CN101412170A - Halogen-free soldering tin paste - Google Patents
Halogen-free soldering tin paste Download PDFInfo
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- CN101412170A CN101412170A CNA2008102194970A CN200810219497A CN101412170A CN 101412170 A CN101412170 A CN 101412170A CN A2008102194970 A CNA2008102194970 A CN A2008102194970A CN 200810219497 A CN200810219497 A CN 200810219497A CN 101412170 A CN101412170 A CN 101412170A
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Abstract
The invention discloses a halogen-free soldering tin plaster. The soldering tin plaster comprises the following raw materials in weight percentage: 15 to 45 percent of polymerized rosin, 5 to 30 percent of hydrogenated rosin, 2 to 5 percent of polyamide, 2 to 5 percent of modified hydrogenated castor oil, 4 to 15 percent of an organic acid active agent, 0.5 to 2 percent of a corrosion inhibitor, 1 to 3 percent of a surfactant and the balance being an organic solvent. A method for producing the soldering tin plaster comprises the following steps: firstly, the polymerized rosin and the hydrogenated rosin are added into the organic solvent and are heated and dissolved at the temperature of 100 DEG C around; the polyamide and the modified hydrogenated castor oil are added into the solute, are cooled to the temperature of 80 DEG C around and are added with the organic acid active agent and the corrosion inhibitor; and after the mixture is dissolved, the mixture is cooled to the temperature of 40 DEG C around, is added with the surfactant, is stirred to be even and is cooled to obtain the soldering tin plaster. The halogen-free soldering tin plaster contains no halogen, has good weldability and printability, has fewer residues and is free from cleaning after welding.
Description
Technical field:
The present invention relates to technical field of soldering paste, refer in particular to a kind of halogen-free soldering tin paste.
Background technology:
Leadless soldering tin paste now generally uses, because the Effect on Performance such as wetting of lead-free alloy itself, to making the activating agent that generally uses halogen in the present leadless soldering tin paste, in the hope of problems such as wetting poor, the failure weldings that can solve pb-free solder, but because halogen-containing activating agent can produce the gas that is pernicious to people on a small quantity in welding process, may remain in after the welding on the plate face simultaneously, thereby may influence welding reliability.Now existing part company requires the solder(ing) paste content of halogen not contain below 100PP or fully, and the development of visible halogen free soldering paste is trend of the times, slowly will substitute halogen-containing product.
Simultaneously, mainly there is following problem in existing leadless soldering tin paste on the market.
1, content of halogen exceeds standard, and the reliability to postwelding impacts easily.
2, process and poor welding.
(1) solder joint is not full, and it is bad to climb tin.
(2) the rosin joint dry joint is more, increases the weight of the later stage repair.
(3) wetability is poor, and phenomenons such as naked copper are arranged.
3, welding back residue is too much, causes the plate face untidy, causes poor reliability simultaneously.
4, printing is poor, the demoulding, and mouldability is bad, occurs cold and hot caving in easily, also has the husky phenomenon of tin cream appearance change in printing process simultaneously.
For this reason, the inventor through research and design, develop a kind of not halogen-containingly, have good weldability and printing, the few and halogen-free soldering tin paste that avoids cleaning of welding back residue.
Summary of the invention:
Technical problem to be solved by this invention is exactly in order to overcome the deficiency of present product, to provide a kind of not halogen-containing, have good weldability and printing, the few and halogen-free soldering tin paste that avoids cleaning of welding back residue.
For solving the problems of the technologies described above, the present invention has adopted following technical scheme: this halogen-free soldering tin paste comprises: newtrex, Foral, polyamide, modified hydrogenated castor oil, organic acid activator, corrosion inhibiter, surfactant, organic solvent, the percentage by weight of above-mentioned material is newtrex: 15-45%, Foral: 5-30%, polyamide: 2-5%, modified hydrogenated castor oil: 2-5%, organic acid activator: 4-15%, corrosion inhibiter: 0.5-2%, surfactant: 1-3%, organic solvent: surplus.
Described organic acid activator is: one or more in succinic acid, azelaic acid, decanedioic acid, adipic acid, malic acid, benzoic acid, salicylic acid, itaconic acid, glutaric acid, phthalic acid, tartaric acid, dodecoic acid, tetradecylic acid, hexadecylic acid, the polymeric acid.
Described corrosion inhibiter is a kind of in hydroquinones, the benzotriazole or two kinds.
Described surfactant is: one or more in Triton X-100 (OP-10), APES (TX-10), the cetylamine.
Described organic solvent is: one or more in tetrahydrofurfuryl alcohol, lauryl alcohol, ethylene glycol, butyl glycol ether, diethylene glycol monobutyl ether, glycol propyl ether, EGME, propane diols, the hexylene glycol.
In sum, the present invention includes: newtrex, Foral, polyamide, modified hydrogenated castor oil, organic acid activator, corrosion inhibiter, surfactant, organic solvent.The present invention is used for the preparation of solder(ing) paste, and the present invention is not halogen-containing, has good weldability and printing, and welding back residue is few and avoid cleaning, and the bigger market competitiveness is arranged.
The specific embodiment:
The present invention includes: newtrex, Foral, polyamide, modified hydrogenated castor oil, organic acid activator, corrosion inhibiter, surfactant, organic solvent, the percentage by weight of above-mentioned material is newtrex: 15-45%, Foral: 5-30%, polyamide: 2-5%, modified hydrogenated castor oil: 2-5%, organic acid activator: 4-15%, corrosion inhibiter: 0.5-2%, surfactant: 1-3%, organic solvent: surplus.
Above-mentioned organic acid activator is: one or more in succinic acid, azelaic acid, decanedioic acid, adipic acid, malic acid, benzoic acid, salicylic acid, itaconic acid, glutaric acid, phthalic acid, tartaric acid, dodecoic acid, tetradecylic acid, hexadecylic acid, the polymeric acid.
Above-mentioned corrosion inhibiter is a kind of in hydroquinones, the benzotriazole or two kinds.
Above-mentioned surfactant is: one or more in OP-10, TX-10, the cetylamine.
Above-mentioned organic solvent is: one or more in tetrahydrofurfuryl alcohol, lauryl alcohol, ethylene glycol, butyl glycol ether, diethylene glycol monobutyl ether, glycol propyl ether, EGME, propane diols, the hexylene glycol.
The percentage by weight of newtrex, Foral, polyamide, modified hydrogenated castor oil, organic acid activator, corrosion inhibiter, surfactant, organic solvent is newtrex in the present embodiment one: Foral 32%: polyamide 10%: modified hydrogenated castor oil 3%: organic acid activator 3.5%: corrosion inhibiter 8%: surfactant 1.5%: organic solvent 2.5%: 39.5%.
Wherein, corrosion inhibiter is: hydroquinones, benzotriazole, its percentage by weight is hydroquinones: benzotriazole 0.5%: 1%.
Surfactant is: OP-10, cetylamine, its percentage by weight are OP-10:1%, cetylamine: 1.5%.
Organic solvent is: tetrahydrofurfuryl alcohol, diethylene glycol monobutyl ether, glycol propyl ether, hexylene glycol, its percentage by weight are tetrahydrofurfuryl alcohol: diethylene glycol monobutyl ether 6%: glycol propyl ether 12%: hexylene glycol 9.5%: 12%.
Preparation method is as follows among the embodiment one:
First with in newtrex, the Foral adding organic solvent, about 100 ℃, descend heating for dissolving then; Add polyamide, modified hydrogenated castor oil then; Be cooled to then and add organic acid activator and hydroquinones about 80 ℃; Be cooled to after waiting to dissolve about 40 ℃ and add OP-10 and cetylamine is stirred to evenly; Can obtain the halogen-free solder(ing) paste of exempting to clean after the cooling.
The halogen-free soldering tin paste that obtains and lead-free alloy powder SnAg3Cu0.5 can be mixed with the proportioning of 11:89, vacuumize, promptly obtain the tin cream of lead-free alloy, this tin cream can be used for typography and spot printing technology through being usually used in the welding of radiator original paper, and is not halogen-containing in the tin cream, welding back little residue and transparent, need not to clean, can be used for multiple sheet material welding, have excellent printing and welding performance.
The percentage by weight of newtrex, Foral, polyamide, modified hydrogenated castor oil, organic acid activator, corrosion inhibiter, surfactant, organic solvent is newtrex in the present embodiment two: Foral 25%: polyamide 16%: modified hydrogenated castor oil 3%: organic acid activator 3.5%: corrosion inhibiter 7.5%: surfactant 2%: organic solvent 2.5%: 40.5%.
Wherein, corrosion inhibiter is: hydroquinones, benzotriazole, its percentage by weight is hydroquinones: benzotriazole 1%: 1%.
Surfactant is: TX-10, cetylamine, its percentage by weight are TX-10:1%, cetylamine: 1.5%.
Organic solvent is: tetrahydrofurfuryl alcohol, diethylene glycol monobutyl ether, EGME, propane diols, its percentage by weight is tetrahydrofurfuryl alcohol: diethylene glycol monobutyl ether 12%: EGME 8%: propane diols 8%: 12.5%.
The preparation method of solder(ing) paste is as follows among the embodiment two:
First with in newtrex, the Foral adding organic solvent, about 100 ℃, descend heating for dissolving then; Add polyamide, modified hydrogenated castor oil then; Be cooled to then and add organic acid activator, hydroquinones and benzotriazole about 80 ℃; Be cooled to after waiting to dissolve about 40 ℃ and add TX-10 and cetylamine is stirred to evenly; Can obtain halogen-free soldering tin paste after the cooling.
The halogen-free soldering tin paste that obtains and lead-free alloy powder Sn42Bi58 can be mixed with the proportioning of 11.5:88.5, vacuumize, promptly obtain the solder(ing) paste of lead-free alloy, this solder(ing) paste can be used for typography and spot printing technology through being usually used in the welding of radiator original paper, and is not halogen-containing in the tin cream, welding back little residue and transparent, need not to clean, can be used for multiple sheet material welding, have excellent printing and welding performance.
In sum, the present invention includes: newtrex, Foral, polyamide, modified hydrogenated castor oil, organic acid activator, corrosion inhibiter, surfactant, organic solvent.The present invention is used for the preparation of lead-free tin cream, and the solder(ing) paste of making is not halogen-containing, has good weldability and printing, and welding back residue is few and avoid cleaning, and the bigger market competitiveness is arranged.
Certainly, the above only is example of the present invention, is not to limit the scope of the present invention, and all equivalences of doing according to the described structure of the present patent application claim, feature and principle change or modify, and all should be included in the present patent application claim.
Claims (5)
1, a kind of halogen-free soldering tin paste, it is characterized in that: this solder(ing) paste comprises: newtrex, Foral, polyamide, modified hydrogenated castor oil, organic acid activator, corrosion inhibiter, surfactant, organic solvent, the percentage by weight of above-mentioned material is newtrex: 15-45%, Foral: 5-30%, polyamide: 2-5%, modified hydrogenated castor oil: 2-5%, organic acid activator: 4-15%, corrosion inhibiter: 0.5-2%, surfactant: 1-3%, organic solvent: surplus.
2, halogen-free soldering tin paste according to claim 1 is characterized in that: described organic acid activator is: one or more in succinic acid, azelaic acid, decanedioic acid, adipic acid, malic acid, benzoic acid, salicylic acid, itaconic acid, glutaric acid, phthalic acid, tartaric acid, dodecoic acid, tetradecylic acid, hexadecylic acid, the polymeric acid.
3, halogen-free soldering tin paste according to claim 2 is characterized in that: described corrosion inhibiter is a kind of in hydroquinones, the benzotriazole or two kinds.
4, halogen-free soldering tin paste according to claim 3 is characterized in that: described surfactant is: one or more in Triton X-100, APES, the cetylamine.
5, halogen-free soldering tin paste according to claim 4 is characterized in that: described organic solvent is: one or more in tetrahydrofurfuryl alcohol, lauryl alcohol, ethylene glycol, butyl glycol ether, diethylene glycol monobutyl ether, glycol propyl ether, EGME, propane diols, the hexylene glycol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102194970A CN101412170A (en) | 2008-11-28 | 2008-11-28 | Halogen-free soldering tin paste |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102194970A CN101412170A (en) | 2008-11-28 | 2008-11-28 | Halogen-free soldering tin paste |
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| CN101412170A true CN101412170A (en) | 2009-04-22 |
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| CNA2008102194970A Pending CN101412170A (en) | 2008-11-28 | 2008-11-28 | Halogen-free soldering tin paste |
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Cited By (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101934439A (en) * | 2010-10-08 | 2011-01-05 | 常州市亚太微电子材料有限公司 | High activity halogen free soldering paste and making method thereof |
| CN101934437A (en) * | 2010-09-30 | 2011-01-05 | 常州市亚太微电子材料有限公司 | Unleaded solder paste and preparation method thereof |
| CN102069323A (en) * | 2010-12-14 | 2011-05-25 | 东莞市特尔佳电子有限公司 | Intermediate-temperate tin alloy soldering paste used for through hole coating and preparation method thereof |
| CN101695794B (en) * | 2009-10-23 | 2011-09-07 | 东莞市特尔佳电子有限公司 | Halogen-free tin-bismuth-copper soldering paste and preparation method thereof |
| CN102371443A (en) * | 2011-09-06 | 2012-03-14 | 云南锡业锡材有限公司 | Flux suitable for multiple tin-based welding pastes and preparation method thereof |
| CN102528327A (en) * | 2011-12-30 | 2012-07-04 | 深圳市上煌实业有限公司 | High-temperature lead-free solder paste and preparation method |
| CN102528328A (en) * | 2011-12-30 | 2012-07-04 | 深圳市上煌实业有限公司 | Lead-free solder paste for needle cylinder and preparation method |
| CN102528329A (en) * | 2011-12-30 | 2012-07-04 | 深圳市上煌实业有限公司 | Halogen-free and lead-free solder paste and preparation method |
| CN102581523A (en) * | 2012-03-21 | 2012-07-18 | 瑞玛泰（北京）科技有限公司 | Halogen-free solder paste and preparation method thereof |
| CN101695796B (en) * | 2009-10-23 | 2012-11-14 | 东莞市特尔佳电子有限公司 | Halogen-free lead-free soldering paste for radiator and preparation method thereof |
| CN102794581A (en) * | 2012-08-15 | 2012-11-28 | 江苏科技大学 | Steel no-clean welding flux and preparation method thereof |
| CN102909493A (en) * | 2012-11-20 | 2013-02-06 | 邸园园 | Soldering flux |
| CN103008921A (en) * | 2012-12-26 | 2013-04-03 | 广东中实金属有限公司 | Halogen-free scaling powder used for lead-free solder paste and preparation method thereof |
| CN104526185A (en) * | 2014-12-02 | 2015-04-22 | 苏州优诺电子材料科技有限公司 | High-stability SMT (Surface Mount Technology) low-temperature solder paste soldering flux and preparation method thereof |
| CN106378549A (en) * | 2016-11-08 | 2017-02-08 | 金锚电力控股有限公司 | No-clean scaling powder applied to copper and aluminum brazing |
| CN109676284A (en) * | 2018-12-13 | 2019-04-26 | 上海锡喜材料科技有限公司 | Weld-aiding cream and preparation method thereof |
| CN109909638A (en) * | 2019-03-20 | 2019-06-21 | 中山翰荣新材料有限公司 | A kind of solder(ing) paste and preparation method thereof with good collapse resistance energy |
| CN112867583A (en) * | 2018-10-25 | 2021-05-28 | 千住金属工业株式会社 | Flux and solder paste |
| US11992901B1 (en) * | 2023-02-25 | 2024-05-28 | Dongguan City Thousand Island Metal Foil Co., Ltd. | Lead-free and halogen-free solder paste |
-
2008
- 2008-11-28 CN CNA2008102194970A patent/CN101412170A/en active Pending
Cited By (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101695796B (en) * | 2009-10-23 | 2012-11-14 | 东莞市特尔佳电子有限公司 | Halogen-free lead-free soldering paste for radiator and preparation method thereof |
| CN101695794B (en) * | 2009-10-23 | 2011-09-07 | 东莞市特尔佳电子有限公司 | Halogen-free tin-bismuth-copper soldering paste and preparation method thereof |
| CN101934437A (en) * | 2010-09-30 | 2011-01-05 | 常州市亚太微电子材料有限公司 | Unleaded solder paste and preparation method thereof |
| CN101934439A (en) * | 2010-10-08 | 2011-01-05 | 常州市亚太微电子材料有限公司 | High activity halogen free soldering paste and making method thereof |
| CN102069323A (en) * | 2010-12-14 | 2011-05-25 | 东莞市特尔佳电子有限公司 | Intermediate-temperate tin alloy soldering paste used for through hole coating and preparation method thereof |
| CN102069323B (en) * | 2010-12-14 | 2013-05-29 | 东莞市特尔佳电子有限公司 | Intermediate-temperate tin alloy soldering paste used for through hole coating and preparation method thereof |
| CN102371443A (en) * | 2011-09-06 | 2012-03-14 | 云南锡业锡材有限公司 | Flux suitable for multiple tin-based welding pastes and preparation method thereof |
| CN102371443B (en) * | 2011-09-06 | 2017-03-15 | 云南锡业锡材有限公司 | It is applied to scaling powder of multiple tinbase solder(ing) pastes and preparation method thereof |
| CN102528327A (en) * | 2011-12-30 | 2012-07-04 | 深圳市上煌实业有限公司 | High-temperature lead-free solder paste and preparation method |
| CN102528328A (en) * | 2011-12-30 | 2012-07-04 | 深圳市上煌实业有限公司 | Lead-free solder paste for needle cylinder and preparation method |
| CN102528329A (en) * | 2011-12-30 | 2012-07-04 | 深圳市上煌实业有限公司 | Halogen-free and lead-free solder paste and preparation method |
| CN102528328B (en) * | 2011-12-30 | 2013-09-25 | 深圳市上煌实业有限公司 | Lead-free solder paste for needle cylinder and preparation method |
| CN102528329B (en) * | 2011-12-30 | 2013-09-18 | 深圳市上煌实业有限公司 | Halogen-free and lead-free solder paste and preparation method |
| CN102581523B (en) * | 2012-03-21 | 2015-06-17 | 北京鹏瑞中联科技有限公司 | Halogen-free solder paste |
| CN102581523A (en) * | 2012-03-21 | 2012-07-18 | 瑞玛泰（北京）科技有限公司 | Halogen-free solder paste and preparation method thereof |
| CN102794581B (en) * | 2012-08-15 | 2014-12-10 | 江苏科技大学 | Steel no-clean welding flux and preparation method thereof |
| CN102794581A (en) * | 2012-08-15 | 2012-11-28 | 江苏科技大学 | Steel no-clean welding flux and preparation method thereof |
| CN102909493A (en) * | 2012-11-20 | 2013-02-06 | 邸园园 | Soldering flux |
| CN103008921A (en) * | 2012-12-26 | 2013-04-03 | 广东中实金属有限公司 | Halogen-free scaling powder used for lead-free solder paste and preparation method thereof |
| CN104526185A (en) * | 2014-12-02 | 2015-04-22 | 苏州优诺电子材料科技有限公司 | High-stability SMT (Surface Mount Technology) low-temperature solder paste soldering flux and preparation method thereof |
| CN106378549A (en) * | 2016-11-08 | 2017-02-08 | 金锚电力控股有限公司 | No-clean scaling powder applied to copper and aluminum brazing |
| CN106378549B (en) * | 2016-11-08 | 2019-04-19 | 金锚电力控股有限公司 | A kind of cleaning-free scaling powder for copper aluminium soldering |
| CN112867583A (en) * | 2018-10-25 | 2021-05-28 | 千住金属工业株式会社 | Flux and solder paste |
| CN112867583B (en) * | 2018-10-25 | 2022-03-04 | 千住金属工业株式会社 | Flux and solder paste |
| CN109676284A (en) * | 2018-12-13 | 2019-04-26 | 上海锡喜材料科技有限公司 | Weld-aiding cream and preparation method thereof |
| CN109909638A (en) * | 2019-03-20 | 2019-06-21 | 中山翰荣新材料有限公司 | A kind of solder(ing) paste and preparation method thereof with good collapse resistance energy |
| US11992901B1 (en) * | 2023-02-25 | 2024-05-28 | Dongguan City Thousand Island Metal Foil Co., Ltd. | Lead-free and halogen-free solder paste |
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Open date: 20090422 |