CN103212917B - A kind of lead-free solder adding mishmetal rhenium-cerium alloy - Google Patents
A kind of lead-free solder adding mishmetal rhenium-cerium alloy Download PDFInfo
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- CN103212917B CN103212917B CN201310115016.2A CN201310115016A CN103212917B CN 103212917 B CN103212917 B CN 103212917B CN 201310115016 A CN201310115016 A CN 201310115016A CN 103212917 B CN103212917 B CN 103212917B
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- rhenium
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Abstract
The invention discloses a kind of lead-free solder adding mishmetal rhenium-cerium alloy, described lead-free solder component comprises tin Sn, mishmetal rhenium Re-cerium Ce alloy, copper Cu, bismuth Bi, nickel, gallium Ga and germanium Ge; Wherein, the mass percent of each component is as follows: tin Sn88-90%; Mishmetal rhenium Re-cerium Ce alloy 2-5%; Copper Cu3-5%; Bismuth Bi0.5-2%; Nickel 0.1-0.5%; Gallium Ga0.005-0.01%; Germanium Ge0.005-0.01%; Each metal material after said ratio is put into melting furnace high temperature melting, stir, again the metal in stove is burnt and form ingot or strip, compare common lead-free solder, tensile strength promotes 100%, falling impacts increases by 2000 times, perfect coupling aircraft is to the high request of unleaded auxiliary material, can adapt to suppress, the extreme environments such as high/low temperature, be specially adapted to the wiring board assembling of aerospace flight vehicle instrument, and this soldering tin product are due in manufacture craft, do not add lead metal, also meet unleaded environmental requirement simultaneously.
Description
Technical field
The present invention relates to soldering tin material, be specifically related to a kind of alloy lead-free solder adding mishmetal rhenium-cerium.
Background technology
At present along with the development of China's Aero-Space cause, aircraft interior assembling instrument wiring board weld due to be under pressure wait external environmental factor affect, cause the scolding tin obscission that happens occasionally, potential safety hazard is created to the use of most advanced and sophisticated instrument, and due to lead-free solder tensile strength and falling impacts all the time cannot with have compared with kupper solder, the application of lead-free solder is limited to, and this environmental-friendly lead-free theory advocated with country is again disagreed.
Summary of the invention
Technical problem to be solved by this invention is to provide and is a kind ofly applied to aircraft and the lead-free solder of interpolation mishmetal rhenium-cerium alloy that all meets the demands of extensibility and falling impacts.
For solving the problem, the present invention is achieved through the following technical solutions: a kind of lead-free solder adding mishmetal rhenium-cerium alloy, and described lead-free solder component comprises tin Sn, mishmetal rhenium Re-cerium Ce alloy, copper Cu, bismuth Bi, nickel, gallium Ga and germanium Ge; Wherein, the mass percent of each component is as follows: tin Sn88-90%; Mishmetal rhenium Re-cerium Ce alloy 2-5%; Copper Cu3-5%; Bismuth Bi0.5-2%; Nickel 0.1-0.5%; Gallium Ga0.005-0.01%; Germanium Ge0.005-0.01%; Each metal material after said ratio is put into melting furnace high temperature melting, stirs, then the metal burning in stove is formed ingot or strip.
Further technical scheme, the main component of described mishmetal rhenium-cerium alloy is rhenium and cerium, wherein mass percent is rhenium 70-80%, cerium 20-30%, its manufacture craft first sinters by powder metallurgic method, then with crucible facture in proportion Melting And Solidification make alloy, secondary smelting to be used as uses.
The invention has the beneficial effects as follows: make in material at scolding tin and add mishmetal rhenium-cerium alloy, compare common lead-free solder, tensile strength promotes 100%, and falling impacts increases by 2000 times, and perfectly coupling aircraft is to the high request of unleaded auxiliary material, can adapt to suppress, the extreme environments such as high/low temperature, be specially adapted to the wiring board assembling of aerospace flight vehicle instrument, and this soldering tin product are due in manufacture craft, do not add lead metal, also meet unleaded environmental requirement simultaneously.
Detailed description of the invention
Following examples elaborate to the present invention, and each metal material and percentages are calculated.
Embodiment one
This lead-free solder carries out preparation experiment in following ratio:
The invention provides a kind of lead-free solder adding mishmetal rhenium-cerium alloy, described lead-free solder component comprises tin Sn, mishmetal rhenium Re-cerium Ce alloy, copper Cu, bismuth Bi, nickel, gallium Ga and germanium Ge; Wherein, the mass percent of each component is as follows: tin Sn88%; Mishmetal rhenium Re-cerium Ce alloy 2%; Copper Cu5%; Bismuth Bi1%; Nickel 0.2%; Gallium Ga0.005%; Germanium Ge0.005%; Each metal material after said ratio is put into melting furnace high temperature melting, stirs, then the metal burning in stove is formed ingot or strip, wherein, the mass percent of mishmetal rhenium-cerium alloy is rhenium 75%, cerium 25%.
Then the scolding tin goods baked are carried out high pressure extension test, extensibility is 4.0 × 10N
2, promote 90% than common lead-free product, falling impacts test is more than 2000 times, and solder joint does not come off.
Embodiment two
This lead-free solder carries out preparation experiment in following ratio:
Add a lead-free solder for mishmetal rhenium-cerium alloy, described lead-free solder component comprises tin Sn, mishmetal rhenium Re-cerium Ce alloy, copper Cu, bismuth Bi, nickel, gallium Ga and germanium Ge; Wherein, the mass percent of each component is as follows: tin Sn90%; Mishmetal rhenium Re-cerium Ce alloy 5%; Copper Cu3%; Bismuth Bi1.5%; Nickel 0.1%; Gallium Ga0.01%; Germanium Ge0.01%; Each metal material after said ratio is put into melting furnace high temperature melting, stirs, then the metal burning in stove is formed ingot or strip, the mass percent of mishmetal rhenium-cerium alloy is rhenium 80%, cerium 20%.
Then the scolding tin goods baked are carried out high pressure extension test, extensibility is 4.0 × 10N2, promotes 100% than common lead-free product, and falling impacts test is more than 2000 times, and solder joint does not come off.
Below the present invention be described in detail, the above, be only the preferred embodiment of the present invention, when not limiting the scope of the present invention, namely allly does impartial change according to the application's scope and modify, all should still belong in covering scope of the present invention.
Claims (1)
1. add a lead-free solder for mishmetal rhenium-cerium alloy, it is characterized in that: described lead-free solder component comprises tin Sn, mishmetal rhenium Re-cerium Ce alloy, copper Cu, bismuth Bi, nickel, gallium Ga and germanium Ge; Wherein, the mass percent of each component is as follows:
Each metal material after said ratio is put into melting furnace high temperature melting, stirs, then the metal burning in stove is formed ingot or strip;
The main component of described mishmetal rhenium-cerium alloy is rhenium and cerium, wherein mass percent is rhenium 70-80%, cerium 20-30%, its manufacture craft first sinters by powder metallurgic method, then with crucible facture in proportion Melting And Solidification make alloy, secondary smelting to be used as uses.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310115016.2A CN103212917B (en) | 2013-03-22 | 2013-03-22 | A kind of lead-free solder adding mishmetal rhenium-cerium alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310115016.2A CN103212917B (en) | 2013-03-22 | 2013-03-22 | A kind of lead-free solder adding mishmetal rhenium-cerium alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103212917A CN103212917A (en) | 2013-07-24 |
| CN103212917B true CN103212917B (en) | 2015-11-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310115016.2A Expired - Fee Related CN103212917B (en) | 2013-03-22 | 2013-03-22 | A kind of lead-free solder adding mishmetal rhenium-cerium alloy |
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| CN (1) | CN103212917B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106271213A (en) * | 2015-05-22 | 2017-01-04 | 成都飞机工业（集团）有限责任公司 | A kind of titanium-zirconium-copper-nickel-based solder for titanium alloy soldering |
| CN110170762B (en) * | 2019-06-12 | 2021-07-23 | 烟台博瑞锡业科技有限公司 | High-temperature-resistant lead-free tin bar for transformer and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1249302A1 (en) * | 1999-11-18 | 2002-10-16 | Nippon Steel Corporation | Solder alloy, electronic member having solder ball and solder bump |
| CN1775457A (en) * | 2005-12-12 | 2006-05-24 | 黄德欢 | Lead-free soldering tin |
| CN1785579A (en) * | 2005-12-16 | 2006-06-14 | 亚通电子有限公司 | Lead les tin solder |
| CN101342641A (en) * | 2008-08-25 | 2009-01-14 | 天津大学 | Tin-silver-zinc system leadless soldering plaster and method of producing the same |
| CN101564803A (en) * | 2008-07-15 | 2009-10-28 | 广州冶炼厂 | Leadless solder of silverless Sn-Bi-Cu system and preparation method thereof |
| CN102233488A (en) * | 2010-05-07 | 2011-11-09 | 宁波卓诚焊锡科技有限公司 | Lead-free solder |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR980006783A (en) * | 1996-05-13 | 1998-03-30 | 이. 힐러 윌리엄 | Low cost phase locked motor control method and structure |
| US20020155024A1 (en) * | 2000-10-27 | 2002-10-24 | H-Technologies Group, Inc. | Lead-free solder compositions |
-
2013
- 2013-03-22 CN CN201310115016.2A patent/CN103212917B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1249302A1 (en) * | 1999-11-18 | 2002-10-16 | Nippon Steel Corporation | Solder alloy, electronic member having solder ball and solder bump |
| CN1775457A (en) * | 2005-12-12 | 2006-05-24 | 黄德欢 | Lead-free soldering tin |
| CN1785579A (en) * | 2005-12-16 | 2006-06-14 | 亚通电子有限公司 | Lead les tin solder |
| CN101564803A (en) * | 2008-07-15 | 2009-10-28 | 广州冶炼厂 | Leadless solder of silverless Sn-Bi-Cu system and preparation method thereof |
| CN101342641A (en) * | 2008-08-25 | 2009-01-14 | 天津大学 | Tin-silver-zinc system leadless soldering plaster and method of producing the same |
| CN102233488A (en) * | 2010-05-07 | 2011-11-09 | 宁波卓诚焊锡科技有限公司 | Lead-free solder |
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| CN103212917A (en) | 2013-07-24 |
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Granted publication date: 20151125 Termination date: 20160322 |