CN102699563A - Low-silver lead-free soft solder - Google Patents
Low-silver lead-free soft solder Download PDFInfo
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- CN102699563A CN102699563A CN2012102151280A CN201210215128A CN102699563A CN 102699563 A CN102699563 A CN 102699563A CN 2012102151280 A CN2012102151280 A CN 2012102151280A CN 201210215128 A CN201210215128 A CN 201210215128A CN 102699563 A CN102699563 A CN 102699563A
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Abstract
The invention discloses a low-silver lead-free soft solder, which is moderate in melting point, strong in tensile strength and low in cost. Based on the total weight of the solder, the solder contains 0.1 to 0.7 weight percent of Ag, 0.1 to 1.0 weight percent of Cu, 0.01 to 5 weight percent of Bi, 0.01 to 3 weight percent of Sb, 0 to 0.5 weight percent of Ni, 0.001 to 0.1 weight percent of P, 0.001 to 0.1 weight percent of X and the balance of Sn, wherein X is any one or combination of Ga, Ge and misch metal. The low-silver lead-free soft solder is applied to wave soldering, reflow soldering and manual soldering in the field of electronic and microelectronic packaging.
Description
Technical field
The present invention relates to a kind of lead-free brazing, this solder is particularly suitable for wave-soldering, Reflow Soldering and the manual welding in electronics and microelectronics Packaging field.
Background technology
For adapting to the nontoxic requirement of electronics and IT products, lead-free brazing is widely used at electronics and microelectronics industry in recent years.The lead-free brazing of Sn (3.0-3.9) Ag (0.5-0.7) Cu high silver content wherein obtains the popularization of industry owing to having better comprehensive mechanical property and processing performance.Yet; Along with green unleaded deep enforcement and propelling; Electronics industry circle is found; In consumption electronic product transportation and military service process, receive unexpectedly easily and jolt, shake, collide and fall, thereby introduce a kind of new inefficacy mechanism that causes by mechanical shock in the electronics assembling interconnection, and the solder of high silver content problem in this respect is particularly outstanding.The lead-free brazing of low silver content has toughness preferably, aspect anti-dropping capability, is superior to this high silver solder such as Sn3.0Ag0.5Cu, and material cost descends to some extent, in the industry cycle receives extensive concern.The second generation lead-free brazing scheme that the JEITA of Information Industry Association of NEC released in 2007 is low-silver solder.Very likely can bring a series of problem but low-silver lead-free solder is used for the electronics assembling, descend like tensile strength, fusing point is too high, and oxidation is serious, and thermal fatigue property is relatively poor, reprocesses difficulty, low-melting alloy segregation etc.For solving the solder problem of oxidation, No. 200910042771.6 one Chinese patent application add micro-P on low silver alloy basis, Ga, and Ge reduces the oxidation in the wave-soldering process, solves problems such as solder joint bridging and wetability deficiency simultaneously.For reducing fusing point, No. 200810026634.9 one Chinese patent application has been announced a kind of low silver leadless solder, and its Bi content is 1-5%, and this solder has good soldering processes performance and comprehensive mechanical property simultaneously.Yet a lot of existing literature only are absorbed in a certain or two performances improving solder, and ignore other performances, and its application is restricted.
Summary of the invention
The present invention will solve that present low silver leadless solder fusing point is too high, and tensile strength is low, problems such as non-oxidizability difference; Provide a kind of fusing point of the present invention moderate, low cost, good in oxidation resistance for this reason; Good mechanical properties; Wetability is good, and the molten low low-silver lead-free soft solder of copper rate is beneficial to practicability and industrialization.
For addressing the above problem, the technical scheme that the present invention adopts, its special character is to be that benchmark contains with said solder gross weight:
Ag?0.1-0.7%，
Cu?0.1-1.0?%，
Bi?0.01-5%，
Sb?0.01-3%，
Ni?0?-0.5?%，
P?0.001-0.1?%，
X 0.001-0.1 %, the Sn surplus; Said X is a kind of or any several kinds combination in Ga, Ge, the mishmetal.
The present invention preferably contains:
Ag?0.2-0.5%，Cu?0.4-0.8?%，?Bi?0.5-2.5%，?Sb?0.5-2%，Ni?0.02-0.3?%，P?0.002-0.02?%，X?0.002-0.02?%。
The preparation method of low-silver lead-free soft solder of the present invention: in proportion with the Sn-Cu intermediate alloy, Sn-Ag intermediate alloy, Sn-Bi intermediate alloy; Sn-Ni intermediate alloy and Sn ingot are put into vacuum melting furnace or non-vacuum melting stove; At 500 ℃ of left and right sides melting 0.5-1h, then with the Sn-P intermediate alloy, the Sn-X intermediate alloy joins in the smelting furnace; Fully stir before coming out of the stove, prepare required brazing filler metal alloy.
Low-silver lead-free soft solder alloy melting point of the present invention belongs to moderate in the sector application, and its tensile strength is not less than 40MPa.
Be made into any or multiple in solder foundry alloy or solder piece, welding rod, welding wire, soldered ball, welding powder, the soldering paste when the present invention prepares, be applied to electronics and microelectronics assembling field.
A kind of low-silver lead-free soft solder alloy of the present invention is nontoxic, pollution-free, and cost is low, and non-oxidizability is strong, and good combination property satisfies welding requirements such as wave-soldering, Reflow Soldering and manual welding.
Compared with prior art, the present invention has following remarkable result:
1 solder Ag content of the present invention is lower, compares SAC305, has practiced thrift the solder cost.
The fusing point of 2 novel alloys of the present invention is moderate, and existing process equipment capable of using carries out the electronics assembling.
Add the anti-oxidant of the P of trace as solder in the 3 low-silver lead-free soft solders of the present invention, the non-oxidizability of solder is significantly improved.
Add Bi in the 4 low-silver lead-free soft solders of the present invention, reduced the fusing point of solder, improved the wetting behavior of solder, improved the tensile strength of solder.
Add Sb in the 5 low-silver lead-free soft solders of the present invention, improved the mechanical property of solder, improved the reliability of solder.
Added Ni in the 6 low-silver lead-free soft solders of the present invention, reduced the corrode of solder when having reduced the brazing filler metal alloy brazed copper copper base; Refinement simultaneously compound pattern between interface metal, improved the reliability of solder joint.
Added Ga in the 7 low-silver lead-free soft solders of the present invention, a kind of or any several kinds of combinations in Ge and the mishmetal can make alloy under molten condition, have oxidation resistance and wettability preferably.
The specific embodiment
Lead-free solder of the present invention is a benchmark with its weight, and contained component and content thereof are provided by the embodiment of table 1, and tensile strength, fusing point, the rate of spread and the antioxygenic property of test implementation example and comparative example.
The component of the percentage composition among the embodiment is fed intake with the intermediate alloy form, in proportion with the Sn-Cu intermediate alloy, the Sn-Ag intermediate alloy; The Sn-Bi intermediate alloy; Sn-Ni intermediate alloy and Sn ingot are put into vacuum melting furnace or non-vacuum melting stove, at 500 ℃ of left and right sides melting 0.5-1h, then with the Sn-P intermediate alloy; The Sn-X intermediate alloy joins in the smelting furnace; And fully stir, casting solidification obtains brazing filler metal alloy, also can be processed into solder piece, solder bar, welding wire, weld tabs, soldered ball, welding powder or soldering paste.
Table 1 embodiment and Comparative Examples technical indicator
Annotate: 1. table 1 result all accomplishes under same test conditions.
2. the liquid film flavescence time is an index of scalar alloy oxidation (resistance to oxidation).
Lead-free solder of the present invention is nontoxic, pollution-free, cost is low, it is moderate to have good cold and hot working performance, a fusing point; Advantages such as good, the molten copper rate of good in oxidation resistance, good mechanical properties, wetability is low; Be suitable for wave-soldering, Reflow Soldering and the manual welding in electronics and microelectronics Packaging field, be worth of widely use.
Although describe the present invention with embodiment, these embodiment explain not limit the present invention.For a person skilled in the art, should be understood that, under the situation of the scope of in not deviating from claim of the present invention, being asked for protection, can carry out various improvement and variation above-mentioned embodiment.
Claims (2)
1. a low-silver lead-free soft solder is characterized in that, is that benchmark contains with said solder gross weight: Ag 0.1-0.7%, Cu 0.1-1.0 %, Bi 0.01-5%, Sb 0.01-3%, Ni 0-0.5 %, P 0.001-0.1 %, X 0.001-0.1 %, Sn surplus; Said X is a kind of or any several kinds combination in Ga, Ge, the mishmetal.
2. a kind of low-silver lead-free soft solder as claimed in claim 1 is characterized in that containing: Ag 0.2-0.5%, Cu 0.4-0.8 %, Bi 0.5-2.5%, Sb 0.5-2%, Ni 0.02-0.3 %, P 0.002-0.02 %, X 0.002-0.02 %.
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| CN2012102151280A CN102699563A (en) | 2012-06-23 | 2012-06-23 | Low-silver lead-free soft solder |
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| CN2012102151280A CN102699563A (en) | 2012-06-23 | 2012-06-23 | Low-silver lead-free soft solder |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102962599A (en) * | 2012-11-20 | 2013-03-13 | 哈尔滨理工大学 | Lead-free solder for electronic packaging |
| CN103273219A (en) * | 2013-06-28 | 2013-09-04 | 深圳市富维德电子科技有限公司 | Tin, silver, copper and nickel welding material and preparation method thereof |
| CN103341699A (en) * | 2013-07-04 | 2013-10-09 | 浙江亚通焊材有限公司 | Unleaded Sn-In-Ag brazing filler metal replacing tin-lead brazing filler metal |
| CN104070303A (en) * | 2013-03-28 | 2014-10-01 | 北京康普锡威科技有限公司 | Anti-oxidation high-temperature soft-solder solid wire and manufacturing method thereof |
| CN104384746A (en) * | 2014-09-20 | 2015-03-04 | 明光旭升科技有限公司 | Low-melting-point lead-free soldering tin particles and preparation method thereof |
| CN104395035A (en) * | 2013-05-29 | 2015-03-04 | 新日铁住金高新材料株式会社 | Solder ball and electronic member |
| WO2015066155A1 (en) * | 2013-10-31 | 2015-05-07 | Alpha Metals, Inc. | Lead-free, silver-free solder alloys |
| CN104625464A (en) * | 2014-12-23 | 2015-05-20 | 苏州龙腾万里化工科技有限公司 | Novel lead-free tin bar |
| CN107073657A (en) * | 2015-03-24 | 2017-08-18 | 哈利玛化成株式会社 | solder alloy, solder paste and electronic circuit substrate |
| CN108941971A (en) * | 2018-08-16 | 2018-12-07 | 广东省焊接技术研究所（广东省中乌研究院） | One kind aqueous tin cream free of cleaning and preparation method thereof |
| CN108994480A (en) * | 2018-10-10 | 2018-12-14 | 云南锡业锡材有限公司 | A kind of SnBiAgCu high-reliability lead-free solder alloy |
| CN109262160A (en) * | 2018-11-23 | 2019-01-25 | 深圳市唯特偶新材料股份有限公司 | A kind of novel electron welding material |
| CN111250894A (en) * | 2020-04-07 | 2020-06-09 | 上海锡喜材料科技有限公司 | Formula of lead-free and flux-free soft solder wire product for IC power device |
| CN113385853A (en) * | 2021-07-30 | 2021-09-14 | 浙江亚通焊材有限公司 | Low-silver high-reliability lead-free soft solder and preparation method and application thereof |
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| US4929423A (en) * | 1988-03-31 | 1990-05-29 | Cookson Group Plc | Low toxicity alloy compositions for joining and sealing |
| CN1195592A (en) * | 1997-02-15 | 1998-10-14 | 三星电子株式会社 | Leadless alloy for soldering flux |
| CN1400081A (en) * | 2001-06-28 | 2003-03-05 | 千住金属工业株式会社 | Lead-free welding flux alloy |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102962599A (en) * | 2012-11-20 | 2013-03-13 | 哈尔滨理工大学 | Lead-free solder for electronic packaging |
| CN104070303A (en) * | 2013-03-28 | 2014-10-01 | 北京康普锡威科技有限公司 | Anti-oxidation high-temperature soft-solder solid wire and manufacturing method thereof |
| CN104395035B (en) * | 2013-05-29 | 2017-10-20 | 新日铁住金高新材料株式会社 | Solder ball and electronic component |
| CN104395035A (en) * | 2013-05-29 | 2015-03-04 | 新日铁住金高新材料株式会社 | Solder ball and electronic member |
| CN103273219A (en) * | 2013-06-28 | 2013-09-04 | 深圳市富维德电子科技有限公司 | Tin, silver, copper and nickel welding material and preparation method thereof |
| CN103273219B (en) * | 2013-06-28 | 2015-04-15 | 深圳市富维德电子科技有限公司 | Tin, silver, copper and nickel welding material and preparation method thereof |
| CN103341699A (en) * | 2013-07-04 | 2013-10-09 | 浙江亚通焊材有限公司 | Unleaded Sn-In-Ag brazing filler metal replacing tin-lead brazing filler metal |
| WO2015066155A1 (en) * | 2013-10-31 | 2015-05-07 | Alpha Metals, Inc. | Lead-free, silver-free solder alloys |
| CN104384746A (en) * | 2014-09-20 | 2015-03-04 | 明光旭升科技有限公司 | Low-melting-point lead-free soldering tin particles and preparation method thereof |
| CN104625464A (en) * | 2014-12-23 | 2015-05-20 | 苏州龙腾万里化工科技有限公司 | Novel lead-free tin bar |
| CN107073657A (en) * | 2015-03-24 | 2017-08-18 | 哈利玛化成株式会社 | solder alloy, solder paste and electronic circuit substrate |
| US10213880B2 (en) | 2015-03-24 | 2019-02-26 | Harima Chemicals, Incorporated | Solder alloy, solder paste, and electronic circuit board |
| US10300562B2 (en) | 2015-03-24 | 2019-05-28 | Harima Chemicals, Incorporated | Solder alloy, solder paste, and electronic circuit board |
| CN108941971A (en) * | 2018-08-16 | 2018-12-07 | 广东省焊接技术研究所（广东省中乌研究院） | One kind aqueous tin cream free of cleaning and preparation method thereof |
| CN108941971B (en) * | 2018-08-16 | 2020-12-18 | 广东省科学院中乌焊接研究所 | Cleaning-free water-based solder paste and preparation method thereof |
| CN108994480A (en) * | 2018-10-10 | 2018-12-14 | 云南锡业锡材有限公司 | A kind of SnBiAgCu high-reliability lead-free solder alloy |
| CN109262160A (en) * | 2018-11-23 | 2019-01-25 | 深圳市唯特偶新材料股份有限公司 | A kind of novel electron welding material |
| CN111250894A (en) * | 2020-04-07 | 2020-06-09 | 上海锡喜材料科技有限公司 | Formula of lead-free and flux-free soft solder wire product for IC power device |
| CN113385853A (en) * | 2021-07-30 | 2021-09-14 | 浙江亚通焊材有限公司 | Low-silver high-reliability lead-free soft solder and preparation method and application thereof |
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Application publication date: 20121003 |
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