CN105499828A - Novel soldering paste - Google Patents
Novel soldering paste Download PDFInfo
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- CN105499828A CN105499828A CN201410499023.1A CN201410499023A CN105499828A CN 105499828 A CN105499828 A CN 105499828A CN 201410499023 A CN201410499023 A CN 201410499023A CN 105499828 A CN105499828 A CN 105499828A
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- scaling powder
- glass putty
- alkynol
- tin cream
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Abstract
The invention discloses novel soldering paste which comprises tin powder, a flux and an alkynol compound. The tin powder is one or a combination of a general solder alloy, an Sn-Pb alloy and an Sn-Zn alloy, and additives, such as copper, bismuth, indium and antimony, are allowed to be added in the tin powder especially. The flux is in a form of a liquid or a paste body, and comprises the following components according to the formula ratio: 30-75 percent of a main material, 20-60 percent of solvent, 1-10 percent of thixotropic agent and 0-20 percent of activator, and 0-3 percent of additive. The additive amount of the alkynol compound is 0.005-1 percent if the total weight of the tin powder and the flux is 100. The formula of the novel soldering paste is designed, the lasting viscosity stability of the novel soldering paste is ensured by virtue of the alkynol compound, and when the novel soldering paste is used in combination with an alloy containing indium, the variation of the viscosity of the novel soldering paste is not generated, and the welding quality of a circuit board is improved.
Description
Technical field
The present invention relates to a kind of solder(ing) paste, scaling powder technical equipment field, particularly a kind of Novel welding tin cream.
Background technology
Along with the development of electronic science and technology, surface mounting technology is in occupation of more and more important effect in Electronic Assemblies, and solder(ing) paste is a kind of solder arisen at the historic moment along with surface mounting technology, is also extremely important auxiliary material in surface mount.Domestic printed circuit board (PCB) uses solder(ing) paste in high-end, High Density Packaging field, as: go back ubiquity in the printed circuit board welding process of high-grade mobile phone, digital camera, precision instrument etc. and easily produce bubble, rosin joint, connect weldering compared with same kind of products at abroad, easily dry in particularly using, namely viscosity stability difference etc. problem, be on the one hand that external solder(ing) paste production equipment will be got well relatively, reason domesticly in formula for a product and associated production technique, also there is wretched insufficiency on the other hand.
Solder(ing) paste is the critical material in surface installation technique, its performance quality directly affects the quality of electronic product, in Electronic Assemblies, the quality problems of 80% are relevant to solder(ing) paste, solder(ing) paste according to solder(ing) paste viscosity B coefficent completes the welding of electronic product, will form weld defect, can hide some dangers for undoubtedly to the reliability of electronic product, along with electronic technology constantly develops, the welding quality proposed requirement of people to electronic product is also more and more higher.
In prior art circuits plate welding process, scaling powder and glass putty are mixed, the i.e. solder(ing) paste of general designation, first be about to solder(ing) paste and smear and be printed onto on circuit board (PCB), being inserted by electronic building brick is downloaded on substrate again, in processing procedure, substrate is by reflow soldering, by the method for reflow soldering heating for dissolving, carries out the welding of assembly pin; Usual solder(ing) paste scaling powder used is generally be made up of resin, solvent, activating agent, thixotropic agent etc., and the glass putty used also is tin-lead alloy powder.
Shortcoming/the deficiency of prior art is: glass putty and scaling powder mixing after tin cream, in preservation process, activating agent in glass putty and scaling powder reacts, particularly when using the alloy containing indium composition, both reactions are larger, consequently cause the viscosity of solder(ing) paste to change, the expansion of solder(ing) paste superficial layer is also hardening, and the overall viscosity of tin cream is deteriorated or the viscosity that disappears after a period of time has passed; Above-mentioned defect causes the printing of substrate, the wettability of glass putty becomes extremely low, and printing the problem such as bad, wet performance is bad often has generation; Substrate after the printing, enters a few hours between reflow soldering, and section can cause the wettability of glass putty bad with the change of interior solder(ing) paste at this moment, causes the bad connection of substrate and assembly, finally affects product quality.
Summary of the invention
For solving the problems of the technologies described above, the invention provides a kind of Novel welding tin cream, for deficiency of the prior art and defect, design Novel welding tin cream formula, by the combination of glass putty, scaling powder and alkynol compound additive, there is provided solder(ing) paste to arrive through this period of standing time of reflow soldering when preserving or after substrate printed coating, viscosity variation situation can not occur, to remove the bad problem because time variations produces; When sharing with the alloy containing indium composition, the change of solder(ing) paste viscosity can not be produced too, improving the welding quality of circuit board.
For achieving the above object, technical scheme of the present invention is as follows: a kind of Novel welding tin cream, comprises glass putty, scaling powder, alkynol system compound, it is characterized in that:
Described Novel welding tin cream is proportionally mixed and processed by glass putty, liquid state or paste soldering flux, alkynol based compound.
Described glass putty adopts one or more alloy combination in General welding ashbury metal, tin-lead alloy, tin-zinc alloy, particularly allows to add the additives such as copper, bismuth, indium, antimony in described glass putty, still can normally use; Any shape of described glass putty all can use, as circle, irregular shape or both mixtures; The particle size range of described glass putty is 5um-50um.
Described scaling powder proterties is liquid or body of paste, and described scaling powder comprises main material, solvent, thixotropic agent, activating agent; Described scaling powder is according to weight percent meter (100%), and its formula rate is main material is 30-75%, solvent 20-60%, thixotropic agent 1-10%, activating agent 0-20%, auxiliary agent 0-3%.
The main material of described scaling powder comprises any one or multiple mixture composition in gum rosin, newtrex, Foral, disproportionated rosin, various derivant and alkyd resin, synthetic resin.
Described solvent is made up of ester classes such as the alcohol types such as MonoEthyeneglycol mono-vinyl ethylene glycol, Diethyleneglycolmonobutylether butyl, Hexyleneglycol hexylene glycol, Terpineol terpinol, benzoic acid butyl ester, diethylene adipates.
Described thixotropic agent is made up of raw materials such as hardened castor oil, beeswax, Brazil wax, stearic amide, alkyl stearic acid.
Described activating agent is made by raw materials such as ammonium halogen hydracid salt, organic acid, organic amine classes; Described organic acid is diethylamine hydrobromide, ethanedioic acid, stearic acid, benzoic acid composition; Organic amine is ethamine, dioctyl ester amine, triethyl amine composition.
In described scaling powder, also appropriate proportioning is added with the auxiliary agents such as antioxidant, deodorant, delustering agent.
Described alkynol based compound, be a kind of compound of a kind of acetylene in conjunction with close carbon alkyl combined structure, described alkynol based compound is made up of one or two or more kinds mixture independent in following compound; The use amount of described alkynol compound, as with the gross weight of glass putty and scaling powder for 100, its addition scope is 0.005-10%; Specifically comprise following compound:
3-methyl-1-butyne-3-ol:3-methyl isophthalic acid-butine-3-alcohol;
3-methyl-1-pentine-3-ol:3-methyl-1-pentene alkynes-3-alcohol;
3,5-dimethyl-1-hexyne-3-ol:3,5-dimethyl-1-alkynes-3-alcohol;
2,5-dimethyl-3-hexyne-2,5-diol:2,5-dimethyl-3-is alkynes-2,5-glycol;
3,6-dimethyl-4-octyne-6-diol:3,6-dimethyl-4-octyne-6-glycol;
2,4,7,9-tetramethyl-5-decyn-4,7-diol:2,4,7,9-tetramethyl-5-decine-4,7-glycol.
The chemical reaction that the present invention can effectively suppress because using soldering alloy, indium equal size is too high and produce; For this ashbury metal containing indium, the indium content in alloy allows the degree reaching 0.03-5%, still can have normal result of use.
Described alkynol has chemical stereo structural feature, make the electron density of glass putty, scaling powder, alkynol three kinds of bond peripheries very high, form high polarity group, because the metal ingredient in solder(ing) paste, dissociated in its surface to glass putty, produce the reaction suppressing glass putty and activating agent, consequently suppress the reaction of glass putty, activating agent, viscosity B coefficent can not be produced because of time variations.
Particularly in order to alkynol can prevent the time response of tin cream from making a variation, preferably add about 0.01 weight preferably.Contrary, if the consumption of alkynol compound is too much, other composition then producing scaling powder reduces as part by weight such as resin, activating agent, thixotropic agent, and wetability that is bad, scolding tin is not good, weldability declines, produce tin sweat(ing) to cause application to be printed ... Deng bad phenomenon; The use amount of alkynol is to be no more than 0.5 for best.
Preferably, when the ratio of described glass putty and scaling powder adds up to 100, the ratio that described glass putty proportion is 80-95%, scaling powder proportion is 5-20% is the most suitable.
One of the modulator approach of described solder(ing) paste for glass putty, scaling powder, alkynol being mixed or alkynol elder generation and scaling powder are mixed simultaneously, and then mixes with glass putty or alkynol and glass putty is mixed, then the three kinds of methods mixed with scaling powder.
In the modulation of described solder(ing) paste, alkynol and scaling powder are first mixed, when then being mixed with glass putty by mixed material, more can promote the dispersiveness of alkynol and regiospecific or directionality.
By technique scheme, the beneficial effect of technical solution of the present invention is: described solder(ing) paste can effectively be used in the reflow soldering process process of electronic component, electronic module, printed circuit board (PCB) etc. of conventionally manufacture; With various glass putty with the use of time, can make solder(ing) paste after preservation or application substrate, the middle standing time started before Reflow Soldering manufacture process the bad phenomenon such as sclerderm film, caking, viscosity B coefficent can not occur; Significantly improve substrate painting effect, printing performance and welding performance; Design Novel welding tin cream formula, through the combination of glass putty, scaling powder and alkynol compound additive, guarantee that solder(ing) paste has lasting viscosity stability, when sharing with the alloy containing indium composition, the change of solder(ing) paste viscosity can not be produced too, improve the welding quality of circuit board.
subordinate list explanation
Subordinate list 1 is proportioning and the performance evaluation table of a kind of Novel welding tin cream specific embodiment 1 to example 6 disclosed in this invention;
Subordinate list 2 is the comparative example 1 of a kind of Novel welding tin cream disclosed in this invention without alkynol based compound and the performance evaluation table of example 2.
Symbol description is evaluated in corresponding component title and table in table:
1. glass putty 2. scaling powder 3. alkynol based compound 4. main material
5. solvent 6. thixotropic agent 7. activating agent 8. auxiliary agent
◎: very zero: good △: can X be used: bad
Detailed description of the invention
Below in conjunction with the subordinate list in the embodiment of the present invention, be clearly and completely described technical scheme, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
According to subordinate list 1 and subordinate list 2, the invention provides a kind of Novel welding tin cream, comprise glass putty 1, scaling powder 2, alkynol based compound 3.
Described Novel welding tin cream is proportionally mixed and processed by glass putty 1, liquid state or paste soldering flux 2, alkynol based compound 3.
Described glass putty 1 adopts one or more alloy combination in General welding ashbury metal, tin-lead alloy, tin-zinc alloy, particularly allows to add the additives such as copper, bismuth, indium, antimony in described glass putty, still can normally use; Any shape of described glass putty all can use, as circle, irregular shape or both mixtures; The particle size range of described glass putty 1 is 10um-50um.
Described scaling powder 2 proterties is liquid or body of paste, and described scaling powder 2 comprises main material 4, solvent 5, thixotropic agent 6, activating agent 7; Described scaling powder 2 is according to weight percent meter (100%), and its formula rate is main material 4 is 30-75%, and solvent 5 is 20-60%, and thixotropic agent 6 is 1-10%, activating agent 7 is 0-20%, auxiliary agent 8 is 0-3%.
The main material 4 of described scaling powder 2 comprises gum rosin, newtrex mixture composition.
Described solvent 5 is Hexycarbitol diethylene glycol (DEG) hexyl ether.
Described thixotropic agent 6 is hardened castor oil.
Described activating agent 7 is diethylamine hydrobromide, ethanedioic acid, Dioctylamine dioctylamine mixture composition.
Also the auxiliary agents 8 such as antioxidant, deodorant, delustering agent are added with in right amount in described scaling powder 2.
Described alkynol based compound 3, be a kind of compound of a kind of acetylene in conjunction with close carbon alkyl combined structure, described alkynol based compound 3 is made up of one independent in following compound; Described alkynol compound 3 use amount, as with the gross weight of glass putty 1 and scaling powder 2 for 100, its addition scope is 0.025-3%; Specifically comprise following compound:
3-methyl-1-pentine-3-ol:3-methyl-1-pentene alkynes-3-alcohol;
2,5-dimethyl-3-hexyne-2,5-diol:2,5-dimethyl-3-is alkynes-2,5-glycol;
2,4,7,9-tetramethyl-5-decyn-4,7-diol:2,4,7,9-tetramethyl-5-decine-4,7-glycol.
The chemical reaction that the present invention can effectively suppress because using soldering alloy, indium equal size is too high and produce; For this ashbury metal containing indium, the indium content in alloy allows the degree reaching 0.03-5%, still can have normal result of use.
Described alkynol has chemical stereo structural feature, make the electron density of glass putty 1, scaling powder 2, alkynol three kinds of bond peripheries very high, form high polarity group, because the metal ingredient in solder(ing) paste, dissociated in its surface to glass putty, produce the reaction suppressing glass putty and activating agent, consequently suppress the reaction of glass putty, activating agent, viscosity B coefficent can not be produced because of time variations.
Particularly in order to alkynol can prevent the time response of tin cream from making a variation, the quantity of adding is advisable with minimum limitation as far as possible; Contrary, if the consumption of alkynol compound is too much, other composition then producing scaling powder reduces as part by weight such as resin, activating agent, thixotropic agent, and wetability that is bad, scolding tin is not good, weldability declines, produce the bad phenomenon of tin sweat(ing) etc. to cause application to be printed; The use amount of alkynol is to be no more than 0.5% for best.
Preferably, when the ratio of described glass putty 1 and scaling powder 2 adds up to 100, the ratio that described glass putty 1 proportion is 80-95%, scaling powder 2 proportion is 5-20% is the most suitable.
Described solder(ing) paste modulator approach is method glass putty 1, scaling powder 2, alkynol system compound 3 simultaneously mixed.
The embodiment of the present invention concrete operation step be: 1, the rosin recorded in subordinate list 1 and subordinate list 2, solvent 5, activating agent 7, thixotropic agent 6 and alkynol based compound 3 are cooled after putting into container heating for dissolving than quantity again, namely complete the modulation of scaling powder; 2, use Sn-Pb alloy or the Sn-Pb-In alloy of particle diameter 20-40um, put into container with the weight ratio of the part by weight of glass putty 90.5 and above-mentioned scaling powder 9.5, after stirring, namely complete the making of described solder(ing) paste.
The solder(ing) paste of invention is placed in container, is placed in 25 DEG C of environment and preserves after 15 days, adopts the tin cream in glass bar stirred vessel to do caking test, to determine whether caking.
Adopt viscosimeter (MacomuPCU-205) with 25 DEG C, 10rpm carries out tested viscosity value.
Adopt printing machine that solder(ing) paste is made electroplating film in copper laminated plates, carry out printing performance test.
Copper laminated plates after printing evaluation, the reflow oven putting into temperature 230 DEG C is welded, and judges its welding performance.
By above-mentioned specific embodiment, the invention has the beneficial effects as follows: described solder(ing) paste can effectively be used in the reflow soldering process process of electronic component, electronic module, printed circuit board (PCB) etc. of conventionally manufacture; With various glass putty with the use of time, can make solder(ing) paste after preservation or application substrate, the middle standing time started before Reflow Soldering manufacture process the bad phenomenon such as sclerderm film, caking, viscosity B coefficent can not occur; Significantly improve substrate painting effect, printing performance and welding performance; Design Novel welding tin cream formula, through the combination of glass putty, scaling powder and alkynol compound additive, guarantee that solder(ing) paste has lasting viscosity stability, when sharing with the alloy containing indium composition, the change of solder(ing) paste viscosity can not be produced too, improve the welding quality of circuit board.
To the above-mentioned explanation of the disclosed embodiments, professional and technical personnel in the field are realized or uses the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiments, General Principle as defined herein can without departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention can not be restricted to these embodiments shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Subordinate list 1 is a kind of Novel welding tin cream specific embodiment 1 to example 6 proportioning disclosed in this invention and performance evaluation table
Subordinate list 2 is the comparative example 1 of a kind of Novel welding tin cream disclosed in this invention without alkynol based compound and the performance evaluation table of example 2
Claims (8)
1. a Novel welding tin cream, is characterized in that, comprises glass putty, scaling powder, alkynol system compound; Described Novel welding tin cream is proportionally mixed and processed by glass putty, scaling powder, alkynol based compound; Described glass putty adopts one or more alloy combination in General welding ashbury metal, tin-lead alloy, tin-zinc alloy, particularly allow to add the additives such as copper, bismuth, indium, antimony in described glass putty, described glass putty shape is circle, irregular shape or both mixtures; The particle size range of described glass putty is 5um-50um particle diameter; Described flux shape is liquid or body of paste, and described scaling powder comprises main material, solvent, thixotropic agent, activating agent; Described scaling powder is according to weight percent meter, and its formula rate is main material is 30-75%, solvent 20-60%, thixotropic agent 1-10%, activating agent 0-20%, auxiliary agent 0-3%; Described alkynol based compound quantity, as with the gross weight of glass putty and scaling powder for 100, its addition scope is 0.005-1%; In described scaling powder, also appropriate proportioning is added with the auxiliary agents such as antioxidant, deodorant, delustering agent.
2. a kind of Novel welding tin cream according to claim 1, it is characterized in that, the main material of described scaling powder comprises any one or multiple mixture composition in gum rosin, newtrex, Foral, disproportionated rosin, various derivant and alkyd resin, synthetic resin.
3. a kind of Novel welding tin cream according to claim 1, is characterized in that, described solvent is made up of ester classes such as the alcohol types such as mono-vinyl ethylene glycol, butyl, hexylene glycol, terpinol, benzoic acid butyl ester, diethylene adipates.
4. a kind of Novel welding tin cream according to claim 1, is characterized in that, described thixotropic agent is made up of raw materials such as hardened castor oil, beeswax, Brazil wax, stearic amide, alkyl stearic acid.
5. a kind of Novel welding tin cream according to claim 1, is characterized in that, described activating agent is made by raw materials such as ammonium halogen hydracid salt, organic acid, organic amine classes; Described organic acid is diethylamine hydrobromide, ethanedioic acid, stearic acid, benzoic acid composition; Organic amine is ethamine, dioctyl ester amine, triethyl amine composition.
6. a kind of Novel welding tin cream according to claim 1, it is characterized in that, described alkynol based compound is by 3-methyl isophthalic acid-butine-3-alcohol, methylpentynol, 3,5-dimethyl-1-alkynes-3-alcohol, 2,5-dimethyl-3-alkynes-2,5-glycol, 3,6-dimethyl-4-octyne-6-glycol, 2,4,7, independent one or two or more kinds mixture composition in 9-tetramethyl-5-decine-4,7-diol compound.
7. a kind of Novel welding tin cream according to claim 1, it is characterized in that, in described additive, indium content allows to reach 0.03-5%.
8. a kind of Novel welding tin cream according to claim 1, it is characterized in that, the modulator approach of described solder(ing) paste is for mixing glass putty, scaling powder, alkynol or alkynol elder generation and scaling powder are mixed simultaneously, one of and then mix with glass putty or alkynol and glass putty are mixed, then the three kinds of methods mixed with scaling powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410499023.1A CN105499828A (en) | 2014-09-25 | 2014-09-25 | Novel soldering paste |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410499023.1A CN105499828A (en) | 2014-09-25 | 2014-09-25 | Novel soldering paste |
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| CN105499828A true CN105499828A (en) | 2016-04-20 |
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| CN201410499023.1A Pending CN105499828A (en) | 2014-09-25 | 2014-09-25 | Novel soldering paste |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107498214A (en) * | 2016-11-29 | 2017-12-22 | 广东剑鑫科技股份有限公司 | Special cleaning-free scaling powders of the outer PIN of network transformer and preparation method thereof |
| CN109530977A (en) * | 2017-09-21 | 2019-03-29 | 株式会社田村制作所 | Scaling powder and soldering paste |
| CN110480206A (en) * | 2019-08-23 | 2019-11-22 | 重庆集诚汽车电子有限责任公司 | A kind of novel welding material and its application |
| CN115709349A (en) * | 2021-08-20 | 2023-02-24 | 北京小米移动软件有限公司 | Tin powder, preparation method of tin powder, tin paste, welding method of circuit board and circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1894050A (en) * | 2003-05-06 | 2007-01-10 | 高级技术材料公司 | Supercritical fluid-based cleaning compositions and methods |
| JP2008266597A (en) * | 2007-03-22 | 2008-11-06 | Arakawa Chem Ind Co Ltd | Polymeric rosin, hydrogenated polymeric rosin and production method of these rosins, as well as flux and solder paste using these rosins |
| CN102371443A (en) * | 2011-09-06 | 2012-03-14 | 云南锡业锡材有限公司 | Flux suitable for multiple tin-based welding pastes and preparation method thereof |
| CN101508061B (en) * | 2009-03-30 | 2012-10-03 | 汕头市骏码凯撒有限公司 | Welding flux for SnAgCu alloy solder powder and preparation method thereof |
| CN103242745A (en) * | 2007-03-22 | 2013-08-14 | 荒川化学工业株式会社 | Process for manufacturing polymelyzed rosin derivatives |
-
2014
- 2014-09-25 CN CN201410499023.1A patent/CN105499828A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1894050A (en) * | 2003-05-06 | 2007-01-10 | 高级技术材料公司 | Supercritical fluid-based cleaning compositions and methods |
| JP2008266597A (en) * | 2007-03-22 | 2008-11-06 | Arakawa Chem Ind Co Ltd | Polymeric rosin, hydrogenated polymeric rosin and production method of these rosins, as well as flux and solder paste using these rosins |
| CN103242745A (en) * | 2007-03-22 | 2013-08-14 | 荒川化学工业株式会社 | Process for manufacturing polymelyzed rosin derivatives |
| CN101508061B (en) * | 2009-03-30 | 2012-10-03 | 汕头市骏码凯撒有限公司 | Welding flux for SnAgCu alloy solder powder and preparation method thereof |
| CN102371443A (en) * | 2011-09-06 | 2012-03-14 | 云南锡业锡材有限公司 | Flux suitable for multiple tin-based welding pastes and preparation method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107498214A (en) * | 2016-11-29 | 2017-12-22 | 广东剑鑫科技股份有限公司 | Special cleaning-free scaling powders of the outer PIN of network transformer and preparation method thereof |
| CN107498214B (en) * | 2016-11-29 | 2019-06-14 | 广东剑鑫科技股份有限公司 | Dedicated cleaning-free scaling powder of the outer PIN of network transformer and preparation method thereof |
| CN109530977A (en) * | 2017-09-21 | 2019-03-29 | 株式会社田村制作所 | Scaling powder and soldering paste |
| CN109530977B (en) * | 2017-09-21 | 2021-11-19 | 株式会社田村制作所 | Flux and solder paste |
| CN110480206A (en) * | 2019-08-23 | 2019-11-22 | 重庆集诚汽车电子有限责任公司 | A kind of novel welding material and its application |
| CN110480206B (en) * | 2019-08-23 | 2021-09-28 | 重庆集诚汽车电子有限责任公司 | Welding material and application thereof |
| CN115709349A (en) * | 2021-08-20 | 2023-02-24 | 北京小米移动软件有限公司 | Tin powder, preparation method of tin powder, tin paste, welding method of circuit board and circuit board |
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