, for example. It Aluminum alloy (A1050) was used for the terminal body 21 for the purpose of weight reduction, and industrial pure copper was used for the electrode plate 22 in order to reduce the contact resistance of the power source connecting portion. The terminal main body 21 and the electrode plate 22 are referred to as No. 2 in Table 2. It was joined by the brazing material of No. 4. The brazing temperature is 520 ° C. and the brazing holding time is 60 minutes. The joint strength (tensile strength) of the brazed portion 25 was 38 MPa. The present invention can also be applied to joining an aluminum alloy member and a copper member other than those in the above embodiments.
【００２７】[0027]
【発明の効果】本発明によれば、５２０℃以下の低い温
度でアルミニウム合金と銅をろう付けすることができる
ため、接合界面に生じるＡｌ−Ｃｕ金属間化合物層がき
わめて少なく、実用に供し得る強靭なろう付け接合が得
られる。また本発明のろう材によれば、アルミニウム合
金表面に予めめっきを施すなどの前処理が不要であり、
フラックスを用いる必要もない。しかも本発明のろう材
によれば、摩擦圧接や爆圧接着等のように機械的な圧力
によって接合する場合に問題となる被接合部材の変形を
引き起こすおそれがなく、任意形状の部材を接合するこ
とができる。According to the present invention, the aluminum alloy and the copper can be brazed at a low temperature of 520 ° C. or less, so that the Al-Cu intermetallic compound layer formed at the joint interface is extremely small and can be put to practical use. A strong brazing joint is obtained. Further, according to the brazing material of the present invention, pretreatment such as pre-plating the aluminum alloy surface is unnecessary,
There is no need to use flux. Moreover, according to the brazing material of the present invention, there is no fear of causing deformation of the members to be joined, which is a problem when joining by mechanical pressure such as friction welding or explosive adhesion, and joining members of arbitrary shapes be able to.
【図１】本発明のろう材によって接合された複合材の試
作品の斜視図。FIG. 1 is a perspective view of a prototype of a composite material joined by a brazing material of the present invention.
【図２】本発明の一実施例を示す複合材の斜視図。FIG. 2 is a perspective view of a composite material showing an embodiment of the present invention.
１０…複合材 １１…アルミニウム合金部材 １２…銅部材 １５…ろう付け部 ２０…複合材（ブスバー） ２１…端子本体 ２２…電極板 ２５…ろう付け部 DESCRIPTION OF SYMBOLS 10 ... Composite material 11 ... Aluminum alloy member 12 ... Copper member 15 ... Brazing part 20 ... Composite material (bus bar) 21 ... Terminal main body 22 ... Electrode plate 25 ... Brazing part
Claims (6)
の含有量が３０〜８０wt％，添加成分としてＣｕ：１０
〜４０wt％，Ａｇ：１０〜４０wt％，Ｓｉ：０〜１０wt
％を含むことを特徴とするアルミニウム合金と銅の接合
用ろう材。1. A brazing material containing Al as a main component, which comprises Al
Content of 30-80 wt%, Cu: 10 as an additive component
~ 40wt%, Ag: 10 ~ 40wt%, Si: 0 ~ 10wt%
% Brazing material for joining aluminum alloy and copper.
のうちの１種以上を、合計で１５wt％以内添加した請求
項１記載のろう材。2. In addition to the above composition, Mg, Bi, Zn, Mn
The brazing material according to claim 1, wherein one or more of the above are added within 15 wt% in total.
の含有量が３０〜８０wt％，添加成分としてＧｅ：１０
〜４０wt％，Ａｇ：１０〜４０wt％，Ｓｉ：０〜１０wt
％を含むことを特徴とするアルミニウム合金と銅の接合
用ろう材。3. A brazing material containing Al as a main component, which comprises Al
Content of 30 to 80 wt%, Ge as an additive component: 10
~ 40wt%, Ag: 10 ~ 40wt%, Si: 0 ~ 10wt%
% Brazing material for joining aluminum alloy and copper.
のうちの１種以上を、合計で１５wt％以内添加した請求
項３記載のろう材。4. In addition to the above composition, Mg, Bi, Zn, Mn
The brazing material according to claim 3, wherein one or more of the above are added within 15 wt% in total.
３０〜８０wt％，Ｃｕ：１０〜４０wt％，Ａｇ：１０〜
４０wt％，Ｓｉ：０〜１０wt％を含むろう材によって接
合したことを特徴とするアルミニウム合金と銅からなる
複合材。5. An aluminum alloy member and a copper member are made of Al:
30-80 wt%, Cu: 10-40 wt%, Ag: 10-
A composite material composed of an aluminum alloy and copper, which is joined by a brazing material containing 40 wt% and Si: 0 to 10 wt%.
３０〜８０wt％，Ｇｅ：１０〜４０wt％，Ａｇ：１０〜
４０wt％，Ｓｉ：０〜１０wt％を含むろう材によって接
合したことを特徴とするアルミニウム合金と銅からなる
複合材。6. An aluminum alloy member and a copper member are made of Al:
30-80 wt%, Ge: 10-40 wt%, Ag: 10-
A composite material composed of an aluminum alloy and copper, which is joined by a brazing material containing 40 wt% and Si: 0 to 10 wt%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01853894A JP3398203B2 (en) | 1994-02-15 | 1994-02-15 | Aluminum alloy and copper brazing filler metal and composites joined by this brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01853894A JP3398203B2 (en) | 1994-02-15 | 1994-02-15 | Aluminum alloy and copper brazing filler metal and composites joined by this brazing filler metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH07223090A true JPH07223090A (en) | 1995-08-22 |
| JP3398203B2 JP3398203B2 (en) | 2003-04-21 |
Family
ID=11974409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01853894A Expired - Lifetime JP3398203B2 (en) | 1994-02-15 | 1994-02-15 | Aluminum alloy and copper brazing filler metal and composites joined by this brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3398203B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000252387A (en) * | 1999-03-04 | 2000-09-14 | Mitsubishi Electric Corp | Power semiconductor module, its manufacture and module substrate |
| WO2005014217A1 (en) * | 2003-08-07 | 2005-02-17 | Sumitomo Precision Products Co., Ltd. | Al-Cu JUNCTION STRUCTURE AND METHOD FOR MANUFACTURING SAME |
| CN101972902A (en) * | 2010-11-22 | 2011-02-16 | 山东电力研究院 | Aluminum alloy welding flux for copper and aluminum welding |
| CN103157862A (en) * | 2011-12-16 | 2013-06-19 | 株式会社电装 | Manufacturing method of heat exchanger, and heat exchanger manufactured by such manufacturing method |
| JP2013202616A (en) * | 2012-03-27 | 2013-10-07 | Sumitomo Metal Mining Co Ltd | Ge-Al-BASED SOLDER ALLOY CONTAINING Pb-FREE |
| WO2014162669A1 (en) * | 2013-04-05 | 2014-10-09 | 株式会社デンソー | Heat exchanger and production method therefor |
| CN106312363A (en) * | 2016-08-30 | 2017-01-11 | 北京有色金属与稀土应用研究所 | Al-Ag-Ge-Mg-Ti aluminum-based medium temperature vacuum brazing filler metal and preparation method thereof |
| CN108326472A (en) * | 2018-03-08 | 2018-07-27 | 合肥盛邦电器有限公司 | A kind of Cu-AL pipe mouth brush solder flux |
| CN114406518A (en) * | 2022-01-11 | 2022-04-29 | 西安理工大学 | Transition layer welding wire for preparing aluminum-steel composite structure, preparation method and arc surfacing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105364335A (en) * | 2015-12-15 | 2016-03-02 | 北京有色金属与稀土应用研究所 | Al-Ag-Cu-Mg aluminium base alloy-state brazing filler metal and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0332489A (en) * | 1989-06-28 | 1991-02-13 | Meidensha Corp | Production of brazing material |
| JPH0332488A (en) * | 1989-06-28 | 1991-02-13 | Meidensha Corp | Production of brazing material |
| JPH0332492A (en) * | 1989-06-28 | 1991-02-13 | Meidensha Corp | Brazing material and production thereof |
| JPH07214379A (en) * | 1994-01-27 | 1995-08-15 | Meidensha Corp | Production of brazing filler metal |
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1994
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0332489A (en) * | 1989-06-28 | 1991-02-13 | Meidensha Corp | Production of brazing material |
| JPH0332488A (en) * | 1989-06-28 | 1991-02-13 | Meidensha Corp | Production of brazing material |
| JPH0332492A (en) * | 1989-06-28 | 1991-02-13 | Meidensha Corp | Brazing material and production thereof |
| JPH07214379A (en) * | 1994-01-27 | 1995-08-15 | Meidensha Corp | Production of brazing filler metal |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000252387A (en) * | 1999-03-04 | 2000-09-14 | Mitsubishi Electric Corp | Power semiconductor module, its manufacture and module substrate |
| WO2005014217A1 (en) * | 2003-08-07 | 2005-02-17 | Sumitomo Precision Products Co., Ltd. | Al-Cu JUNCTION STRUCTURE AND METHOD FOR MANUFACTURING SAME |
| US6921583B2 (en) | 2003-08-07 | 2005-07-26 | Sumitomo Precision Products Co., Ltd. | Al-Cu bonded structure and method for making the same |
| CN101972902A (en) * | 2010-11-22 | 2011-02-16 | 山东电力研究院 | Aluminum alloy welding flux for copper and aluminum welding |
| CN103157862A (en) * | 2011-12-16 | 2013-06-19 | 株式会社电装 | Manufacturing method of heat exchanger, and heat exchanger manufactured by such manufacturing method |
| JP2013202616A (en) * | 2012-03-27 | 2013-10-07 | Sumitomo Metal Mining Co Ltd | Ge-Al-BASED SOLDER ALLOY CONTAINING Pb-FREE |
| WO2014162669A1 (en) * | 2013-04-05 | 2014-10-09 | 株式会社デンソー | Heat exchanger and production method therefor |
| JP2014202425A (en) * | 2013-04-05 | 2014-10-27 | 株式会社デンソー | Heat exchanger and heat exchanger manufacturing method |
| CN106312363A (en) * | 2016-08-30 | 2017-01-11 | 北京有色金属与稀土应用研究所 | Al-Ag-Ge-Mg-Ti aluminum-based medium temperature vacuum brazing filler metal and preparation method thereof |
| CN106312363B (en) * | 2016-08-30 | 2019-05-03 | 北京有色金属与稀土应用研究所 | A kind of Al-Cu-Ag-Ge-Mg-Ti aluminium base medium temperature vacuum brazing material and preparation method thereof |
| CN108326472A (en) * | 2018-03-08 | 2018-07-27 | 合肥盛邦电器有限公司 | A kind of Cu-AL pipe mouth brush solder flux |
| CN114406518A (en) * | 2022-01-11 | 2022-04-29 | 西安理工大学 | Transition layer welding wire for preparing aluminum-steel composite structure, preparation method and arc surfacing method |
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