CN104400248A - Photovoltaic tin-alloy solder, and preparation method and use thereof - Google Patents

Photovoltaic tin-alloy solder, and preparation method and use thereof Download PDF

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Publication number
CN104400248A
CN104400248A CN201410576569.2A CN201410576569A CN104400248A CN 104400248 A CN104400248 A CN 104400248A CN 201410576569 A CN201410576569 A CN 201410576569A CN 104400248 A CN104400248 A CN 104400248A
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China
Prior art keywords
solder
tin
photovoltaic
alloy
preparation
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410576569.2A
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Chinese (zh)
Inventor
古列东
白海龙
刘宝权
张剑林
吕金梅
秦俊虎
赵玲彦
汪洋
黄迎红
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YUNNAN TIN MATERIAL CO Ltd
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YUNNAN TIN MATERIAL CO Ltd
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Publication date
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Priority to CN201410576569.2A priority Critical patent/CN104400248A/en
Publication of CN104400248A publication Critical patent/CN104400248A/en
Pending legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24Selection of soldering or welding materials proper
    • B23K35/26Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262Sn as the principal constituent
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244Powders, particles or spheres; Preforms made therefrom
    • B23K35/025Pastes, creams, slurries
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40Making wire or rods for soldering or welding

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Conductive Materials (AREA)

Abstract

The invention discloses a photovoltaic tin-alloy solder, and a preparation method and use thereof, and belongs to the fields of photovoltaic welding belt welding and soft solders in electron industry. The alloy solder comprises the following components according to the total weight of: 0.2%-10% of bismuth, 0.1%-5% of stibium, 0.1%-3.5% of silver, 0.005%-0.2% of P, 0.005%-0.2% of Ge, 0.005%-0.2% of Ga, 0.005%-0.3% of Si, 0.005%-0.3% of rare-earth La and Ce or a mixture of rare-earth La and Ce, 0.005-0.3% of Ca, 0.005-0.3% of Mg and 0.005-0.05% of Ni, which are added to Sn or tin-lead alloy materials. The solder is a novel photovoltaic tin solder, which is relatively excellent in performance, relatively good in reliability, and relatively low in use cost; the photovoltaic tin-alloy solder has relatively good solderability and inoxidizability and excellent physical property, and is low in concentration of detrimental impurities.

Description

A kind of photovoltaic tin alloy solder, Preparation method and use
Technical field
The invention belongs to photovoltaic welding belt welding and electron trade solder field, be particularly useful for the welding procedures such as photovoltaic copper strip, wire and link material hot tinning, wave-soldering, hot air leveling, Reflow Soldering, spot welding.
Background technology
At present for the material of photovoltaic welding belt overlay coating, normally used solder is traditional tin-lead solder, as Sn60PbA, Sn63PbA, Sn62PbAg2 etc., and not for the interconnected welding of photovoltaic industry the hot tinning such as copper strips, wire, welding do the design and exploitation optimized.The product environment for use such as solar electrical energy generation, collecting plate of photovoltaic uses under being usually in the comparatively severe condition of comparatively large, the dry or moist environment of day and night temperature, this just requires that welding itself can bear the impact of certain cold and hot expansion, has good toughness and the distortion of opposing environment, cracking and the ability of shrinkage.
Enter 21 century, energy and environment problem becomes the problem that the mankind primarily solve, solar energy power generating, heat collector, environmental friendliness, the clean energy is brought to hundreds of millions common families, this has also driven further developing of photovoltaic industry welding material, use traditional tin-lead solder more superior to serviceability from simple, the alternative solders that cost is close or lower, provides necessary guarantee by the reliability to photovoltaic products, stability and comprehensive quality.
Summary of the invention
The object of this invention is to provide a kind of, Novel photovoltaic tin solder that better reliability, use cost lower more excellent than conventional tin-lead solders performance, product has good solderability, non-oxidizability and superior physical property, and the concentration of objectionable impurities is low.
Realizing the technical scheme that the object of the invention takes is: in Sn system or tin Pb alloy material, be added with the bismuth of solder gross weight 0.2 ~ 10%, the antimony of 0.1 ~ 5%, the silver of 0.1 ~ 3.5%.
The P of solder gross weight 0.005 ~ 0.2% is also comprised in this solder; The Ge of 0.005 ~ 0.2%; The Ga of 0.005 ~ 0.2%; The Si of 0.005 ~ 0.3%; The rare earth La of 0.005 ~ 0.3%, Ce or both mixing; The Ca of 0.005 ~ 0.3%; The Mg of 0.005 ~ 0.3%; The Ni of 0.005 ~ 0.05%.
Described in this, the preparation method of photovoltaic tin alloy solder is: frequently melt Sn system or tin Pb alloy material in stove in a vacuum in advance, be formulated into unclassified stores in proportion again, degassed-removal of impurities-stirring-modifier treatment is carried out in stove, leave standstill 20 ~ 40 minutes, then be mixed with final solder alloy in electromagnetic oven or intermediate frequency furnace.
In above-mentioned preparation method, after adding all raw materials of preparation solder, the charcoal absorption removing impurities of gross weight 0.1 ~ 2% should be added, stir 30 ~ 40 minutes, frequently prepare in stove in a vacuum, the vacuum of vacuum outgas is-0.1 ~ 0.2MPa, and temperature stabilization is at 260 ~ 300 DEG C again; Be cast into the solder alloy of 0.5 ~ 5kg different size with the mold of cooling after having prepared in electromagnetic oven or intermediate frequency furnace.
The alloy that this preparation method obtains is bar, rod, bar, silk, powder, cream material by pressure processing plastic forming.
Above-mentioned photovoltaic tin alloy solder can be used for the hot-dip of photovoltaic copper strip material, the tin creamy material of wave-soldering, spot welding and automatic welding and SMT surface printing.
Photovoltaic solder of the present invention is used for having the following advantages in photovoltaic industry welding.
1. compared with common solder, its solderability is more excellent, tests with Weldability detector or wetting balance, and its wetting time is less than 0.6 second, between 0.4 ~ 0.6 second;
2. molten copper rate is lower, and in photovoltaic copper strip hot tinning uses, its copper ramp-up rate as Sn60PbA compares than ordinary solder, raising as being about 0.001%, need not carry out copper removal in using one week for every 8 hours;
3. use this solder carry out photovoltaic zinc-plated time, carry out the degradation of about 1000 hours, tinned surface can not produce cracking, carries out 72 hours aging and salt spray tests, without obvious metachromatism;
4. use the photovoltaic copper strip of this solder, its tensile strength promotes more than 10% than traditional ordinary solder, and percentage elongation is higher than ordinary solder by 2 ~ 5%;
5. use cost is lower, and slag rate is lower, within its 8 hours, produces slag rate and is about 0.2%, far below the slag rate of more than 2% of ordinary solder.
Detailed description of the invention
embodiment 1:after tin (Sn99.90) being melted in frequency stove stove in a vacuum, addition element P (red phosphorus), surface adds plant ash or active carbon covers, temperature is elevated to 500 ~ 700 DEG C, stir 30 ~ 50 minutes under the effect in intermediate frequency furnace magnetic field, leave standstill 10 ~ 20 minutes, make the tin phosphorus alloy of 1%.According to this method, make tin germanium and other intermediate alloys of 3% equally, 260 DEG C are melted to by needing the tin of preparation, add Pb, Bi, Sb etc. successively, be warmed up to 280 ~ 320 DEG C, make Bi:1.0%, the tin-lead-bismuth antimony Sn60Pb40BiSb of Sb:0.2% and alloy, add batching total amount about 0.2% activated carbon in a furnace, 0.1%ZnCl or 0.1%NaOH carries out that technique is degassed, removing impurities process, adds micro-intermediate alloy tin phosphorus, tin germanium after completing again successively, and tin gallium, and take out 1 ~ 2kg carry out anti-oxidant slag rate experiment, within its hour, slag rate is lower than 0.2%.
embodiment 2:prepare corresponding intermediate alloy as described in Example 1, after fusing tin, make the SAC of Sn62PbAg2, add Bi:0.8%, Sb:0.4%, adds micro-intermediate alloy tin phosphorus, tin germanium again after completing, and tin gallium, and take out 1 ~ 2kg carry out anti-oxidant slag rate experiment, within its hour, slag rate is lower than 0.2%.
embodiment 3:prepare corresponding intermediate alloy as described in Example 1, after fusing tin, make the alloy of Sn63PbA, add Bi:1.5%, Sb:0.6%, adds micro-intermediate alloy tin phosphorus, tin germanium more successively after completing, and tin gallium, and take out 1 ~ 2kg carry out anti-oxidant slag rate experiment, within its hour, slag rate is lower than 0.2%.
embodiment 4:prepare corresponding intermediate alloy as described in Example 1, after fusing tin, make the alloy of SnAg0.3Cu0.7, add Bi:0.6%, Sb:0.4%, adds micro-intermediate alloy tin phosphorus, tin germanium more successively after completing, and tin gallium, and take out 1 ~ 2kg carry out anti-oxidant slag rate experiment, within its hour, slag rate is lower than 0.2%.
embodiment 5:prepare corresponding intermediate alloy as described in Example 1, after fusing tin, make the alloy of SnAg0.5Cu0.7, add Bi:0.6%, Sb:0.4%, adds micro-intermediate alloy tin phosphorus, tin germanium more successively after completing, and tin gallium, and take out 1 ~ 2kg carry out anti-oxidant slag rate experiment, within its hour, slag rate is lower than 0.2%.
embodiment 6:prepare corresponding intermediate alloy as described in Example 1, after fusing tin, make the alloy of SnAg0.8Cu0.7, add Bi:0.6%, Sb:0.4%, adds micro-intermediate alloy tin phosphorus, tin germanium more successively after completing, and tin gallium, and take out 1 ~ 2kg carry out anti-oxidant slag rate experiment, within its hour, slag rate is lower than 0.2%.
embodiment 7:prepare corresponding intermediate alloy as described in Example 1, after fusing tin, make the alloy of SnAg3.0Cu0.5, add Bi:0.6%, Sb:0.4%, adds micro-intermediate alloy tin phosphorus, tin germanium again after completing, and tin gallium, and take out 1 ~ 2kg carry out anti-oxidant slag rate experiment, within its hour, slag rate is lower than 0.2%.
The alloy of above example casts slivering, rod again; Pressure processing Plastic Forming is silk or is formed powder be mixed with tin cream by the mode of atomization, all can melt in copper strips hot tinning, spot welding and wave-soldering, spray tin (hot air leveling) or Reflow Soldering at photovoltaic industry and use.

Claims (6)

1. a photovoltaic tin alloy solder, is characterized in that: in Sn system or tin Pb alloy material, be added with the bismuth of solder gross weight 0.2 ~ 10%, the antimony of 0.1 ~ 5%, the silver of 0.1 ~ 3.5%.
2., by photovoltaic tin alloy solder according to claim 1, it is characterized in that: the P also comprising solder gross weight 0.005 ~ 0.2% in this solder; The Ge of 0.005 ~ 0.2%; The Ga of 0.005 ~ 0.2%; The Si of 0.005 ~ 0.3%; The rare earth La of 0.005 ~ 0.3%, Ce or both mixing; The Ca of 0.005 ~ 0.3%; The Mg of 0.005 ~ 0.3%; The Ni of 0.005 ~ 0.05%.
3. the preparation method of a photovoltaic tin alloy solder according to claim 1, it is characterized in that: frequently melt Sn system or tin Pb alloy material in stove in a vacuum in advance, be formulated into unclassified stores in proportion again, degassed-removal of impurities-stirring-modifier treatment is carried out in stove, leave standstill 20 ~ 40 minutes, then be mixed with final solder alloy in electromagnetic oven or intermediate frequency furnace.
4. by the preparation method of photovoltaic tin alloy solder according to claim 3, it is characterized in that: after adding all raw materials of preparation solder, the charcoal absorption removing impurities of gross weight 0.1 ~ 2% should be added, stir 30 ~ 40 minutes, frequently prepare in stove in a vacuum again, the vacuum of vacuum outgas is-0.1 ~ 0.2MPa, and temperature stabilization is at 260 ~ 300 DEG C; Be cast into the solder alloy of 0.5 ~ 5kg different size with the mold of cooling after having prepared in electromagnetic oven or intermediate frequency furnace.
5. by the preparation method of photovoltaic tin alloy solder according to claim 4, it is characterized in that: obtained alloy is bar, rod, bar, silk, powder, cream material by pressure processing plastic forming.
6. photovoltaic tin alloy solder according to claim 1 is for the preparation of the hot-dip of photovoltaic copper strip material, the application of the tin creamy material of wave-soldering, spot welding and automatic welding and SMT surface printing.
CN201410576569.2A 2014-10-24 2014-10-24 Photovoltaic tin-alloy solder, and preparation method and use thereof Pending CN104400248A (en)

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104801877A (en) * 2015-04-28 2015-07-29 太仓巨仁光伏材料有限公司 Soldering flux for confluence strap of solar cell module and preparation method of soldering flux
CN104979417A (en) * 2015-06-29 2015-10-14 同享(苏州)电子材料科技有限公司 Light reflecting welding strip and solar assembly
CN105195915A (en) * 2015-10-30 2015-12-30 苏州优诺电子材料科技有限公司 Low-temperature lead-free solder alloy
CN105252165A (en) * 2015-11-30 2016-01-20 苏州龙腾万里化工科技有限公司 Antimony-added soldering tin bar
CN106244851A (en) * 2016-08-31 2016-12-21 西安泰力松新材料股份有限公司 A kind of low temperature ashbury metal and preparation method thereof
WO2017101436A1 (en) * 2015-12-18 2017-06-22 王能青 Alloy solder, and preparation method therefor and use thereof
CN106903452A (en) * 2017-05-02 2017-06-30 泰州朗瑞新能源科技有限公司 One kind casting tin-lead welding material and preparation method thereof
CN108274147A (en) * 2017-12-22 2018-07-13 占卫君 A kind of efficient cryogenic welding, preparation method and photovoltaic module
CN108393608A (en) * 2018-02-13 2018-08-14 西安泰力松新材料股份有限公司 A kind of photovoltaic welding belt lead-free solder alloy and preparation method thereof
CN108555472A (en) * 2017-12-29 2018-09-21 西安泰力松新材料股份有限公司 A kind of photovoltaic welding belt solder and preparation method thereof
CN111390424A (en) * 2020-04-21 2020-07-10 深圳市唯特偶新材料股份有限公司 Tin-plated copper strip coating anti-oxidation solder alloy and preparation method thereof
CN114227058A (en) * 2021-12-29 2022-03-25 江苏太阳科技股份有限公司 Low-temperature antioxidant composite solder and preparation method and application thereof
CN115091072A (en) * 2022-07-01 2022-09-23 天津市松本环保科技有限公司 Solder wire alloy formula for automatic welding and manufacturing method
CN115365699A (en) * 2022-09-19 2022-11-22 云南锡业锡材有限公司 Sn-Ag-Cu series lead-free solder alloy without microcracks at welding spots and preparation method thereof
CN115401359A (en) * 2022-09-23 2022-11-29 晶科能源股份有限公司 Solder strip and preparation method thereof

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CN102776401A (en) * 2012-08-01 2012-11-14 云南锡业锡材有限公司 Preparation method of anaerobic tin based solder alloy
CN103100805A (en) * 2013-02-17 2013-05-15 云南锡业锡材有限公司 Preparation method for high-purity lead-free welding flux
CN103801853A (en) * 2012-11-06 2014-05-21 西北机器有限公司 Lead-free tin-based solder for solar photovoltaic module and preparation method thereof

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1073539A1 (en) * 1999-02-16 2001-02-07 Multicore Solders Limited Lead-free solder alloy powder paste use in pcb production
CN101132881A (en) * 2004-12-01 2008-02-27 爱尔发加热有限公司 Solder alloy
WO2007023288A2 (en) * 2005-08-24 2007-03-01 Fry's Metals Inc. Solder alloy
CN101007373A (en) * 2006-12-04 2007-08-01 云南锡业集团(控股)有限责任公司 Lead-free welding flux alloy
CA2808356A1 (en) * 2010-08-26 2012-03-01 Dynajoin Corporation Variable melting point solders
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Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104801877A (en) * 2015-04-28 2015-07-29 太仓巨仁光伏材料有限公司 Soldering flux for confluence strap of solar cell module and preparation method of soldering flux
CN104979417A (en) * 2015-06-29 2015-10-14 同享(苏州)电子材料科技有限公司 Light reflecting welding strip and solar assembly
CN104979417B (en) * 2015-06-29 2017-01-04 同享(苏州)电子材料科技有限公司 Reflective solder strip and solar components
CN105195915A (en) * 2015-10-30 2015-12-30 苏州优诺电子材料科技有限公司 Low-temperature lead-free solder alloy
CN105252165A (en) * 2015-11-30 2016-01-20 苏州龙腾万里化工科技有限公司 Antimony-added soldering tin bar
WO2017101436A1 (en) * 2015-12-18 2017-06-22 王能青 Alloy solder, and preparation method therefor and use thereof
CN106244851A (en) * 2016-08-31 2016-12-21 西安泰力松新材料股份有限公司 A kind of low temperature ashbury metal and preparation method thereof
CN106903452A (en) * 2017-05-02 2017-06-30 泰州朗瑞新能源科技有限公司 One kind casting tin-lead welding material and preparation method thereof
CN108274147A (en) * 2017-12-22 2018-07-13 占卫君 A kind of efficient cryogenic welding, preparation method and photovoltaic module
CN108555472A (en) * 2017-12-29 2018-09-21 西安泰力松新材料股份有限公司 A kind of photovoltaic welding belt solder and preparation method thereof
CN108393608A (en) * 2018-02-13 2018-08-14 西安泰力松新材料股份有限公司 A kind of photovoltaic welding belt lead-free solder alloy and preparation method thereof
CN108393608B (en) * 2018-02-13 2020-12-01 西安泰力松新材料股份有限公司 Lead-free alloy solder for photovoltaic solder strip and preparation method thereof
CN111390424A (en) * 2020-04-21 2020-07-10 深圳市唯特偶新材料股份有限公司 Tin-plated copper strip coating anti-oxidation solder alloy and preparation method thereof
CN114227058A (en) * 2021-12-29 2022-03-25 江苏太阳科技股份有限公司 Low-temperature antioxidant composite solder and preparation method and application thereof
CN115091072A (en) * 2022-07-01 2022-09-23 天津市松本环保科技有限公司 Solder wire alloy formula for automatic welding and manufacturing method
CN115365699A (en) * 2022-09-19 2022-11-22 云南锡业锡材有限公司 Sn-Ag-Cu series lead-free solder alloy without microcracks at welding spots and preparation method thereof
CN115401359A (en) * 2022-09-23 2022-11-29 晶科能源股份有限公司 Solder strip and preparation method thereof
CN115401359B (en) * 2022-09-23 2023-11-24 晶科能源股份有限公司 Solder strip and preparation method thereof

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Application publication date: 20150311