CN105088043B - A kind of liquid alloy and its preparation method and application - Google Patents
A kind of liquid alloy and its preparation method and application Download PDFInfo
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- CN105088043B CN105088043B CN201510593302.9A CN201510593302A CN105088043B CN 105088043 B CN105088043 B CN 105088043B CN 201510593302 A CN201510593302 A CN 201510593302A CN 105088043 B CN105088043 B CN 105088043B
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Abstract
The present invention relates to a kind of liquid alloy and its preparation method and application, wherein, included according to the liquid alloy of the present invention：The tin (Sn) of the gallium (Ga) of 1 90 parts by weight, the indium (In) of 1 75 parts by weight and 1 40 parts by weight.The liquid alloy has superconducting property at a critical temperature, belong to non-ideal type Ⅱ superconductor, and there is the good characteristics such as application is easy, use range is wide, cost is cheap, nontoxic, mobility is good, thermal conductivity is excellent, its preparation technology is same simple efficiently, environmental protection and saving, and the electricity that the liquid alloy also can be widely used to electronic component is plugged into, electronic circuit board and selfreparing conductor etc..
Description
Technical field
The present invention relates to metal material field, more particularly to a kind of liquid alloy and its preparation method and application.
Background technology
Low-melting alloy, refer to that fusing point is less than the fusible alloy of 232 DEG C (Sn fusing point), generally by low melting points such as bismuths (Bi)
Metallic element forms.Low-melting alloy is generally widely used as solder, and the device such as electrical equipment, steam, fire-fighting, fire alarm
In fuse, the temperature-sensitive component such as fuse, be a kind of quite potential new material.
Liquid alloy is a kind of low-melting alloy, and is at normal temperatures liquid, can be flowed freely as water, but
Possess the characteristic of metal.The atomic structure of liquid alloy is also different from common solid metallic, is more closely similar to amorphous liquid,
Its capacity of heat transmission and specific heat capacity are far above thermal conducting agents such as traditional first alcohol and waters.
Gallium is pale blue non-ferrous metal, is changed into silvery white liquid at 29.76 DEG C.Liquid gallium is easy to supercooling and is cooled to 0 DEG C
Without solidifying.Liquid alloy based on gallium (Ga) is exactly using such a metal low melting point and the property that can keep supercooled liquid, is mixed
Prepared by closing the metals such as bismuth (Bi), aluminium (Al), magnesium (Mg), silver-colored (Ag).Existing minimum fusing point is recorded as 3 DEG C, therefore is under normal temperature
Liquid.
One of most common application of superconductor is superconducting wire or coil, and its connection also requires excellent conduction
Property, to ensure to transport larger current in use.The superconducting wire having been reported is plugged into, and method includes bonding, sintering connects
Connect, weld, metal socket, crimping etc..The preparation technology of wherein superconducting joint is complicated, and the requirement to material of plugging into is very high, general
Logical material is difficult to be competent at.
Silver paste conducting wire based on silk-screen printing is commonly applied to thin film switch, soft circuit, toy circuit, hand-written printed line
The products such as road, electronic organ line, computor-keyboard circuit, remote control, because such a conducting wire sectional area is smaller, so need institute
The printing material of use has good electrical conductivity, and is hardly damaged and causes open circuit.
The content of the invention
[technical problem]
One aspect of the present invention is related to a kind of liquid alloy, and the liquid alloy has that nontoxic, mobility is good, heat conduction is led
The good characteristic such as superconduction under excellent electrical property, critical-temperature.
Another aspect of the present invention is related to a kind of preparation of liquid alloy, and the preparation technology is simply efficient, and cost is low
It is honest and clean, environmental protection and saving.
Another aspect of the invention is related to a kind of application of liquid alloy, and the liquid alloy can be widely applied to superconduction
Circuit (such as superconducting wire is plugged into), the electricity of electronic component are plugged into, electronic circuit board, selfreparing conductor field.
[technical scheme]
According to an aspect of the invention, there is provided a kind of liquid alloy, can be included：Gallium (Ga), the 1- of 1-90 parts by weight
The indium (In) of 75 parts by weight and the tin (Sn) of 1-40 parts by weight.The weight of each component is than different adjustable obtained liquid
The fusing point of alloy.Wherein, by adjusting gallium (Ga) content, the mobility of the liquid alloy can also be adjusted.
According to an embodiment of the invention, the liquid alloy can include：The gallium of 5-65 parts by weight, 20-70 weight
The indium of part and the tin of 5-25 parts by weight.
According to an embodiment of the invention, the liquid alloy can include：The gallium and total amount of 70-90 parts by weight be
The indium and tin of 10-30 parts by weight, and the weight of the indium and tin ratio is 1:2.
Matching obtained liquid alloy with this has suitable mobility and good electrical conductivity, can be applied to selfreparing and leads
In body, conductor is repaired when conductor is damaged, avoid the conductor open circuit and the loss that causes the accident.
According to an embodiment of the invention, the liquid alloy can further include other groups of 1-30 parts by weight
Point.Other components do not limit particularly, and preferably, may be selected from lead (Pb), aluminium (Al), silver-colored (Ag), chromium (Cr), titanium
(Ti), iron (Fe), magnesium (Mg), calcium (Ca), copper (Cu), cobalt (Co), manganese (Mn), nickel (Ni), zinc (Zn), germanium (Ge), strontium (Sr), yttrium
(Y), at least one of zirconium (Zr), niobium (Nb), molybdenum (Mo), cadmium (Cd), CNT (CNT) and graphene (Graphene).
According to an embodiment of the invention, the liquid alloy can include other components of 1-15 parts by weight.
According to an embodiment of the invention, the liquid alloy can include other components of 1-5 parts by weight.
According to an embodiment of the invention, the liquid alloy can include：The gallium of 40-50 parts by weight, 15-20 weight
The indium, the tin of 30-40 parts by weight and the lead of 1-10 parts by weight of part.
According to an embodiment of the invention, the liquid alloy can include：The gallium of 40-65 parts by weight, 15-25 weight
Part indium, the tin of 10-20 parts by weight, the silver of the zinc of 1-5 parts by weight and 1-5 parts by weight.
According to another aspect of the present invention, there is provided the preparation method of above-mentioned liquid alloy, it may include following steps：
(1) weight ratio described above weighs gallium, indium and tin respectively；
(2) under conditions of air is completely cut off, gallium is heated to melting completely；
(3) tin is added in the gallium of molten condition, in a heated condition, such as being heated to more than 235 DEG C melts tin,
Stir simultaneously to obtain uniform gallium tin mixture；
(4) indium is added in the gallium tin mixture of molten condition, in a heated condition, such as maintains temperature at 120 DEG C
Indium is melted above, while is stirred to obtain uniform gallium, indium and the mixture of tin；
(5) liquid alloy is naturally cooled into room temperature, so as to which the liquid alloy be made.
According to another implementation of the invention, the preparation method of the liquid alloy can further comprise：
Weigh above weight than other components, other components may be selected from lead (Pb), aluminium (Al), silver-colored (Ag), chromium
(Cr), titanium (Ti), iron (Fe), magnesium (Mg), calcium (Ca), copper (Cu), cobalt (Co), manganese (Mn), nickel (Ni), zinc (Zn), germanium (Ge), strontium
(Sr), in yttrium (Y), zirconium (Zr), niobium (Nb), molybdenum (Mo), cadmium (Cd), CNT (CNT) and graphene (Graphene) extremely
Few one kind；And other components are added to the production that the arbitrary steps after step (1) and before step (5) are obtained
In thing, and stir to well mixed.
The addition and stirring of other components can be carried out under heating or room temperature condition.
According to a further aspect of the invention, the application of above-mentioned liquid alloy may include to be used for superconducting circuit, electronics member device
The electricity of part is plugged into, electronic circuit board and selfreparing conductor etc..
The liquid alloy has natural indium (In) or tin (Sn) and indium tin (InSn) phase during the solidification that cools
Deng metallographic from separating, this is the origin of its superconducting characteristic.
According to an embodiment of the invention, the liquid alloy may include in the application of superconducting circuit：Superconducting wire
Plug into, make Josephson junction etc..
The liquid alloy belongs to non-ideal type Ⅱ superconductor, has two critical magnetic field values, in two critical magnetic fields
Between value, the liquid alloy allows partial magnetic field penetrable material, in addition, non-ideal type Ⅱ superconductor has higher stagnation temperature
Degree and critical magnetic field, can be by larger supercurrent, therefore has higher industrial application value.
[beneficial effect]
Liquid alloy of the present invention has the following advantages that：
(1) it is nontoxic according to the liquid alloy being made up of gallium, tin and indium of an embodiment of the invention, even if mixing
Enter some poisonous compositions, such as lead, cobalt or cadmium, due to neutralizing the effect of dilution and alloying, obtained liquid alloy is also only
There is extremely low toxicity.
(2) it is excellent according to the electric conductivity of the liquid alloy of the present invention, such as described electrical conductivity of the liquid alloy at 20 DEG C
Can be 3 × 106Ω-1m-1More than, for example, Ga62In22Sn16The electrical conductivity of (index number is weight ratio) is 3.1 × 106Ω-1m-1, Ga88In4Sn8Electrical conductivity be 3.6 × 106Ω-1m-1, be significantly better than common silver paste curing conductive circuit (electrical conductivity 1 ×
104Ω-1m-1), therefore silver paste can be replaced to be used for the electricity of electronic component and plugged into, in electronic circuit board, and its fold resistance is substantially excellent
In optical fiber, common metal wire and silver paste solidification wire etc..
(3) suitable mobility is had according to the liquid alloy of the present invention at normal temperatures, can be applied in selfreparing conductor,
When conductor is damaged outflow repair conductor, avoid the conductor open circuit and the loss that causes the accident.
(4) superconducting property is had according to the liquid alloy of the present invention, belongs to non-ideal type Ⅱ superconductor, for example,
Ga5In71Sn24、Ga62In22Sn16Liquid alloys such as (index number are weight ratio) measures super higher than 6K (such as 6.4K, 6.6K)
Initial transition temperature (see Fig. 1 and 2) is led, with traditional low temperature superconducting material NbTi, Nb3Sn etc. is close.And compared to first
Type I superconductors I mercury, it is equally liquid at room temperature, but mercury is type I superconductor, larger supercurrent can not be carried, to work
Industry is applied without big meaning.
(5) it is at normal temperatures liquid according to the liquid alloy of the present invention, can be fitted into different containers and form required shape
Shape, and required superconductive device is cured as in subsequent temperature-fall period, compared to the superconducting alloy that normal temperature is solid-state, simplify
Alloy uses the preceding processing to its shape so that the application of the liquid alloy is relatively simple；In addition, using above-mentioned property,
Wide application prospect is provided to carry out the 3D printing of complicated superconductive device using the liquid alloy.
(6) as described above according to the present invention liquid alloy at normal temperatures be liquid property, carry out superconducting wire connect
It is good with the contact of superconducting wire when refuting, without welding or being bonded, the process of plugging into is simplified, reduces cost.
(7) preparation method of liquid alloy according to another aspect of the present invention, its preparation technology is simply efficient, cost
It is cheap, environmental protection and saving.
Brief description of the drawings
Accompanying drawing illustrates the preferred embodiment of the present invention, together with narration above, for further understanding the present invention's
Technical spirit.In the drawing：
Fig. 1 is to compare Ga according to the weight of an embodiment of the invention:In:Sn is 5:71:24 Ga5In71Sn24Liquid
The resistivity of state alloy variation with temperature under different additional transverse field strengths to the curve map and resistivity of temperature；
Fig. 2 is to compare Ga according to the weight of an embodiment of the invention:In:Sn is 62:22:16 Ga62In22Sn16's
Curve map of the surface resistance that liquid alloy cools down and heated up under zero magnetic field intensity to temperature；
Fig. 3 is to compare Ga according to the weight of an embodiment of the invention:In:Sn:Zn:Ag is 62:22:16:1:1
Ga62In22Sn16Zn1Ag1Liquid alloy under different additional transverse field strengths resistivity variation with temperature；
Fig. 4 is to compare Ga according to the weight of an embodiment of the invention:In:Sn is 62:22:16 Ga62In22Sn16's
Liquid alloy is applied to the schematic diagram that superconducting wire is plugged into；
Fig. 5 is to compare Ga according to the weight of an embodiment of the invention:In:Sn is 62:22:16 Ga62In22Sn16's
The critical current curve map that liquid alloy measures under 4.2K；
Fig. 6 is to compare Ga according to the weight of an embodiment of the invention:In:Sn is 62:22:16 Ga62In22Sn16's
Liquid alloy is applied to the schematic diagram for making Josephson junction；
Fig. 7 is to compare Ga according to the weight of an embodiment of the invention:In:Sn is 62:22:16 Ga62In22Sn16's
Liquid alloy resistivity variation with temperature under different additional transverse field strengths；
Fig. 8 is to compare Ga according to the weight of an embodiment of the invention:In:Sn is 5:71:24 Ga5In71Sn24Liquid
The schematic diagram that state Alloyapplication is plugged into the electricity of electronic component；
Fig. 9 is to compare Ga according to the weight of an embodiment of the invention:In:Sn is 88:4:8 Ga88In4Sn8Liquid
State Alloyapplication is in the schematic diagram of electronic circuit board；
Figure 10 is to compare Ga according to the weight of an embodiment of the invention:In:Sn is 88:4:8 Ga88In4Sn8Liquid
State Alloyapplication is in the schematic diagram of selfreparing.
Embodiment
Hereinafter, the preferred embodiment of the present invention is described in detail with reference to the accompanying drawings.Before the description, it should manage
Solution, the embodiment being exemplified below is only the preferred embodiment of task of explanation, not for limitation the scope of the present invention, because
This, it is also contemplated that, the present invention is further included in other etc. in the range of description and claims of this specification
With technology or modification.
The preparation of liquid alloy
Embodiment 1
With gallium：Indium：Tin=5:71:24 weight score also known as amount gallium, indium and tin.Then under conditions of air is completely cut off,
First gallium is heated to melting completely, continues to keep the state of isolation air, add tin and be heated to more than 235 DEG C, stir simultaneously,
After tin is completely melt, adds indium and maintain temperature to be stirred simultaneously more than 120 DEG C, after indium is completely melt, naturally cool to
Room temperature, it is Ga so as to obtain weight ratio5In71Sn24Liquid alloy.
Embodiment 2
Except with gallium：Indium：Tin=62:22:Outside 16 weight score also known as amount gallium, indium and tin.With same as Example 1
Method to obtain weight ratio be Ga62In22Sn16Liquid alloy.
Embodiment 3
Except with gallium：Indium：Tin=40:40:Outside 20 weight score also known as amount gallium, indium and tin.With same as Example 1
Method to obtain weight ratio be Ga40In40Sn20Liquid alloy.
Embodiment 4
Except with gallium：Indium：Tin=88:4:Outside 8 weight score also known as amount gallium, indium and tin.With same as Example 1
It is Ga that method, which obtains weight ratio,88In4Sn8Liquid alloy.
Embodiment 5
With gallium：Indium：Tin：Lead=40:20:35:5 weight score also known as amount gallium, indium, tin and lead.Then in isolation air
Under conditions of, first gallium is heated to melting completely, continues to keep the state of isolation air, add lead and heating stirring, treat that lead is complete
After running down, add tin and maintain temperature to be stirred simultaneously more than 235 DEG C, treat that tin is completely melt, be eventually adding indium, and maintain
Temperature stirs and indium is also completely melt more than 120 DEG C, naturally cools to room temperature, is so as to obtain weight ratio
Ga40In20Sn35Pb5Liquid alloy.
Embodiment 6
With gallium：Indium：Tin：Zinc：Silver=62:22:16:1:1 weight score also known as amount gallium, indium, tin, zinc and silver.Then exist
Completely cut off under conditions of air, first be heated to melting completely by gallium, continue to keep the state of isolation air, add tin, zinc and silver simultaneously
Temperature is maintained to stir simultaneously more than 235 DEG C, treat that tin, zinc and silver are completely melt, be eventually adding indium, and maintain temperature at 120 DEG C
More than, while stir and indium is also completely melt, room temperature is naturally cooled to, is Ga so as to obtain weight ratio62In22Sn16Zn1Ag1
Liquid alloy.
The measure of the physical property of liquid alloy
Using fusing point, the superconducting critical of liquid alloy made from comprehensive physical property measuring system (PPMS) measure embodiment 1-6
The physical properties such as the electrical conductivity under temperature, critical current density and room temperature (20 DEG C).The comprehensive physical property measuring system
(PPMS) it is made up of fundamental system and various measurements and expanding function option, wherein fundamental system can provide 1.8K to 1000K's
The measuring environment in temperature and 0T to 9T magnetic field, and the software and hardware control centre of whole system.
In addition, the shape and chi of the drop formed using liquid alloy made from spinning drop method measure embodiment 1-6
It is very little, surface tension is then tried to achieve according to the density combination Bashforth-Adams equations of each liquid alloy.Wherein, rotation is passed through
The drop for turning to be formed each liquid alloy is among certain centrifugal force field, and regulation rotating speed changes the equilibrium configuration of drop
In order to determine.
Each physical property of liquid alloy made from the embodiment 1-6 that the above method measures, design parameter such as following table 1
It is shown：
[table 1]
As shown in Table 1, liquid alloy made from 1-6 is respectively provided with superconductivity according to an embodiment of the invention, such as
Ga5In71Sn24、Ga62In22Sn16Superconduction critical temperature (the starting higher than 6K (6.55K, 6.67K) is measured Deng three component alloys
Transition temperature Tc (onset)), as illustrated in fig. 1 and 2, with Conventional cryogenic superconductor NbTi, Nb3Sn etc. is close.In addition, three groups
Divide above alloy, such as Ga40In20Sn35Pb5Critical-temperature improve nearly 1K, reached 7.25K.Further, each liquid
The critical current density of alloy is larger, shows great industrial application value.
In addition, the surface tension of liquid alloy made from 1-6 is relatively low according to an embodiment of the invention, flows at room temperature
Property is good, and electric conductivity is excellent, and the electrical conductivity at 20 DEG C is close to or higher than 3 × 106Ω-1m-1, it is significantly better than common silver
Starch curing conductive circuit (1 × 104Ω-1m-1), alternative its is applied to electronic component and electronic circuit board etc..
Fig. 1 is that obtained weight ratio is Ga in embodiment 15In71Sn24Liquid alloy resistivity to the curve map of temperature
And resistivity variation with temperature under different additional transverse magnetic fields.Wherein, under the conditions of curve map A1 represents zero externally-applied magnetic field
Ga5In71Sn24Resistivity variation with temperature, its resistivity reduces with the reduction of temperature, and now alloy is normal state,
Correlation curves of the binding curve figure B1 when additional transverse field strength is 0, it is known that Ga5In71Sn246.1K is dropped in temperature
When, resistivity is reduced to 0, into complete superconducting state, i.e. Ga5In71Sn24Superconduction zero-resistance temperature Tc (0) be 6.1K；Curve map B1
Represent Ga5In71Sn24Resistivity 0,0.005T, 0.01T, 0.02T, 0.04T, 0.06T, 0.08T, 0.1T, 0.15T,
The different variation with temperature under additional transverse field strength such as 0.2T, 0.25T and 0.3T, as magnetic field intensity is increased to by 0
0.3T, the superconduction initial transition temperature Tc (onset) and zero-resistance temperature Tc (0) of alloy slowly reduce, but still suffer from superconduction
State, illustrate that alloy under very high additional transverse magnetic field, can still carry very big supercurrent, show Ga5In71Sn24
Non-ideal type Ⅱ superconductor characteristic.
Fig. 2 is that obtained weight ratio is Ga in embodiment 262In22Sn16Liquid alloy cooled down under zero magnetic field intensity with
And the surface resistance of heating is to the curve map of temperature.Wherein, Ga62In22Sn16Cooled under conditions of being 0 in applied field strengths
Curve and heating curve be close, the superconduction initial transition temperature Tc (onset) of alloy is 6.5-7K, zero-resistance temperature Tc
(0) it is 4.1-4.4K.Heating and cooling also show sample homogeneity simultaneously it can be seen that without new calorifics second-order phase transistion generation
Well.
Fig. 3 is that obtained weight ratio is Ga in embodiment 662In22Sn16Zn1Ag1Liquid alloy in different additional transverse magnetics
Resistivity variation with temperature under field intensity.Wherein, Ga62In22Sn16Zn1Ag1Occur two under without magnetic field or Weak magentic-field
Temperature transition point, using itself gallium of this material, homoatomic size and number does not change for zinc and silver, it is possible to develop it is new with
Josephson becomes extremely sensitive magnetic flux-electric pressure converter of core parts.And it can be added using its liquid in room temperature
Work particularly in superconducting thin film device, is especially suitable for outer space working environment and is used for detecting mineral into any irregular shape
Resource.
The application of liquid alloy
Embodiment 7：Superconducting wire is plugged into
As shown in figure 4, it is Ga by obtained weight ratio in embodiment 262In22Sn16Liquid alloy insert hold-up vessel B3
In, sealed with plastic cement.Again by two superconducting wires by sealed plasthetic, contacted in push-in plastic containers B3 with liquid alloy, its
In the distance between two superconducting wires be D3, so as to which superconducting wire joint be made, realize superconducting wire and plug into.
Ga62In22Sn16It is good compared to welding or Nian Jie contact with superconducting wire when progress superconducting wire is plugged into, also obvious letter
Change the process of plugging into, sufficiently lower cost.
As shown in figure 5, under conditions of temperature, zero applied field strengths in 4.2K, the diameter d of the joint is 0.3cm,
Cross-sectional area S is 0.071cm2, critical current IcFor 56A, that is, obtain up to 788Acm-2Critical current density Jtc, it is complete
The full current transfer requirement for meeting superconducting wire.In addition, the critical current density of other liquid alloys according to the present invention is close,
So it can be applied to plugging into for above-mentioned superconducting wire.
The shape of the hold-up vessel can select according to use demand, for example, can be cuboid, cylinder, not advise even
Then three-dimensional configuration etc., A3 regions as shown in Figure 4 illustrate that internal diameter is d and profile is cylinder or cuboid (length of side a × b)
Hold-up vessel.The material of the hold-up vessel can also select according to requirements, for example, can be plastics, metal, graphite, super
Lead material etc.；The species of the superconducting wire connected is also flexile, for example, can be wire rod, band, bulk, cable etc.,
For example, the C3 regions shown in Fig. 4 illustrate wire rod and the superconducting wire of web type.
Existing superconducting wire is most long to can reach 2 kilometers, but can not still meet big coil one around target on earth.It is existing
Wire connecting method it is extremely complex, whole coil is heat-treated by some needs, it is envisaged that bigger coil, is more needed
Bigger vacuum heating apparatus.According to the present embodiment, alloy of the invention can complete plugging into for superconducting wire in room temperature, can fit
The joint of any shape is answered, plasticity, practicality are very strong, and fault rate is low, have extremely long-range application prospect.
For example, according to another experiment, using the Ga of the present embodiment62In22Sn16By niobium titanium superconducting wire plugging into Fig. 4
Mode connects into unicoil, niobium titanium superconduction circle (inductance 10 made from test-9H).Wherein, the liquid alloy hold-up vessel of connection
Internal diameter be 10mm (i.e. d in Fig. 4), the stabling current of carrying is about 165A, and this is equivalent to 210Acm-2Current density
Jc, its resistance is less than 10-16Ω ranks, this is much smaller than 10 required by superconducting MRI (magnetic resonance imaging)-13The requirement of Ω ranks.
By contrast, the niobium titanium superconduction circle connected by traditional standard mechanical forcing press, both are in the performance of resistance without great area
Not, still, niobium titanium superconduction circle made from conventional method be easy to because cold-thermal effect and loose contact, fraction defective reach
30%, and use the superconduction circle that the liquid alloy of the present invention is plugged into cold events, will not also produce showing for loose contact with cooling
As.
Embodiment 8：Make Josephson junction
It is an easy superconducting microbridge as shown in Figure 6, by Ternary Liquid Ga62In22Sn16It is made and is laid in substrate
On superconducting thin film, the centre for setting film is narrow thin bridge zone, that is, be made superconducting microbridge.The superconducting microbridge cause its two
Weak link is realized in the superconducting thin film part of side, so that Josephson effect is presented in whole superconducting thin film.
Again by liquid alloy Ga62In22Sn16The resistivity variation with temperature under different additional transverse magnetic fields, such as schemes
Shown in 7, it can be seen that because the coherence length of superconduction changes, in resistance with the test of changes of magnetic field, even if having faint
Magnetic field two different temperatures transition points just occur.As a comparison, liquid alloy Ga62In22Sn16Zn1Ag1Utilize material itself
Gallium, zinc and silver not homoatomic size and number change, the sensitivity of obtained Josephson junction can be improved, because doping
The liquid alloy Ga of zinc and silver62In22Sn16Zn1Ag1Occur the temperature transformation ranges of widerization under additional transverse magnetic field,
As shown in figure 3, so as to develop the new extremely sensitive magnetic flux-voltage conversion for becoming core parts with Josephson
Device.And any irregular shape can be processed into using its liquid in room temperature, particularly in superconducting thin film device, especially
It is adapted to outer space working environment to be used for detecting mineral resources.
Embodiment 9：The electricity of electronic component is plugged into
As shown in figure 8, the schematic diagram plugged into for liquid alloy applied to the electricity of electronic component.Such as the system of electronic sensor
Make, wherein, sensing element A5 is fixed on the flexible substrates C5 of stacking first, flexible substrates used herein are to be poly- to benzene two
Formic acid second diester (PET) film；Then the microchannel D5 being connected using photoetching technique structure with sensing element；Then by embodiment
Obtained liquid alloy Ga in 15In71Sn24Injection microchannel is in contact with sensing element, you can structure conductive path, finally will
Flexible substrates C5 is positioned on substrate B5, so as to which required electronic component be made.Exist using according to the liquid alloy of the present invention
Normal temperature is the property of liquid condition, can save the welding or bonding of sensing element and connecting or disconnecting circuit, substantially avoid high-temperature soldering
Or conductive adhesive is applied to its possible destruction or pollution, contact and fill with sensing element further according to liquid alloy of the invention
Point, contact surface is big, and simplifies the manufacture craft of electronic component, therefore can be widely applied to electricity according to the liquid alloy of the present invention
The electricity of sub- component is plugged into, and its fold resistance is better than optical fiber, plain conductor, silver paste solidification wire etc..
Embodiment 10：Electronic circuit board and selfreparing
As shown in figure 9, the schematic diagram in terms of being applied to electronic circuit board for liquid alloy.Wherein, can be used alone basis
The liquid alloy of the embodiment of the present invention 4, such as Ga88In4Sn8, or be well mixed by a certain percentage with conductive silver paste or electroconductive resin,
A certain amount of solvent, binding agent and light curing agent are added, is then coated on poly terephthalic acid second two using screen printing technique
On ester (PET) film B6, it is made and can be applied to soft circuit, toy circuit, handwriting pad circuit, electronic organ line, computor-keyboard line
The conducting wire A6 of the products such as road.The electrical conductivity of such a circuit is higher than common silver paste curing circuit.
In addition, as shown in Figure 10, impaired rupture is employed into liquid alloy Ga88In4Sn8Conductor cool to solid-state,
Then 300K is warming up to, measures its resistivity (resistance four-end method) as 10-7The Ω m orders of magnitude, still less than all kinds of conductive silver pastes
Resistivity (about 10-5Ω m) two orders of magnitude, it was demonstrated that the conductor adhesion that remains unchanged connects, and has fully ensured that the connection of circuit, so as to
Show certain self-reparing capability.By contrast, resistivity of the conductive silver paste in undamaged rupture is 10-5The Ω m orders of magnitude,
And turn into open circuit after impaired rupture, because without self-healing properties, resistance tends to be infinitely great, irreversible so as to damage.Further,
As shown in Figure 10, the impaired conductor is in the temperature-rise period after cooling, when cooling compared with, resistivity in 293K it
Poor Δ ρ (293K)=1.4 × 10-7Ω m (rate of change 2.3%), the difference of the resistivity in 300K is maximum, and Δ ρ (300K)=
2.0×10-7Ω m (rate of change 3.2%), rate of change is smaller, illustrates that self-reparing capability is excellent.
The present invention has had been described in detail.It is to be understood, however, that above-mentioned detailed description and specific implementation
Example, while the preferred embodiment of the present invention is represented, is only used for illustrating.
Claims (11)
1. a kind of liquid alloy, it is made up of the tin of the gallium of 1-40 parts by weight, the indium of 1-40 parts by weight and 1-20 parts by weight.
2. a kind of liquid alloy, it is made up of the tin of the gallium of 1-5 parts by weight, the indium of 1-71 parts by weight and 1-24 parts by weight.
3. a kind of liquid alloy, wherein, indium of the liquid alloy by the gallium and total amount of 70-90 parts by weight for 10-30 parts by weight
Formed with tin, and the weight of the indium and tin ratio is 1:2.
4. a kind of liquid alloy, wherein, the liquid alloy is by the gallium of 40-50 parts by weight, the indium of 15-20 parts by weight, 30-40 weights
Measure the tin of part and the lead composition of 1-10 parts by weight.
5. a kind of liquid alloy, wherein, the liquid alloy is by the gallium of 40-65 parts by weight, the indium of 15-25 parts by weight, 10-20 weights
Measure the silver composition of the tin of part, the zinc of 1-5 parts by weight and 1-5 parts by weight.
6. a kind of preparation method of the liquid alloy any one of claims 1 to 3, comprises the following steps：
(1) gallium, indium and tin are also known as measured with the weight score of the liquid alloy any one of claims 1 to 3；
(2) under conditions of air is completely cut off, gallium is heated to melting completely；
(3) tin is added in the gallium of molten condition, melts tin in a heated condition, while stirred to obtain uniform gallium tin
Mixture；
(4) indium is added in the gallium tin mixture of molten condition, heating stirring is to obtain uniform gallium, indium and the mixing of tin
Thing；
(5) liquid alloy is naturally cooled into room temperature, so as to which the liquid alloy be made.
7. a kind of preparation method of the liquid alloy described in claim 4 or 5, including：
(1) gallium, indium and tin are also known as measured with the weight score of the liquid alloy described in claim 4 or 5；
(2) under conditions of air is completely cut off, gallium is heated to melting completely；
(3) tin is added in the gallium of molten condition, melts tin in a heated condition, while stirred to obtain uniform gallium tin
Mixture；
(4) indium is added in the gallium tin mixture of molten condition, heating stirring is to obtain uniform gallium, indium and the mixing of tin
Thing；
(5) liquid alloy is naturally cooled into room temperature, so as to which the liquid alloy be made,
And further comprise：
Other components are weighed, the arbitrary steps that other components are added to after step (1) and before step (5) are obtained
In the product obtained, and stir to well mixed.
8. a kind of liquid alloy any one of claims 1 to 3 is plugged into the electricity of superconducting circuit, electronic component, electricity
Application in sub- wiring board and selfreparing conductor.
9. the application of liquid alloy according to claim 8, wherein, the application in superconducting circuit includes：Superconducting line
Josephson junction is plugged into and made to material.
10. a kind of liquid alloy described in claim 4 or 5 is plugged into the electricity of superconducting circuit, electronic component, electronic circuit board
With the application in selfreparing conductor.
11. the application of liquid alloy according to claim 10, wherein, the application in superconducting circuit includes：Superconduction
Josephson junction is plugged into and made to wire rod.
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