CN1861824A - Non-pollution lower melting point alloy - Google Patents
Non-pollution lower melting point alloy Download PDFInfo
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- CN1861824A CN1861824A CN 200610087523 CN200610087523A CN1861824A CN 1861824 A CN1861824 A CN 1861824A CN 200610087523 CN200610087523 CN 200610087523 CN 200610087523 A CN200610087523 A CN 200610087523A CN 1861824 A CN1861824 A CN 1861824A
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Abstract
A no pollution and low melting point alloy relates to applying to protecting electric force, circuit and electron device against overloading, temperature response device of fire alarm and other safety precautions, the heat sink melting point alloy of super integrated circuit, and especially its melting point is lower than 70 deg.C and has no lead or cadmium. Its characteristic is the ingredient and ratio of the alloy, Bi is 24.8-29.8%, Sn is 4.3-14.7%, Ga is 0-10.2%, the others are In and inevitable substance, the content of impurity is lower than 0.2. The melting point of alloy is 46-70 deg.C. According to the research, some part of the low melting point alloy can be used as the heat sink materials in super integrated circuit.
Description
Technical field
Non-pollution lower melting point alloy; relate to the safety control facilities such as temperature sensing device of a kind of overload protection that is used for electric power, circuit and electronics, fire alarm and be lower than the environment-friendly low-melting point alloy of 70 ℃ and lead-free and cadmium-free as the fusing point alloy, particularly fusing point of the heat sink material of super large-scale integration.
Background technology
In electron trade, low melting point alloy is widely used in the overload protection of electric power, circuit and electronics, in the safety control facilities such as the temperature sensing device of fire alarm, is protection device security and personnel safety indispensable material.Yet, traditional low melting point alloy generally all contain poisonous and harmful elements such as lead, cadmium (as 96 ℃ of Rose metal fusing points, leaded 28%; 70 ℃ of martial virtue alloy melting points, leaded 25%, contain cadmium 12.5%), totally unfavorable to conservation of natural environment and human health.Along with country advocates the enforcement of the friendly type social policy of built environment and people to the enhancing of environmental protection consciousness, be badly in need of a kind of lead-free and cadmium-free, and the application of putting into production of the pollution-free alloy with better performance.
Along with the continuous development of electronic technology and the application of super large-scale integration, power density constantly strengthens with geometricprogression, and traditional radiating mode and heat sink material more and more can not satisfy the requirements of one's work that dispel the heat under this condition.In order to guarantee the works better of super large-scale integration, need a kind ofly possess good thermal conductivity, and be liquid novel heat sink material under working conditions.It is extremely important to research and develop the alloy material that satisfies technical development and environmental protection double requirements.
Summary of the invention
The objective of the invention is deficiency, the non-pollution lower melting point alloy that a kind of fusing point is low, free from environmental pollution, have better physicals is provided above-mentioned prior art existence.
The objective of the invention is to be achieved through the following technical solutions.
Non-pollution lower melting point alloy is characterized in that the weight percent of its alloy consists of: Bi:24.8%～29.8%, and Sn:4.3%～14.7%, Ga:0～10.2%, surplus is In and unavoidable impurities, wherein foreign matter content is less than 0.2.
Non-pollution lower melting point alloy of the present invention is characterized in that the weight percent of its alloy consists of: Bi:27%～28%, and Sn:9%～10%, surplus is In and unavoidable impurities, wherein foreign matter content is less than 0.2.
Non-pollution lower melting point alloy of the present invention is characterized in that the weight percent of its alloy consists of: Bi:26.5%～27.5%, and Sn:8.5%～9.5%, Ga:1.5%～2%, surplus is In and unavoidable impurities, wherein foreign matter content is less than 0.2.
Non-pollution lower melting point alloy of the present invention, the weight percent that it is characterized in that its alloy consists of: Bi:26.0%～27.0%, Sn:8.5%～9.5%, Ga:3.5%～4.5%, surplus is In and unavoidable impurities, and wherein foreign matter content is less than 0.2.
Non-pollution lower melting point alloy of the present invention, the weight percent that it is characterized in that its alloy consists of: Bi:24.5%～25.5%, Sn:13.5%～14.5%, Ga:7.5%～8.5%, surplus is In and unavoidable impurities, and wherein foreign matter content is less than 0.2.
A kind of non-pollution lower melting point alloy preparation process of the present invention is that the indium that will take by weighing places Stainless Steel Crucible, and heat fused on electric furnace under agitation adds bismuth, tin and gallium successively.Treat that added metal is all molten intact, continuing to stir is cast into ingot.Obtain alloy and a small amount of residue.The fusing point that records this alloy with melting point detector is 46 ℃～70 ℃.Up-to-date studies show that, part low melting point alloy of the present invention can be used for the heat sink material of super large-scale integration.
Embodiment
Non-pollution lower melting point alloy, the weight percent of its alloy consists of: Bi:24.8%～29.8%, Sn:4.3%～14.7%, Ga:0～10.2%, surplus is In and unavoidable impurities, wherein foreign matter content is less than 0.2.
The present invention is further described as follows below in conjunction with example.
Embodiment 1
(sensibility reciprocal 0.1g) takes by weighing the indium 65.0g that contains In99.99% with electronic balance, contains the bismuth 27.0g of Bi 〉=99.9%, contains the tin 7.0g of Sn 〉=99.9%, contains 〉=the gallium 1.0g of Ga99.99%.It is the Stainless Steel Crucible of 150ml that indium is placed volume, and heat fused on electric furnace under agitation adds bismuth, tin and gallium successively.Treat that added metal is all molten intact, be cast into ingot after the stirring.Obtain alloy 99g and a small amount of residue.Through chemical analysis gained alloy bismuth-containing 26.9%, stanniferous 6.8%, contain gallium 1.1%, surplus is an indium, other content of impurities is 0.1%.The fusing point that records this alloy with melting point detector is 68.5 ℃.
Embodiment 2
(sensibility reciprocal 0.1g) takes by weighing the indium 63.5g that contains In99.99% with electronic balance, contains the bismuth 30.0g of Bi 〉=99.9%, contains the tin 4.5g of Sn 〉=99.9%, contains 〉=the gallium 2.0g of Ga99.99%.It is the Stainless Steel Crucible of 150ml that indium is placed volume, and heat fused on electric furnace under agitation adds bismuth, tin and gallium successively.Treat that added metal is all molten intact, be cast into ingot after the stirring.Obtain alloy 98.8g and a small amount of residue.Through chemical analysis gained alloy bismuth-containing 29.8%, stanniferous 4.3%, contain gallium 2.1%, surplus is an indium, other content of impurities is 0.12%.The fusing point that records this alloy with melting point detector is 68.0 ℃.
Embodiment 3
(sensibility reciprocal 0.1g) takes by weighing the indium 62.0g that contains In99.99% with electronic balance, contains the bismuth 30.0g of Bi 〉=99.9%, contains the tin 7.0g of Sn 〉=99.9%, contains the gallium 1.0g of Ga 〉=99.99%.It is the Stainless Steel Crucible of 150ml that indium is placed volume, and heat fused on electric furnace under agitation adds bismuth, tin and gallium successively.Treat that added metal is all molten intact, be cast into ingot after the stirring.Obtain alloy 98.9g and a small amount of residue.Obtain alloy 98.9g and a small amount of residue.Through chemical analysis gained alloy bismuth-containing 29.8%, stanniferous 6.9%, contain gallium 1.1%, surplus is an indium, other content of impurities is 0.2%.The fusing point that records this alloy with melting point detector is 70.0 ℃.
Embodiment 4
(sensibility reciprocal 0.1g) takes by weighing the indium 50.0g that contains In99.99% with electronic balance, contains the bismuth 25.0g of Bi 〉=99.9%, contains the tin 15.0g of Sn 〉=99.9%, contains the gallium 10.0g of Ga 〉=99.99%.It is the Stainless Steel Crucible of 150ml that indium is placed volume, and heat fused on electric furnace under agitation adds bismuth, tin and gallium successively.Treat that added metal is all molten intact, be cast into ingot after the stirring.Obtain alloy 99.2g and a small amount of residue.Through chemical analysis gained alloy bismuth-containing 24.8%, stanniferous 14.7%, contain gallium 10.2%, surplus is an indium, other content of impurities is 0.1%.The fusing point that records this alloy with melting point detector is 48.5 ℃
Embodiment 5
(sensibility reciprocal 0.1g) takes by weighing the indium 62.0g that contains In99.99% with electronic balance, contains the bismuth metal 27.0g of Bi 〉=99.9%, contains the tin 9.0g of Sn 〉=99.9%, contains the gallium 2.0g of Ga 〉=99.99%.It is the Stainless Steel Crucible of 150ml that indium is placed volume, and heat fused on electric furnace under agitation adds bismuth, tin and gallium successively.Treat that added metal is all molten intact, be cast into ingot after the stirring.Obtain alloy 98.7g and a small amount of residue.Through chemical analysis gained alloy bismuth-containing 26.8%, stanniferous 8.8%, contain gallium 2.1%, surplus is an indium, other content of impurities is 0.09%.The fusing point that records this alloy with melting point detector is 58.0 ℃.
Embodiment 6
(sensibility reciprocal 0.1g) takes by weighing the indium 53.0g that contains In99.99% with electronic balance, contains the bismuth 25.0g of Bi 〉=99.9%, contains the tin 14.0g of Sn 〉=99.9%, contains the gallium 8.0g of Ga 〉=99.99%.It is the Stainless Steel Crucible of 150ml that indium is placed volume, and heat fused on electric furnace under agitation adds bismuth, tin and gallium successively.Treat that added metal is all molten intact, be cast into ingot after the stirring.Obtain alloy 99.2g and a small amount of residue.Through chemical analysis gained alloy bismuth-containing 24.9%, stanniferous 13.7%, contain gallium 8.2%, surplus is an indium, other content of impurities is 0.1%.The fusing point that records this alloy with melting point detector is 46.0 ℃.
Embodiment 7
(sensibility reciprocal 0.1g) takes by weighing the indium 61.0g that contains In99.99% with electronic balance, contains the bismuth 26.0g of Bi 〉=99.9%, contains the tin 9.0g of Sn 〉=99.9%, contains the gallium 4.0g of Ga 〉=99.99%.It is the Stainless Steel Crucible of 150ml that indium is placed volume, and heat fused on electric furnace under agitation adds bismuth, tin and gallium successively.Treat that added metal is all molten intact, be cast into ingot after the stirring.Obtain alloy 99.1g and a small amount of residue.Through chemical analysis gained alloy bismuth-containing 25.9%, stanniferous 8.8%, contain gallium 4.1%, surplus is an indium, other content of impurities is 0.19%.The fusing point that records this alloy with melting point detector is 52.0 ℃.
Embodiment 8
(sensibility reciprocal 0.1g) takes by weighing the indium 50.0g that contains In99.99% with electronic balance, contains the bismuth 28.0g of Bi 〉=99.9%, contains the tin 12.0g of Sn 〉=99.9%, contains the gallium 10.0g of Ga 〉=99.99%.It is the Stainless Steel Crucible of 150ml that indium is placed volume, and heat fused on electric furnace under agitation adds bismuth, tin and gallium successively.Treat that added metal is all molten intact, be cast into ingot after the stirring.Obtain alloy 99.3g and a small amount of residue.Through chemical analysis gained alloy bismuth-containing 27.7%, stanniferous 11.8%, contain gallium 10.2%, surplus is an indium, other content of impurities is 0.1%.The fusing point that records this alloy with melting point detector is 55.3 ℃.
Embodiment 9
(sensibility reciprocal 0.1g) takes by weighing the indium 62.5g that contains In99.99% with electronic balance, contains the bismuth 28.3g of Bi 〉=99.9%, contains the tin 9.2g of Sn 〉=99.9%.It is the Stainless Steel Crucible of 150ml that indium is placed volume, and heat fused on electric furnace under agitation adds bismuth and tin successively.Treat that added metal is all molten intact, be cast into ingot after the stirring.Obtain alloy 99g and a small amount of residue.Through chemical analysis gained alloy bismuth-containing 28.1%, stanniferous 9.0%, surplus is indium, and other content of impurities is 0.12%.The fusing point that records this alloy with melting point detector is 62.2 ℃.
Claims (5)
1. non-pollution lower melting point alloy is characterized in that the weight percent of its alloy consists of: Bi:24.8%～29.8%, and Sn:4.3%～14.7%, Ga:0～10.2%, surplus is In and unavoidable impurities, wherein foreign matter content is less than 0.2.
2. non-pollution lower melting point alloy according to claim 1 is characterized in that the weight percent of its alloy consists of: Bi:27%～28%, and Sn:9%～10%, surplus is In and unavoidable impurities, wherein foreign matter content is less than 0.2.
3. non-pollution lower melting point alloy according to claim 1, the weight percent that it is characterized in that its alloy consists of: Bi:26.5%～27.5%, Sn:8.5%～9.5%, Ga:1.5%～2%, surplus is In and unavoidable impurities, and wherein foreign matter content is less than 0.2.
4. non-pollution lower melting point alloy according to claim 1, the weight percent that it is characterized in that its alloy consists of: Bi:26.0%～27.0%, Sn:8.5%～9.5%, Ga:3.5%～4.5%, surplus is In and unavoidable impurities, and wherein foreign matter content is less than 0.2.
5. non-pollution lower melting point alloy according to claim 1, the weight percent that it is characterized in that its alloy consists of: Bi:24.5%～25.5%, Sn:13.5%～14.5%, Ga:7.5%～8.5%, surplus is In and unavoidable impurities, and wherein foreign matter content is less than 0.2.
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| CN103509987A (en) * | 2013-07-29 | 2014-01-15 | 楚盛 | Metal alloy heat conducting material with low melting point and preparation method thereof |
| CN103614602A (en) * | 2013-12-16 | 2014-03-05 | 曹帅 | Liquid metal thermal interface material used in 120 DEG C and preparation method thereof |
| CN103740996A (en) * | 2013-12-04 | 2014-04-23 | 曹帅 | Three-phase liquid metal material and preparation method thereof |
| CN104213011A (en) * | 2014-09-04 | 2014-12-17 | 楚盛 | Long-service life and low-melting point metal alloy heat conducting material and preparation method thereof |
| CN104263994A (en) * | 2014-10-20 | 2015-01-07 | 湘潭大学 | Graphene alloy composite thermal conductive material and preparation method thereof |
| CN105349866A (en) * | 2015-11-26 | 2016-02-24 | 苏州天脉导热科技有限公司 | Low-melting-point alloy with melting point being 40-60 DEG C and preparation method of low-melting-point alloy |
| CN105483486A (en) * | 2015-11-26 | 2016-04-13 | 苏州天脉导热科技有限公司 | Low-melting-point alloy and thermal interface material made from low-melting-point alloy |
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| CN115537624A (en) * | 2022-09-30 | 2022-12-30 | 中国航发北京航空材料研究院 | Material for precision forming of flexible body, matched mould and preparation method |
| CN117457306A (en) * | 2023-12-25 | 2024-01-26 | 山东迅实电气有限公司 | Lightning arrester conductive module and preparation method thereof |
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| CN1059373A (en) * | 1990-08-28 | 1992-03-11 | 沈阳市铝制品厂 | Make the low melting point alloy of fuse sheet |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103509987A (en) * | 2013-07-29 | 2014-01-15 | 楚盛 | Metal alloy heat conducting material with low melting point and preparation method thereof |
| CN103509987B (en) * | 2013-07-29 | 2016-06-08 | 楚盛 | A kind of low-melting point metal alloy Heat Conduction Material and preparation method thereof |
| CN103740996B (en) * | 2013-12-04 | 2016-03-09 | 曹帅 | A kind of Three-phase liquid metal material and preparation method thereof |
| CN103740996A (en) * | 2013-12-04 | 2014-04-23 | 曹帅 | Three-phase liquid metal material and preparation method thereof |
| CN103614602A (en) * | 2013-12-16 | 2014-03-05 | 曹帅 | Liquid metal thermal interface material used in 120 DEG C and preparation method thereof |
| CN103614602B (en) * | 2013-12-16 | 2015-07-22 | 曹帅 | Liquid metal thermal interface material used in 120 DEG C and preparation method thereof |
| CN104213011A (en) * | 2014-09-04 | 2014-12-17 | 楚盛 | Long-service life and low-melting point metal alloy heat conducting material and preparation method thereof |
| CN104263994A (en) * | 2014-10-20 | 2015-01-07 | 湘潭大学 | Graphene alloy composite thermal conductive material and preparation method thereof |
| CN105349866A (en) * | 2015-11-26 | 2016-02-24 | 苏州天脉导热科技有限公司 | Low-melting-point alloy with melting point being 40-60 DEG C and preparation method of low-melting-point alloy |
| CN105483486A (en) * | 2015-11-26 | 2016-04-13 | 苏州天脉导热科技有限公司 | Low-melting-point alloy and thermal interface material made from low-melting-point alloy |
| CN114276785A (en) * | 2021-11-29 | 2022-04-05 | 江阴镓力材料科技有限公司 | Metal-based phase-change interface heat conduction material, preparation method and application thereof |
| CN115537624A (en) * | 2022-09-30 | 2022-12-30 | 中国航发北京航空材料研究院 | Material for precision forming of flexible body, matched mould and preparation method |
| CN115537624B (en) * | 2022-09-30 | 2023-11-21 | 中国航发北京航空材料研究院 | Material for precision forming of flexible body, matched die and preparation method |
| CN117457306A (en) * | 2023-12-25 | 2024-01-26 | 山东迅实电气有限公司 | Lightning arrester conductive module and preparation method thereof |
| CN117457306B (en) * | 2023-12-25 | 2024-03-19 | 山东迅实电气有限公司 | Lightning arrester conductive module and preparation method thereof |
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| CN100404716C (en) | 2008-07-23 |
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