CN100528462C - Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof - Google Patents
Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof Download PDFInfo
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- CN100528462C CN100528462C CNB2007100182743A CN200710018274A CN100528462C CN 100528462 C CN100528462 C CN 100528462C CN B2007100182743 A CNB2007100182743 A CN B2007100182743A CN 200710018274 A CN200710018274 A CN 200710018274A CN 100528462 C CN100528462 C CN 100528462C
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Abstract
The invention relates to the colophonium and water free soldering flux is made of 3%-10% active agent, 17%-10% film forming matter, 0.1%-1% surface active agent, 0.1%-1% anti-oxidant and solution agent. It is low in cost and simple in process. It is made by even mixing of soldering flux with SnAgCu lead free soldering paste, with rich welding spot, light surface, little residue and environment friendly.
Description
Technical field
The invention belongs to electronic circuit surface mounting technology field, relate to a kind of low rosin no-clean scaling powder of the SnAgCu of being used for system leadless soldering plaster, also relate to the preparation method that this kind is used for the low rosin no-clean scaling powder of SnAgCu system leadless soldering plaster.
Background technology
In soldering paste, the scaling powder of pasty state is a kind of novel welding auxiliary material, be widely used in the electronic circuit surface mount process, and be the carrier of scolding tin micro mist.By the interaction energy elimination materials to be welded surface of activator in the scaling powder and the oxide-film of scolding tin micro mist itself, make the rapid diffusion of soldering alloy and weld the metal surface attached to quilt.Hyundai electronics industry increases sharply to the demand of scaling powder, and is also more and more higher to the requirement of scaling powder.Scaling powder should have higher solderability, can not produce corrosion to wlding again, also will satisfy the requirement of a series of machinery and electric property simultaneously.
Pb-free solder has become the development trend of current electronic material, but its welding performance is higher, harsher to the scaling powder performance requirement far below leypewter.Along with circuit board constantly develops towards high integration, high wiring density direction, it is more difficult to have caused circuit board to clean thus.The development and application no-clean scaling powder can solve cost height and the problem of environment pollution caused that the cleaning-type scaling powder exists.
Summary of the invention
The objective of the invention is, a kind of low rosin no-clean scaling powder of the SnAgCu of being used for system leadless soldering plaster is provided, the postwelding that solves existing scaling powder existence needs cleaning, cost height and problem of environment pollution caused.
Another object of the present invention is that the preparation method of the low rosin no-clean scaling powder of the above-mentioned SnAgCu of being used for system leadless soldering plaster is provided.
A technical scheme of the present invention is, a kind of low rosin no-clean scaling powder that is used for the SnAgCu system leadless soldering plaster, composed of the following components by mass percentage: activating agent is 3%～10%, rosin is 10%～17%, resin is 2%～10%, and surfactant is 0.1%～1%, and antioxidant is 0.1%～1%, all the other are solvent, and each constituent mass sum is 100%.
Described activating agent is one or more the combination in stearic acid, oxalic acid, citric acid, adipic acid, succinic acid, DL-malic acid, the decanedioic acid.
Described rosin is one or more the combination in water-white rosin, common rosin, the Foral.
Described resin is selected from 301 resins, 302 resins or water-borne acrylic resin.
Described solvent is absolute ethyl alcohol, isopropyl alcohol, the two or more combination in diethylene glycol (DEG), triethylene glycol, glycerine, EGME, ethylene glycol ethyl ether, the butyl glycol ether.
Described surfactant is selected from OP-10, OP-7 or OP-5.
Described antioxidant is selected benzotriazole for use.
Another technical scheme of the present invention is, the above-mentioned SnAgCu of being used for is the preparation method of the low rosin no-clean scaling powder of soldering paste, implement according to the following steps,
A, be that the solvent of 3%～10% activating agent and surplus is put into container and mixed, at room temperature be stirred to dissolving fully mass percent;
B, be that 10%～17% rosin adds in the mixed liquor that step a makes, be heated to 30 ℃～50 ℃ and be stirred to dissolving fully mass percent;
C, be that 0.1%～1% surfactant adds in the mixed liquor that step b makes, and at room temperature stir mass percent;
D, be that 0.1%～1% antioxidant adds in the mixed liquor that step c makes, at room temperature be stirred to dissolving fully mass percent;
E, be that 2%～10% resin adds in the mixed liquor that steps d makes, be heated to 30 ℃～50 ℃ and stir mass percent;
F, the mixing material that step e is made at room temperature cool off, and filter, promptly.
The invention has the beneficial effects as follows that this kind is used for the low rosin no-clean scaling powder of SnAgCu system leadless soldering plaster, the postwelding that has solved existing scaling powder existence needs to clean, corrosivity is strong and problem of environment pollution caused.
The present invention has also reduced technological process, has reduced production cost.
The specific embodiment
The present invention is described in detail below in conjunction with the specific embodiment.
The low rosin no-clean scaling powder that is used for the SnAgCu system leadless soldering plaster, composed of the following components by mass percentage: activating agent is 3%～10%, rosin is 10%～17%, resin is 2%～10%, surfactant is 0.1%～1%, antioxidant is 0.1%～1%, and all the other are solvent, and each constituent mass sum is 100%.
Activating agent select for use in stearic acid, oxalic acid, citric acid, adipic acid, succinic acid, DL-malic acid, the decanedioic acid one or more group and.Activating agent has the ability on clean metal surface, mainly relies on the dissolution of organic acid to oxide.
Rosin select for use in water-white rosin, common rosin, the Foral one or more group and.It well helps in the weldering performance rosin in performance, and the security and the plate face aesthetic of impurity component meeting butt welding point that its is wherein contained affect.
Film forming matter is selected from 301 resins, 302 resins or water-borne acrylic resin.Film forming matter has the effect of adhesion soldering alloy and prevents the effect of soldering alloy oxidation in welding process, after welding is finished, can form layer protecting film.
Solvent select for use in absolute ethyl alcohol, isopropyl alcohol, diethylene glycol (DEG), triethylene glycol, glycerine, EGME, ethylene glycol ethyl ether, the butyl glycol ether two or more groups and, solvent can be with substance dissolves such as rosin, surfactant, antioxidant.
Surfactant is selected from OP-10, OP-7 or OP-5.Surfactant can improve the flowability and the wetability of solder flux, reduces the surface tension of scaling powder, and guides soldering alloy to diffusion all around, thereby forms smooth solder joint.
Antioxidant is selected benzotriazole for use, can prevent alloy oxidation.
During actual the use, scaling powder of the present invention with 10%～20% and 80%～90% SnAgCu system leadless soldering plaster promptly make after mixing and exempt from cleaning-type SnAgCu system leadless soldering plaster.
Embodiment 1
Take by weighing following each component by mass percentage:
Activating agent is that 3.0% wherein stearic acid is 1.5%, succinic acid is 1.5%
Rosin is selected water-white rosin 17.0% for use
Resin is selected water-borne acrylic resin 2.0% for use
Surfactant is selected OP-10 1.0% for use
Antioxidant is selected benzotriazole 0.1% for use
Solvent (wherein absolute ethyl alcohol, butyl glycol ether equivalent) surplus
Each constituent mass summation is 100%.
The solvent of a, 3.0% the activating agent that will take by weighing and surplus is put into container and is mixed, and at room temperature is stirred to dissolving fully;
B, 17% the rosin that will take by weighing add in the mixed liquor that step a makes, and are heated to 30 ℃ and are stirred to dissolving fully;
C, 1.0% the surfactant that will take by weighing add in the mixed liquor that step b makes, and at room temperature stir;
D, 0.1% the antioxidant that will take by weighing add in the mixed liquor that step c makes, and at room temperature are stirred to dissolving fully;
E, 2.0% the resin that will take by weighing add in the mixed liquor that steps d makes, and are heated to 30 ℃ and stir;
F, the mixing material that step e is made at room temperature cool off, and filter, promptly.
The scaling powder that present embodiment is prepared is faint yellow transparent thick liquid, and the pH value is 5.2～5.5, halide not, and non-volatile content is 32.8%, density is 1.26g/ml.Scaling powder of the present invention with 10% and 90% SnAgCu system leadless soldering plaster mix and make the SnAgCu system leadless soldering plaster of exempting to clean, and by the standard circumfluence welding, the postwelding residual quantity is 6.87%, non-corrosiveness, and solder ball and wetability test are 1 grade.
Embodiment 2
By following each component of mass percent weighing, the temperature that will need to heat in manufacturing process is controlled at 40 ℃, and other are with embodiment 1.
Activating agent is selected citric acid 5.0% for use
Rosin is that 12% wherein common rosin is 6.0%, water-white rosin is 6.0%
Resin is selected 302 resins 6.0% for use
Surfactant is selected OP-7 0.5% for use
Antioxidant is selected benzotriazole 0.5% for use
Mixed solvent (wherein isopropyl alcohol, diethylene glycol (DEG) equivalent) surplus
Each constituent mass summation is 100%.
The scaling powder that present embodiment is prepared is faint yellow transparent thick liquid, the pH value is 5～5.3, halide not, non-volatile content is 32.52%, density is 1.21g/ml, scaling powder of the present invention with 15% and 85% SnAgCu system leadless soldering plaster, mix and make the SnAgCu system leadless soldering plaster of exempting to clean, by the standard circumfluence welding, the postwelding residual quantity is 6.54%, non-corrosiveness, solder ball and wetability test are 1 grade.
Embodiment 3
By following each component of mass percent weighing, the temperature that will need to heat in manufacturing process is controlled at 50 ℃, and other are with embodiment 1.
Activating agent is that 10% wherein the D L MALIC ACID is 5.0%, anhydrous citric acid is 5.0%
Rosin is that 10% wherein common rosin is 5.0%, Foral is 5.0%
Resin is selected 301 resins 10% for use
Surfactant is selected OP-5 0.1% for use
Antioxidant is selected benzotriazole 1.0% for use
Solvent (wherein absolute ethyl alcohol, glycerine equivalent) surplus
Each constituent mass summation is 100%.
The low rosin no-clean scaling powder that present embodiment is prepared is faint yellow transparent thick liquid, and the pH value is 4.8～5, halide not, and non-volatile content is 31.42%, density is 1.20g/ml.Scaling powder of the present invention with 20% and 80% SnAgCu system leadless soldering plaster mix and make the SnAgCu system leadless soldering plaster of exempting to clean, and by the standard circumfluence welding, the postwelding residual quantity is 6.35%, non-corrosiveness, and solder ball and wetability test are 1 grade.
Embodiment 4
By following each component of mass percent weighing, the temperature that will need to heat in manufacturing process is controlled at 35 ℃, and other are with embodiment 1.
Activating agent is selected oxalic acid 3.0% for use
Rosin is selected common rosin 10.0% for use
Resin is selected 302 resins 2.0% for use
Surfactant is selected OP-5 0.1% for use
Antioxidant is selected benzotriazole 0.1% for use
Solvent (wherein absolute ethyl alcohol, glycerine equivalent) surplus
Each constituent mass summation is 100%.
The low rosin no-clean scaling powder that present embodiment is prepared is faint yellow transparent thick liquid, and the pH value is 4.9～5.1, halide not, and non-volatile content is 32.4%, density is 1.25g/ml.Scaling powder of the present invention with 20% and 80% SnAgCu system leadless soldering plaster mix and make the SnAgCu system leadless soldering plaster of exempting to clean, and by the standard circumfluence welding, the postwelding residual quantity is 6.25%, non-corrosiveness, and solder ball and wetability test are 1 grade.
Embodiment 5
By following each component of mass percent weighing, the temperature that will need to heat in manufacturing process is controlled at 45 ℃, and other are with embodiment 1.
Activating agent is that 10% wherein the DL-malic acid is 4.0%, anhydrous citric acid is 4.0%,
Decanedioic acid is 2.0%
Rosin is that 17% wherein common rosin is 3.0%, Foral is 10.0%,
Water-white rosin is 4.0%
Resin is selected 301 resins 10% for use
Surfactant is selected OP-5 1.0% for use
Antioxidant is selected benzotriazole 1.0% for use
Solvent (wherein isopropyl alcohol, diethylene glycol (DEG), triethylene glycol, glycerine equivalent) surplus
Each constituent mass summation is 100%.
The low rosin no-clean scaling powder that present embodiment is prepared is faint yellow transparent thick liquid, and the pH value is 4.7～4.9, halide not, and non-volatile content is 30.42%, density is 1.28g/ml.Scaling powder of the present invention with 15% and 85% SnAgCu system leadless soldering plaster mix and make the SnAgCu system leadless soldering plaster of exempting to clean, and by the standard circumfluence welding, the postwelding residual quantity is 6.30%, non-corrosiveness, and solder ball and wetability test are 1 grade.
In sum, the low rosin no-clean scaling powder that prescription of the present invention uses resin and activating agent to prepare as the part substitute of rosin, the SnAgCu system leadless soldering plaster that goes out to exempt to clean with SnAgCu system leadless soldering plaster mixed preparing, have good welding performance, the postwelding solder joint is full, and surface-brightening is smooth, residual few, residue is to the substrate non-corrosiveness, and postwelding need not to clean environmentally safe.
Claims (8)
1. the low rosin no-clean scaling powder that is used for the SnAgCu system leadless soldering plaster, it is characterized in that: composed of the following components by mass percentage: activating agent is 3%～10%, rosin is 10%～17%, resin is 2%～10%, surfactant is 0.1%～1%, antioxidant is 0.1%～1%, and all the other are solvent, and each constituent mass sum is 100%.
2. the low rosin no-clean scaling powder that is used for the SnAgCu system leadless soldering plaster as claimed in claim 1 is characterized in that: described activating agent is one or more the combination in stearic acid, oxalic acid, citric acid, adipic acid, succinic acid, DL-malic acid, the decanedioic acid.
3. the low rosin no-clean scaling powder that is used for the SnAgCu system leadless soldering plaster as claimed in claim 1 is characterized in that: described rosin is one or more the combination in water-white rosin, common rosin, the Foral.
4. the low rosin no-clean scaling powder that is used for the SnAgCu system leadless soldering plaster as claimed in claim 1 is characterized in that: described resin is 301 resins, 302 resins or water-borne acrylic resin.
5. the low rosin no-clean scaling powder that is used for the SnAgCu system leadless soldering plaster as claimed in claim 1 is characterized in that: described solvent is the two or more combination in absolute ethyl alcohol, isopropyl alcohol, diethylene glycol (DEG), triethylene glycol, glycerine, EGME, ethylene glycol ethyl ether, the butyl glycol ether.
6. the low rosin no-clean scaling powder that is used for the SnAgCu system leadless soldering plaster as claimed in claim 1, it is characterized in that: described surfactant is OP-10 or OP-7.
7. the low rosin no-clean scaling powder that is used for the SnAgCu system leadless soldering plaster as claimed in claim 1, it is characterized in that: described antioxidant is selected benzotriazole for use.
8. method for preparing the described scaling powder of claim 1, it is characterized in that: this method is implemented according to the following steps,
A, be that the solvent of 3%～10% activating agent and surplus is put into container and mixed, at room temperature be stirred to dissolving fully mass percent;
B, be that 10%～17% rosin adds in the mixed liquor that step a makes, be heated to 30 ℃～50 ℃ and be stirred to dissolving fully mass percent;
C, be that 0.1%～1% surfactant adds in the mixed liquor that step b makes with mass percent. and at room temperature stir;
D, be that 0.1%～1% antioxidant adds in the mixed liquor that step c makes, at room temperature be stirred to dissolving fully mass percent;
E, be that 2%～10% resin adds in the mixed liquor that steps d makes, be heated to 30 ℃～50 ℃ and stir mass percent;
F, the mixing material that step e is made at room temperature cool off, and filter, promptly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100182743A CN100528462C (en) | 2007-07-17 | 2007-07-17 | Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100182743A CN100528462C (en) | 2007-07-17 | 2007-07-17 | Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof |
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| CN101085496A CN101085496A (en) | 2007-12-12 |
| CN100528462C true CN100528462C (en) | 2009-08-19 |
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| CNB2007100182743A Expired - Fee Related CN100528462C (en) | 2007-07-17 | 2007-07-17 | Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof |
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| JP5486282B2 (en) * | 2009-12-08 | 2014-05-07 | 荒川化学工業株式会社 | Solder paste flux and solder paste |
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| CN107175427A (en) * | 2017-06-02 | 2017-09-19 | 苏州龙腾万里化工科技有限公司 | A kind of nontoxic scaling powder agent |
| CN107199418A (en) * | 2017-07-17 | 2017-09-26 | 苏州龙腾万里化工科技有限公司 | A kind of cleaning-free scaling powder |
| CN109175789A (en) * | 2018-09-20 | 2019-01-11 | 湖北双登润阳新能源有限公司 | The aqueous formulations of solder flux of lead acid accumulator pole group automatic welding |
| CN109420863A (en) * | 2018-10-08 | 2019-03-05 | 广东中实金属有限公司 | A kind of solder(ing) paste and preparation method thereof reducing VOC emission |
| CN113798733A (en) * | 2021-09-26 | 2021-12-17 | 上海用森电子科技有限公司 | No-clean soldering flux and preparation method thereof |
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Assignee: Metal products (Shenzhen) Co., Ltd. Assignor: Xi'an University of Technology Contract fulfillment period: 2009.9.9 to 2014.9.9 contract change Contract record no.: 2009440001459 Denomination of invention: Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof Granted publication date: 20090819 License type: Exclusive license Record date: 2009.9.21 |
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