CN100396426C - Al-Cu-Sn series lead-free soldering tin - Google Patents
Al-Cu-Sn series lead-free soldering tin Download PDFInfo
- Publication number
- CN100396426C CN100396426C CNB2005100619436A CN200510061943A CN100396426C CN 100396426 C CN100396426 C CN 100396426C CN B2005100619436 A CNB2005100619436 A CN B2005100619436A CN 200510061943 A CN200510061943 A CN 200510061943A CN 100396426 C CN100396426 C CN 100396426C
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- CN
- China
- Prior art keywords
- soldering tin
- pure
- free soldering
- quartz glass
- series lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 17
- 238000005476 soldering Methods 0.000 title claims abstract description 14
- 239000012535 impurity Substances 0.000 claims abstract description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 22
- 229910052718 tin Inorganic materials 0.000 abstract description 18
- 230000008018 melting Effects 0.000 abstract description 15
- 238000002844 melting Methods 0.000 abstract description 15
- 229910052802 copper Inorganic materials 0.000 abstract description 12
- 239000000203 mixture Substances 0.000 abstract description 12
- 229910052782 aluminium Inorganic materials 0.000 abstract description 11
- 239000002994 raw material Substances 0.000 abstract description 11
- 230000006698 induction Effects 0.000 abstract description 9
- 230000005496 eutectics Effects 0.000 abstract description 2
- 238000003723 Smelting Methods 0.000 abstract 1
- 239000000956 alloy Substances 0.000 description 21
- 229910000679 solder Inorganic materials 0.000 description 15
- 238000000113 differential scanning calorimetry Methods 0.000 description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 238000007789 sealing Methods 0.000 description 5
- 238000010792 warming Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 4
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 230000031709 bromination Effects 0.000 description 2
- 238000005893 bromination reaction Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 238000007726 management method Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 229910018182 Al—Cu Inorganic materials 0.000 description 1
- 241000282414 Homo sapiens Species 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- ZCILODAAHLISPY-UHFFFAOYSA-N biphenyl ether Natural products C1=C(CC=C)C(O)=CC(OC=2C(=CC(CC=C)=CC=2)O)=C1 ZCILODAAHLISPY-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The present invention discloses Al-Cu-Sn series lead-free soldering tin which comprises the components of the proportion by weight: 0.1 to 3.0% of Al, 0.1 to 10.0% of Cu, Sn as the rest and inevitable impurities. The Al-Cu-Sn series lead-free soldering tin is similar to eutectic compositions, and the melting point of the Al-Cu-Sn series lead-free soldering tin is from 228 to 233 DEG C. The present invention has the advantages of simple component, plentiful Sn, Al and Cu raw material resource and low cost. The melting points of lead-free soldering tin with the same components smelted by a quartz glass pipe and a vacuum induction smelting furnace are same.
Description
Technical field
The present invention relates to soldering tin material, particularly a kind of Al-Cu-Sn series lead-free soldering tin material that is suitable for fields such as electronics assembling and encapsulation and electric equipment, Communication Equipment.
Background technology
Use Sn
63Pb
37Contain lead in the electronic product of scolding tin manufacturing inevitably, such electronic product go out of use or removal process in, environment is polluted, human beings'health is brought harm.For eliminate in the waste electronic product plumbous to environment pollution and to the harm of people's health.China Ministry of Information Industry has formulated " electronics and IT products prevention and cure of pollution management method " in March, 2003 and has clearly stipulated: " producer should take measures to gradually reduce and superseded electronics and IT products in the content of lead, mercury, cadmium, Cr VI, polymerization bromination biphenyl (PBB), polymerization bromination biphenyl ether (PBDE) and other poisonous and harmful substance ".Therefore, according to " electronics and IT products prevention and cure of pollution management method ", must replace having lead welding tin with Pb-free solder.Electronics and IT products relate to numerous areas such as electronic communication product, computer product, domestic electronic appliances, electronic material product, and these products will be used scolding tin inevitably.Use more Sn at present
96.5Ag
3.5Pb-free solder, because of containing silver, cost is higher.
Summary of the invention
The object of the present invention is to provide lower, the environment amenable Al-Cu-Sn series lead-free soldering tin of a kind of cost.
Al-Cu-Sn series lead-free soldering tin of the present invention, its component and weight percent content are: when the weight percent content of Al was 0.1～2.0%, the weight percent content of Cu was 6～10.0%; When the weight percent content of Al was 3.0%, the weight percent content of Cu was 0.1～2.0%, and all the other are Sn and unavoidable impurities.
The method for preparing the Al-Cu-Sn series lead-free soldering tin has following two kinds:
1) be raw material with pure Al, pure Cu, pure Sn, 0.1～3.0%Al by weight percentage, 0.1～10.0%Cu, all the other are Sn, the alloyage material;
2) alloy material is packed into diameter is in the quartz glass tube of 10～20mm, vacuumizes the flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into electric furnace, be warming up to 800～900 ℃ with 1～3 ℃/minute speed then, be incubated 1～4 hour, be cooled to 200～300 ℃, take out quartz glass tube and also put into cold water immediately, obtain Pb-free solder.
Method 2, step is as follows:
1) be raw material with pure Al, pure Cu, pure Sn, 0.1～3.0%Al by weight percentage, 0.1～10.0%Cu, all the other are Sn, the alloyage material;
2) alloy material is packed in the vacuum induction melting furnace, vacuumize, charge into argon gas then, melting under 850～1100 ℃ of temperature, the casting of fusing back obtains the Pb-free solder alloy ingot.
The invention has the beneficial effects as follows:
The Al-Cu-Sn series lead-free soldering tin of invention approaches eutectic composition, and composition is simple, and according to the difference of component content, its fusing point is at 228～232 ℃.Sn, Al, Cu raw material resources are enriched, and cost is low, and are identical with the fusing point of the Pb-free solder of the same composition of vacuum induction melting furnace melting with quartz glass tube.
Description of drawings
Fig. 1 is differential scanning calorimetry (DSC) curve of the embodiment of the invention 1 Pb-free solder at intensification and temperature-fall period;
Fig. 2 is that the embodiment of the invention 2 Pb-free solders are at the DSC of temperature-rise period curve;
Fig. 3 is the DSC curves of the embodiment of the invention 3 Pb-free solders at intensification and temperature-fall period.
The specific embodiment
Further specify the present invention below in conjunction with example.
1) be raw material with pure Al, pure Cu, pure Sn, prepare the 1kg alloy material by weight percentage, wherein 30.0gAl, 10.0g Cu, all the other are Sn and unavoidable impurities;
2) alloy material is packed in the vacuum induction melting furnace, vacuumize, charge into argon gas then;
3) regulate induction melting furnace power, make furnace temperature reach 950 ℃ carry out melting after, be cast into the bar that diameter is 28mm, be machined into the tensile sample that diameter is 5mm, and the measurement of differential scanning calorimetry (DSC) curve is carried out in sampling, the composition of Pb-free solder sample is 3.0%Al, 1.0%Cu, and all the other are Sn and unavoidable impurities.
The fusing point of DSC test sample product is 231.1 ℃, and hot strength is 6.0MPa, and percentage elongation is 23.1%, and Fig. 1 is that this sample heats up, the DSC curve of temperature-fall period.
Embodiment 2
1) be raw material with pure Al, pure Cu, pure Sn, prepare 50 gram alloy materials by weight percentage, wherein 0.5g Al, 2.0g Cu, all the other are Sn and unavoidable impurities;
2) alloy material is packed into diameter is in the quartz glass tube of 12mm, vacuumizes, under the condition that keeps the alloy material temperature not raise, at the thermal-flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into vertical electric furnace, be warming up to 900 ℃ with 2 ℃/minute speed, be incubated outage after 2 hours, cool to 300 ℃ with the furnace, take out quartz glass tube and put into cold water immediately, obtain the Pb-free solder sample, composition is 1.0%Al, 4.0%Cu, and all the other are Sn and unavoidable impurities.
Sample is machined into the tensile sample that diameter is 5mm, and take a sample and carry out the measurement of differential scanning calorimetry (DSC) curve, the fusing point of this sample is 231.9 ℃, hot strength is 31.0MPa, percentage elongation is 21.0%, and Fig. 2 is the DSC curve of this sample temperature-rise period.
Embodiment 3
1) be raw material with pure Al, pure Cu, pure Sn, prepare the 1kg alloy material by weight percentage, wherein 10.0gAl, 60.0g Cu, all the other are Sn and unavoidable impurities;
2) alloy material is packed in the vacuum induction melting furnace, vacuumize, charge into argon gas then;
3) regulate induction melting furnace power, make furnace temperature reach 1000 ℃ carry out melting after, be cast into the bar that diameter is 28mm, the composition of Pb-free solder sample be 1.0%Al, 6.0%Cu all the other be Sn and unavoidable impurities.
The fusing point that is recorded sample by DSC is 228.3 ℃, and Fig. 3 is that this sample heats up, the DSC curve of temperature-fall period.
Embodiment 4
1) be raw material with pure Al, pure Cu, pure Sn, prepare by weight percentage 50 the gram alloy materials, wherein 0.5g Al, 3.0g Cu all the other be Sn and unavoidable impurities;
2) alloy material is packed into diameter is in the quartz glass tube of 12mm, vacuumizes, under the condition that keeps the alloy material temperature not raise, at the thermal-flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into vertical electric furnace, be warming up to 800 ℃ with 2 ℃/minute speed, be incubated outage after 2 hours, cool to 300 ℃ with the furnace, take out quartz glass tube and put into cold water immediately, obtain the Pb-free solder sample, composition is 1.0%Al, 6.0%Cu, and all the other are Sn and unavoidable impurities.
The fusing point of being measured this sample by differential scanning calorimetry (DSC) is 228.7 ℃, and the fusing point that records with embodiment 3 is identical.
1) be raw material with pure Al, pure Cu, pure Sn, prepare the 1kg alloy material by weight percentage, wherein 30.0gAl, 20.0g Cu, all the other are Sn and unavoidable impurities;
2) alloy material is packed in the vacuum induction melting furnace, vacuumize, charge into argon gas then;
3) regulate induction melting furnace power, make furnace temperature reach 900 ℃ carry out melting after, be cast into the bar that diameter is 28mm, be machined into the tensile sample that diameter is 5mm, and sampling carries out the measurement of differential scanning calorimetry (DSC) curve, the composition of Pb-free solder sample be 3.0%Al, 2.0%Cu all the other be Sn and unavoidable impurities.
The fusing point that is recorded sample by DSC is 230.8 ℃, and hot strength is 60MPa, and percentage elongation is 18.0%.
Embodiment 6
1) be raw material with pure Al, pure Cu, pure Sn, prepare by weight percentage 100 the gram alloy materials, wherein 1.0g Al, 8.0g Cu all the other be Sn and unavoidable impurities;
2) alloy material is packed into diameter is in the quartz glass tube of 15mm, vacuumizes, under the condition that keeps the alloy material temperature not raise, at the thermal-flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into vertical electric furnace, be warming up to 850 ℃ with 2 ℃/minute speed, be incubated outage after 2 hours, cool to 300 ℃ with the furnace, take out quartz glass tube and put into cold water immediately, obtain the Pb-free solder sample, composition is 1.0%Al, 8.0%Cu, and all the other are Sn and unavoidable impurities.
The fusing point of being measured this sample by differential scanning calorimetry (DSC) is 227.9 ℃.
Embodiment 7
1) be raw material with pure Al, pure Cu, pure Sn, prepare by weight percentage 100 the gram alloy materials, wherein 1.0g Al, 10.0g Cu all the other be Sn and unavoidable impurities;
2) alloy material is packed into diameter is in the quartz glass tube of 15mm, vacuumizes, under the condition that keeps the alloy material temperature not raise, at the thermal-flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into vertical electric furnace, be warming up to 900 ℃ with 2 ℃/minute speed, be incubated outage after 2 hours, cool to 300 ℃ with the furnace, take out quartz glass tube and put into cold water immediately, obtain the Pb-free solder sample, composition is 1.0%Al, 10.0%Cu, and all the other are Sn and unavoidable impurities.
The fusing point of being measured this sample by differential scanning calorimetry (DSC) is 231.7 ℃.
Table 1 has been listed the typical composition of Sn-Al-Cu series lead-free soldering tin and the temperature of fusing point.
Table 1
Claims (1)
1. Al-Cu-Sn series lead-free soldering tin, it is characterized in that its component and weight percent content are: when the weight percent content of Al was 0.1～2.0%, the weight percent content of Cu was 6～10.0%; When the weight percent content of Al was 3.0%, the weight percent content of Cu was 0.1～2.0%, and all the other are Sn and unavoidable impurities.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100619436A CN100396426C (en) | 2005-12-12 | 2005-12-12 | Al-Cu-Sn series lead-free soldering tin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100619436A CN100396426C (en) | 2005-12-12 | 2005-12-12 | Al-Cu-Sn series lead-free soldering tin |
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| Publication Number | Publication Date |
|---|---|
| CN1775456A CN1775456A (en) | 2006-05-24 |
| CN100396426C true CN100396426C (en) | 2008-06-25 |
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ID=36765241
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100619436A Expired - Fee Related CN100396426C (en) | 2005-12-12 | 2005-12-12 | Al-Cu-Sn series lead-free soldering tin |
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| Country | Link |
|---|---|
| CN (1) | CN100396426C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105436738A (en) * | 2015-07-13 | 2016-03-30 | 深圳市国睿通用物理科技开发有限公司 | Low-temperature solder alloy and preparation method and application thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5973992B2 (en) * | 2011-04-08 | 2016-08-23 | 株式会社日本スペリア社 | Solder alloy |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985212A (en) * | 1996-12-12 | 1999-11-16 | H-Technologies Group, Incorporated | High strength lead-free solder materials |
| CN1443626A (en) * | 2003-04-16 | 2003-09-24 | 浙江大学 | Leadless welding flux with optimum informance and price ratio |
| JP2004261863A (en) * | 2003-01-07 | 2004-09-24 | Senju Metal Ind Co Ltd | Lead-free solder |
| JP2005125360A (en) * | 2003-10-23 | 2005-05-19 | Matsushita Electric Ind Co Ltd | Material of high-temperature solder, method for evaluating the same, electric/electronic equipment, and soldered structure |
-
2005
- 2005-12-12 CN CNB2005100619436A patent/CN100396426C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5985212A (en) * | 1996-12-12 | 1999-11-16 | H-Technologies Group, Incorporated | High strength lead-free solder materials |
| JP2004261863A (en) * | 2003-01-07 | 2004-09-24 | Senju Metal Ind Co Ltd | Lead-free solder |
| CN1443626A (en) * | 2003-04-16 | 2003-09-24 | 浙江大学 | Leadless welding flux with optimum informance and price ratio |
| JP2005125360A (en) * | 2003-10-23 | 2005-05-19 | Matsushita Electric Ind Co Ltd | Material of high-temperature solder, method for evaluating the same, electric/electronic equipment, and soldered structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105436738A (en) * | 2015-07-13 | 2016-03-30 | 深圳市国睿通用物理科技开发有限公司 | Low-temperature solder alloy and preparation method and application thereof |
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| Publication number | Publication date |
|---|---|
| CN1775456A (en) | 2006-05-24 |
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