CN108941971B - Cleaning-free water-based solder paste and preparation method thereof - Google Patents
Cleaning-free water-based solder paste and preparation method thereof Download PDFInfo
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- CN108941971B CN108941971B CN201810935128.5A CN201810935128A CN108941971B CN 108941971 B CN108941971 B CN 108941971B CN 201810935128 A CN201810935128 A CN 201810935128A CN 108941971 B CN108941971 B CN 108941971B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention discloses a cleaning-free water-based solder paste and a preparation method thereof, and relates to the technical field of welding of diaphragm capsule type pressure temperature controllers. The cleaning-free water-based solder paste is used for welding operation of the diaphragm capsule type pressure temperature controller and is mainly prepared from the following raw materials in percentage by mass: 88-92% of alloy welding powder; 8-12% of paste flux; the alloy welding powder comprises a first component and a second component, wherein the first component is main body welding powder containing Sn, Ag and Cu, and the second component is two or more selected from SnP, SnGa, SnNi, SnCe, SnGd, SnNd and SnPr alloy powder; the paste flux comprises an active agent, a corrosion inhibitor, an aqueous paste forming agent, a rheological agent and a solvent. The cleaning-free water-based solder paste has the characteristics of high reliability, less residue after welding, no cleaning, less corrosion of welding flux steam to a welding piece and the like, and can be suitable for welding of the diaphragm capsule type pressure temperature controller.
Description
Technical Field
The invention relates to the technical field of welding of diaphragm capsule type pressure temperature controllers, in particular to a cleaning-free water-based solder paste and a preparation method thereof.
Background
The diaphragm capsule type pressure temperature controller is a very important core spare part in household electrical appliances, and the requirements on welding assembly are more and more strict along with the continuous development of temperature controller products towards miniaturization, high performance and multiple purposes. The diaphragm capsule and the capillary tube in the diaphragm capsule type pressure temperature controller need to be welded and communicated, the welding of the diaphragm capsule and the capillary tube is required to have excellent reliability due to the triggering of a high-frequency switch in the using process, and the diaphragm capsule and the capillary tube are generally welded by using tin paste at present due to the structural particularity of the diaphragm capsule and the capillary tube.
The traditional solder paste is generally oily solder paste, and because rosin and resin are used as the components of the solder in a large amount, the residual is serious after welding, and the base plate is corroded. The welding spot of the diaphragm capsule type pressure temperature controller is positioned in the closed space of the diaphragm capsule, but the welding flux of the traditional tin paste has stronger corrosivity, and the welding flux steam generated in the welding process stays in the diaphragm capsule to seriously corrode the diaphragm capsule. The corrosion of the bottom plate and the diaphragm capsule can greatly influence the stability of the temperature controller, air leakage is caused when the temperature controller is serious, and the reliability is greatly reduced.
Disclosure of Invention
The invention aims to provide the cleaning-free water-based solder paste which overcomes the defects of the common solder paste during welding of the diaphragm capsule type pressure temperature controller and has the characteristics of high reliability, less residue after welding, no cleaning, small steam corrosion of welding flux and the like.
Another object of the present invention is to provide a method for preparing a no-clean water-based solder paste, which is simple and feasible, and can prepare a no-clean water-based solder paste with high reliability, less post-weld residue, no-clean, and less flux vapor corrosion.
The technical problem to be solved by the invention is realized by adopting the following technical scheme.
The invention provides a cleaning-free water-based solder paste for welding a diaphragm capsule type pressure temperature controller, which is mainly prepared from the following raw materials in percentage by mass:
88-92% of alloy welding powder;
8-12% of paste flux;
the alloy welding powder comprises a first component and a second component, wherein the first component is main body welding powder containing Sn, Ag and Cu, and the second component is two or more selected from SnP, SnGa, SnNi, SnCe, SnGd, SnNd and SnPr alloy powder;
the paste flux comprises an active agent, a corrosion inhibitor, an aqueous paste forming agent, a rheological agent and a solvent.
The invention provides a preparation method of the cleaning-free water-based solder paste, which comprises the following steps:
adding an active agent, a solvent and a corrosion inhibitor into a stirring cylinder, uniformly stirring, and heating to 80 ℃ in a circulating water bath;
adding the rheological agent and the water-based paste-forming agent in sequence at constant temperature, and then uniformly stirring again;
and cooling the water circulation cooling system to room temperature, adding the alloy welding powder, vacuumizing the closed environment, stirring the mixture at a stirring speed of 20rad/min for 10min, and stirring the mixture at a stirring speed of 50rad/min for 25min to obtain the cleaning-free water-based tin paste.
The cleaning-free water-based solder paste and the preparation method thereof provided by the embodiment of the invention have the beneficial effects that:
the cleaning-free water-based solder paste provided by the embodiment of the invention is mainly used for welding operation of the diaphragm capsule type pressure temperature controller, and has the advantages of high reliability, less residue after welding, no cleaning, small corrosion of welding flux steam to a welding piece and the like.
Specifically, by adding other trace alloy powder, particularly alloy powder containing lanthanide elements, the brazing filler metal can form a new alloy phase, the crystal structure is fine and neat, and the toughness and tensile strength of the brazing filler metal are greatly improved, so that the welding strength of the brazing filler metal is improved.
In particular, because the common solder paste is formed into paste by largely adopting rosin and resin, so that a large amount of residues are left after welding, in order to avoid the defect, the invention selects polyethylene glycol or stearic acid on the formed paste, and the component has the advantages of water solubility, good paste forming property, less residues after welding, small corrosivity to substrates, no need of cleaning and the like.
Therefore, aiming at the characteristic that a sealed space is formed after the diaphragm capsule of the diaphragm capsule type pressure temperature controller is welded, in order to avoid the corrosion of the diaphragm capsule caused by flux steam and influence the service life of a product, the selection of the components of the flux formula avoids the components with strong corrosivity of the component steam, alcohols, ethers, amines or ammonium salts are selected as the main components of the paste flux, one part of the components (such as the alcohols and the ethers) is a non-corrosive component, and one part (such as part of the amines and the ammonium salts) is decomposed into a component without corrosive gas at the welding temperature or into gas capable of reacting with or neutralizing organic acid, so that the corrosivity of the flux steam is greatly reduced.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
The following describes the cleaning-free water-based solder paste and the preparation method thereof in detail.
The embodiment of the invention provides a cleaning-free water-based solder paste for welding a diaphragm capsule type pressure temperature controller, which is mainly prepared from the following raw materials in percentage by mass:
88-92% of alloy welding powder;
8-12% of paste flux;
the alloy welding powder comprises a first component and a second component, wherein the first component is main body welding powder containing Sn, Ag and Cu, and the second component is two or more selected from SnP, SnGa, SnNi, SnCe, SnGd, SnNd and SnPr alloy powder.
In detail, in the embodiment of the invention, the alloy welding powder comprises 96-99% of a first component and 1-4% of a second component in percentage by mass. That is, in the embodiment of the present invention, the alloy welding powder includes 96 to 99% by weight of a main body welding powder containing Sn, Ag, and Cu, and 1 to 4% by weight of two or more of SnP, SnGa, SnNi, SnCe, SnGd, SnNd, and SnPr alloy powders. By adding other trace alloy powder, particularly alloy powder containing lanthanide, the brazing filler metal can form a new alloy phase, the crystal structure is more exquisite and neat, the toughness and tensile strength of the brazing filler metal are greatly improved, and the welding strength of the brazing filler metal is improved.
In addition, as a preferable scheme, in the embodiment of the invention, at least 90% of the particle diameters of the alloy welding powder are between 15 and 25 μm, and the maximum particle diameter is not more than 28 μm. The control of the particle diameter of the alloy welding powder is beneficial to improving the welding quality. Of course, in other embodiments of the present invention, the particle size of the alloy welding powder may also be selected according to requirements, and the embodiments of the present invention are not limited.
Wherein the paste flux comprises an active agent, a corrosion inhibitor, an aqueous paste, a rheological agent and a solvent.
In detail, the paste flux comprises 1-7% of an active agent, 0.05-0.35% of a corrosion inhibitor, 50-60% of an aqueous paste, 2-4% of a rheological agent and 30-45% of a solvent in percentage by mass. Aiming at the characteristic that a sealed space is formed after a diaphragm capsule of the diaphragm capsule type pressure temperature controller is welded, in order to avoid that the diaphragm capsule is corroded by flux steam and the service life of a product is influenced, components with strong corrosivity of the component steam are avoided in the selection of formula components of the flux, alcohols, ethers, amines or ammonium salts are selected as main components of a paste flux, a part (such as the alcohols and the ethers) of the components are non-corrosive components, and a part (such as the part of the amines and the ammonium salts) is decomposed into components without corrosive gas at the welding temperature or into gas capable of reacting with or neutralizing organic acid, so that the corrosivity of the flux steam is greatly reduced.
Specifically, the active agent is selected from any three or more of succinic acid, adipic acid, sebacic acid, citric acid, DL-malic acid, citric acid triamine, phthalic acid, triethanolamine, dimethylolbutyric acid and dimethylolpropionic acid.
The corrosion inhibitor is selected from any two or more of triazole, benzotriazole, imidazoline quaternary ammonium salt and oleic acid base imidazoline.
The aqueous paste is selected from one, two or more of polyethylene glycol 2000, polyethylene glycol 4000, polyethylene glycol 6000 and stearic acid.
The rheological agent is selected from one, two or more of polyamide wax, N-dimethylformamide, sodium ricinoleate sulfate and ethylene glycol-butyl ether.
The solvent is selected from any three or more of diethylene glycol mono-octyl ether, triethylene glycol mono-butyl ether, diethylene glycol mono-hexyl ether, triethyl carbitol ether, 2-ethyl-1, 3-hexanediol and 3-ethyl-2, 6-pentanediol.
The embodiment of the invention also provides a preparation method of the no-clean water-based solder paste, which comprises the following steps:
adding an active agent, a solvent and a corrosion inhibitor into a stirring cylinder, uniformly stirring, and heating to 80 ℃ in a circulating water bath;
adding the rheological agent and the water-based paste-forming agent in sequence at constant temperature, and then uniformly stirring again;
and cooling the water circulation cooling system to room temperature, adding the alloy welding powder, vacuumizing the closed environment, stirring the mixture at a stirring speed of 20rad/min for 10min, and stirring the mixture at a stirring speed of 50rad/min for 25min to obtain the cleaning-free water-based tin paste.
The features and properties of the present invention are described in further detail below with reference to examples.
Example 1
The embodiment provides a cleaning-free water-based solder paste which is mainly prepared from the following raw materials in percentage by mass as shown in table 1:
TABLE 1
And, its preparation method is as follows:
(1) preparing the raw materials according to the mass percentage;
(2) adding the prepared active agent, solvent and corrosion inhibitor into a stirring cylinder, stirring uniformly, heating in a circulating water bath, adding the rheological agent and the paste, and stirring uniformly;
(3) cooling by a water circulation cooling system, adding alloy welding powder, sealing and vacuumizing, setting the stirring speed to be 20rad/min, stirring for 10 minutes, and setting the stirring speed to be 50rad/min, and stirring for 25 minutes; stopping stirring to obtain the solder paste.
Example 2
This example provides a no-clean water-based solder paste, which is different from the no-clean water-based solder paste provided in example 1 in that the no-clean water-based solder paste is mainly prepared from the following raw materials in percentage by mass as shown in table 2:
TABLE 2
Example 3
This example provides a no-clean aqueous solder paste, which is different from the no-clean aqueous solder paste provided in example 1 in that the no-clean aqueous solder paste is mainly prepared from the following raw materials in percentage by mass as shown in table 3:
TABLE 3
Example 4
This example provides a no-clean water-based solder paste, which is different from the no-clean water-based solder paste provided in example 1 in that the no-clean water-based solder paste is mainly prepared from the following raw materials in percentage by mass as shown in table 4:
TABLE 4
Example 5
This example provides a no-clean aqueous solder paste, which is different from the no-clean aqueous solder paste provided in example 1 in that the no-clean aqueous solder paste is mainly prepared from the following raw materials in percentage by mass as shown in table 5:
TABLE 5
Comparative example 1
Comparative example 1 is a WQ-105 series lead-free solder paste provided by the research institute of soldering technology in guangdong province, as a conventional solder paste containing rosin or resin, in comparison with the no-clean aqueous solder pastes provided in examples 1 to 5 of the present invention.
Comparative example 2
The solder paste is used by a manufacturer in China.
The solder pastes provided in examples 1 to 5 and comparative examples 1 to 2 were used to assist the soldering of the bellows-type pressure thermostat, and the failure rate, residual corrosion, and corrosion of the bellows were tested to evaluate the soldering effect of the solder paste. The results are shown in Table 6.
TABLE 6 temperature controller welding test results
As can be seen from the above results, the cleaning-free water-based solder paste provided by the embodiment of the invention is used for welding the temperature controller diaphragm capsule and the capillary tube, the welded temperature controller has low failure rate, less residue is left after welding, and the diaphragm capsule is not corroded by flux vapor.
In contrast, in the conventional solder paste containing rosin or resins adopted in comparative example 1, the paste flux contains rosin and resin components, so that the residual after welding is serious, the components in the paste flux are not optimized according to the characteristics of the bellows-type pressure temperature controller, so that the corrosion of the bellows by the steam of the solder flux after welding is serious, and the gas leakage rate is high, and the defect in comparative example 1 also exists in comparative example 2.
In conclusion, the cleaning-free water-based solder paste disclosed by the embodiment of the invention overcomes the defects existing in the process of welding the diaphragm pressure temperature controller by using the common solder paste, and has the characteristics of high reliability, less residues after welding, no cleaning, small flux steam corrosion and the like.
The embodiments described above are some, but not all embodiments of the invention. The detailed description of the embodiments of the present invention is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Claims (8)
1. A cleaning-free water-based solder paste is used for welding a diaphragm pressure temperature controller and is characterized by being mainly prepared from the following raw materials in percentage by mass:
88-92% of alloy welding powder;
8-12% of paste flux;
the alloy welding powder comprises a first component and a second component, wherein the first component is a main body welding powder containing Sn, Ag and Cu, and the second component is two or more selected from SnP, SnGa, SnNi, SnCe, SnGd, SnNd and SnPr alloy powder; the alloy welding powder comprises 96-99% of the first component and 1-4% of the second component in percentage by mass, wherein the Ag accounts for 1%, 2% or 3% of the 96-99% of the first component, the Cu accounts for 0.5%, and the balance is Sn;
the paste flux comprises an active agent, a corrosion inhibitor, an aqueous paste, a rheological agent and a solvent; wherein the aqueous paste is selected from one, two or more of polyethylene glycol 2000, polyethylene glycol 4000, polyethylene glycol 6000 and stearic acid.
2. The no-clean water-based solder paste according to claim 1, characterized in that:
at least 90% of the particle sizes of the alloy welding powder are 15-25 mu m, and the maximum particle size is not more than 28 mu m.
3. The no-clean aqueous solder paste according to claim 1 or 2, characterized in that:
the paste welding flux comprises 1-7% of an active agent, 0.05-0.35% of a corrosion inhibitor, 50-60% of an aqueous paste, 2-4% of a rheological agent and 30-45% of a solvent in percentage by mass.
4. The no-clean water-based solder paste according to claim 3, characterized in that:
the active agent is selected from any three or more of succinic acid, adipic acid, sebacic acid, citric acid, DL-malic acid, citric acid triamine, phthalic acid, triethanolamine, dimethylolbutyric acid and dimethylolpropionic acid.
5. The no-clean water-based solder paste according to claim 4, characterized in that:
the corrosion inhibitor is selected from any two or more of triazole, benzotriazole, imidazoline quaternary ammonium salt and oleic acid imidazoline.
6. The no-clean water-based solder paste according to claim 3, characterized in that:
the rheological agent is selected from any one, two or more of polyamide wax, N-dimethylformamide, sodium ricinoleate sulfate and ethylene glycol-butyl ether.
7. The no-clean water-based solder paste according to claim 6, characterized in that:
the solvent is selected from any three or more of diethylene glycol mono-octyl ether, triethylene glycol monobutyl ether, diethylene glycol monohexyl ether, triethyl carbitol ether, 2-ethyl-1, 3-hexanediol and 3-ethyl-2, 6-pentanediol.
8. A method for preparing a no-clean aqueous solder paste according to any one of claims 1 to 7, comprising:
adding the active agent, the solvent, the corrosion inhibitor and the solvent into a stirring cylinder, uniformly stirring, and heating to 80 ℃ in a circulating water bath;
sequentially adding the rheological agent and the water-based paste at constant temperature and then uniformly stirring again;
and cooling the water circulation cooling system to room temperature, adding the alloy welding powder, vacuumizing the closed environment, stirring the mixture at a stirring speed of 20rad/min for 10min, and stirring the mixture at a stirring speed of 50rad/min for 25min to obtain the cleaning-free water-based tin paste.
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| JP2020116611A (en) * | 2019-01-24 | 2020-08-06 | 株式会社弘輝 | Flux and solder paste |
| CN111730243A (en) * | 2020-07-02 | 2020-10-02 | 东莞市硕美电子材料科技有限公司 | Water-soluble flux composition for hot air leveling |
| CN115971724A (en) * | 2022-12-27 | 2023-04-18 | 云南锡业锡材有限公司 | Halogen-free water-soluble flux paste and preparation method thereof |
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Effective date of registration: 20211130 Address after: 510000 room 09, room 2304, No. 1068, Xingang East Road, Haizhu District, Guangzhou City, Guangdong Province (office only) Patentee after: Guangzhou Zhongwu Welding Material Technology Co.,Ltd. Address before: 510000 courtyard, no.363, Changxing Road, Tianhe District, Guangzhou City, Guangdong Province Patentee before: China Uzbekistan Welding Research Institute, Guangdong Academy of Sciences |