CN1775457A - Lead-free soldering tin - Google Patents
Lead-free soldering tin Download PDFInfo
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- CN1775457A CN1775457A CN 200510061944 CN200510061944A CN1775457A CN 1775457 A CN1775457 A CN 1775457A CN 200510061944 CN200510061944 CN 200510061944 CN 200510061944 A CN200510061944 A CN 200510061944A CN 1775457 A CN1775457 A CN 1775457A
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- pure
- free solder
- quartz glass
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Abstract
The present invention discloses a leadless solder. Its composition includes (by wt%) 1.5-6.0% of Bi, 1.0-7.0% of Zn, 0.0-3.0% of Cu, 0.0-2% of Ag, 0.0-2.0% of Ni, 0.0-2.0% of mixed rare earth and the rest is Sn and inevitable impurity, in said mixed rare earth the elements of La, Ce and Nd are contained. Its melting point is approximate to that of Sn63 Pb37 solder.
Description
Technical field
The present invention relates to a kind of Pb-free solder.
Background technology
Use Sn
63Pb
37Contain lead in the electronic product of scolding tin manufacturing inevitably, such electronic product go out of use or removal process in, environment is polluted, people's health is brought harm.For eliminate in the waste electronic product plumbous to environment pollution and to the harm of people's health, must replace having lead welding tin with Pb-free solder.Sn
63Pb
37Scolding tin approaches eutectic composition, and its fusing point is 183 ℃.Use more Sn at present
96.5Ag
3.5The fusing point of Pb-free solder is 221 ℃, is significantly higher than Sn
63Pb
37In addition, contain In scolding tin Sn
77.2In
20Ag
2.8Fusing point be 178～189 ℃, approach Sn
63Pb
37The fusing point of scolding tin.Because the price height of In has limited the application that contains In scolding tin.Therefore, be necessary to develop a kind of fusing point and be lower than Sn
96.5Ag
3.5, approach Sn
63Pb
37The Pb-free solder of fusing point.
Summary of the invention
The object of the present invention is to provide a kind of fusing point near Sn
63Pb
37Scolding tin, lower-cost Pb-free solder.
Pb-free solder of the present invention, its component and weight percent content thereof are:
Bi 1.5～6.0％、
Zn 1.0～7.0％、
Cu 0.0～3.0％、
Ag 0.0～2％
Ni 0.0～2.0％
Mishmetal 0.0～2.0%, all the other are Sn and unavoidable impurities, contain La, Ce and Nd element in the mishmetal.
Above-mentioned mishmetal can be the commercial goods.
The preparation method of Pb-free solder of the present invention, its step is as follows:
1) be raw material with pure Bi, pure Zn, pure Cu, pure Ag, pure Ni, mishmetal, pure Sn, percentage composition 1.5～6.0%Bi, 1.0～7.0%Zn, 0.0～3.0%Cu, 0.0～2%Ag, 0.0～2.0%Ni, 0.0～2.0% mishmetal, surplus Sn by weight, the alloyage material;
2) alloy material is packed into diameter is in the quartz glass tube of 12～20mm, maybe when containing mishmetal, earlier prepare tin-mixed rare earth alloy with vacuum non-consumable arc furnace, the diameter of then tin-mixed rare earth alloy and other composition being packed into together is in the quartz glass tube of 12～20mm, vacuumize, under the condition that keeps the alloy material temperature not raise, at the thermal-flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into vertical electric furnace, be warming up to 800～900 ℃ with 1～3 ℃/minute speed, be incubated outage after 1～4 hour, cool to 200～300 ℃ with the furnace, take out quartz glass tube and put into cold water immediately, obtain the Pb-free solder sample.
In addition to the above methods, perhaps also can adopt the Pb-free solder of vacuum induction melting furnace melting large volume.
The fusing point of Pb-free solder alloy of the present invention is near Sn
63Pb
37Scolding tin, cost significantly are lower than the Pb-free solder that contains indium, can be used as to substitute Sn
63Pb
37The Pb-free solder alloy of scolding tin.
Description of drawings
Fig. 1 is that Pb-free solder is heating up and differential scanning calorimetric (DSC) curve of temperature-fall period in the embodiment of the invention 1;
Fig. 2 is that Pb-free solder is heating up and the DSC curve of temperature-fall period in the embodiment of the invention 2.
The specific embodiment
Further specify the present invention below in conjunction with example.
Embodiment 1
1) be raw material with pure Bi, pure Zn, pure Ni, pure Sn, prepare 100 gram alloy materials by weight percentage, wherein 5.0gBi, 6.0gZn, 1.0gNi, all the other are Sn and unavoidable impurities;
2) alloy material is packed into diameter is in the quartz glass tube of 15mm, vacuumizes, under the condition that keeps the alloy material temperature not raise, at the thermal-flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into vertical electric furnace, be warming up to 900 ℃ with 2 ℃/minute speed, be incubated outage after 2 hours, cool to 300 ℃ with the furnace, take out quartz glass tube and put into cold water immediately, obtain the Pb-free solder sample, composition is 5.0%Bi, 6.0%Zn, 1.0%Ni, all the other are Sn and unavoidable impurities, and it is 204.5 ℃ with the liquidus point temperature that the solidus temperature is 186.0 ℃, and Fig. 1 is the DSC curve of this sample.
Embodiment 2
1) be raw material with pure Bi, pure Zn, pure Cu, mishmetal, pure Sn, prepare the 1kg alloy material by weight percentage, wherein 50.0gBi, 60.0gZn, 10.0gCu, 10.0g mishmetal, all the other are Sn and unavoidable impurities;
2) contain the scolding tin of rare earth for the ease of preparation, prepare tin-mixed rare earth alloy with vacuum non-consumable arc furnace earlier; Tin-mixed rare earth alloy with Cu sheet parcel, is put into loading hopper, other alloy materials are packed in the vacuum induction melting furnace, vacuumize, charge into argon gas then;
3) regulate induction melting furnace power, make furnace temperature reach 1000 ℃ carry out melting after, add tin-mixed rare earth alloy with Cu sheet parcel, be cast into the bar that diameter is 28mm after the melting, the measurement of differential scanning calorimetry (DSC) curve is carried out in sampling, the composition of Pb-free solder sample is 5.0%Bi, 6.0%Zn, 1.0%Cu, 1.0% mishmetal, and all the other are Sn and unavoidable impurities;
4) solidus of DSC test sample product is that 181.1 ℃, liquidus point are 207.4 ℃, and Fig. 2 is that this sample heats up, the DSC curve of temperature-fall period.
Embodiment 3
1) be raw material with pure Bi, pure Zn, pure Ni, mishmetal, pure Sn, prepare the 1kg alloy material by weight percentage, wherein 50.0gBi, 60.0gZn, 5.0gNi, 10.0g mishmetal, all the other are Sn and unavoidable impurities;
2) contain the scolding tin of rare earth for the ease of preparation, prepare tin-mixed rare earth alloy with vacuum non-consumable arc furnace earlier; Tin-mixed rare earth alloy with Ni sheet parcel, is put into loading hopper, other alloy materials are packed in the vacuum induction melting furnace, vacuumize, charge into argon gas then;
3) regulate induction melting furnace power, make furnace temperature reach 950 ℃ carry out melting after, add tin-mixed rare earth alloy with Ni sheet parcel, be cast into the bar that diameter is 28mm after the melting, the measurement of differential scanning calorimetry (DSC) curve is carried out in sampling, the composition of Pb-free solder sample is 5.0%Bi, 6.0%Zn, 0.5%Ni, 1.0% mishmetal, and all the other are Sn and unavoidable impurities;
4) solidus of DSC test sample product is that 187.5 ℃, liquidus point are 211.2 ℃.
Embodiment 4
1) be raw material with pure Bi, pure Zn, pure Cu, pure Sn, prepare 50 gram alloy materials by weight percentage, wherein 2.5gBi, 3.0gZn, 0.5gCu, all the other are Sn and unavoidable impurities;
2) alloy material is packed into diameter is in the quartz glass tube of 12mm, vacuumizes, under the condition that keeps the alloy material temperature not raise, at the thermal-flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into vertical electric furnace, be warming up to 900 ℃ with 2 ℃/minute speed, be incubated outage after 2 hours, cool to 300 ℃ with the furnace, take out quartz glass tube and put into cold water immediately, obtain the Pb-free solder sample, composition is 5.0%Bi, 6.0%Zn, 1.0%Cu, all the other are Sn and unavoidable impurities, and it is 195.8 ℃ with the liquidus point temperature that the solidus temperature is 187.7 ℃.
Embodiment 5
1) be raw material with pure Bi, pure Zn, pure Cu, pure Sn, prepare the 1kg alloy material by weight percentage, wherein 50.0gBi, 60.0gZn, 5.0gCu, all the other are Sn and unavoidable impurities;
2) alloy material is packed in the vacuum induction melting furnace, vacuumize, charge into argon gas then;
3) regulate induction melting furnace power, make furnace temperature reach～1000 ℃ carry out melting after, be cast into the bar that diameter is 28mm, the measurement of differential scanning calorimetry (DSC) curve is carried out in sampling, the composition of Pb-free solder sample is 5.0%Bi, 6.0%Zn, 0.5%Cu, and all the other are Sn and unavoidable impurities;
4) solidus of DSC test sample product is that 185.5 ℃, liquidus point are 213.0 ℃.
Embodiment 6
1) be raw material with pure Bi, pure Zn, pure Cu, pure Sn, prepare 50 gram alloy materials by weight percentage, wherein 1.25gBi, 1.5gZn, 0.5gCu, all the other are Sn and unavoidable impurities;
2) alloy material is packed into diameter is in the quartz glass tube of 12mm, vacuumizes, under the condition that keeps the alloy material temperature not raise, at the thermal-flame lower seal quartz glass mouth of pipe;
3) quartz glass tube of sealing is put into vertical electric furnace, be warming up to 900 ℃ with 2 ℃/minute speed, be incubated outage after 2 hours, cool to 300 ℃ with the furnace, take out quartz glass tube and put into cold water immediately, obtain the Pb-free solder sample, composition is 2.5%Bi, 3.0%Zn, 1.0%Cu, all the other are Sn and unavoidable impurities, and it is 216.9 ℃ with the liquidus point temperature that the solidus temperature is 190.8 ℃.
Table 1 has been listed the temperature of typical composition, solidus and the liquidus point of Pb-free solder of the present invention.
Table 1
| No | Composition (weight %) | The point (℃) | |||||||
| Bi | Zn | Cu | Ag | Ni | Mishmetal | Sn | Solidus | Liquidus point | |
| 1 | 5.0 | 6.0 | 1.0 | Surplus | 186.0 | 204.5 | |||
| 2 | 5.0 | 6.0 | 1.0 | 1.0 | Surplus | 181.1 | 207.4 | ||
| 3 | 5.0 | 6.0 | 0.5 | 1.0 | Surplus | 187.5 | 211.2 | ||
| 4 | 5.0 | 6.0 | 1.0 | Surplus | 187.7 | 195.8 | |||
| 5 | 6.0 | 6.0 | 0.5 | Surplus | 185.5 | 213.0 | |||
| 6 | 2.5 | 3.0 | 1.0 | Surplus | 190.8 | 216.9 | |||
| 7 | 5.0 | 5.0 | 2.0 | 2.0 | Surplus | 178.8 | 209.2 | ||
| 8 | 5.0 | 6.0 | 2.0 | Surplus | 185.0 | 203.6 | |||
| 9 | 5.0 | 6.0 | 1.0 | 1.0 | Surplus | 183.6 | 196.1 | ||
| 10 | 1.5 | 7.0 | 0.1 | Surplus | 188.6 | 205.1 | |||
| 11 | 6.0 | 1.0 | 0.5 | Surplus | 181.0 | 206.2 | |||
Claims (1)
1. Pb-free solder is characterized in that its component and weight percent content thereof are:
Bi 1.5～6.0％、
Zn 1.0～7.0％、
Cu 0.0～3.0％、
Ag 0.0～2％
Ni 0.0～2.0％
Mishmetal 0.0～2.0%, all the other are Sn and unavoidable impurities, contain La, Ce and Nd element in the mishmetal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510061944 CN1775457A (en) | 2005-12-12 | 2005-12-12 | Lead-free soldering tin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510061944 CN1775457A (en) | 2005-12-12 | 2005-12-12 | Lead-free soldering tin |
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| Publication Number | Publication Date |
|---|---|
| CN1775457A true CN1775457A (en) | 2006-05-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510061944 Pending CN1775457A (en) | 2005-12-12 | 2005-12-12 | Lead-free soldering tin |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101804527A (en) * | 2010-04-06 | 2010-08-18 | 山东大学 | Sn-Zn based unleaded brazing material with low Zn |
| CN101618485B (en) * | 2009-08-03 | 2011-10-19 | 浙江强力焊锡材料有限公司 | Lead free brazing material |
| CN103212917A (en) * | 2013-03-22 | 2013-07-24 | 宁波市鄞州品达电器焊料有限公司 | Lead-free solder added with misch metal (rhenium-cerium) alloy |
| CN105195914A (en) * | 2015-10-27 | 2015-12-30 | 广东中实金属有限公司 | Tin-alloy powder for preparing electronic grade silver-bearing high strength lead-free solder paste |
| CN108465971A (en) * | 2018-02-28 | 2018-08-31 | 西安理工大学 | A kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys |
-
2005
- 2005-12-12 CN CN 200510061944 patent/CN1775457A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101618485B (en) * | 2009-08-03 | 2011-10-19 | 浙江强力焊锡材料有限公司 | Lead free brazing material |
| CN101804527A (en) * | 2010-04-06 | 2010-08-18 | 山东大学 | Sn-Zn based unleaded brazing material with low Zn |
| CN103212917A (en) * | 2013-03-22 | 2013-07-24 | 宁波市鄞州品达电器焊料有限公司 | Lead-free solder added with misch metal (rhenium-cerium) alloy |
| CN103212917B (en) * | 2013-03-22 | 2015-11-25 | 宁波市鄞州品达电器焊料有限公司 | A kind of lead-free solder adding mishmetal rhenium-cerium alloy |
| CN105195914A (en) * | 2015-10-27 | 2015-12-30 | 广东中实金属有限公司 | Tin-alloy powder for preparing electronic grade silver-bearing high strength lead-free solder paste |
| CN108465971A (en) * | 2018-02-28 | 2018-08-31 | 西安理工大学 | A kind of preparation method of low melting point Sn-Zn-Bi brazing filler metal alloys |
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