CN109332943A - Tin wire applying halogen-free high-impedance solid rosin soldering flux and preparation method thereof - Google Patents
Tin wire applying halogen-free high-impedance solid rosin soldering flux and preparation method thereof Download PDFInfo
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- CN109332943A CN109332943A CN201811306009.XA CN201811306009A CN109332943A CN 109332943 A CN109332943 A CN 109332943A CN 201811306009 A CN201811306009 A CN 201811306009A CN 109332943 A CN109332943 A CN 109332943A
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- Prior art keywords
- halogen
- scaling powder
- free high
- tin
- solder
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 36
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 title claims abstract description 28
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 title claims abstract description 28
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 title claims abstract description 28
- 239000007787 solid Substances 0.000 title claims abstract description 22
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 230000004907 flux Effects 0.000 title claims abstract description 12
- 238000005476 soldering Methods 0.000 title abstract 7
- 238000007716 flux method Methods 0.000 title description 2
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 29
- 229910000679 solder Inorganic materials 0.000 claims abstract description 29
- 238000003466 welding Methods 0.000 claims abstract description 16
- 238000005260 corrosion Methods 0.000 claims abstract description 15
- 230000007797 corrosion Effects 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000006184 cosolvent Substances 0.000 claims abstract description 11
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 4
- 239000000843 powder Substances 0.000 claims description 28
- 230000003213 activating effect Effects 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 claims description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 6
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 6
- 239000012964 benzotriazole Substances 0.000 claims description 6
- 239000004615 ingredient Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 5
- 239000000945 filler Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 claims description 3
- KLCNJIQZXOQYTE-UHFFFAOYSA-N 4,4-dimethylpent-1-ene Chemical compound CC(C)(C)CC=C KLCNJIQZXOQYTE-UHFFFAOYSA-N 0.000 claims description 3
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 3
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 238000003723 Smelting Methods 0.000 claims description 3
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 3
- 239000002253 acid Substances 0.000 claims description 3
- 150000007513 acids Chemical class 0.000 claims description 3
- 150000001412 amines Chemical class 0.000 claims description 3
- 238000005219 brazing Methods 0.000 claims description 3
- 229930188620 butyrolactone Natural products 0.000 claims description 3
- 238000013329 compounding Methods 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- 230000008676 import Effects 0.000 claims description 3
- 239000000155 melt Substances 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 claims description 3
- 150000003839 salts Chemical class 0.000 claims description 3
- 239000002904 solvent Substances 0.000 claims description 3
- 229940014800 succinic anhydride Drugs 0.000 claims description 3
- 239000004094 surface-active agent Substances 0.000 claims description 3
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 5
- 230000000694 effects Effects 0.000 abstract description 4
- 239000003112 inhibitor Substances 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 239000013543 active substance Substances 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 description 5
- 150000002367 halogens Chemical class 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- HGUFODBRKLSHSI-UHFFFAOYSA-N 2,3,7,8-tetrachloro-dibenzo-p-dioxin Chemical compound O1C2=CC(Cl)=C(Cl)C=C2OC2=C1C=C(Cl)C(Cl)=C2 HGUFODBRKLSHSI-UHFFFAOYSA-N 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- -1 butyl glycol ether acetic acid Ester Chemical class 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 238000009828 non-uniform distribution Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Conductive Materials (AREA)
Abstract
The invention discloses a tin wire applying halogen-free high-impedance solid rosin soldering flux and a preparation method thereof, wherein the tin wire comprises metal components and soldering flux components, and the soldering flux components comprise the following components in percentage by weight: 75-85% of pure rosin, 0.5-1.5% of film forming agent, 5.5-10% of cosolvent, 5-7% of active agent, 0.4-1.5% of nonionic surfactant and 0.3-0.5% of corrosion inhibitor. Compared with the prior art, the solder joint is full, bright and glossy, and has no oxidation and blackening phenomena after the tin wire welding by using the halogen-free high-impedance solid rosin soldering flux is carried out; the soldering flux is uniformly distributed, and the smog is less and the splashing is avoided; the wettability is high, the expansibility is good, the soldering tin effect is stable, and bad welding spots can be better reduced; more importantly, the halogen-free environment-friendly material meets the environment-friendly requirement, has low cost, simple and convenient preparation method and good market prospect.
Description
Technical field
The present invention relates to scaling powder tin silk technical field, specially a kind of halogen-free high impedance solid state rosin scaling powder of application
Tin silk and preparation method thereof.
Background technique
Manual electronic component welds the solder stick used, is made of tin alloy and scaling powder two parts, welds in electronics
When connecing, solder stick and electric iron cooperate, and good electric iron provides steady and sustained fusing heat, and solder stick is using as filler
Metal be added in the surface and gap of electronic component, fixed electronic component becomes the main component of welding, common at present
Tin silk all contain halogen substantially, these halogen-containing materials burning when generate dioxin, and in the environment can exist for many years,
Organism is even accumulated on all the life, can not be discharged, and therefore, many world major companies abrogate halogen material actively promoting completely
Material, such as forbid in the product using halogen flame, it is not environmentally friendly enough using halogen, and tin silk production in the market is more not
Just, the problems such as process is sufficiently complex, and the allocation ratio of more fluxing agent is bad.
Summary of the invention
The purpose of the present invention is to provide a kind of tin silk using halogen-free high impedance solid state rosin scaling powder and its preparations
Method, to solve the problems mentioned in the above background technology.
To achieve the above object, the invention provides the following technical scheme: a kind of halogen-free high impedance solid state rosin of application helps
Tin silk of solder flux and preparation method thereof, including metal component and flux ingredients, the flux ingredients percentage,
Including following component: pure rosin 75~85%, film forming agent 0.5~1.5%, cosolvent 5.5~10%, activating agent 5~7%, non-
Ionic surface active agent 0.4~1.5%, corrosion inhibiter 0.3~0.5%.
Preferably, the activating agent is grouped as by following group: dipropylene 1~1.5, butyrolactone 0.5~1.0%,
AEO-90.2~0.5%, triethanolamine 0.5~1.2%, succinic anhydride 0.2~0.5%, 2-Butoxyethyl acetate 1~
1.8%, trimethylbutene glycol 0.3~0.8%.
Preferably, the content of the film forming agent is the 0.8~1% of each group total weight percent.
Preferably, the content of the cosolvent is the 7.5~9% of each group total weight percent.
Preferably, the corrosion inhibiter is made of benzotriazole (BTA), and the content of the corrosion inhibiter is each group total weight
The 0.4~0.5% of percentage.
Preferably, the activating agent is grouped as by following group: hydrogen, inorganic salts, acids and amine and their compounding
Composition, the content of activating agent are the 6~6.5% of each group total weight percent.
Preferably, the metal component is welding wire, and welding wire is made of scolding tin solder, and the solder melt point of welding wire is low
In 450 DEG C.
Preferably, the first step carries out the production of scaling powder, pure rosin 75~85% is added in the vessel of a mixing,
And heating stirring is carried out, after waiting pure rosin 75~85% to melt completely, the solvent of formula ratio is then added at 130~150 DEG C,
After mixing evenly, import in batches suitable film forming agent 0.5~1.5%, cosolvent 5.5~10%, activating agent 5~7%, it is non-from
Sub- surfactant 0.4~1.5%, corrosion inhibiter 0.3~0.5% carry out heating stirring to merging, and scaling powder completes.
Then, it prepares solder: preparing gun-metal, tin-nickel alloy and sn-ag alloy, smelting furnace is added in suitable tin,
Then solder is produced with spare according to common making step in the market.
Finally, the solder and weldment that are lower than weldment fusing point are filled out while heated to after brazing filler metal melts temperature using liquid solder
Solid workpieces are filled, solder are squeezed by filiform using hydraulic press, while by scaling powder heating melting, the form of being in a liquid state is injected into
In the hollow of welding wire, tin silk is made in last drawing.
Compared with prior art, the beneficial effects of the present invention are:
Halogen-free high impedance solid state rosin scaling powder tin silk of the invention is scolding tin solder use, is used for automobile, electronics
The consumer goods, computer and perimeter product, mobile device and all types of household electrical appliance operation scolding tin, wetting time is few, can have
Effect shortens the period of encapsulation and element repair operation;Scaling powder splashes less, and residue is few;Possess good diffusion property, simultaneously
Has the halogen-free and Halogen compound characteristic for meeting environmental requirement and high electrical reliability.
Compared with prior art, connect that rear solder joint is full, light using the tin wire bond of halogen-free high impedance solid state rosin scaling powder
It is bright glossy, non-oxidation, nigrescence phenomenon;Scaling powder is evenly distributed, smog is few, does not splash;Wetability is high, and scalability is good, scolding tin
Effect stability can more preferably cut down bad solder joint and occur;It is more importantly halogen-free to meet environmental requirement, low cost, preparation method letter
Just, market expectations have good prospects.
Specific embodiment
The following is a clear and complete description of the technical scheme in the embodiments of the invention, it is clear that described embodiment
Only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, the common skill in this field
Art personnel every other embodiment obtained without making creative work belongs to the model that the present invention protects
It encloses.
The present invention provides a kind of technical solution: a kind of tin silk and its system using halogen-free high impedance solid state rosin scaling powder
Preparation Method, including metal component and flux ingredients, the flux ingredients percentage, including following component: pure
Rosin 75~85%, film forming agent 0.5~1.5%, cosolvent 5.5~10%, activating agent 5~7%, nonionic surfactant
0.4~1.5%, corrosion inhibiter 0.3~0.5%, activating agent are grouped as by following group: dipropylene 1~1.5, butyrolactone 0.5
~1.0%, AEO-90.2~0.5%, triethanolamine 0.5~1.2%, succinic anhydride 0.2~0.5%, butyl glycol ether acetic acid
Ester 1~1.8%, trimethylbutene glycol 0.3~0.8%.
The reasonable addition of film forming agent, can be during terminal pin scolding tin, and the scaling powder being coated with is precipitated, crystallized, and forms one
The uniform film of layer, the residue after pyrolytic because there is the presence of film forming agent, can rapid curing, hardening, reduce it is sticky, it is excellent
Selecting additive amount is 0.8~1%.
The reasonable addition of cosolvent can prevent the trend of the solid components such as activator precipitation from solution, avoid activator
Undesirable non-uniform Distribution, the preferred additive amount of cosolvent are 7.5~9%.
Corrosion inhibiter is made of benzotriazole (BTA), it is the high-efficient corrosion inhibitor of copper, and addition can inhibit in scaling powder
Activating agent corrosion that copper sheet is generated, the preferred additive amount of corrosion inhibiter is 0.4~0.5%.
Preferably, the activating agent is grouped as by following group: hydrogen, inorganic salts, acids and amine and their compounding
Composition, the content of activating agent are the 6~6.5% of each group total weight percent.
Preferably, the metal component is welding wire, and welding wire is made of scolding tin solder, and the solder melt point of welding wire is low
In 450 DEG C.
The preparation process of welding wire is as follows: the first step carries out the production of scaling powder, and pure rosin 75~85% is added one and is mixed
In the vessel of material, and heating stirring is carried out, after waiting pure rosin 75~85% to melt completely, is then added at 130~150 DEG C
The solvent of formula ratio imports suitable film forming agent 0.5~1.5%, cosolvent 5.5~10%, activity after mixing evenly in batches
Agent 5~7%, nonionic surfactant 0.4~1.5%, corrosion inhibiter 0.3~0.5% carry out heating stirring to merging, help weldering
Agent completes.
Then, it prepares solder: preparing gun-metal, tin-nickel alloy and sn-ag alloy, smelting furnace is added in suitable tin,
Then solder is produced with spare according to common making step in the market.
Finally, the solder and weldment that are lower than weldment fusing point are filled out while heated to after brazing filler metal melts temperature using liquid solder
Solid workpieces are filled, solder are squeezed by filiform using hydraulic press, while by scaling powder heating melting, the form of being in a liquid state is injected into
In the hollow of welding wire, tin silk is made in last drawing.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above embodiments is only applicable to help to understand this
The principle of inventive embodiments;At the same time, for those skilled in the art, according to an embodiment of the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (8)
1. a kind of tin silk and preparation method thereof using halogen-free high impedance solid state rosin scaling powder, including metal component and help weldering
Agent ingredient, it is characterised in that: the flux ingredients percentage, including following component: pure rosin 75~85%, at
Film 0.5~1.5%, cosolvent 5.5~10%, activating agent 5~7%, nonionic surfactant 0.4~1.5%, corrosion inhibiter
0.3~0.5%.
2. a kind of tin silk and its preparation side using halogen-free high impedance solid state rosin scaling powder according to claim 1
Method, it is characterised in that: the activating agent is grouped as by following group: dipropylene 1~1.5, butyrolactone 0.5~1.0%,
AEO-90.2~0.5%, triethanolamine 0.5~1.2%, succinic anhydride 0.2~0.5%, 2-Butoxyethyl acetate 1~
1.8%, trimethylbutene glycol 0.3~0.8%.
3. a kind of tin silk and its preparation side using halogen-free high impedance solid state rosin scaling powder according to claim 1
Method, it is characterised in that: the content of the film forming agent is the 0.8~1% of each group total weight percent.
4. a kind of tin silk and its preparation side using halogen-free high impedance solid state rosin scaling powder according to claim 1
Method, it is characterised in that: the content of the cosolvent is the 7.5~9% of each group total weight percent.
5. a kind of tin silk and its preparation side using halogen-free high impedance solid state rosin scaling powder according to claim 1
Method, it is characterised in that: the corrosion inhibiter is made of benzotriazole (BTA), and the content of the corrosion inhibiter is each group total weight
The 0.4~0.5% of percentage.
6. a kind of tin silk and its preparation side using halogen-free high impedance solid state rosin scaling powder according to claim 1
Method, it is characterised in that: the activating agent is grouped as by following group: hydrogen, inorganic salts, acids and amine and their compounding
Composition, the content of activating agent are the 6~6.5% of each group total weight percent.
7. a kind of tin silk and its preparation side using halogen-free high impedance solid state rosin scaling powder according to claim 1
Method, it is characterised in that: the metal component is welding wire, and welding wire is made of scolding tin solder, and the solder melt point of welding wire is low
In 450 DEG C.
8. a kind of tin silk and its preparation side using halogen-free high impedance solid state rosin scaling powder according to claim 1
Method, it is characterised in that: the first step carries out the production of scaling powder, pure rosin 75~85% is added in the vessel of a mixing,
And heating stirring is carried out, after waiting pure rosin 75~85% to melt completely, the solvent of formula ratio is then added at 130~150 DEG C,
After mixing evenly, import in batches suitable film forming agent 0.5~1.5%, cosolvent 5.5~10%, activating agent 5~7%, it is non-from
Sub- surfactant 0.4~1.5%, corrosion inhibiter 0.3~0.5% carry out heating stirring to merging, and scaling powder completes.
Then, it prepares solder: preparing gun-metal, tin-nickel alloy and sn-ag alloy, smelting furnace is added in suitable tin, then
Solder is produced according to common making step in the market with spare.
Finally, the solder and weldment that are lower than weldment fusing point are filled solid while heated to after brazing filler metal melts temperature using liquid solder
Solder is squeezed into filiform using hydraulic press by state workpiece, while by scaling powder heating melting, the form of being in a liquid state is injected into welding wire
Hollow in, tin silk is made in last drawing.
Priority Applications (1)
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CN201811306009.XA CN109332943A (en) | 2018-11-05 | 2018-11-05 | Tin wire applying halogen-free high-impedance solid rosin soldering flux and preparation method thereof |
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CN201811306009.XA CN109332943A (en) | 2018-11-05 | 2018-11-05 | Tin wire applying halogen-free high-impedance solid rosin soldering flux and preparation method thereof |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110744220A (en) * | 2019-11-15 | 2020-02-04 | 北京康普锡威科技有限公司 | Low-spatter welding wire and preparation method thereof |
CN111482730A (en) * | 2020-04-24 | 2020-08-04 | 深圳市博士达焊锡制品有限公司 | Solder wire for automatic soldering robot and preparation method thereof |
CN112621007A (en) * | 2020-12-09 | 2021-04-09 | 东莞市千岛金属锡品有限公司 | Brazing solder wire of antistatic halogen-free solid soldering flux and preparation method thereof |
CN112621012A (en) * | 2020-12-09 | 2021-04-09 | 东莞市千岛金属锡品有限公司 | Brazing solder wire of antistatic low-splashing solid soldering flux and preparation method thereof |
CN112775587A (en) * | 2021-01-14 | 2021-05-11 | 深圳市兴鸿泰锡业有限公司 | Smokeless solder wire and preparation method thereof |
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CN110744220B (en) * | 2019-11-15 | 2021-10-22 | 北京康普锡威科技有限公司 | Low-spatter welding wire and preparation method thereof |
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CN112621012A (en) * | 2020-12-09 | 2021-04-09 | 东莞市千岛金属锡品有限公司 | Brazing solder wire of antistatic low-splashing solid soldering flux and preparation method thereof |
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