CN109332943A - A kind of tin silk and preparation method thereof using halogen-free high impedance solid state rosin scaling powder - Google Patents
A kind of tin silk and preparation method thereof using halogen-free high impedance solid state rosin scaling powder Download PDFInfo
- Publication number
- CN109332943A CN109332943A CN201811306009.XA CN201811306009A CN109332943A CN 109332943 A CN109332943 A CN 109332943A CN 201811306009 A CN201811306009 A CN 201811306009A CN 109332943 A CN109332943 A CN 109332943A
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- China
- Prior art keywords
- scaling powder
- halogen
- solid state
- high impedance
- free high
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Abstract
The invention discloses a kind of tin silks and preparation method thereof using halogen-free high impedance solid state rosin scaling powder, including metal component and flux ingredients, the flux ingredients percentage, including following component: pure rosin 75~85%, film forming agent 0.5~1.5%, cosolvent 5.5~10%, activating agent 5~7%, nonionic surfactant 0.4~1.5%, corrosion inhibiter 0.3~0.5%.Compared with prior art, connect that rear solder joint is full, bright glossy, non-oxidation, nigrescence phenomenon using the tin wire bond of halogen-free high impedance solid state rosin scaling powder；Scaling powder is evenly distributed, smog is few, does not splash；Wetability is high, and scalability is good, scolding tin effect stability, can more preferably cut down bad solder joint and occur；More importantly halogen-free to meet environmental requirement, low cost, preparation method is easy, and market expectations have good prospects.
Description
Technical field
The present invention relates to scaling powder tin silk technical field, specially a kind of halogen-free high impedance solid state rosin scaling powder of application
Tin silk and preparation method thereof.
Background technique
Manual electronic component welds the solder stick used, is made of tin alloy and scaling powder two parts, welds in electronics
When connecing, solder stick and electric iron cooperate, and good electric iron provides steady and sustained fusing heat, and solder stick is using as filler
Metal be added in the surface and gap of electronic component, fixed electronic component becomes the main component of welding, common at present
Tin silk all contain halogen substantially, these halogen-containing materials burning when generate dioxin, and in the environment can exist for many years,
Organism is even accumulated on all the life, can not be discharged, and therefore, many world major companies abrogate halogen material actively promoting completely
Material, such as forbid in the product using halogen flame, it is not environmentally friendly enough using halogen, and tin silk production in the market is more not
Just, the problems such as process is sufficiently complex, and the allocation ratio of more fluxing agent is bad.
Summary of the invention
The purpose of the present invention is to provide a kind of tin silk using halogen-free high impedance solid state rosin scaling powder and its preparations
Method, to solve the problems mentioned in the above background technology.
To achieve the above object, the invention provides the following technical scheme: a kind of halogen-free high impedance solid state rosin of application helps
Tin silk of solder flux and preparation method thereof, including metal component and flux ingredients, the flux ingredients percentage,
Including following component: pure rosin 75~85%, film forming agent 0.5~1.5%, cosolvent 5.5~10%, activating agent 5~7%, non-
Ionic surface active agent 0.4~1.5%, corrosion inhibiter 0.3~0.5%.
Preferably, the activating agent is grouped as by following group: dipropylene 1~1.5, butyrolactone 0.5~1.0%,
AEO-90.2~0.5%, triethanolamine 0.5~1.2%, succinic anhydride 0.2~0.5%, 2-Butoxyethyl acetate 1~
1.8%, trimethylbutene glycol 0.3~0.8%.
Preferably, the content of the film forming agent is the 0.8~1% of each group total weight percent.
Preferably, the content of the cosolvent is the 7.5~9% of each group total weight percent.
Preferably, the corrosion inhibiter is made of benzotriazole (BTA), and the content of the corrosion inhibiter is each group total weight
The 0.4~0.5% of percentage.
Preferably, the activating agent is grouped as by following group: hydrogen, inorganic salts, acids and amine and their compounding
Composition, the content of activating agent are the 6~6.5% of each group total weight percent.
Preferably, the metal component is welding wire, and welding wire is made of scolding tin solder, and the solder melt point of welding wire is low
In 450 DEG C.
Preferably, the first step carries out the production of scaling powder, pure rosin 75~85% is added in the vessel of a mixing,
And heating stirring is carried out, after waiting pure rosin 75~85% to melt completely, the solvent of formula ratio is then added at 130~150 DEG C,
After mixing evenly, import in batches suitable film forming agent 0.5~1.5%, cosolvent 5.5~10%, activating agent 5~7%, it is non-from
Sub- surfactant 0.4~1.5%, corrosion inhibiter 0.3~0.5% carry out heating stirring to merging, and scaling powder completes.
Then, it prepares solder: preparing gun-metal, tin-nickel alloy and sn-ag alloy, smelting furnace is added in suitable tin,
Then solder is produced with spare according to common making step in the market.
Finally, the solder and weldment that are lower than weldment fusing point are filled out while heated to after brazing filler metal melts temperature using liquid solder
Solid workpieces are filled, solder are squeezed by filiform using hydraulic press, while by scaling powder heating melting, the form of being in a liquid state is injected into
In the hollow of welding wire, tin silk is made in last drawing.
Compared with prior art, the beneficial effects of the present invention are:
Halogen-free high impedance solid state rosin scaling powder tin silk of the invention is scolding tin solder use, is used for automobile, electronics
The consumer goods, computer and perimeter product, mobile device and all types of household electrical appliance operation scolding tin, wetting time is few, can have
Effect shortens the period of encapsulation and element repair operation；Scaling powder splashes less, and residue is few；Possess good diffusion property, simultaneously
Has the halogen-free and Halogen compound characteristic for meeting environmental requirement and high electrical reliability.
Compared with prior art, connect that rear solder joint is full, light using the tin wire bond of halogen-free high impedance solid state rosin scaling powder
It is bright glossy, non-oxidation, nigrescence phenomenon；Scaling powder is evenly distributed, smog is few, does not splash；Wetability is high, and scalability is good, scolding tin
Effect stability can more preferably cut down bad solder joint and occur；It is more importantly halogen-free to meet environmental requirement, low cost, preparation method letter
Just, market expectations have good prospects.
Specific embodiment
The following is a clear and complete description of the technical scheme in the embodiments of the invention, it is clear that described embodiment
Only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, the common skill in this field
Art personnel every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
The present invention provides a kind of technical solution: a kind of tin silk and its system using halogen-free high impedance solid state rosin scaling powder
Preparation Method, including metal component and flux ingredients, the flux ingredients percentage, including following component: pure
Rosin 75~85%, film forming agent 0.5~1.5%, cosolvent 5.5~10%, activating agent 5~7%, nonionic surfactant
0.4~1.5%, corrosion inhibiter 0.3~0.5%, activating agent are grouped as by following group: dipropylene 1~1.5, butyrolactone 0.5
~1.0%, AEO-90.2~0.5%, triethanolamine 0.5~1.2%, succinic anhydride 0.2~0.5%, butyl glycol ether acetic acid
Ester 1~1.8%, trimethylbutene glycol 0.3~0.8%.
The reasonable addition of film forming agent, can be during terminal pin scolding tin, and the scaling powder being coated with is precipitated, crystallized, and forms one
The uniform film of layer, the residue after pyrolytic because there is the presence of film forming agent, can rapid curing, hardening, reduce it is sticky, it is excellent
Selecting additive amount is 0.8~1%.
The reasonable addition of cosolvent can prevent the trend of the solid components such as activator precipitation from solution, avoid activator
Undesirable non-uniform Distribution, the preferred additive amount of cosolvent are 7.5~9%.
Corrosion inhibiter is made of benzotriazole (BTA), it is the high-efficient corrosion inhibitor of copper, and addition can inhibit in scaling powder
Activating agent corrosion that copper sheet is generated, the preferred additive amount of corrosion inhibiter is 0.4~0.5%.
Preferably, the activating agent is grouped as by following group: hydrogen, inorganic salts, acids and amine and their compounding
Composition, the content of activating agent are the 6~6.5% of each group total weight percent.
Preferably, the metal component is welding wire, and welding wire is made of scolding tin solder, and the solder melt point of welding wire is low
In 450 DEG C.
The preparation process of welding wire is as follows: the first step carries out the production of scaling powder, and pure rosin 75~85% is added one and is mixed
In the vessel of material, and heating stirring is carried out, after waiting pure rosin 75~85% to melt completely, is then added at 130~150 DEG C
The solvent of formula ratio imports suitable film forming agent 0.5~1.5%, cosolvent 5.5~10%, activity after mixing evenly in batches
Agent 5~7%, nonionic surfactant 0.4~1.5%, corrosion inhibiter 0.3~0.5% carry out heating stirring to merging, help weldering
Agent completes.
Then, it prepares solder: preparing gun-metal, tin-nickel alloy and sn-ag alloy, smelting furnace is added in suitable tin,
Then solder is produced with spare according to common making step in the market.
Finally, the solder and weldment that are lower than weldment fusing point are filled out while heated to after brazing filler metal melts temperature using liquid solder
Solid workpieces are filled, solder are squeezed by filiform using hydraulic press, while by scaling powder heating melting, the form of being in a liquid state is injected into
In the hollow of welding wire, tin silk is made in last drawing.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above embodiments is only applicable to help to understand this
The principle of inventive embodiments；At the same time, for those skilled in the art, according to an embodiment of the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (8)
1. a kind of tin silk and preparation method thereof using halogen-free high impedance solid state rosin scaling powder, including metal component and help weldering
Agent ingredient, it is characterised in that: the flux ingredients percentage, including following component: pure rosin 75~85%, at
Film 0.5~1.5%, cosolvent 5.5~10%, activating agent 5~7%, nonionic surfactant 0.4~1.5%, corrosion inhibiter
0.3~0.5%.
2. a kind of tin silk and its preparation side using halogen-free high impedance solid state rosin scaling powder according to claim 1
Method, it is characterised in that: the activating agent is grouped as by following group: dipropylene 1~1.5, butyrolactone 0.5~1.0%,
AEO-90.2~0.5%, triethanolamine 0.5~1.2%, succinic anhydride 0.2~0.5%, 2-Butoxyethyl acetate 1~
1.8%, trimethylbutene glycol 0.3~0.8%.
3. a kind of tin silk and its preparation side using halogen-free high impedance solid state rosin scaling powder according to claim 1
Method, it is characterised in that: the content of the film forming agent is the 0.8~1% of each group total weight percent.
4. a kind of tin silk and its preparation side using halogen-free high impedance solid state rosin scaling powder according to claim 1
Method, it is characterised in that: the content of the cosolvent is the 7.5~9% of each group total weight percent.
5. a kind of tin silk and its preparation side using halogen-free high impedance solid state rosin scaling powder according to claim 1
Method, it is characterised in that: the corrosion inhibiter is made of benzotriazole (BTA), and the content of the corrosion inhibiter is each group total weight
The 0.4~0.5% of percentage.
6. a kind of tin silk and its preparation side using halogen-free high impedance solid state rosin scaling powder according to claim 1
Method, it is characterised in that: the activating agent is grouped as by following group: hydrogen, inorganic salts, acids and amine and their compounding
Composition, the content of activating agent are the 6~6.5% of each group total weight percent.
7. a kind of tin silk and its preparation side using halogen-free high impedance solid state rosin scaling powder according to claim 1
Method, it is characterised in that: the metal component is welding wire, and welding wire is made of scolding tin solder, and the solder melt point of welding wire is low
In 450 DEG C.
8. a kind of tin silk and its preparation side using halogen-free high impedance solid state rosin scaling powder according to claim 1
Method, it is characterised in that: the first step carries out the production of scaling powder, pure rosin 75~85% is added in the vessel of a mixing,
And heating stirring is carried out, after waiting pure rosin 75~85% to melt completely, the solvent of formula ratio is then added at 130~150 DEG C,
After mixing evenly, import in batches suitable film forming agent 0.5~1.5%, cosolvent 5.5~10%, activating agent 5~7%, it is non-from
Sub- surfactant 0.4~1.5%, corrosion inhibiter 0.3~0.5% carry out heating stirring to merging, and scaling powder completes.
Then, it prepares solder: preparing gun-metal, tin-nickel alloy and sn-ag alloy, smelting furnace is added in suitable tin, then
Solder is produced according to common making step in the market with spare.
Finally, the solder and weldment that are lower than weldment fusing point are filled solid while heated to after brazing filler metal melts temperature using liquid solder
Solder is squeezed into filiform using hydraulic press by state workpiece, while by scaling powder heating melting, the form of being in a liquid state is injected into welding wire
Hollow in, tin silk is made in last drawing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811306009.XA CN109332943A (en) | 2018-11-05 | 2018-11-05 | A kind of tin silk and preparation method thereof using halogen-free high impedance solid state rosin scaling powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811306009.XA CN109332943A (en) | 2018-11-05 | 2018-11-05 | A kind of tin silk and preparation method thereof using halogen-free high impedance solid state rosin scaling powder |
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| CN109332943A true CN109332943A (en) | 2019-02-15 |
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ID=65313468
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| CN201811306009.XA Pending CN109332943A (en) | 2018-11-05 | 2018-11-05 | A kind of tin silk and preparation method thereof using halogen-free high impedance solid state rosin scaling powder |
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Cited By (5)
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| CN110744220A (en) * | 2019-11-15 | 2020-02-04 | 北京康普锡威科技有限公司 | Low-spatter welding wire and preparation method thereof |
| CN111482730A (en) * | 2020-04-24 | 2020-08-04 | 深圳市博士达焊锡制品有限公司 | Solder wire for automatic soldering robot and preparation method thereof |
| CN112621007A (en) * | 2020-12-09 | 2021-04-09 | 东莞市千岛金属锡品有限公司 | Brazing solder wire of antistatic halogen-free solid soldering flux and preparation method thereof |
| CN112621012A (en) * | 2020-12-09 | 2021-04-09 | 东莞市千岛金属锡品有限公司 | Brazing solder wire of antistatic low-splashing solid soldering flux and preparation method thereof |
| CN112775587A (en) * | 2021-01-14 | 2021-05-11 | 深圳市兴鸿泰锡业有限公司 | Smokeless solder wire and preparation method thereof |
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| CN112621007A (en) * | 2020-12-09 | 2021-04-09 | 东莞市千岛金属锡品有限公司 | Brazing solder wire of antistatic halogen-free solid soldering flux and preparation method thereof |
| CN112621012A (en) * | 2020-12-09 | 2021-04-09 | 东莞市千岛金属锡品有限公司 | Brazing solder wire of antistatic low-splashing solid soldering flux and preparation method thereof |
| CN112775587A (en) * | 2021-01-14 | 2021-05-11 | 深圳市兴鸿泰锡业有限公司 | Smokeless solder wire and preparation method thereof |
| CN112775587B (en) * | 2021-01-14 | 2021-11-16 | 深圳市兴鸿泰锡业有限公司 | Smokeless solder wire and preparation method thereof |
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