CN111730243A - Water-soluble flux composition for hot air leveling - Google Patents
Water-soluble flux composition for hot air leveling Download PDFInfo
- Publication number
- CN111730243A CN111730243A CN202010627828.5A CN202010627828A CN111730243A CN 111730243 A CN111730243 A CN 111730243A CN 202010627828 A CN202010627828 A CN 202010627828A CN 111730243 A CN111730243 A CN 111730243A
- Authority
- CN
- China
- Prior art keywords
- acid
- hot air
- mass fraction
- water
- organic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a water-soluble scaling powder composition for hot air leveling, which comprises a film forming agent, organic salt, a surfactant, organic acid, a corrosion inhibitor, inorganic salt, a solubilizer, an alkaline substance and deionized water; the film forming agent is a mixture of rosin, an organic solvent and polyethylene glycol; the organic salt is organic hydrochloride; the inorganic salt is one or more of sodium chloride, ammonium chloride and ammonium fluoroborate. The water-soluble soldering flux composition for hot air leveling has the advantages of simple process, low manufacturing cost, small smell, excellent tin coating after hot air leveling, flat tin surface, no residual of printed ions and difficult yellowing of white oil.
Description
Technical Field
The invention relates to the technical field of a soldering flux composition for hot air leveling of a circuit board, in particular to a water-soluble soldering flux composition for hot air leveling.
Background
The soldering flux for hot air leveling is a chemical substance which can help and promote the welding process in the welding process of the surface of the circuit board, and has the functions of protecting and preventing oxidation reaction. Mainly has the functions of assisting heat conduction, removing oxides, reducing the surface tension of the welded material and removing the surface of the welded materialOil stainIncreasing the welding area, preventing reoxidation, etc. The hot air leveling soldering flux commonly used in the market at present has many defects, such as strong smell, poor tin coating after hot air leveling, uneven tin surface, residual mimeograph ions, yellow white oil and the like.
Disclosure of Invention
The invention aims to provide the soldering flux composition for hot air leveling of the circuit board, which has the advantages of simple process, low manufacturing cost, small smell, excellent tin coating after hot air leveling, flat tin surface, no residual imprint ions and difficult yellowing of white oil.
In order to achieve the above object, the present invention provides a water-soluble flux composition for hot air leveling, characterized in that: comprises film forming agent, organic salt, surface active agent, organic acid, corrosion inhibitor, inorganic salt, solubilizer, alkaline substance and deionized water;
the film forming agent is a mixture of rosin, an organic solvent and polyethylene glycol;
the organic salt is organic hydrochloride;
the inorganic salt is one or more of sodium chloride, ammonium chloride and ammonium fluoroborate.
Preferably, the mass fraction of the film forming agent is 40-80%; the mass fraction of the organic salt is 0.5-3%; the mass fraction of the surfactant is 0.1-0.5%; the mass fraction of the organic acid is 3-10%; the mass fraction of the corrosion inhibitor is 0.01-0.2%; the mass fraction of the inorganic salt is 0.5-3%; the mass fraction of the solubilizer is 1-5%; the mass fraction of the alkaline substance is 0.1-3%; the pH value of the water-soluble soldering flux composition for hot air leveling is 0-3.
Preferably, the mass fraction of the film forming agent is 50-70%; the mass fraction of the organic salt is 1-2%; the mass fraction of the surfactant is 0.2-0.4%; the mass fraction of the organic acid is 5-8%; the mass fraction of the corrosion inhibitor is 0.05-0.1%; the mass fraction of the inorganic salt is 1-2.5%; the mass fraction of the solubilizer is 2-4%; the mass fraction of the alkaline substance is 0.5-2%; the pH value of the water-soluble soldering flux composition for hot air leveling is 1-2.
Preferably, the rosin isWater white rosinRHR-101/301、Foral AX-E、Crude Sichuan rosin KR-612/610、TSR-610 rosinAndhydrogenated rosin glycerol esterOne or a combination of more of (a);
the organic solvent is one or more of methanol, ethanol, isopropanol, diethylene glycol monobutyl ether, dibasic ester and glycol ether;
the polyethylene glycol is one or a combination of more of ethylene glycol polyoxyethylene ether 200, 400, 600 and 800;
the mass ratio of the rosin, the organic solvent and the polyethylene glycol is 1: 5-1: 30.
Preferably, the mass ratio of the rosin, the organic solvent and the polyethylene glycol is 1: 10-1: 20.
Preferably, the organic salt is2-bromoethylamine oxybromide salt、Diphenylguanidine hydrobromide、Diethylamine hydrobromide saltCyclohexylamine hydrobromide, triethylamine hydrochloride,Triethanolamine hydrochlorideAnddiethylamine hydrochlorideOne or more combinations of (a).
Preferably, the surfactant is polyoxyethylene octyl phenol ether, octyl phenylPolyoxyethylene ethersOne or more of polyoxyethylene nonyl phenyl ether and polyoxyethylene isomeric alcohol, butyl naphthalene sulfonate, dodecyl sulfate, polysorbate, condensate of fatty alcohol and ethylene oxide, isopropyl naphthalene sulfonate, alkyl or long-chain amido benzene sulfonate, polyacrylic amine, alkylphenol polyoxyethylene phosphate, lignocellulose, stearic acid monoglyceride, heavy alkylbenzene sulfonate and alkyl sulfonate.
Preferably, the organic acid is formic acid, acetic acid, succinic acid, itaconic acid,Tartaric acid、Oxalic acid、Citric acidOne or more of malonic acid, adipic acid, suberic acid and azelaic acid.
Preferably, the corrosion inhibitor is one or a combination of more of benzotriazole, methyl benzotriazole, N-ethylimidazole, 2-mercaptobenzimidazole, 2, 5, 6-trimethylbenzimidazole, 2-mercaptobenzothiazole, N-acetylimidazole, 1- (2, 4, 6-triisopropylphenylsulfonyl) imidazole, 2-mercapto-1-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1, 3-dibenzylimidazole, 1- (4-nitrobenzene) -1H-imidazole, sodium mercaptoimidazolepropanesulfonate, 4-azabenzimidazole and ethyl-2-methylimidazole.
Preferably, the solubilizer is one or a combination of several of sodium salt, potassium salt, ammonium salt, low-carbon sodium alkyl benzene sulfonate, alkyl phosphate, polyoxyethylene castor oil, polyoxyethylene sorbitan fatty acid ester and polyglycerol fatty acid ester of toluenesulfonic acid, urea, xylene sulfonic acid and cumyl sulfonic acid.
Preferably, the alkaline substance is one or more of monoethanolamine, triethanolamine, dimethylethanolamine, diethylethanolamine, sodium hydroxide, sodium carbonate, sodium bicarbonate, potassium hydroxide, potassium bicarbonate and potassium carbonate.
Preferably, the deionized water has a conductivity of less than 3us/cm and a pH of 6-7.
Therefore, the water-soluble soldering flux composition for hot air leveling has the advantages of simple process, low manufacturing cost, small smell, excellent tin coating after hot air leveling, flat tin surface, no residual imprint ions and difficult yellowing of white oil.
The technical solution of the present invention is further described in detail by the following examples.
Detailed Description
The embodiments of the present invention will be further explained below.
Example one
A water-soluble soldering flux composition for hot air leveling comprises a film forming agent, an organic salt, a surfactant, an organic acid, a corrosion inhibitor, an inorganic salt, a solubilizer, an alkaline substance and deionized water. The film forming agent is a mixture of rosin, an organic solvent and polyethylene glycol; the organic salt is organic hydrochloride; the surfactant is polyoxyethylene octyl phenol ether or octyl phenylPolyoxyethylene ethersOne or more of nonylphenol polyoxyethylene ether and isomeric alcohol polyoxyethylene ether; the organic acid isTartaric acid、Oxalic acid、Citric acidOne or more of malonic acid, adipic acid, suberic acid and azelaic acid; the corrosion inhibitor is one or more of benzotriazole, methylbenzotriazole and imidazole; the inorganic salt is one or more of sodium chloride, ammonium chloride and ammonium fluoroborate. The alkaline substance is one or more of organic amine, water-soluble hydroxide and carbonate compounds; the solubilizer is sodium salt of toluene sulfonic acid, urea, xylene sulfonic acid and cumene sulfonic acid, polyoxyethylene castor oil, polyoxyethylene sorbitan esterOne or more of fatty acid ester and polyglyceryl fatty acid ester;
the mass fraction of the film forming agent is 40-80%; the mass fraction of the organic salt is 0.5-3%; the mass fraction of the surfactant is 0.1-0.5%; the mass fraction of the organic acid is 3-10%; the mass fraction of the corrosion inhibitor is 0.01-0.2%; the mass fraction of the inorganic salt is 0.5-3%; the mass fraction of the solubilizer is 1-5%; the mass fraction of the alkaline substance is 0.1-3%; the pH value of the water-soluble soldering flux composition for hot air leveling is 0-3.
The film forming agent is a mixture of rosin, an organic solvent and polyethylene glycol; the rosin isWater white rosinRHR-101/301、Foral AX-E、Crude Sichuan rosin KR-612/610、TSR-610 rosinAndhydrogenated rosin glycerol esterOne or a combination of more of (a);
the organic solvent is one or more of methanol, ethanol, isopropanol, diethylene glycol monobutyl ether, dibasic ester and glycol ether;
the polyethylene glycol is one or a combination of more of ethylene glycol polyoxyethylene ether 200, 400, 600 and 800;
the mass ratio of the rosin, the organic solvent and the polyethylene glycol is 1: 5-1: 30;
the organic salt is2-bromoethylamine hydrobromide salt、Diphenylguanidine hydrobromide、Diethylamine hydrobromide saltCyclohexylamine hydrobromide, triethylamine hydrochloride,Triethanolamine hydrochlorideAnddiethylamine hydrochlorideOne or more combinations of (a);
the surfactant is polyoxyethylene octyl phenol ether or octyl phenylPolyoxyethylene ethersNonylphenol polyoxyethylene ether and isomeric alcohol polyoxyethylene ether, butylnaphthalene sulfonate, dodecyl sulfate, polysorbate, condensation product of fatty alcohol and ethylene oxide, isopropyl naphthalene sulfonate, alkyl or long-chain amido benzene sulfonate, polyacrylic amine, alkylphenol polyoxyethylene ether phosphate, lignocellulose, stearic acid monoglyceride, heavy alkylbenzene sulfonate and one or more of alkyl sulfonate;
the organic acid is formic acid, acetic acid, succinic acid,Itaconic acid, itaconic acid,Tartaric acid、Oxalic acid、Citric acidOne or more of malonic acid, adipic acid, suberic acid and azelaic acid;
the alkaline substance is one or a combination of more of monoethanolamine, triethanolamine, dimethylethanolamine, diethylethanolamine, sodium hydroxide, sodium carbonate, sodium bicarbonate, potassium hydroxide, potassium bicarbonate and potassium carbonate;
the corrosion inhibitor is one or a combination of more of benzotriazole, methylbenzotriazole, N-ethylimidazole, 2-mercaptobenzimidazole, 2, 5, 6-trimethylbenzimidazole, 2-mercaptobenzothiazole, N-acetylimidazole, 1- (2, 4, 6-triisopropylphenylsulfonyl) imidazole, 2-mercapto-1-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1, 3-dibenzylimidazole, 1- (4-nitrobenzene) -1H-imidazole, sodium mercaptoimidazolepropanesulfonate, 4-azabenzimidazole and ethyl-2-methylimidazole.
One or more of sodium salt, potassium salt, ammonium salt, low-carbon sodium alkyl benzene sulfonate, alkyl phosphate, polyoxyethylene castor oil, polyoxyethylene sorbitan fatty acid ester and polyglycerol fatty acid ester of solubilizer toluene sulfonic acid, urea, xylene sulfonic acid and cumyl sulfonic acid.
The deionized water has a conductivity of less than 3us/cm and pH of 6-7.
The water-soluble soldering flux composition for hot air leveling has the advantages of simple process, low manufacturing cost, small smell, excellent tin coating after hot air leveling, flat tin surface, no residual of printed ions and difficult yellowing of white oil.
Example two
The mass fraction of the film forming agent is 50-70%; the mass fraction of the organic salt is 1-2%; the mass fraction of the surfactant is 0.2-0.4%; the mass fraction of the organic acid is 5-8%; the mass fraction of the corrosion inhibitor is 0.05-0.1%; the mass fraction of the inorganic salt is 1-2.5%; the mass fraction of the solubilizer is 2-4%; the mass fraction of the alkaline substance is 0.5-2%; the pH value of the water-soluble soldering flux composition for hot air leveling is 1-2.
A water-soluble flux composition for hot air leveling is the same as in the first embodiment.
The water-soluble soldering flux composition for hot air leveling has the advantages of simple process, low manufacturing cost, small smell, excellent tin coating after hot air leveling, flat tin surface, no residual of printed ions and difficult yellowing of white oil.
EXAMPLE III
The mass ratio of the rosin, the organic solvent and the polyethylene glycol is 1: 10-1: 20;
a water-soluble flux composition for hot air leveling is the same as in the first embodiment.
The water-soluble soldering flux composition for hot air leveling has the advantages of simple process, low manufacturing cost, small smell, excellent tin coating after hot air leveling, flat tin surface, no residual of printed ions and difficult yellowing of white oil.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting the same, and although the present invention is described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that: modifications and equivalents may be made to the invention without departing from the spirit and scope of the invention.
Claims (10)
1. A water-soluble flux composition for hot air leveling is characterized in that: comprises film forming agent, organic salt, surface active agent, organic acid, corrosion inhibitor, inorganic salt, solubilizer, alkaline substance and deionized water;
the film forming agent is a mixture of rosin, an organic solvent and polyethylene glycol;
the organic salt is organic hydrochloride;
the inorganic salt is one or more of sodium chloride, ammonium chloride and ammonium fluoroborate.
2. The water-soluble flux composition for hot air leveling according to claim 1, wherein: the mass fraction of the film forming agent is 40-80%; the mass fraction of the organic salt is 0.5-3%; the mass fraction of the surfactant is 0.1-0.5%; the mass fraction of the organic acid is 3-10%; the mass fraction of the corrosion inhibitor is 0.01-0.2%; the mass fraction of the inorganic salt is 0.5-3%; the mass fraction of the solubilizer is 1-5%; the mass fraction of the alkaline substance is 0.1-3%; the pH value of the water-soluble soldering flux composition for hot air leveling is 0-3.
3. The water-soluble flux composition for hot air leveling according to claim 1, wherein: the mass fraction of the film forming agent is 50-70%; the mass fraction of the organic salt is 1-2%; the mass fraction of the surfactant is 0.2-0.4%; the mass fraction of the organic acid is 5-8%; the mass fraction of the corrosion inhibitor is 0.05-0.1%; the mass fraction of the inorganic salt is 1-2.5%; the mass fraction of the solubilizer is 2-4%; the mass fraction of the alkaline substance is 0.5-2%; the pH value of the water-soluble soldering flux composition for hot air leveling is 1-2.
4. The water-soluble flux composition for hot air leveling according to claim 1, wherein: the rosin isWater white rosinRHR-101/301、Foral AX-E、Crude Sichuan rosin KR-612/610、TSR-610 rosinAndhydrogenated rosin glycerol EstersOne or a combination of more of (a);
the organic solvent is one or more of methanol, ethanol, isopropanol, diethylene glycol monobutyl ether, dibasic ester and glycol ether;
the polyethylene glycol is one or a combination of more of ethylene glycol polyoxyethylene ether 200, 400, 600 and 800;
the mass ratio of the rosin, the organic solvent and the polyethylene glycol is 1: 5-1: 30.
5. The water-soluble flux composition for hot air leveling as claimed in claim 4, wherein: the mass ratio of the rosin, the organic solvent and the polyethylene glycol is 1: 10-1: 20.
6. The water-soluble flux composition for hot air leveling according to claim 1, wherein: the organic salt is2-bromoethylamine hydrobromide salt、Diphenylguanidine hydrobromide、Diethylamine hydrobromide saltCyclohexylamine hydrobromide, triethylamine hydrochloride,Triethanolamine hydrochlorideAnddiethylamine hydrochlorideOne or more combinations of (a).
7. The water-soluble flux composition for hot air leveling according to claim 1, wherein: the surfactant is polyoxyethylene octyl phenol ether or octyl phenylPolyoxyethylene ethersOne or more of polyoxyethylene nonyl phenyl ether and polyoxyethylene isomeric alcohol, butyl naphthalene sulfonate, dodecyl sulfate, polysorbate, condensate of fatty alcohol and ethylene oxide, isopropyl naphthalene sulfonate, alkyl or long-chain amido benzene sulfonate, polyacrylic amine, alkylphenol polyoxyethylene phosphate, lignocellulose, stearic acid monoglyceride, heavy alkylbenzene sulfonate and alkyl sulfonate.
8. The water-soluble flux composition for hot air leveling according to claim 1, wherein: the organic acid is formic acid, acetic acid, succinic acid, itaconic acid,Tartaric acid、Oxalic acid、Citric acidOne or more of malonic acid, adipic acid, suberic acid and azelaic acid.
9. The water-soluble flux composition for hot air leveling according to claim 1, wherein: the corrosion inhibitor is one or a combination of more of benzotriazole, methylbenzotriazole, N-ethylimidazole, 2-mercaptan benzimidazole, 2, 5, 6-trimethylbenzimidazole, 2-mercaptobenzothiazole, N-acetylimidazole, 1- (2, 4, 6-triisopropylphenylsulfonyl) imidazole, 2-mercapto-1-methylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 1, 3-dibenzylimidazole, 1- (4-nitrobenzene) -1H-imidazole, sodium mercaptoimidazolepropanesulfonate, 4-azabenzimidazole and ethyl-2-methylimidazole.
10. The water-soluble flux composition for hot air leveling according to claim 1, wherein: the solubilizer is one or a combination of more of sodium salt, potassium salt, ammonium salt, low-carbon sodium alkyl benzene sulfonate, alkyl phosphate, polyoxyethylene castor oil, polyoxyethylene sorbitan fatty acid ester and polyglycerol fatty acid ester of toluenesulfonic acid, urea, xylene sulfonic acid and cumenesulfonic acid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010627828.5A CN111730243A (en) | 2020-07-02 | 2020-07-02 | Water-soluble flux composition for hot air leveling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010627828.5A CN111730243A (en) | 2020-07-02 | 2020-07-02 | Water-soluble flux composition for hot air leveling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111730243A true CN111730243A (en) | 2020-10-02 |
Family
ID=72652517
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010627828.5A Pending CN111730243A (en) | 2020-07-02 | 2020-07-02 | Water-soluble flux composition for hot air leveling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111730243A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113798720A (en) * | 2021-09-23 | 2021-12-17 | 沭阳县壹陆捌助剂有限公司 | Production process of C9 type neutral soldering flux |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103846576A (en) * | 2014-03-17 | 2014-06-11 | 苏州龙腾万里化工科技有限公司 | Halogen-free low-carbon environment-friendly flux |
| JP2017064759A (en) * | 2015-09-30 | 2017-04-06 | 株式会社タムラ製作所 | Flux composition, solder composition and electronic substrate |
| CN107150190A (en) * | 2017-07-20 | 2017-09-12 | 合肥安力电力工程有限公司 | A kind of New Flux and preparation method thereof |
| CN108941971A (en) * | 2018-08-16 | 2018-12-07 | 广东省焊接技术研究所（广东省中乌研究院） | One kind aqueous tin cream free of cleaning and preparation method thereof |
| CN111299896A (en) * | 2020-03-11 | 2020-06-19 | 漳州佳联化工有限公司 | Soldering paste and preparation method thereof |
-
2020
- 2020-07-02 CN CN202010627828.5A patent/CN111730243A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103846576A (en) * | 2014-03-17 | 2014-06-11 | 苏州龙腾万里化工科技有限公司 | Halogen-free low-carbon environment-friendly flux |
| JP2017064759A (en) * | 2015-09-30 | 2017-04-06 | 株式会社タムラ製作所 | Flux composition, solder composition and electronic substrate |
| CN107150190A (en) * | 2017-07-20 | 2017-09-12 | 合肥安力电力工程有限公司 | A kind of New Flux and preparation method thereof |
| CN108941971A (en) * | 2018-08-16 | 2018-12-07 | 广东省焊接技术研究所（广东省中乌研究院） | One kind aqueous tin cream free of cleaning and preparation method thereof |
| CN111299896A (en) * | 2020-03-11 | 2020-06-19 | 漳州佳联化工有限公司 | Soldering paste and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113798720A (en) * | 2021-09-23 | 2021-12-17 | 沭阳县壹陆捌助剂有限公司 | Production process of C9 type neutral soldering flux |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5215675A (en) | Aqueous stripping composition containing peroxide and water soluble ester | |
| CN1235719C (en) | Soldering flux with cationic surfactant | |
| TWI613330B (en) | Etching liquid composition and etching method | |
| CN111730243A (en) | Water-soluble flux composition for hot air leveling | |
| KR100793590B1 (en) | Photoresist Stripper/Cleaner Compositions Containing Aromatic Acid Inhibitors | |
| US20160234947A1 (en) | Adhesion Promotion in Printed Circuit Boards | |
| WO2005034596B1 (en) | Improved method for micro-roughening treatment of copper and mixed-metal circuitry | |
| EP3033929A1 (en) | Adhesion promotion in printed circuit boards | |
| JP3546040B2 (en) | Coating composition for forming insulating film, non-oriented electrical steel sheet coated with the coating composition, and method of forming insulating film on the steel sheet | |
| US20130277602A1 (en) | Etching agent for aluminum or aluminum alloy | |
| CN112522037A (en) | Neutral water-based cleaning agent for cleaning PCB and preparation method thereof | |
| CN111434801B (en) | Water-based copper protective agent | |
| CN101685274B (en) | Cleaning agent for thick-film photoresist | |
| WO2006052692A2 (en) | Post etch cleaning composition for use with substrates having aluminum | |
| CN109778299B (en) | Electrolytic stripping agent for copper-plated layer on surface of iron base material, and preparation method and stripping process thereof | |
| WO2011052987A2 (en) | Etching solution composition | |
| CN102286749A (en) | Wet leveling liquid | |
| CN107447220A (en) | A kind of chromium-free environment-friendly antioxidant and preparation method | |
| CN113741158A (en) | Aqueous stripping liquid composition and use method thereof | |
| CN105728986A (en) | No-wash flux | |
| CN103132081A (en) | Preparation method of water soluble copper corrosion inhibitor | |
| JP4575232B2 (en) | Rust prevention method for steel | |
| CN105290651B (en) | A kind of environment-friendly antibacterial scaling powder and preparation method thereof | |
| KR20200077839A (en) | Etching composition | |
| CN114571138B (en) | Environment-friendly soldering flux and preparation method and application thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201002 |