CN110373590A - A kind of liquid conduction insulating materials and the preparation method and application thereof - Google Patents
A kind of liquid conduction insulating materials and the preparation method and application thereof Download PDFInfo
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- CN110373590A CN110373590A CN201910641076.5A CN201910641076A CN110373590A CN 110373590 A CN110373590 A CN 110373590A CN 201910641076 A CN201910641076 A CN 201910641076A CN 110373590 A CN110373590 A CN 110373590A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C12/00—Alloys based on antimony or bismuth
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/04—Alloys containing less than 50% by weight of each constituent containing tin or lead
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0094—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with organic materials as the main non-metallic constituent, e.g. resin
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Abstract
The present invention relates to a kind of liquid conduction insulating materials and the preparation method and application thereof, the liquid conduction insulating materials is made of metal alloy and solvent, density when the metal alloy solid-state is less than density when liquid, and the viscosity of the solvent is 0.2~500mpa.s；The preparation method of the liquid conduction insulating materials includes: that metal alloy is dispersed into after metal alloy particle to mix with solvent；The liquid conduction insulating materials can be used for electronic field, and being particularly suitable for preparation can reset circuit, visualization circuit, self-repair circuit, circuit fuse etc.；Also, due to its intrinsic liquidus behavior, it is easy to be recycled, it is environmentally friendly.
Description
Technical field
The present invention relates to field of electronic materials more particularly to a kind of liquid conduction insulating materials and preparation method thereof with answer
With.
Background technique
The electronic component of stable state is the basis of nearly all computer there are two types of having under outside stimulus.Therefore, may be used
The material changed between conductive state and insulation state is received significant attention because of its huge science and industry meaning.For this
For kind material, conductive insulation changes (Conductor-Insulator Transition, CIT) phenomenon under environmental stimuli
It can occur.Thus, the material for having conductive insulator transition ability is referred to as CIT material.In the past few decades, a series of
CIT material is found successively, including Mott insulator, vanadium dioxide etc..However, above-mentioned CIT material suffers from more or less
The shortcomings that, such as including complicated chemical structure, realization condition harsh (such as extremely high pressure) etc..These disadvantages hinder CIT
Material is further applied.The reason of its essential reason is, various CIT materials above-mentioned realize conductive insulator transition be usually
The change of single substance microstructure.
In addition, the CIT material realized at present is all the temperature transition model of solid-state and its conduction insulation under normal conditions
It encloses relatively narrow.Conventional frame is jumped out, using the mutual cooperation between composite inner substance, and then realizes materials conductive insulator transition
Function is the available strategy for solving the predicament that CIT material is faced.Therefore, realize that a kind of liquid with wide warm area is conductive absolutely
Edge (LCIT) material has highly important theoretical and real value.
Summary of the invention
The purpose of the present invention is overcoming the deficiencies of existing technologies, a kind of (wide warm area) liquid conduction insulating materials is provided, is led to
Extraneous stimulation is crossed, huge variation (at least up to 9 magnitudes) occurs for the resistivity of the material, and then realizes conductive and insulation
The function of mutually switching between state.
Specifically, liquid conduction insulating materials provided by the invention is made of metal alloy and solvent, the metal is closed
The density when solid-state of gold is less than density when liquid, and the viscosity of the solvent is 0.2~500mpa.s.
Further, the viscosity of the solvent is 0.5~20mpa.s.
Further, the metal alloy is selected from one or more of gallium, gallium-base alloy, bismuth, bismuth-base alloy.
Density when gallium-base alloy and bismuth-base alloy solid-state is less than density when liquid, and the solvent of itself and specific viscosity is mixed
Conjunction obtains liquid conduction insulating materials, which has the performance of conductive insulator transition in wide warm area；When alloying pellet is in solid
When state, this material is in conductive state, and when it is liquid that alloying pellet, which melts, material becomes the state that insulate.
Present invention simultaneously provides a kind of liquid conduction insulating materials, the liquid conduction insulating materials is by metal alloy and molten
Agent composition；The metal alloy is GaIn24.5、Bi31.6In48.8Sn19.6、Ga、Ga61In25Sn13Zn1, Bi, one of, it is described
Solvent is dimethicone.
Further, the volume ratio of the metal alloy and solvent is 1:0.3~1.
Further, the volume ratio of the metal alloy and solvent is 1:0.4.
Present invention simultaneously provides the preparation methods of the liquid conduction insulating materials, comprising: metal alloy is dispersed into gold
It is mixed after belonging to alloying pellet with solvent；Wherein, the method for the dispersion is supercritical ultrasonics technology or direct paddling process；The metal alloy
Even particulate dispersion is in a solvent.
Further, the partial size of the metal alloy particle is 1 μm~1mm.
Further, the partial size of the metal alloy particle is 10~100 μm.
The present invention also provides the application of the liquid conduction insulating materials and the preparation method in electronic field.
Further, the liquid conduction insulating materials can be used for selfreparing fuse, automatic starting device alarm dress
It sets, temperature detect switch (TDS), temperature sensor, restructural temperature control circuit, phase transition storage.
Metal alloy is separated into metal alloy particle, is then mixed with solvent, is thus made as LCIT material.Work as the external world
Temperature when being higher than the transformation temperature of the metal alloy drop in LCIT material, metal alloy drop is liquid, and LCIT material is in
(resistivity is greater than 10 to the state that insulate4Ωm)；When ambient temperature is lower than metal alloy drop transformation temperature, metal alloy drop is solid
State, LCIT material becomes conductive state (resistivity is less than 10 at this time-5Ωm)。
Beneficial effects of the present invention:
When metal alloy and solvent mix, there are gap, conductive gold between the metal alloy particle and solvent when liquid
Belong to alloying pellet by solvent separating into isolated island one by one, thus LCIT material at this time is non-conductive.And confirmed by relevant calculation,
Only gallium and bismuth the metal volume expansion in solidification, expansion rate is respectively 3.05% and 3.08%.For gallium metal and bismuth metal
For, when the metal alloy solidification in LCIT material, alloying pellet can expand.The alloy liquid droplet of expansion has squeezed out surrounding
Solvent, so that alloy liquid droplet contacts with each other.The alloy liquid droplet to contact with each other forms a conductive path, so that LCIT at this time
Materials conductive.
Liquid conduction insulating materials of the present invention, due to solvent under specific viscosity possessed mobility so that
The conductive insulator transition point of this conduction insulating materials is only related with the transformation temperature of metal alloy drop；That is, with solid-state
When the metal alloy of density and the solvent of specific viscosity range of the density when being less than liquid be that liquid made from raw material is conductive absolutely
The transformation of the conductive insulation of wide warm area may be implemented in edge material.Had using circuit made from above-mentioned liquid conduction insulating materials
It can reset, visualize and the advantages of selfreparing；Simultaneously as its intrinsic liquidus behavior, this liquid conduction insulating materials is very
It is easily recycled recycling, it is very friendly to environment.This conduction insulation process is entirely reversible and theoretically can be real
Now transformation many times.
Detailed description of the invention
Fig. 1 is the schematic illustration of the preparation method of LCIT material.
Fig. 2 is the SEM figure of liquid conduction insulating materials prepared by embodiment 1.
Fig. 3 be by LCIT material form can reset circuit schematic diagram.
Fig. 4 is the self-repair circuit schematic diagram being made of LCIT material.
Fig. 5 is the operation schematic diagram of the selfreparing fuse of LCIT material preparation.
Specific embodiment
The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention..
Embodiment 1
The present embodiment provides a kind of liquid conduction insulating materials, the preparation method of the liquid conduction insulating materials is as follows
(process flow such as Fig. 1):
(1) by metal alloy GaIn24.5It is mixed with dimethicone according to the volume ratio of 1:0.4；
(2) using mechanical agitator with the mixture of 800r/min whipping step (1) to GaIn24.5Partial size be 50 μm,
Obtain liquid conduction insulating materials；
Metal alloy GaIn24.5Phase transformation inversion point be 15.7 DEG C, the liquid conduction insulating materials conduction insulator transition
The temperature of point is 15.7 DEG C.
Obtained liquid conduction insulating materials is poured into vessel, is refrigerated to subzero 50 degree using insulating box, at this time liquid
State conduction insulating materials becomes conductive state；Liquid conduction insulating materials after freezing is heated to 15.7 DEG C, liquid is conductive at this time
Insulating materials becomes the state that insulate.
Wherein, when the temperature of above-mentioned liquid conduction insulating materials is higher than GaIn24.515.7 DEG C of fusing point when, in insulation
State does not have as shown in Fig. 2, liquid metal droplet included in liquid conduction insulating materials is separated by dimethicone at this time
It contacts with each other.When the temperature of liquid conduction insulating materials is lower than the freezing point of liquid metal droplet, liquid metal droplet is solidifying
Consolidate and expand so that the liquid metal droplet separated contacts with each other, to realize conduction.Also, the liquid conduction insulation
The conduction of material is with state of insulation as the variation of temperature is reversible.
Embodiment 2
The present embodiment provides a kind of liquid conduction insulating materials, are only that metal alloy is with the difference of embodiment 1
Bi31.6In48.8Sn19.6, fusing point is 60 DEG C, and the temperature of the conductive insulator transition point of the liquid conduction insulating materials is 60 DEG C.
Embodiment 3
The present embodiment provides a kind of liquid conduction insulating materials, are only that metal alloy is Ga with the difference of embodiment 1, melt
Point is 29.7 DEG C, and the temperature of the conductive insulator transition point of the liquid conduction insulating materials is 29.7 DEG C.
Embodiment 4
The present embodiment provides a kind of liquid conduction insulating materials, are only that metal alloy is with the difference of embodiment 1
Ga61In25Sn13Zn1, fusing point is 3 DEG C, and the temperature of the conductive insulator transition point of the liquid conduction insulating materials is 3 DEG C.
Embodiment 5
The present embodiment provides a kind of liquid conduction insulating materials, are only that metal alloy is Bi with the difference of embodiment 1, melt
Point is 271.5 DEG C, and the temperature of the conductive insulator transition point (electric resistance changing point) of the liquid conduction insulating materials is 271.5 DEG C.
Experimental example 1
This experimental example using the liquid conduction insulating materials of embodiment 1 be made a kind of temperature control can reset circuit, such as Fig. 3 institute
Show, the liquid conduction insulating materials is placed into built-up circuit in container of different shapes, makes circuit become to lead by cooling
Logical state；It is below or above electric resistance changing point by control temperature, the on and off of circuit can be efficiently controlled, reach temperature control
The effect of switch.
Experimental example 2
A kind of self-repair circuit is made using the liquid conduction insulating materials of embodiment 1 in this experimental example, as shown in figure 4, working as
For the slight scratch that applies when liquid conduction insulating materials surface, liquid conduction insulating materials can still carry out conduction；Work as application
Scratch it is too big, when destroying the structure of whole liquid conduction insulating materials, liquid conduction insulating materials is no longer conductive at this time；It is logical
Crossing heating can be such that the scratch applied restores, and then realize conduction again, reach the selfreparing purpose to circuit.
Experimental example 3
A kind of circuit fuse is made using the liquid conduction insulating materials of embodiment 2 in this experimental example, as shown in figure 5, working as
When short circuit occurs for circuit, temperature be increased dramatically, so that fuse temperature increases, it is liquid that Bi based alloy particle wherein included, which melts,
Drop-wise.After Bi based alloy is melted, volume becomes smaller, and the Bi base particle to contact with each other is caused to be separated from each other, and becomes the state that insulate, no longer leads
Electricity plays the function of fuse so as to cause circuit disconnection.Also, pass through the gold for adjusting liquid conduction insulating materials in fuse
Belong to composition of alloy, can effectively adjust the operating temperature of fuse.This preparation is simple, the adjustable fusing utensil of operating temperature
Have wide practical use.
Experimental example 4
This test example demonstrates the cubical expansivity of gallium Base Metal and bismuthino metal in solidification, calculates expansion according to the following formula
Rate:
VLAnd VSRespectively represent the volume of solid metallic and liquid metal, ρLAnd ρSRespectively represent solid metallic and liquid gold
The density of category；Therefore, cubical expansivity can be by calculating solid metallic and liquid metal density difference and liquid metal density
The ratio of value obtains.Specifically, density of the gallium in solid-state and liquid is respectively 5.9g/cm3 6.08g/cm3.Bismuth is solid
Density when state and liquid is respectively 9.75g/cm3And 10.05g/cm3.Gallium and bismuth the metal body in solidification have been calculated as a result,
Product can expand, and expansion rate is respectively 3.05% and 3.08%.
Although above having used general explanation, specific embodiment and test, the present invention is made to retouch in detail
It states, but on the basis of the present invention, it can be made some modifications or improvements, this is apparent to those skilled in the art
's.Therefore, these modifications or improvements without departing from theon the basis of the spirit of the present invention, belong to claimed
Range.
Claims (10)
1. a kind of liquid conduction insulating materials, which is characterized in that the liquid conduction insulating materials is by metal alloy and solvent group
Density when at, the solid-state of the metal alloy is less than density when liquid, and the viscosity of the solvent is 0.2~500mpa.s.
2. liquid conduction insulating materials according to claim 1, which is characterized in that the viscosity of the solvent be 0.5~
20mpa.s。
3. liquid conduction insulating materials according to claim 1 or 2, which is characterized in that the metal alloy is selected from gallium, gallium
One or more of based alloy, bismuth, bismuth-base alloy.
4. a kind of liquid conduction insulating materials, which is characterized in that the liquid conduction insulating materials is by metal alloy and solvent group
At；The metal alloy is GaIn24.5、Bi31.6In48.8Sn19.6、Ga、Ga61In25Sn13Zn1, Bi, one of, the solvent
For dimethicone.
5. liquid conduction insulating materials according to claim 4, which is characterized in that the volume of the metal alloy and solvent
Than for 1:0.3~1.
6. liquid conduction insulating materials according to claim 5, which is characterized in that the volume of the metal alloy and solvent
Than for 1:0.4.
7. the preparation method of the described in any item liquid conduction insulating materials of claim 1~6 characterized by comprising will be golden
Belong to after alloy is dispersed into metal alloy particle and being mixed with solvent.
8. preparation method according to claim 7, which is characterized in that the partial size of the metal alloy particle be 1 μm~
1mm。
9. preparation method according to claim 8, which is characterized in that the partial size of the metal alloy particle is 10~100 μ
m。
10. the described in any item liquid conduction insulating materials of claim 1~6 and the described in any item preparations of claim 7~9
The application of method in electronic field.
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2019
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| CN105088043A (en) * | 2015-09-17 | 2015-11-25 | 河北安耐哲新能源技术有限公司 | Liquid alloy, preparing method of liquid alloy and application of liquid alloy |
| CN106782877A (en) * | 2016-11-28 | 2017-05-31 | 云南科威液态金属谷研发有限公司 | A kind of method of metal surface electric field in uniform electric insulation equipment |
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