CN101402162A - Colophony type plaster shaped soldering fluid for Sn-Ag-Cu leadless brazing filler metal - Google Patents
Colophony type plaster shaped soldering fluid for Sn-Ag-Cu leadless brazing filler metal Download PDFInfo
- Publication number
- CN101402162A CN101402162A CNA2008102267346A CN200810226734A CN101402162A CN 101402162 A CN101402162 A CN 101402162A CN A2008102267346 A CNA2008102267346 A CN A2008102267346A CN 200810226734 A CN200810226734 A CN 200810226734A CN 101402162 A CN101402162 A CN 101402162A
- Authority
- CN
- China
- Prior art keywords
- acid
- lead
- soldering flux
- free brazing
- colophony type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a rosin-type pasty soldering flux for a Sn-Ag-Cu leadless solder and belongs to the field of soldering flux of a leadless solder. The aim of the invention is to provide a soldering flux suitable for the Sn-Ag-Cu leadless solder. The soldering flux comprises the following compositions and contents: 10.0 to 20.0 percent of an activating agent, 2.0 to 5.0 percent of a nonionics, 30.0 to 39.0 percent of a solvent, 10.0 to 15.0 percent of an antisettle agent, 4.0 to 10.0 percent of a paste forming agent, 0.5 to 2.0 percent of a corrosion inhibitor and 20.0 to 28.0 percent of modified rosin. The soldering flux has the advantages of good moistening capacity, high activating temperature, no corrosiveness and the like.
Description
Technical field
The invention belongs to the lead-free solder soldering fluid field, be specifically related to a kind of scaling powder, particularly be applicable to the colophony type paste soldering flux that the Sn-Ag-Cu lead-free brazing is used.
Background technology
In recent years, relevant Research of Lead-free Solders job development was very fast.The Sn-Ag-Cu alloy has been subjected to extensive concern both domestic and external with its excellent wetting capacity energy and mechanical property.But because the fusing point of Sn-Ag-Cu lead-free solder alloy exceeds about 35 ℃ than traditional solder containing lead fusing point, this with regard to having occurred because the serious problem of solder high-temperature oxydation that the raising of brazing temperature brings.Therefore, pb-free solder is also had higher requirement to the performance of scaling powder.The use of lead-free brazing has necessarily required corresponding scaling powder to match, and accelerating research and development lead-free brazing special environment friendly scaling powder is the inevitable requirement of the unleaded process of electronic product.
Lead-free brazing is compared the most tangible difference with solder containing lead be that the wettability of lead-free brazing is poor, the welding temperature height.Therefore, be applicable to the scaling powder of solder containing lead at present, can't satisfy the requirement of lead-free brazing.Subject matter is: the one, and these scaling powders are not enough to the wettability of lead-free brazing, easily cause defectives such as failure welding, and this will bring problems such as the increase of postwelding plate face residue, seriously corroded, reliability reduction; The 2nd, be not suitable for the higher welding temperature of lead-free brazing, a lot of scaling powders can lose the part activity through higher preheat temperature and higher furnace temperature the time, and produce the bad situation of tin that goes up; Moreover the scaling powder of some solder containing lead has corrosiveness to lead-free brazing, contains a large amount of volatile organic matters (VOC) in some scaling powder solvent in addition, is that environmental requirement is forbidden.
Therefore, lead-free brazing must be prepared specially with scaling powder, and pb-free solder technology has following requirement to scaling powder: 1. owing between scaling powder and the brazing filler metal alloy surface chemical reaction is arranged, therefore, the different-alloy composition will be selected different scaling powders; 2. because the wetability of lead-free alloy is poor, require the activity of scaling powder to want enough high; 3. improve the activation temperature of scaling powder, the adapted to leadless welding temperature; 4. the postwelding residue is few, and non-corrosiveness, satisfies probe test and electromigration.
Summary of the invention
The objective of the invention is to solve existing technical problem, a kind of good moistening capacity, activation temperature height, non-corrosiveness are provided, and the Sn-Ag-Cu lead-free brazing colophony type paste soldering flux of environmental protection.
Sn-Ag-Cu lead-free brazing provided by the present invention with the composition and the quality percentage composition thereof of colophony type paste soldering flux is:
Activator 10.0-20.0%
Non-ionic surface active agent 2.0-5.0%
Solvent 30.0-39.0%
Anti-settling agent 10.0-15.0%
Paste making agent 4.0-10.0%
Corrosion inhibiter 0.5-2.0%
Modified rosin 20.0-28.0%
Wherein, described activator is selected from monocarboxylic acid, dicarboxylic acids, one or more in tricarboxylic acid or the inorganic acid; The preferred lactic acid of described monocarboxylic acid; The preferred succinic acid of described dicarboxylic acids, glutaric acid, azelaic acid, adipic acid, maleic acid or DL-malic acid; Described tricarboxylic acid optimization citric acid; Described inorganic acid preferred boric acid.
The selected activator of the present invention can electrolysis discharge H in solvent
+Ion with the oxide reaction of mother metal and solder surface, is removed oxide-film, reaches the purpose that increases wetability.
Described non-ionic surface active agent is a kind of in OPEO (abbreviating TX-10 as) or the isooctylphenol APEO (abbreviating the OP emulsifying agent as);
This type of surfactant is not volatile, (Printed circuitboard, the PCB) interfacial tension between surface and the molten braze alloy strengthen wetting power can to reduce printed circuit board (PCB), that improves scaling powder whereby helps the weldering performance, thereby reduces the formation of solder balls and solder flux bridge.
Described solvent is the mixture of at least a polyalcohol and at least a ethers; Described polyalcohol is selected from glycerine, hexylene glycol, diethylene glycol (DEG), 2 ethyls-1 or 3 hexylene glycols; Described ether is selected from DGDE, diethylene glycol butyl ether, diethylene glycol hexyl ether or octyl ether.
The selected solvent of the present invention is high boiling solvent, can effectively improve the fusing point and the dry tolerance energy of scaling powder, has prolonged service life.
Described anti-settling agent is a rilanit special.
The effect of adding anti-settling agent is the thinning behavior of shear force that strengthens the scaling powder fluid, improves its printing performance, avoids the phenomenon of caving in.
Described paste making agent is one or both mixing of PEG400 or Macrogol 600.
Described corrosion inhibiter is the organic amine corrosion inhibiter; Can select a kind of in triethylamine or the triethanolamine for use.
Corrosion inhibiter plays antopxidation, can reduce the corrosivity of scaling powder to printed panel.
Described modified rosin is one or more mixing among newtrex, perhydrogenated rosin, water-white rosin or the rosin KE-604.
The selected modified rosin Stability Analysis of Structures of the present invention, to be difficult for crystallization, heat-resisting oxidation, acid number low; help improving the stable performance of scaling powder; modified rosin is solid-state at normal temperatures simultaneously; unionization, after the soldering, it is good to form air-tightness; transparent organic film; bump can be wrapped up, isolate contacting of metal and atmosphere and other Korrosionsmediums, have the excellent protection performance.
Sn-Ag-Cu lead-free brazing provided by the present invention is as follows with the compound method of colophony type paste soldering flux:
1) takes by weighing activator, non-ionic surface active agent, solvent, anti-settling agent, paste making agent, corrosion inhibiter and modified rosin by above-mentioned quality percentage composition ratio;
2) with the mixture of modified rosin and solvent after 140-180 ℃ of heating dissolved, add activator, stir, after continuing heating for dissolving, be cooled to 80-100 ℃, add non-ionic surface active agent, anti-settling agent, paste making agent and corrosion inhibiter, be stirred to dissolving, leave standstill and be cooled to room temperature and promptly get Sn-Ag-Cu lead-free brazing colophony type paste soldering flux.
The colophony type paste soldering flux that Sn-Ag-Cu lead-free brazing provided by the present invention is used has following beneficial effect:
1) scaling powder wettability provided by the present invention is superior;
2) scaling powder activation temperature provided by the present invention is suitable;
3) scaling powder provided by the present invention is not halogen-containing, and is residual few, compliance with environmental protection requirements.
The invention will be further described below in conjunction with the specific embodiment.
The specific embodiment
All adopt following method preparation Sn-Ag-Cu lead-free brazing colophony type paste soldering flux of the present invention among the following embodiment: with the mixture of modified rosin and solvent after 140-180 ℃ of heating dissolved, add activator, stir, after continuing heating for dissolving, be cooled to 80-100 ℃, add non-ionic surface active agent, anti-settling agent, paste making agent and corrosion inhibiter, be stirred to dissolving, leave standstill and be cooled to room temperature.
Embodiment 1
Sn-Ag-Cu lead-free brazing prepared among the embodiment is as shown in table 1 with the composition and the quality percentage composition thereof of colophony type paste soldering flux:
| Form | Succinic acid | Azelaic acid | TX-10 | Glycerine | DGDE | Rilanit special | PEG400 | Triethylamine | Newtrex |
| Content wt% | 7.0 | 7.0 | 4.0 | 15.0 | 20.0 | 14.0 | 7.0 | 2.0 | 24.0 |
Table 1
Embodiment 2
Sn-Ag-Cu lead-free brazing prepared among the embodiment is as shown in table 2 with the composition and the quality percentage composition thereof of colophony type paste soldering flux:
| Form | Glutaric acid | Maleic acid | The OP emulsifying agent | Hexylene glycol | The diethylene glycol butyl ether | Rilanit special | Macrogol 600 | Triethylamine | Perhydrogenated rosin |
| Content wt% | 6.0 | 8.0 | 4.0 | 15.0 | 15.0 | 15.0 | 10.0 | 1.0 | 26.0 |
Table 2
Embodiment 3
Sn-Ag-Cu lead-free brazing prepared among the embodiment is as shown in table 3 with the composition and the quality percentage composition thereof of colophony type paste soldering flux:
| Form | Succinic acid | Lactic acid | Boric acid | The OP emulsifying agent | Glycerine | DGDE | Rilanit special | PEG400 | Triethanolamine | Newtrex | Foral |
| Content wt% | 5.6 | 7. 0 | 7. 4 | 2.0 | 18.0 | 18.0 | 12.0 | 5.0 | 2.0 | 13.0 | 10.0 |
Table 3
Embodiment 4
Sn-Ag-Cu lead-free brazing prepared among the embodiment is as shown in table 4 with the composition and the quality percentage composition thereof of colophony type paste soldering flux:
| Form | Citric acid | The DL-malic acid | TX-10 | Diethylene glycol (DEG) | The diethylene glycol hexyl ether | Rilanit special | PEG400 | Triethanolamine | Water-white rosin |
| Content wt% | 10.0 | 8.0 | 4.0 | 16.0 | 16.0 | 15.0 | 10.0 | 2.0 | 20.0 |
Table 4
Embodiment 5
Sn-Ag-Cu lead-free brazing prepared among the embodiment is as shown in table 5 with the composition and the quality percentage composition thereof of colophony type paste soldering flux:
| Form | Succinic acid | Adipic acid | Lactic acid | TX-10 | 2 ethyls-1,3 hexylene glycol | DGDE | Rilanit special | Macrogol 600 | Triethylamine | Newtrex | Rosin KE-604 |
| Content wt% | 4.0 | 4.0 | 2.0 | 3.0 | 24.0 | 15.0 | 12.0 | 6.0 | 2 | 22.0 | 6.0 |
Table 5
Embodiment 6
Sn-Ag-Cu lead-free brazing prepared among the embodiment is as shown in table 6 with the composition and the quality percentage composition thereof of colophony type paste soldering flux:
| Form | Citric acid | Acrylic acid | Lactic acid | The OP emulsifying agent | 2 ethyls-1,3 hexylene glycol | Octyl ether | Rilanit special | Macrogol 600 | Triethanolamine | Perhydrogenated rosin | Rosin KE-604 |
| Content wt% | 9.6 | 6.4 | 2.0 | 5.0 | 20.0 | 14.0 | 10.0 | 4.0 | 0.5 | 24.0 | 4.0 |
Table 6
Sn-Ag-Cu lead-free brazing colophony type paste soldering flux with preparing among the embodiment 1-6 detects according to national standard, and every index is as shown in table 7 below.
The performance of the special-purpose scaling powder of Sn-Ag-Cu lead-free brazing that table 7 the present invention is prepared
As can be known from Table 7, the special-purpose scaling powder of Sn-Ag-Cu lead-free brazing of the present invention: 1. not halogen-containing, rosin content is suitable; 2. physical stability is good, the postwelding residue be transparent membranaceous material 3. the postwelding insulaion resistance of printed panel meet and exceed 10
8Ω, the rate of spread 〉=75%.
Claims (8)
1, a kind of Sn-Ag-Cu lead-free brazing colophony type paste soldering flux is characterized in that, the composition of described scaling powder and quality percentage composition thereof are:
Activator 10.0-20.0%
Non-ionic surface active agent 2.0-5.0%
Solvent 30.0-39.0%
Anti-settling agent 10.0-15.0%
Paste making agent 4.0-10.0%
Corrosion inhibiter 0.5-2.0%
Modified rosin 20.0-28.0%
Wherein, described activator is selected from monocarboxylic acid, dicarboxylic acids, one or more in tricarboxylic acid or the inorganic acid;
Described non-ionic surface active agent is a kind of in OPEO or the isooctylphenol APEO;
Described solvent is the mixture of at least a polyalcohol and at least a ethers;
Described anti-settling agent is a rilanit special;
Described paste making agent is one or both mixing of PEG400 or Macrogol 600;
Described corrosion inhibiter is the organic amine corrosion inhibiter;
Described modified rosin is one or more mixing among newtrex, perhydrogenated rosin, water-white rosin or the rosin KE-604.
2, Sn-Ag-Cu lead-free brazing colophony type paste soldering flux according to claim 1 is characterized in that, described monocarboxylic acid is a lactic acid.
3, Sn-Ag-Cu lead-free brazing colophony type paste soldering flux according to claim 1 is characterized in that, described dicarboxylic acids is succinic acid, glutaric acid, azelaic acid, adipic acid, maleic acid or DL-malic acid.
4, the special-purpose scaling powder of Sn-Ag-Cu lead-free brazing according to claim 1 is characterized in that described tricarboxylic acid is a citric acid.
5, Sn-Ag-Cu lead-free brazing colophony type paste soldering flux according to claim 1 is characterized in that, described inorganic acid is a boric acid.
6, Sn-Ag-Cu lead-free brazing colophony type paste soldering flux according to claim 1 is characterized in that, described polyalcohol is selected from glycerine, hexylene glycol, diethylene glycol (DEG), 2 ethyls-1 or 3 hexylene glycols.
7, Sn-Ag-Cu lead-free brazing colophony type paste soldering flux according to claim 1 is characterized in that, described ether is selected from DGDE, diethylene glycol butyl ether, diethylene glycol hexyl ether or octyl ether.
8, Sn-Ag-Cu lead-free brazing colophony type paste soldering flux according to claim 1 is characterized in that, described organic amine corrosion inhibiter is a kind of in triethylamine or the triethanolamine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102267346A CN101402162A (en) | 2008-11-21 | 2008-11-21 | Colophony type plaster shaped soldering fluid for Sn-Ag-Cu leadless brazing filler metal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2008102267346A CN101402162A (en) | 2008-11-21 | 2008-11-21 | Colophony type plaster shaped soldering fluid for Sn-Ag-Cu leadless brazing filler metal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101402162A true CN101402162A (en) | 2009-04-08 |
Family
ID=40536400
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2008102267346A Pending CN101402162A (en) | 2008-11-21 | 2008-11-21 | Colophony type plaster shaped soldering fluid for Sn-Ag-Cu leadless brazing filler metal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101402162A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102161135A (en) * | 2011-03-30 | 2011-08-24 | 浙江强力焊锡材料有限公司 | Lead-free welding tin wire and water-soluble welding flux used by same |
| CN102166689A (en) * | 2011-03-30 | 2011-08-31 | 浙江强力焊锡材料有限公司 | Halogen-free lead-free soldering paste and soldering flux used by same |
| CN102371443A (en) * | 2011-09-06 | 2012-03-14 | 云南锡业锡材有限公司 | Flux suitable for multiple tin-based welding pastes and preparation method thereof |
| CN102528315A (en) * | 2012-01-11 | 2012-07-04 | 深圳市唯特偶新材料股份有限公司 | Lead-free and cleaning-free solder paste capable of realizing few-cavity welding layers and preparation method of lead-free cleaning-free solder paste |
| CN103056557A (en) * | 2012-11-22 | 2013-04-24 | 天长市飞龙金属制品有限公司 | Active soldering flux |
| CN104801888A (en) * | 2015-05-20 | 2015-07-29 | 苏州汉尔信电子科技有限公司 | Scaling powder for solar photovoltaic components and preparation method of scaling powder |
| CN101569966B (en) * | 2009-06-10 | 2015-11-25 | 上海华庆焊材技术有限公司 | A kind of lead-free tin cream |
| CN106944770A (en) * | 2017-04-01 | 2017-07-14 | 江门市资迪科技环保有限公司 | A kind of preparation method of water-in-oil type BNi5 soldering paste |
| CN111151910A (en) * | 2020-01-07 | 2020-05-15 | 杭州乔泰电子有限公司 | Lead-free soldering paste |
| CN111390423A (en) * | 2020-04-21 | 2020-07-10 | 广州先艺电子科技有限公司 | Gold-tin eutectic soldering paste and preparation method thereof |
-
2008
- 2008-11-21 CN CNA2008102267346A patent/CN101402162A/en active Pending
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101569966B (en) * | 2009-06-10 | 2015-11-25 | 上海华庆焊材技术有限公司 | A kind of lead-free tin cream |
| CN102161135A (en) * | 2011-03-30 | 2011-08-24 | 浙江强力焊锡材料有限公司 | Lead-free welding tin wire and water-soluble welding flux used by same |
| CN102166689A (en) * | 2011-03-30 | 2011-08-31 | 浙江强力焊锡材料有限公司 | Halogen-free lead-free soldering paste and soldering flux used by same |
| CN102166689B (en) * | 2011-03-30 | 2013-05-22 | 浙江强力焊锡材料有限公司 | Halogen-free lead-free soldering paste and soldering flux used by same |
| CN102371443A (en) * | 2011-09-06 | 2012-03-14 | 云南锡业锡材有限公司 | Flux suitable for multiple tin-based welding pastes and preparation method thereof |
| CN102371443B (en) * | 2011-09-06 | 2017-03-15 | 云南锡业锡材有限公司 | It is applied to scaling powder of multiple tinbase solder(ing) pastes and preparation method thereof |
| CN102528315B (en) * | 2012-01-11 | 2015-03-11 | 深圳市唯特偶新材料股份有限公司 | Lead-free and cleaning-free solder paste capable of realizing few-cavity welding layers and preparation method of lead-free cleaning-free solder paste |
| CN102528315A (en) * | 2012-01-11 | 2012-07-04 | 深圳市唯特偶新材料股份有限公司 | Lead-free and cleaning-free solder paste capable of realizing few-cavity welding layers and preparation method of lead-free cleaning-free solder paste |
| CN103056557A (en) * | 2012-11-22 | 2013-04-24 | 天长市飞龙金属制品有限公司 | Active soldering flux |
| CN104801888A (en) * | 2015-05-20 | 2015-07-29 | 苏州汉尔信电子科技有限公司 | Scaling powder for solar photovoltaic components and preparation method of scaling powder |
| CN104801888B (en) * | 2015-05-20 | 2016-08-24 | 苏州汉尔信电子科技有限公司 | A kind of solar photovoltaic assembly scaling powder and preparation method thereof |
| CN106944770A (en) * | 2017-04-01 | 2017-07-14 | 江门市资迪科技环保有限公司 | A kind of preparation method of water-in-oil type BNi5 soldering paste |
| CN106944770B (en) * | 2017-04-01 | 2019-04-12 | 江门市资迪科技环保有限公司 | A kind of preparation method of water-in-oil type BNi5 soldering paste |
| CN111151910A (en) * | 2020-01-07 | 2020-05-15 | 杭州乔泰电子有限公司 | Lead-free soldering paste |
| CN111390423A (en) * | 2020-04-21 | 2020-07-10 | 广州先艺电子科技有限公司 | Gold-tin eutectic soldering paste and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101402162A (en) | Colophony type plaster shaped soldering fluid for Sn-Ag-Cu leadless brazing filler metal | |
| CN110961829B (en) | Soldering flux and preparation method thereof, and solder paste and preparation method thereof | |
| CN101564805A (en) | Novel environment-friendly soldering flux for low-silver SnAgCu unleaded soldering paste | |
| CN100532003C (en) | Colophony type non-halide cleaning-free soldering flux for lead-free solder wire | |
| CN107088716B (en) | Environment-friendly low-temperature residue-free solder paste and preparation method thereof | |
| CN102825398B (en) | Soldering flux matched with lead-free solder | |
| CN101966632B (en) | Wash-free soldering flux for leadless low-temperature soldering paste and preparation method thereof | |
| CN100528462C (en) | Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof | |
| US9421646B2 (en) | Soldering paste and flux | |
| CN107160052B (en) | A kind of high performance low temperature solder lead-free tin cream and preparation method thereof | |
| TWI643694B (en) | Flux for solder paste and solder paste | |
| CN102069323B (en) | Intermediate-temperate tin alloy soldering paste used for through hole coating and preparation method thereof | |
| JP2014100737A (en) | Solder composition for laser soldering, and printed wiring board using the same | |
| CN101462209A (en) | Common resin type soldering flux without halogen suitable for low-silver leadless solder paste | |
| JP7089491B2 (en) | Flux composition, solder paste and electronic circuit board | |
| CN108213766B (en) | Special soldering paste for aluminum product welding and preparation method and use method thereof | |
| KR102242412B1 (en) | Flux composition, solder paste composition, and electronic circuit board | |
| CN104923952A (en) | Lead-free halogen-free tin paste and production process thereof | |
| JP6522674B2 (en) | Flux composition, solder paste and electronic circuit board | |
| CN101569966A (en) | Method for preparing lead-free tin cream and soldering flux thereof | |
| CN108555474B (en) | Halogen-free environment-friendly lead-free tin paste and preparation method thereof | |
| JP6259623B2 (en) | Low acid value acrylic resin-containing soldering flux and solder paste composition | |
| JP2017064787A (en) | Flux composition for soldering, solar cell module and electronic substrate | |
| WO2023179805A1 (en) | Flux for no-clean gold-tin soldering paste, preparation method therefor, and application thereof | |
| CN105598602B (en) | High activity tin silk halogen-free flux and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090408 |