CN105127616A - Washing-free soldering flux - Google Patents
Washing-free soldering flux Download PDFInfo
- Publication number
- CN105127616A CN105127616A CN201510622857.1A CN201510622857A CN105127616A CN 105127616 A CN105127616 A CN 105127616A CN 201510622857 A CN201510622857 A CN 201510622857A CN 105127616 A CN105127616 A CN 105127616A
- Authority
- CN
- China
- Prior art keywords
- parts
- washing
- scaling powder
- soldering flux
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention discloses a washing-free soldering flux which comprises the following components in parts by weight: 20 parts of rosin, 20 parts of resin, 2-3 parts of butanedioic acid, 2-3 parts of glutaric acid, 2-3 parts of sebacic acid, 2-3 parts of pimelic acid, 0.5 part of an anti-corrosive agent, 0.5 part of a co-solvent, 0.5 part of a film forming agent, and 50 parts of an organic solvent. Through the adoption of the scheme, the washing-free soldering flux has the advantages that the solid content is low, oxides are effectively removed, oxidation is prevented, the surface tension of a welding material is reduced, washing is avoided, the service life is long, the performance is stable, the sources are wide, and the use is safe; and the washing-free soldering flux has a wide market prospect in popularization of the washing-free soldering flux.
Description
Technical field
The present invention relates to electrophile field, particularly relate to a kind of cleaning-free scaling powder.
Background technology
Scaling powder is widely used in field of industrial production; scaling powder can help and promote welding process in welding procedure; there is protective effect simultaneously, stop the chemical substance of oxidation reaction, mainly contain auxiliary heat conduction, remove oxide, reduce soldered material surface tension, remove soldered material surface and oil contaminant, increase bonding area, prevent several aspects such as reoxidizing.
Existing scaling powder generally adopts halogen scaling powder, helps weldering effective, but corrosivity is comparatively strong, toxicity is comparatively large, cause larger pollution and harm to environment, is unfavorable for using over a long time.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of cleaning-free scaling powder, traditional halogen scaling powder is replaced by adopting abietic resin scaling powder, and increase the effect of dissolving waste material, solid content is low, effectively remove oxide, anti-oxidation, the surface tension reducing welding material, No clean, long service life, stable performance, wide material sources, use safety, cleaning-free scaling powder universal on have market prospects widely.
For solving the problems of the technologies described above, the invention provides a kind of cleaning-free scaling powder, composition proportion comprises:
Rosin 20 parts,
Resin 20 parts,
Succinic acid 2-3 part,
Glutaric acid 2-3 part,
SA 2-3 part,
Pimelic acid 2-3 part,
Anticorrosive 0.5 part,
Cosolvent 0.5 part,
Film forming agent 0.5 part,
Organic solvent 50 parts.
In a preferred embodiment of the present invention, described organic solvent comprise ethanol, propyl alcohol, butanols, acetone, toluene isobutyl ketone, ethyl acetate, butyl acetate one or more.
In a preferred embodiment of the present invention, the solid content of described cleaning-free scaling powder is less than 2%.
The invention has the beneficial effects as follows: cleaning-free scaling powder of the present invention has the advantage such as surface tension, No clean, long service life, stable performance, wide material sources, use safety that solid content is low, effectively remove oxide, anti-oxidation, reduction welding material, has market prospects widely popularizing of cleaning-free scaling powder.
Detailed description of the invention
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
The embodiment of the present invention comprises:
A kind of cleaning-free scaling powder, composition proportion comprises:
Rosin 20 parts,
Resin 20 parts,
Succinic acid 2-3 part,
Glutaric acid 2-3 part,
SA 2-3 part,
Pimelic acid 2-3 part,
Anticorrosive 0.5 part,
Cosolvent 0.5 part,
Film forming agent 0.5 part,
Organic solvent 50 parts, abietic resin scaling powder replaces traditional halogen scaling powder, and increase and dissolve the effect of waste material, solid content is low, effectively remove oxide, anti-oxidation, the surface tension reducing welding material, No clean, long service life, stable performance, wide material sources, use safety.
Preferably, described organic solvent comprise ethanol, propyl alcohol, butanols, acetone, toluene isobutyl ketone, ethyl acetate, butyl acetate one or more, the waste material considerably increasing the solubility of solvent, reduce solid content, produce when decreasing welding.
Preferably, the solid content of described cleaning-free scaling powder is less than 2%.
The beneficial effect of cleaning-free scaling powder of the present invention is:
One, by adopting abietic resin scaling powder to replace traditional halogen scaling powder, and increase and dissolve the effect of waste material, solid content is low, effectively remove oxide, anti-oxidation, the surface tension reducing welding material, No clean, long service life, stable performance, wide material sources, use safety;
Two, by adopting one or more organic solvents as scaling powder of ethanol, propyl alcohol, butanols, acetone, toluene isobutyl ketone, ethyl acetate, butyl acetate, the waste material considerably increasing the solubility of solvent, reduce solid content, produce when decreasing welding.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.
Claims (3)
1. a cleaning-free scaling powder, is characterized in that, composition proportion comprises:
Rosin 20 parts,
Resin 20 parts,
Succinic acid 2-3 part,
Glutaric acid 2-3 part,
SA 2-3 part,
Pimelic acid 2-3 part,
Anticorrosive 0.5 part,
Cosolvent 0.5 part,
Film forming agent 0.5 part,
Organic solvent 50 parts.
2. cleaning-free scaling powder according to claim 1, is characterized in that, described organic solvent comprise ethanol, propyl alcohol, butanols, acetone, toluene isobutyl ketone, ethyl acetate, butyl acetate one or more.
3. cleaning-free scaling powder according to claim 1, is characterized in that, the solid content of described cleaning-free scaling powder is less than 2%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510622857.1A CN105127616A (en) | 2015-09-28 | 2015-09-28 | Washing-free soldering flux |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510622857.1A CN105127616A (en) | 2015-09-28 | 2015-09-28 | Washing-free soldering flux |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105127616A true CN105127616A (en) | 2015-12-09 |
Family
ID=54713365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510622857.1A Pending CN105127616A (en) | 2015-09-28 | 2015-09-28 | Washing-free soldering flux |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105127616A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105537805A (en) * | 2016-03-07 | 2016-05-04 | 苏州龙腾万里化工科技有限公司 | No-clean scaling powder |
| CN105537803A (en) * | 2016-02-24 | 2016-05-04 | 苏州龙腾万里化工科技有限公司 | Protective anti-corrosion no-clean flux |
| CN107097019A (en) * | 2017-06-08 | 2017-08-29 | 苏州龙腾万里化工科技有限公司 | A kind of organic cleaning-free scaling powder |
| CN108526755A (en) * | 2018-04-13 | 2018-09-14 | 苏州龙腾万里化工科技有限公司 | A kind of scaling powder that can increase solder fluidity |
| CN108526756A (en) * | 2018-04-11 | 2018-09-14 | 苏州龙腾万里化工科技有限公司 | A kind of cleaning-free scaling powder |
| CN108526754A (en) * | 2018-04-11 | 2018-09-14 | 苏州龙腾万里化工科技有限公司 | A kind of high cleaning intensity scaling powder |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101085497A (en) * | 2007-07-17 | 2007-12-12 | 西安理工大学 | Low-rosin cleaning-free scaling powder for tin-lead soldering paste and preparation method thereof |
| CN101085496A (en) * | 2007-07-17 | 2007-12-12 | 西安理工大学 | Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof |
| CN101157168A (en) * | 2007-11-16 | 2008-04-09 | 北京工业大学 | Lead-free solder thread-use colophony type non-halide cleaning-free scaling powder |
| US20090308496A1 (en) * | 2006-12-12 | 2009-12-17 | Yuji Kawamata | Flux for lead-free solder and soldering Method |
| CN102513732A (en) * | 2011-12-15 | 2012-06-27 | 中南大学 | Halogen-free cleaning-free rosin flux, and preparation and application thereof |
| CN104308388A (en) * | 2010-11-26 | 2015-01-28 | 深圳市晨日科技有限公司 | Die-bond soldering paste for high-power LED and preparation method of die-bond soldering paste |
-
2015
- 2015-09-28 CN CN201510622857.1A patent/CN105127616A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090308496A1 (en) * | 2006-12-12 | 2009-12-17 | Yuji Kawamata | Flux for lead-free solder and soldering Method |
| CN101085497A (en) * | 2007-07-17 | 2007-12-12 | 西安理工大学 | Low-rosin cleaning-free scaling powder for tin-lead soldering paste and preparation method thereof |
| CN101085496A (en) * | 2007-07-17 | 2007-12-12 | 西安理工大学 | Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof |
| CN101157168A (en) * | 2007-11-16 | 2008-04-09 | 北京工业大学 | Lead-free solder thread-use colophony type non-halide cleaning-free scaling powder |
| CN104308388A (en) * | 2010-11-26 | 2015-01-28 | 深圳市晨日科技有限公司 | Die-bond soldering paste for high-power LED and preparation method of die-bond soldering paste |
| CN102513732A (en) * | 2011-12-15 | 2012-06-27 | 中南大学 | Halogen-free cleaning-free rosin flux, and preparation and application thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105537803A (en) * | 2016-02-24 | 2016-05-04 | 苏州龙腾万里化工科技有限公司 | Protective anti-corrosion no-clean flux |
| CN105537805A (en) * | 2016-03-07 | 2016-05-04 | 苏州龙腾万里化工科技有限公司 | No-clean scaling powder |
| CN107097019A (en) * | 2017-06-08 | 2017-08-29 | 苏州龙腾万里化工科技有限公司 | A kind of organic cleaning-free scaling powder |
| CN108526756A (en) * | 2018-04-11 | 2018-09-14 | 苏州龙腾万里化工科技有限公司 | A kind of cleaning-free scaling powder |
| CN108526754A (en) * | 2018-04-11 | 2018-09-14 | 苏州龙腾万里化工科技有限公司 | A kind of high cleaning intensity scaling powder |
| CN108526755A (en) * | 2018-04-13 | 2018-09-14 | 苏州龙腾万里化工科技有限公司 | A kind of scaling powder that can increase solder fluidity |
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| PB01 | Publication | ||
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151209 |