CN103949803A - Soldering flux for low-silver lead-free soldering paste and preparation method for soldering flux - Google Patents
Soldering flux for low-silver lead-free soldering paste and preparation method for soldering flux Download PDFInfo
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- CN103949803A CN103949803A CN201410177358.1A CN201410177358A CN103949803A CN 103949803 A CN103949803 A CN 103949803A CN 201410177358 A CN201410177358 A CN 201410177358A CN 103949803 A CN103949803 A CN 103949803A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3601—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with inorganic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/203—Fluxing, i.e. applying flux onto surfaces
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a soldering flux for low-silver lead-free soldering paste. The soldering flux consists of the following components in percentage by mass: 30-60 percent of film forming matter, 10-15 percent of active agent, 8-10 percent of rheological agent, 0.1-10 percent of corrosion inhibitor and the balance of solvent, wherein the sum of the mass percentage of the components is 100 percent. The invention also discloses a preparation method for the soldering flux. The preparation method comprises the following steps: heating the solvent until the temperature is 80-90 DEG C; then sequentially adding the film forming matter, the active agent, the rheological agent and the corrosion inhibitor to obtain the soldering flux. The soldering flux for the low-silver lead-free soldering paste has the advantages that the reaction characteristics of soldering powder and the active agent are changed by virtue of the corrosion inhibitor, and the effect of stably storing the soldering paste is achieved. The soldering paste prepared from the soldering flux is excellent in room-temperature and low-temperature storage stability, and the room-temperature shelf time is longer than or equal to 15 days.
Description
Technical field
The invention belongs to electronic circuit surface mounting technology field, be specifically related to a kind of low-silver lead-free solder(ing) paste scaling powder, the invention still further relates to the preparation method of this scaling powder.
Background technology
Solder(ing) paste is the critical material in surface installation technique, the good and bad quality that directly affects electronic product of its performance, and in Electronic Assemblies, 80% quality problems are relevant to solder(ing) paste.It is one of problem of often running into of enterprise that solder(ing) paste become dry to lose efficacy, if occur, because the reasons such as artificial, technique can not be used after causing solder(ing) paste to unpack in time, solder(ing) paste becomes dry will cause waste, and even causes tremendous economic loss.If the solder(ing) paste that adopts inefficacy or solder(ing) paste viscosity to change completes the welding of electronic product, will form weld defect, can hide some dangers for to the reliability of electronic product undoubtedly.
Summary of the invention
The object of this invention is to provide a kind of low-silver lead-free solder(ing) paste scaling powder, solve the problem that enterprise's solder(ing) paste becomes dry and lost efficacy, improve Quality of electronic products.
Another object of the present invention is to provide the preparation method of scaling powder for a kind of low-silver lead-free solder(ing) paste.
The technical solution adopted in the present invention is, a kind of low-silver lead-free solder(ing) paste scaling powder, composed of the following components according to mass percent: film forming matter 30～60%, activating agent 10～15%, rheological agent 8～10%, corrosion inhibiter 0.1～10%, surplus is solvent, above constituent mass percentage sum is 100%.
Feature of the present invention is also,
Film forming matter is any two kinds of mixtures that form for 1:1～4:1 in mass ratio in Foral, ice galbanum, newtrex, water-white rosin, or the mixture that any two kinds of rosin and pentaerythritol resin or 90M resin form, wherein pentaerythritol resin or 90M resin content are 5～20% of scaling powder gross mass.
Activating agent is any two kinds of mixtures that form for 1:8～1:2 in mass ratio in malonic acid, succinic acid, adipic acid, salicylic acid, DL-malic acid.
Rheological agent is rilanit special, and corrosion inhibiter is zinc carbonate or BTA, or zinc carbonate and BTA are the mixture that 2:1～1:2 forms in mass ratio.
Solvent is a kind of in tetrahydrofurfuryl alcohol, ethylene glycol, EGME or PEG400, or the mixture that to be tetrahydrofurfuryl alcohol form for 2:1～5:1 in mass ratio with diethylene glycol monobutyl ether 250 or diethylene glycol monobutyl ether 400.
Another technical scheme of the present invention is, the preparation method of scaling powder for a kind of low-silver lead-free solder(ing) paste specifically implements according to following steps:
Step 1, takes respectively film forming matter 30～60% according to mass percent, activating agent 10～15%, and rheological agent 8～10%, corrosion inhibiter 0.1～10%, surplus is solvent, above constituent mass percentage sum is 100%;
Step 2, is heated to 80～90 ℃ by solvent, adds while stirring film forming matter, and constant temperature is stirred to completely and dissolves;
Step 3, adds activating agent in the solution that step 2 mixes, and stirs at 80～90 ℃;
Step 4, adds rheological agent in the solution that step 3 mixes, and stirs at 80～90 ℃;
Step 5, adds corrosion inhibiter in the solution of step 4 mixing, is stirred to solution even at 80～90 ℃, is cooled to room temperature, obtains low-silver lead-free solder(ing) paste scaling powder.
Feature of the present invention is also,
In step 1, film forming matter is any two kinds of mixtures that form for 1:1～4:1 in mass ratio in Foral, ice galbanum, newtrex, water-white rosin, or the mixture that any two kinds of rosin and pentaerythritol resin or 90M resin form, wherein pentaerythritol resin or 90M resin content are 5～20% of scaling powder gross mass.
In step 1, activating agent is any two kinds of mixtures that form for 1:8～1:2 in mass ratio in malonic acid, succinic acid, adipic acid, salicylic acid, DL-malic acid.
In step 1, rheological agent is rilanit special, and corrosion inhibiter is zinc carbonate or BTA, or zinc carbonate and BTA are the mixture that 2:1～1:2 forms in mass ratio.
In step 1, solvent is a kind of in tetrahydrofurfuryl alcohol, ethylene glycol, EGME or PEG400, or the mixture that to be tetrahydrofurfuryl alcohol form for 2:1～5:1 in mass ratio with diethylene glycol monobutyl ether 250 or diethylene glycol monobutyl ether 400.
The invention has the beneficial effects as follows:
1. low-silver lead-free solder(ing) paste scaling powder of the present invention, by corrosion inhibiter, change the response characteristic of soldering tin powder and activating agent, reach solder(ing) paste and deposit stable effect, with the solder(ing) paste of scaling powder preparation of the present invention, have good room temperature, low-temp storage stability, room temperature shelf life is more than or equal to 15 days.
2. low-silver lead-free solder(ing) paste of the present invention is simple, easy to operate by the preparation method of scaling powder.
The specific embodiment
Below in conjunction with the specific embodiment, the present invention is described in detail.
Low-silver lead-free solder(ing) paste scaling powder of the present invention, composed of the following components according to mass percent: film forming matter 30～60%, activating agent 10～15%, rheological agent 8～10%, corrosion inhibiter 0.1～10%, surplus is solvent, above constituent mass percentage sum is 100%.
Film forming matter is any two kinds of mixtures that form for 1:1～4:1 in mass ratio in Foral, ice galbanum, newtrex, water-white rosin, or the mixture that any two kinds of rosin and pentaerythritol resin or 90M resin form, wherein pentaerythritol resin or 90M resin content are 5～20% of scaling powder gross mass.
Activating agent is any two kinds of mixtures that form for 1:8～1:2 in mass ratio in malonic acid, succinic acid, adipic acid, salicylic acid, DL-malic acid.
Rheological agent is rilanit special; Corrosion inhibiter is zinc carbonate or BTA, or zinc carbonate and BTA are the mixture that 2:1～1:2 forms in mass ratio.
Solvent is a kind of in tetrahydrofurfuryl alcohol, ethylene glycol, EGME or PEG400, or the mixture that to be tetrahydrofurfuryl alcohol form for 2:1～5:1 in mass ratio with diethylene glycol monobutyl ether 250 or diethylene glycol monobutyl ether 400.
Low-silver lead-free solder(ing) paste scaling powder of the present invention, by corrosion inhibiter, change the response characteristic of soldering tin powder and activating agent, reach solder(ing) paste and deposit stable effect, with the solder(ing) paste of scaling powder preparation of the present invention, have good room temperature, low-temp storage stability, room temperature shelf life is more than or equal to 15 days.
The preparation method of scaling powder for above-mentioned low-silver lead-free solder(ing) paste, specifically implements according to following steps:
Step 1, takes respectively film forming matter 30～60% according to mass percent, activating agent 10～15%, and rheological agent 8～10%, corrosion inhibiter 0.1～10%, surplus is solvent, above constituent mass percentage sum is 100%;
Step 2, is heated to 80～90 ℃ by solvent, adds while stirring film forming matter, and constant temperature is stirred to completely and dissolves;
Step 3, adds activating agent in the solution that step 2 mixes, and stirs at 80～90 ℃;
Step 4, adds rheological agent in the solution that step 3 mixes, and stirs at 80～90 ℃;
Step 5, adds corrosion inhibiter in the solution of step 4 mixing, is stirred to solution even at 80～90 ℃, is cooled to room temperature, obtains low-silver lead-free solder(ing) paste scaling powder.
Embodiment 1
Step 1, according to mass percent, take respectively Foral 18%, newtrex 12%, activating agent 11.5%, activating agent is the mixture that succinic acid and salicylic acid form for 1:5 in mass ratio, rilanit special 8%, zinc carbonate 1%, tetrahydrofurfuryl alcohol 49.5%, above constituent mass percentage sum is 100%;
Step 2, is heated to 80 ℃ by tetrahydrofurfuryl alcohol, adds while stirring Foral and newtrex, and constant temperature is stirred to completely and dissolves;
Step 3, the mixture that succinic acid and salicylic acid are formed for 1:5 in mass ratio adds in the solution that step 2 mixes, and stirs at 80 ℃;
Step 4, adds rilanit special in the solution that step 3 mixes, and stirs at 80 ℃;
Step 5, adds zinc carbonate in the solution of step 4 mixing, is stirred to solution even at 80 ℃, is cooled to room temperature, obtains low-silver lead-free solder(ing) paste scaling powder.
The scaling powder of embodiment 1 preparation is light yellow thick liquid, deposits in (2～5 ℃) under refrigerator cold-storage environment by this scaling powder is airtight, within 1 year, does not lose efficacy.This scaling powder and Sn0.3Ag0.7Cu scolding tin micro mist is even with mass ratio 13:87 mechanical mixture, obtain solder(ing) paste, deposit in (2～5 ℃) under refrigerator cold-storage environment by this solder(ing) paste is airtight, within 3 months, do not lose efficacy; Airtight depositing under room temperature environment, did not lose efficacy within 10 days.
Embodiment 2
Step 1, according to mass percent, take respectively Foral 15%, newtrex 15%, pentaerythritol resin 10%, activating agent 11.5%, activating agent is the mixture that succinic acid and salicylic acid form for 1:6 in mass ratio, rilanit special 9%, BTA 1%, solvent is 38.5%, solvent is the mixture that tetrahydrofurfuryl alcohol and diethylene glycol monobutyl ether 250 form for 2:1 in mass ratio, and above constituent mass percentage sum is 100%;
Step 2, in mass ratio for the mixture that 2:1 forms is heated to 85 ℃, adds the mixture of Foral, newtrex and pentaerythritol resin by tetrahydrofurfuryl alcohol and diethylene glycol monobutyl ether 250 while stirring, and constant temperature is stirred to completely and dissolves;
Step 3, the mixture that succinic acid and salicylic acid are formed for 1:6 in mass ratio adds in the solution that step 2 mixes, and stirs at 85 ℃;
Step 4, adds rilanit special in the solution that step 3 mixes, and stirs at 85 ℃;
Step 5, adds BTA in the solution of step 4 mixing, is stirred to solution even at 85 ℃, is cooled to room temperature, obtains low-silver lead-free solder(ing) paste scaling powder.
The scaling powder of embodiment 2 preparation is yellow thickness lotion, deposits in (2～5 ℃) under refrigerator cold-storage environment by this scaling powder is airtight, within 1 year, does not lose efficacy.This scaling powder and Sn0.3Ag0.7Cu scolding tin micro mist is even with mass ratio 10:90 mechanical mixture, make solder(ing) paste, deposit in (2～5 ℃) under refrigerator cold-storage environment by this solder(ing) paste is airtight, within 6 months, do not lose efficacy; Airtight depositing under room temperature environment, did not lose efficacy within 15 days.
Embodiment 3
Step 1, according to mass percent, take respectively Foral 20%, newtrex 15%, pentaerythritol resin 15%, activating agent 10%, activating agent is the mixture that succinic acid and salicylic acid form for 1:6 in mass ratio, rilanit special 8%, corrosion inhibiter 1%, corrosion inhibiter is the mixture that zinc carbonate and BTA form for 1:1 in mass ratio, solvent is 31%, and solvent is the mixture that tetrahydrofurfuryl alcohol and diethylene glycol monobutyl ether 250 form for 4:1 in mass ratio, and above constituent mass percentage sum is 100%;
Step 2, in mass ratio for the mixture that 4:1 forms is heated to 90 ℃, adds the mixture of Foral, newtrex and pentaerythritol resin by tetrahydrofurfuryl alcohol and diethylene glycol monobutyl ether 250 while stirring, and constant temperature is stirred to completely and dissolves;
Step 3, the mixture that succinic acid and salicylic acid are formed for 1:6 in mass ratio adds in the solution that step 2 mixes, and stirs at 90 ℃;
Step 4, adds rilanit special in the solution that step 3 mixes, and stirs at 90 ℃;
Step 5, the mixture that zinc carbonate and BTA are formed for 1:1 in mass ratio adds in the solution that step 4 mixes, and is stirred to solution even at 90 ℃, is cooled to room temperature, obtains low-silver lead-free solder(ing) paste scaling powder.
The scaling powder of embodiment 3 preparation is yellow thickness lotion, deposits in (2～5 ℃) under refrigerator cold-storage environment by this scaling powder is airtight, within 2 years, does not lose efficacy.This scaling powder and Sn0.3Ag0.7Cu scolding tin micro mist is even with mass ratio 15:85 mechanical mixture, make solder(ing) paste, deposit in (2～5 ℃) under refrigerator cold-storage environment by this solder(ing) paste is airtight, within 6 months, do not lose efficacy; Airtight depositing under room temperature environment, did not lose efficacy within 20 days.
Embodiment 4
Step 1, according to mass percent, take respectively Foral 25%, newtrex 15%, pentaerythritol resin 20%, activating agent 10%, activating agent is the mixture that succinic acid and salicylic acid form for 1:6 in mass ratio, rilanit special 8%, corrosion inhibiter is 0.5%, corrosion inhibiter is the mixture that zinc carbonate and BTA form for 1:1 in mass ratio, solvent is 22.5%, and solvent is the mixture that tetrahydrofurfuryl alcohol and diethylene glycol monobutyl ether 400 form for 5:1 in mass ratio, and above constituent mass percentage sum is 100%;
Step 2, in mass ratio for the mixture that 5:1 forms is heated to 90 ℃, adds the mixture of Foral, newtrex and pentaerythritol resin by tetrahydrofurfuryl alcohol and diethylene glycol monobutyl ether 400 while stirring, and constant temperature is stirred to completely and dissolves;
Step 3, the mixture that succinic acid and salicylic acid are formed for 1:6 in mass ratio adds in the solution that step 2 mixes, and stirs at 90 ℃;
Step 4, adds rilanit special in the solution that step 3 mixes, and stirs at 90 ℃;
Step 5, the mixture that zinc carbonate and BTA are formed for 1:1 in mass ratio adds in the solution that step 4 mixes, and is stirred to solution even at 90 ℃, is cooled to room temperature, obtains low-silver lead-free solder(ing) paste scaling powder.
The scaling powder of embodiment 4 preparation is yellow thickness lotion, deposits in (2～5 ℃) under refrigerator cold-storage environment by this scaling powder is airtight, within 2 years, does not lose efficacy.This scaling powder and Sn0.3Ag0.7Cu scolding tin micro mist is even with mass ratio 13:87 mechanical mixture, and solder(ing) paste processed, deposits in (2～5 ℃) under refrigerator cold-storage environment by this solder(ing) paste is airtight, within 1 year, does not lose efficacy; Airtight depositing under room temperature environment, did not lose efficacy within 30 days.
Embodiment 5
Step 1, according to mass percent, take respectively ice galbanum 17.5%, water-white rosin 17.5%, activating agent 12%, activating agent is the mixture that malonic acid and adipic acid form for 1:2 in mass ratio, rilanit special 10%, corrosion inhibiter 5%, corrosion inhibiter is the mixture that zinc carbonate and BTA form for 2:1 in mass ratio, ethylene glycol 38%, and above constituent mass percentage sum is 100%;
Step 2, is heated to 80 ℃ by ethylene glycol, adds while stirring the mixture of ice galbanum and water-white rosin, and constant temperature is stirred to completely and dissolves;
Step 3, the mixture that malonic acid and adipic acid are formed for 1:2 in mass ratio adds in the solution that step 2 mixes, and stirs at 80 ℃;
Step 4, adds rilanit special in the solution that step 3 mixes, and stirs at 80 ℃;
Step 5, the mixture that zinc carbonate and BTA are formed for 2:1 in mass ratio adds in the solution that step 4 mixes, and is stirred to solution even at 80 ℃, is cooled to room temperature, obtains low-silver lead-free solder(ing) paste scaling powder.
Embodiment 6
Step 1, according to mass percent, take respectively Foral 30%, ice galbanum 15%, activating agent 10%, activating agent is the mixture that succinic acid and DL-malic acid form for 1:8 in mass ratio, rilanit special 8%, corrosion inhibiter 10%, corrosion inhibiter is the mixture that zinc carbonate and BTA form for 1:2 in mass ratio, EGME 27%, and above constituent mass percentage sum is 100%;
Step 2, is heated to 85 ℃ by EGME, adds while stirring the mixture of Foral and ice galbanum, and constant temperature is stirred to completely and dissolves;
Step 3, the mixture that succinic acid and DL-malic acid are formed for 1:8 in mass ratio adds in the solution that step 2 mixes, and stirs at 85 ℃;
Step 4, adds rilanit special in the solution that step 3 mixes, and stirs at 85 ℃;
Step 5, the mixture that zinc carbonate and BTA are formed for 1:2 in mass ratio adds in the solution that step 4 mixes, and is stirred to solution even at 85 ℃, is cooled to room temperature, obtains low-silver lead-free solder(ing) paste scaling powder.
Embodiment 7
Step 1, according to mass percent, take respectively ice galbanum 24%, newtrex 6%, activating agent 15%, activating agent is the mixture that salicylic acid and DL-malic acid form for 1:4 in mass ratio, rilanit special 9%, corrosion inhibiter 0.1%, corrosion inhibiter is the mixture that zinc carbonate and BTA form for 1.5:1 in mass ratio, PEG400 45.9%, and above constituent mass percentage sum is 100%;
Step 2, is heated to 90 ℃ by PEG400, adds while stirring the mixture of ice galbanum and newtrex, and constant temperature is stirred to completely and dissolves;
Step 3, the mixture that salicylic acid and DL-malic acid are formed for 1:4 in mass ratio adds in the solution that step 2 mixes, and stirs at 90 ℃;
Step 4, adds rilanit special in the solution that step 3 mixes, and stirs at 90 ℃;
Step 5, the mixture that zinc carbonate and BTA are formed for 1.5:1 in mass ratio adds in the solution that step 4 mixes, and is stirred to solution even at 90 ℃, is cooled to room temperature, obtains low-silver lead-free solder(ing) paste scaling powder.
Claims (10)
1. a low-silver lead-free solder(ing) paste scaling powder, is characterized in that, composed of the following components according to mass percent: film forming matter 30～60%, activating agent 10～15%, rheological agent 8～10%, corrosion inhibiter 0.1～10%, surplus is solvent, and above constituent mass percentage sum is 100%.
2. low-silver lead-free solder(ing) paste scaling powder according to claim 1, it is characterized in that, described film forming matter is any two kinds of mixtures that form for 1:1～4:1 in mass ratio in Foral, ice galbanum, newtrex, water-white rosin, or the mixture that any two kinds of rosin and pentaerythritol resin or 90M resin form, wherein pentaerythritol resin or 90M resin content are 5～20% of scaling powder gross mass.
3. low-silver lead-free solder(ing) paste scaling powder according to claim 1, is characterized in that, described activating agent is any two kinds of mixtures that form for 1:8～1:2 in mass ratio in malonic acid, succinic acid, adipic acid, salicylic acid, DL-malic acid.
4. low-silver lead-free solder(ing) paste scaling powder according to claim 1, is characterized in that, described rheological agent is rilanit special; Corrosion inhibiter is zinc carbonate or BTA, or zinc carbonate and BTA are the mixture that 2:1～1:2 forms in mass ratio.
5. low-silver lead-free solder(ing) paste scaling powder according to claim 1, it is characterized in that, described solvent is a kind of in tetrahydrofurfuryl alcohol, ethylene glycol, EGME or PEG400, or the mixture that to be tetrahydrofurfuryl alcohol form for 2:1～5:1 in mass ratio with diethylene glycol monobutyl ether 250 or diethylene glycol monobutyl ether 400.
6. a preparation method for scaling powder for low-silver lead-free solder(ing) paste, is characterized in that, specifically according to following steps, implements:
Step 1, takes respectively film forming matter 30～60% according to mass percent, activating agent 10～15%, and rheological agent 8～10%, corrosion inhibiter 0.1～10%, surplus is solvent, above constituent mass percentage sum is 100%;
Step 2, is heated to 80～90 ℃ by solvent, adds while stirring film forming matter, and constant temperature is stirred to completely and dissolves;
Step 3, adds activating agent in the solution that step 2 mixes, and stirs at 80～90 ℃;
Step 4, adds rheological agent in the solution that step 3 mixes, and stirs at 80～90 ℃;
Step 5, adds corrosion inhibiter in the solution of step 4 mixing, is stirred to solution even at 80～90 ℃, is cooled to room temperature, obtains low-silver lead-free solder(ing) paste scaling powder.
7. the preparation method of scaling powder for low-silver lead-free solder(ing) paste according to claim 6, it is characterized in that, in step 1, film forming matter is any two kinds of mixtures that form for 1:1～4:1 in mass ratio in Foral, ice galbanum, newtrex, water-white rosin, or the mixture that any two kinds of rosin and pentaerythritol resin or 90M resin form, wherein pentaerythritol resin or 90M resin content are 5～20% of scaling powder gross mass.
8. the preparation method of scaling powder for low-silver lead-free solder(ing) paste according to claim 6, it is characterized in that, in step 1, activating agent is any two kinds of mixtures that form for 1:8～1:2 in mass ratio in malonic acid, succinic acid, adipic acid, salicylic acid, DL-malic acid.
9. the preparation method of scaling powder for low-silver lead-free solder(ing) paste according to claim 6, is characterized in that, in step 1, rheological agent is rilanit special; Corrosion inhibiter is zinc carbonate or BTA, or zinc carbonate and BTA are the mixture that 2:1～1:2 forms in mass ratio.
10. the preparation method of scaling powder for low-silver lead-free solder(ing) paste according to claim 6, it is characterized in that, in step 1, solvent is a kind of in tetrahydrofurfuryl alcohol, ethylene glycol, EGME or PEG400, or the mixture that to be tetrahydrofurfuryl alcohol form for 2:1～5:1 in mass ratio with diethylene glycol monobutyl ether 250 or diethylene glycol monobutyl ether 400.
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| CN201410177358.1A CN103949803A (en) | 2014-04-29 | 2014-04-29 | Soldering flux for low-silver lead-free soldering paste and preparation method for soldering flux |
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| CN201410177358.1A CN103949803A (en) | 2014-04-29 | 2014-04-29 | Soldering flux for low-silver lead-free soldering paste and preparation method for soldering flux |
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| CN103949803A true CN103949803A (en) | 2014-07-30 |
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| CN104874940A (en) * | 2015-06-18 | 2015-09-02 | 重庆理工大学 | Non-cleaning flux for low-silver lead-free brazing filler metal and preparation method of non-cleaning flux |
| CN108941971A (en) * | 2018-08-16 | 2018-12-07 | 广东省焊接技术研究所（广东省中乌研究院） | One kind aqueous tin cream free of cleaning and preparation method thereof |
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