CN104942480A - Solid state scaling powder for stainless steel soldering and preparing method - Google Patents
Solid state scaling powder for stainless steel soldering and preparing method Download PDFInfo
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- CN104942480A CN104942480A CN201510375209.0A CN201510375209A CN104942480A CN 104942480 A CN104942480 A CN 104942480A CN 201510375209 A CN201510375209 A CN 201510375209A CN 104942480 A CN104942480 A CN 104942480A
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- Prior art keywords
- stainless steel
- acid
- solid flux
- solid
- soft soldering
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- 239000007787 solid Substances 0.000 title claims abstract description 59
- 229910001220 stainless steel Inorganic materials 0.000 title claims abstract description 52
- 239000010935 stainless steel Substances 0.000 title claims abstract description 51
- 238000005476 soldering Methods 0.000 title claims abstract description 45
- 239000000843 powder Substances 0.000 title abstract description 25
- 238000000034 method Methods 0.000 title abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 24
- 239000002184 metal Substances 0.000 claims abstract description 24
- 239000013543 active substance Substances 0.000 claims abstract description 20
- 239000002253 acid Substances 0.000 claims abstract description 18
- 239000006184 cosolvent Substances 0.000 claims abstract description 15
- 150000007513 acids Chemical class 0.000 claims abstract description 14
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 99
- 230000004907 flux Effects 0.000 claims description 47
- 239000000203 mixture Substances 0.000 claims description 24
- 239000007788 liquid Substances 0.000 claims description 17
- 230000007797 corrosion Effects 0.000 claims description 16
- 238000005260 corrosion Methods 0.000 claims description 16
- -1 α-AEEA Chemical compound 0.000 claims description 16
- 238000003756 stirring Methods 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 13
- 230000003213 activating effect Effects 0.000 claims description 11
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims description 10
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 10
- 238000002360 preparation method Methods 0.000 claims description 9
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 238000002425 crystallisation Methods 0.000 claims description 8
- 230000008025 crystallization Effects 0.000 claims description 8
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 8
- BHHYHSUAOQUXJK-UHFFFAOYSA-L zinc fluoride Chemical compound F[Zn]F BHHYHSUAOQUXJK-UHFFFAOYSA-L 0.000 claims description 8
- 239000002202 Polyethylene glycol Substances 0.000 claims description 7
- 229920001223 polyethylene glycol Polymers 0.000 claims description 7
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 6
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 5
- 230000008018 melting Effects 0.000 claims description 5
- 239000011787 zinc oxide Substances 0.000 claims description 5
- TXUICONDJPYNPY-UHFFFAOYSA-N (1,10,13-trimethyl-3-oxo-4,5,6,7,8,9,11,12,14,15,16,17-dodecahydrocyclopenta[a]phenanthren-17-yl) heptanoate Chemical compound C1CC2CC(=O)C=C(C)C2(C)C2C1C1CCC(OC(=O)CCCCCC)C1(C)CC2 TXUICONDJPYNPY-UHFFFAOYSA-N 0.000 claims description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 4
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 claims description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims description 4
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims description 4
- 239000011976 maleic acid Substances 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- UDGSVBYJWHOHNN-UHFFFAOYSA-N n',n'-diethylethane-1,2-diamine Chemical compound CCN(CC)CCN UDGSVBYJWHOHNN-UHFFFAOYSA-N 0.000 claims description 4
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 4
- 239000005416 organic matter Substances 0.000 claims description 4
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 claims description 4
- 229920002401 polyacrylamide Polymers 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229960004889 salicylic acid Drugs 0.000 claims description 4
- 235000011150 stannous chloride Nutrition 0.000 claims description 4
- 239000001119 stannous chloride Substances 0.000 claims description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims description 4
- 150000003852 triazoles Chemical class 0.000 claims description 4
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims description 3
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 claims description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims description 3
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 3
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 claims description 3
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 claims description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 claims description 3
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 3
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 claims description 3
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 claims description 3
- 238000013019 agitation Methods 0.000 claims description 3
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 229930016911 cinnamic acid Natural products 0.000 claims description 3
- 235000013985 cinnamic acid Nutrition 0.000 claims description 3
- 150000001991 dicarboxylic acids Chemical class 0.000 claims description 3
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 claims description 3
- 235000011187 glycerol Nutrition 0.000 claims description 3
- 150000002462 imidazolines Chemical class 0.000 claims description 3
- 235000014655 lactic acid Nutrition 0.000 claims description 3
- 235000011090 malic acid Nutrition 0.000 claims description 3
- 239000001630 malic acid Substances 0.000 claims description 3
- LGRLWUINFJPLSH-UHFFFAOYSA-N methanide Chemical compound [CH3-] LGRLWUINFJPLSH-UHFFFAOYSA-N 0.000 claims description 3
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 claims description 3
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 claims description 3
- IJFHXXRIQVMNDB-UHFFFAOYSA-N n-ethyl-n-[2-(ethylamino)ethyl]hydroxylamine Chemical compound CCNCCN(O)CC IJFHXXRIQVMNDB-UHFFFAOYSA-N 0.000 claims description 3
- 229910000480 nickel oxide Inorganic materials 0.000 claims description 3
- DBJLJFTWODWSOF-UHFFFAOYSA-L nickel(ii) fluoride Chemical compound F[Ni]F DBJLJFTWODWSOF-UHFFFAOYSA-L 0.000 claims description 3
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 claims description 3
- 229920001083 polybutene Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- ANOBYBYXJXCGBS-UHFFFAOYSA-L stannous fluoride Chemical compound F[Sn]F ANOBYBYXJXCGBS-UHFFFAOYSA-L 0.000 claims description 3
- 229960002799 stannous fluoride Drugs 0.000 claims description 3
- 239000001384 succinic acid Substances 0.000 claims description 3
- 239000011975 tartaric acid Substances 0.000 claims description 3
- 235000002906 tartaric acid Nutrition 0.000 claims description 3
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 claims description 3
- 229960001763 zinc sulfate Drugs 0.000 claims description 3
- 229910000368 zinc sulfate Inorganic materials 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 24
- 239000000463 material Substances 0.000 abstract description 5
- 238000003892 spreading Methods 0.000 abstract description 4
- 230000007480 spreading Effects 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 description 40
- 238000005219 brazing Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000009736 wetting Methods 0.000 description 4
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical group [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229920002594 Polyethylene Glycol 8000 Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 125000005605 benzo group Chemical group 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000002362 mulch Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses solid state scaling powder for stainless steel soldering and a preparing method. The solid state scaling powder comprises 0-68.5% of organic cosolvent, 0-19.8% of a metal active agent, 0-39.8% of an acids active agent, 0.1-0.8% of inhibiter and the balance is an organic vehicle. The preparing method comprises the steps that firstly, according to the weight ratio, the organic cosolvent and the metal active agent are mixed and stirred; secondly, the acids active agent is added into a solution disposed in the first step, standing is carried out on the solution for 24 hours. The solid state scaling powder for stainless steel soldering and the preparing method can be applied to the field of scaling powder, the problem that the welding performance is unstable can be effectively solved, and the problems that the spreading condition of soldering materials is poor, and the spreading rate is low can be effectively solved.
Description
Technical field
The present invention relates to scaling powder field, especially a kind of Solid flux for stainless steel soft soldering and preparation method.
Background technology
American Welding Society (AWS) (AWS) regulation solder liquidus temperature is solder brazing higher than 450 DEG C of solderings carried out, and is solder lower than 450 DEG C of solderings carried out.Solder mainly relies on solder to form joint to the wetting of mother metal.Solder is low-temperature welding technique, and it has following characteristics compared with solder brazing: (1) solder can carry out soldering with the common thermal source such as flatiron, blowtorch, is easy to operation; (2) heating-up temperature is low, and the structure property change of base metals is little, and welded part can be made to weld by any way, and its contingent expansion, Strength Changes and distortion are all less; (3) soldering productivity ratio is high, and a performance welding tens to several thousand weld seams, easily are automated production; (4) the brazing filler metal melts temperature owing to using is low, and during soldering, scaling powder is not easily burnt and the selectable scope of flux compounds be applicable to is wide, and performance is more excellent.
Have the wire of most of resistor and capacitor to adopt stainless steel material as pin in the market, the novel resistance to bending of stainless steel wire pin, toughness is strong, resistance to torsion; Its resistance to vibration is 3-6 times of ordinary steel wire pin, more reliable after electronic devices and components solder connects, product longer service life, and cost is lower; Meanwhile, along with the pursuit of various electronic installation aspect of performance such as good and high strength at appearance looks elegant, surface tactile sensation, electronic product more adopts the Stainless Steel Shell after various surface, intensity process.
But there is many difficult points and defect because welding temperature is too high in stainless steel soft soldering tech of the prior art; Simultaneously stainless steel complicated component, there is the oxide of Multiple components and structure on surface, soft solder and stainless steel material wetting poor, realize the fluxes for soft soldering that stainless steel soft soldering tech needs to prepare excellent performance.Meanwhile, stainless steel welding material disclosed in prior art and technology mainly concentrate on solder brazing, typically with ore, potassium titanate, titanium dioxide, crome metal compound, bismuth oxide, rare earth oxide or fluoride, and carbon, silicon, manganese, the composition combination meltings such as phosphorus form the stainless steel electrode for solder brazing, welding wire, welding powder etc., these products in use welding temperature are high, need to adopt the equipments such as arc welding, so inapplicable in the welding of electronic devices and components and casting of electronic device, electronic product requirement solder joint cannot be met little, reliability is high, surfacing, the characteristics such as solder joint light.
Summary of the invention
The technical problem that the present invention solves is to provide a kind of Solid flux for stainless steel soft soldering and preparation method, the welding activity that effectively can solve 320-420 DEG C of solder can not meet the problem of actual production demand, effectively can solve the problem helping weldering unstable properties, effectively can solve solder and sprawl situation difference, problem that the rate of spread is low.
For solving the problems of the technologies described above, the invention provides a kind of Solid flux for stainless steel soft soldering, it is characterized in that, calculate by weight percentage, this Solid flux comprises:
Organic cosolvent 0-68.5%, metal active agent 0-19.8%; Acids activating agent 0-39.8%, corrosion inhibiter 0.1-0.8%, surplus is organic carrier; Wherein,
Described organic cosolvent is one or more in glycerine, diethylene glycol (DEG), monoethanolamine, ethylenediamine, triethanolamine, butanediolamine, fatty amine, diethylamine, diethylenetriamine, 3-Propanolamine, polymine, azanol, α-AEEA, hydroxyl diethyl ethylenediamine, four hydroxyethyl diamines, succinic acid amine, N, N-diethyl ethylene diamine, tetrahydrofurfuryl alcohol;
Described metal active agent is one or more in dibutyltin diacetate, stannous methide, stannous chloride, stannous fluoride, tin fluoborate, titanium oxide, zinc sulfate, zinc oxide, zinc fluoride, nickel oxide, nickel fluoride, nickel chloride;
Described acids activating agent is one or more in monocarboxylic acid, dicarboxylic acids, 2 hydroxy propanoic acid, malic acid, maleic acid, fluoboric acid, hydrofluoric acid, tartaric acid, cinnamic acid, 11 carbon diacid, dodecanedioic acid, L-amino acid, salicylic acid;
Described corrosion inhibiter is the one in BTA, triazole type, imidazolines organic matter;
Described organic carrier is one or more in Foral, water-soluble rosin resin, polyethylene glycol, polyethylene glycol oxide, polypropylene, polyacrylamide, polybutene.
The above-mentioned Solid flux for stainless steel soft soldering also can have following features, and described Solid flux comprises:
The above-mentioned Solid flux for stainless steel soft soldering also can have following features, and described Solid flux comprises:
The above-mentioned Solid flux for stainless steel soft soldering also can have following features, and described Solid flux comprises:
The above-mentioned Solid flux for stainless steel soft soldering also can have following features, and described Solid flux comprises:
In addition, present invention also offers a kind of preparation method of Solid flux as previously mentioned, it is characterized in that, comprise the steps:
Step a, with mass ratio range, by organic cosolvent and metal active agent mix and blend;
Step b, is added acids activating agent in the solution that step a is configured, and leaves standstill 24 hours;
Step c, is heated to 140-145 DEG C by the solution that step b configures and removes the moisture brought into or produce in course of reaction, and then cool to room temperature, and obtains solid state crystallization thing;
Steps d, the solid state crystallization thing obtained by step c is placed in reactor, heats and keeps temperature to be 105-120 DEG C, and is stirred to and melts for liquid;
Step e, joins corrosion inhibiter in the liquid of melting, Keep agitation 5-30min;
Step f, is cooled to temperature 90-95 DEG C by the liquid of step e, adds organic carrier and stirs 10-20min;
Step g, by the mixture cool to room temperature of step f, obtains the Solid flux for stainless steel soft soldering.
Scaling powder prepared by the present invention is prepared the solid state crystallization thing having and remove stainless steel surface oxides performance by organic cosolvent, metal active agent and acids activating agent three complete reaction; Mushy stage occurs this solid state crystallization thing between 70-80 DEG C changes, have no irritating odor, it is neutral substance under normal temperature, the effect also effectively removing stainless steel surface oxides and grease can be decomposed when welding and being heated, can there is displacement reaction rapidly with the metal simple-substance on top layer in the metal ion simultaneously wherein added, at its Surface mulch one deck and the good metal bonding layer of soft solder wetability.
The metal active agent added in scaling powder of the present invention is dissolved or is uniformly distributed in organic cosolvent and acids active agent response product, in solder termination process, metal active agent presents with positive and negative ion state, the simple substance atom effect exposed with top layer, there is displacement reaction and at the new dissimilar metal layer of stainless steel Surface Realize, this new metal level and stainless steel-based physical efficiency reach metallurgical binding, and it is wetting good with the soft solder of melting, soft solder sprawling at matrix skin can be promoted, promote welding spot reliability, effectively ensure solder joint service life.
The corrosion inhibiter of scaling powder of the present invention can after welding completes, and forms stable non-corrosiveness product, reduce the corrosion of residue butt welding point joint and electronic devices and components, improve the service life of components and parts and equipment with the material such as residual corrosive ion.
The carrier of scaling powder of the present invention is water-soluble, volatile noresidue organic solvent, the state of organic cosolvent, metal active agent and inhibition agent composition can be adjusted, ensure to be the solid-state of high strength at normal temperatures, and rapid curing in lead-free soldering wire drawing process process, flux-free spillover.
Scaling powder of the present invention, the flame spray welding etc. when being applicable to the machine automatization weldering within the scope of 320-420 DEG C, the weldering of manual flatiron and being applied to larger electronic device, can realize carrying out solder to the stainless steel electronic device of Multiple components.
Relative to prior art, technique scheme of the present invention has following beneficial effect:
1, the present invention adopt organic cosolvent, metal active agent and acids activating agent product as the striping composition in scaling powder and active component,, low-hygroscopicity, butt welding point joint and solder horn non-corrosiveness solid-state in high strength, help weldering stable performance at normal temperatures; Especially can give full play to welding active under the soldering temperature of 320-420 DEG C, effectively remove the surface oxides of stainless steel device, solder is sprawled in order, and the rate of spread is high.
2, metal active agent is added in scaling powder of the present invention, in welding process, play the effect of removing oxide-film and forming new metal simple-substance top layer simultaneously, effectively can promote that lead-free brazing is at the wetting and spreading on device top layer, improve wettability and the Joint Strength of soft solder and substrate.
3, the organic carrier that the present invention adopts is water-soluble and volatile organic matter, and postwelding residue is few, can wash by water.
Other features and advantages of the present invention will be set forth in the following description, and, partly become apparent from description, or understand by implementing the present invention.Object of the present invention and other advantages realize by structure specifically noted in description, claims and obtain.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearly understand, hereinafter will be described in detail to embodiments of the invention.It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can be combined mutually.
The invention provides a kind of Solid flux for stainless steel soft soldering, calculate by weight percentage, this Solid flux comprises:
Organic cosolvent 0-68.5%, metal active agent 0-19.8%; Acids activating agent 0-39.8%, corrosion inhibiter 0.1-0.8%, surplus is organic carrier; Wherein,
Described organic cosolvent is one or more in glycerine, diethylene glycol (DEG), monoethanolamine, ethylenediamine, triethanolamine, butanediolamine, fatty amine, diethylamine, diethylenetriamine, 3-Propanolamine, polymine, azanol, α-AEEA, hydroxyl diethyl ethylenediamine, four hydroxyethyl diamines, succinic acid amine, N, N-diethyl ethylene diamine, tetrahydrofurfuryl alcohol;
Described metal active agent is one or more in dibutyltin diacetate, stannous methide, stannous chloride, stannous fluoride, tin fluoborate, titanium oxide, zinc sulfate, zinc oxide, zinc fluoride, nickel oxide, nickel fluoride, nickel chloride;
Described acids activating agent is one or more in monocarboxylic acid, dicarboxylic acids, 2 hydroxy propanoic acid, malic acid, maleic acid, fluoboric acid, hydrofluoric acid, tartaric acid, cinnamic acid, 11 carbon diacid, dodecanedioic acid, L-amino acid, salicylic acid;
Described corrosion inhibiter is the one in BTA, triazole type, imidazolines organic matter;
Described organic carrier is one or more in Foral, water-soluble rosin resin, polyethylene glycol, polyethylene glycol oxide, polypropylene, polyacrylamide, polybutene.
Accordingly, present invention also offers a kind of preparation method of Solid flux as previously mentioned, it is characterized in that, comprise the steps:
Step a, with mass ratio range, by organic cosolvent and metal active agent mix and blend;
Step b, is added acids activating agent in the solution that step a is configured, and leaves standstill 24 hours;
Step c, is heated to 140-145 DEG C by the solution that step b configures and removes the moisture brought into or produce in course of reaction, and then cool to room temperature, and obtains solid state crystallization thing;
Steps d, the solid state crystallization thing obtained by step c is placed in reactor, heats and keeps temperature to be 105-120 DEG C, and is stirred to and melts for liquid;
Step e, joins corrosion inhibiter in the liquid of melting, Keep agitation 5-30min;
Step f, is cooled to temperature 90-95 DEG C by the liquid of step e, adds organic carrier and stirs 10-20min;
Step g, by the mixture cool to room temperature of step f, obtains the Solid flux for stainless steel soft soldering.
Accordingly, the invention provides following multiple specific embodiment (it should be noted that: following examples constituent content all by weight percentage);
Embodiment 1
For a Solid flux for stainless steel soft soldering, composition of raw materials component is as follows:
Collocation method: N, N-diethyl ethylene diamine, zinc fluoride weighed by said ratio and stir in corrosion-resistant reactor, be slowly dropwise added in reactor by the fluoboric acid of the 40%wt concentration of weighing, placement 24 is little of reacting completely; Above-mentioned reaction solution is heated to 145 DEG C moisture is fully removed, solid-state active mixture to be cooled; Again above-mentioned solid mixt is heated to 110 DEG C in a kettle., add BTA again in above-mentioned liquid object, continue to stir 20min, polyethylene glycol oxide 100000 carrier of said ratio is added when liquid scaling powder temperature is down to 90 DEG C, continue stirring until and mix, be cooled to normal temperature, namely obtain a kind of Solid flux for stainless steel soft soldering.
Embodiment 2
For a Solid flux for stainless steel soft soldering, composition of raw materials component is as follows:
Collocation method: azanol, four hydroxyethyl diamines, zinc oxide weighed by said ratio and stir in corrosion-resistant reactor, be slowly dropwise added in reactor by the hydrofluoric acid of 40% concentration weighed, placement 24 is little of reacting completely; Above-mentioned reaction solution is heated to 140 DEG C moisture is fully removed, solid-state active mixture to be cooled; Again above-mentioned solid mixt is heated to 105 DEG C in a kettle., add triazole type corrosion inhibiter again in above-mentioned liquid object, continue to stir 15min, the PEG 8000 carrier of said ratio is added when liquid scaling powder temperature is down to 90 DEG C, continue stirring until and mix, be cooled to normal temperature, namely obtain a kind of Solid flux for stainless steel soft soldering.
Embodiment 3
For a Solid flux for stainless steel soft soldering, composition of raw materials component is as follows:
Collocation method: α-AEEA, zinc oxide, stannous chloride weighed by said ratio and stir in corrosion-resistant reactor, be added in reactor by the maleic acid of weighing, placement 24 is little of reacting completely; Above-mentioned reaction solution is heated to 145 DEG C moisture is fully removed, solid-state active mixture to be cooled; Again above-mentioned solid mixt is heated to 105 DEG C in a kettle., add imidazoline again in above-mentioned liquid object, continue to stir 10min, the water-soluble rosin resin carrier of said ratio is added when liquid scaling powder temperature is down to 90 DEG C, continue stirring until and mix, be cooled to normal temperature, namely obtain a kind of Solid flux for stainless steel soft soldering.
Embodiment 4
For a Solid flux for stainless steel soft soldering, composition of raw materials component is as follows:
Collocation method: diethylenetriamine, nickel chloride weighed by said ratio and stir in corrosion-resistant reactor, be slowly dropwise added in reactor by the hydrofluoric acid of the salicylic acid of weighing and 40% concentration, placement 24 is little of reacting completely; Above-mentioned reaction solution is heated to 145 DEG C moisture is fully removed, solid-state active mixture to be cooled; Again above-mentioned solid mixt is heated to 120 DEG C in a kettle., adding benzo three nitrogen again files in above-mentioned liquid object, continue to stir 12min, the Polyacrylamide gel of said ratio is added when liquid scaling powder temperature is down to 90 DEG C, continue stirring until and mix, be cooled to normal temperature, namely obtain a kind of Solid flux for stainless steel soft soldering.
In order to the implementation result of above-described embodiment provided by the invention effectively can be verified, present invention also offers the following method of inspection:
Above case study on implementation makes a kind of Solid flux for stainless steel soft soldering, with reference to lead-free brazing rate of spread measuring method described in GB GB9491, to spread lead-free brazing as the diameter of a ball and the rate of spread characteristic manner of ratio as solder expanding rear center's height.
Concrete operations technique is as described below:
1, specification is the stainless steel substrates 5 of 50 × 50 × 0.3mm, uses ethanol purge dry for standby.
2, Sn-0.7Cu solder is coiled into the solder ring that quality is 0.3 ± 0.005g.
3, get stainless steel substrates, place a solder ring in central authorities, and add above-mentioned scaling powder provided by the invention in ring central authorities.
4, after the heated at constant temperature platform this test piece being placed on test temperature keeps 20s, air cooling is to room temperature, wipes flux residue with absolute ethyl alcohol, adopts micrometer to record each solder joint height (Hi).
5, the height using the arithmetic mean of instantaneous value (Hav) of the solder joint height (Hi) in five pieces of test pieces as described scaling powder postwelding Lead-Free Solder Joint, occurs that the sample of obvious deviation should be left out.
6,5 solder rings are placed in evaporating dish heat respectively, make its fusing point be a bead.Put it into after cooling in the specific gravity bottle of 25 DEG C and measure its displacement (m) in water, obtain molten bulb diameter according to following formula,
V＝m/5
V＝4π(D/2)
3/3
E＝(D-Hav)/D×100
The rate of spread E (%) of described scaling powder lead-free brazing after experimental temperature expansion is obtained according to E=(D-Hav)/D × 100.
In formula: the average rate of spread % of E-sample
M-bead discharges the quality of water in water
The volume cm of V-bead
3
The diameter cm of D-bead
The average solder joint height cm of Hav-
This scaling powder rate of spread measures the rate of spread of each case lead-free brazing when 320 DEG C and 380 DEG C of welding respectively, and testing result is as shown in table 1.
The performance test results of table 1 embodiment of the present invention 1 to 4
Meanwhile, through retrieval, applicant finds that application number all belongs to scaling powder technical field for " a kind of No clean Solid flux for the solder of aluminium low temperature and the preparation method " described in 201410752119.4 and this patent; Through carefully consulting, applicant finds that this case main distinction compared with the present invention is:
Stainless steel fluxes for soft soldering of the present invention adopt the active component and film forming agent that are highly applicable to stainless steel soft soldering processes and need not dilute solution be configured, preparation technology is easier; Be applicable to high-temperature soldering, especially at the stainless steel soft Welding of 320-420 DEG C.
The No clean Solid flux of the aluminium low temperature solder described in documents, complicated process of preparation; Be applicable to middle low-temperature welding, be especially applicable to the weldering of manual low temperature flatiron and flame spray welding etc.
Therefore, in raw material and proportioning thereof and applicable solder range of application and soldering temperature, documents and the present invention all have the difference of essence; Meanwhile, according to above-mentioned experimental result: above-mentioned scaling powder provided by the invention has good spreading property in the case of a high temperature.
A kind of Solid flux for stainless steel soft soldering of the present invention all can realize solder on stainless steel substrate large area when carrying out solder more than 320 DEG C is sprawled, there is high activity feature, be suitable for being applied in the stainless steel pin of each components and parts of electronics, electrical equipment and communication equipment field and product, the solder of housing.
Although it is apparent to those skilled in the art that embodiment disclosed by the present invention as above, the embodiment that described content only adopts for ease of understanding the present invention, and be not used to limit the present invention.Those of skill in the art belonging to any the present invention; under the prerequisite not departing from the spirit and scope disclosed by the present invention; any amendment and change can be carried out in the form implemented and details; but scope of patent protection of the present invention, the scope that still must define with appending claims is as the criterion.
Claims (6)
1. for a Solid flux for stainless steel soft soldering, it is characterized in that, calculate by weight percentage, this Solid flux comprises:
Organic cosolvent 0-68.5%, metal active agent 0-19.8%; Acids activating agent 0-39.8%, corrosion inhibiter 0.1-0.8%, surplus is organic carrier; Wherein,
Described organic cosolvent is one or more in glycerine, diethylene glycol (DEG), monoethanolamine, ethylenediamine, triethanolamine, butanediolamine, fatty amine, diethylamine, diethylenetriamine, 3-Propanolamine, polymine, azanol, α-AEEA, hydroxyl diethyl ethylenediamine, four hydroxyethyl diamines, succinic acid amine, N, N-diethyl ethylene diamine, tetrahydrofurfuryl alcohol;
Described metal active agent is one or more in dibutyltin diacetate, stannous methide, stannous chloride, stannous fluoride, tin fluoborate, titanium oxide, zinc sulfate, zinc oxide, zinc fluoride, nickel oxide, nickel fluoride, nickel chloride;
Described acids activating agent is one or more in monocarboxylic acid, dicarboxylic acids, 2 hydroxy propanoic acid, malic acid, maleic acid, fluoboric acid, hydrofluoric acid, tartaric acid, cinnamic acid, 11 carbon diacid, dodecanedioic acid, L-amino acid, salicylic acid;
Described corrosion inhibiter is the one in BTA, triazole type, imidazolines organic matter;
Described organic carrier is one or more in Foral, water-soluble rosin resin, polyethylene glycol, polyethylene glycol oxide, polypropylene, polyacrylamide, polybutene.
2. the Solid flux for stainless steel soft soldering according to claim 1, is characterized in that, described Solid flux comprises:
3. the Solid flux for stainless steel soft soldering according to claim 1, is characterized in that, described Solid flux comprises:
4. the Solid flux for stainless steel soft soldering according to claim 1, is characterized in that, described Solid flux comprises:
5. the Solid flux for stainless steel soft soldering according to claim 1, is characterized in that, described Solid flux comprises:
6. the preparation method of Solid flux as described in any one of claim 1-5, is characterized in that, comprise the steps:
Step a, with mass ratio range, by organic cosolvent and metal active agent mix and blend;
Step b, is added acids activating agent in the solution that step a is configured, and leaves standstill 24 hours;
Step c, is heated to 140-145 DEG C by the solution that step b configures and removes the moisture brought into or produce in course of reaction, and then cool to room temperature, and obtains solid state crystallization thing;
Steps d, the solid state crystallization thing obtained by step c is placed in reactor, heats and keeps temperature to be 105-120 DEG C, and is stirred to and melts for liquid;
Step e, joins corrosion inhibiter in the liquid of melting, Keep agitation 5-30min;
Step f, is cooled to temperature 90-95 DEG C by the liquid of step e, adds organic carrier and stirs 10-20min;
Step g, by the mixture cool to room temperature of step f, obtains the Solid flux for stainless steel soft soldering.
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| CN106271222A (en) * | 2016-09-12 | 2017-01-04 | 东莞市千岛金属锡品有限公司 | A kind of Solid flux for automatic tin soldering solder and preparation method thereof |
| CN106695154A (en) * | 2017-01-16 | 2017-05-24 | 佛山通宝华通控制器有限公司 | Soft soldering structure of corrugated pipe, capillary pipe and bottom plate for pressure type thermostat |
| TWI607822B (en) * | 2016-03-17 | 2017-12-11 | 國立屏東科技大學 | Silicon dioxide-based ignition flux for arc stud welding |
| CN107962317A (en) * | 2017-10-31 | 2018-04-27 | 常州菲胜图自动化仪器有限公司 | A kind of water base type scaling powder free of cleaning |
| CN108637521A (en) * | 2018-07-17 | 2018-10-12 | 烟台艾邦电子材料有限公司 | It is a kind of can low-temperature welding stainless steel material solder stick and preparation method thereof |
| CN113084394A (en) * | 2021-04-16 | 2021-07-09 | 湖南东安县特种焊材有限公司 | Non-corrosive soldering flux and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113084394A (en) * | 2021-04-16 | 2021-07-09 | 湖南东安县特种焊材有限公司 | Non-corrosive soldering flux and preparation method thereof |
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Denomination of invention: A Solid Flux for Stainless Steel Soft Brazing Granted publication date: 20160824 Pledgee: China Co. truction Bank Corp Dongguan branch Pledgor: DONGGUAN CITY THOUSAND ISLAND METAL FOIL CO.,LTD. Registration number: Y2024980015348 |