CN1836825A - Water-soluble soldering flux dedicated for lead-free solder - Google Patents
Water-soluble soldering flux dedicated for lead-free solder Download PDFInfo
- Publication number
- CN1836825A CN1836825A CN 200610076272 CN200610076272A CN1836825A CN 1836825 A CN1836825 A CN 1836825A CN 200610076272 CN200610076272 CN 200610076272 CN 200610076272 A CN200610076272 A CN 200610076272A CN 1836825 A CN1836825 A CN 1836825A
- Authority
- CN
- China
- Prior art keywords
- acid
- water
- lead
- free solder
- soldering flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
The water soluble soldering flux specially for lead-free soldering material consists of boric acid and organic acid activator 5.0-10.0 wt%, non-ionic surfactant or cationic surfactant 0.1-1.0 wt%, co-solvent 8.0-20.0 wt%, filming agent 0.1-1.0 wt%, corrosion retardant 0.1-0.5 wt%, except deionized water. The compounding process includes the following steps: mixing co-solvent and partial deionized water, adding filming agent under stirring, adding the rest deionized water, activator and surfactant after dissolving, adding corrosion retardant while stirring to dissolve, stilling, and filtering to obtain the filtrate as the soldering flux. The water soluble soldering flux has excellent soldering assisting performance on lead-free soldering material, environment friendship and other advantages.
Description
Technical field
The present invention relates to a kind of scaling powder, particularly the water-soluble flux of adapted to leadless scolder special use.
Background technology
Because the requirement of global environmental regulation and electronics industry development, electronic product is unleaded to be a kind of inexorable trend.Studying more and preliminary business-like lead-free solder at present in the world is Sn-Ag and Sn-Ag-Cu eutectic alloy.But in research and use, find that compare with traditional Sn-Pb scolder, the lead-free solder wetability is poor, easily oxidation, and fusing point height.The rising of fusing point means that welding temperature must improve, and the damage that this can cause plate bin spare on the one hand will inevitably increase the volatilization of activating agent in the scaling powder on the other hand, is easy to cause the inefficacy of solder flux performance, and does not have good activation and protective effect.Requirement must have the corresponding scaling powder can supporting with it use in the research and development process of lead-free solder.
Over nearly 10 years, water-soluble flux at home and abroad electronics industry also is widely used.Water-soluble flux in the past has stronger activity, and corrosivity is also bigger simultaneously, and the postwelding printed board is sticking, is unfavorable for online detection.And the research in past mainly concentrates on the scaling powder Products Development of solder containing pb use, can not satisfy the needs of current lead-free solder development, awaits further carrying out the research about water-soluble soldering flux dedicated for lead-free solder.
There is the patent of invention of a scaling powder in [patent documentation 1] China, and name is called cleaning-free lead-free solder soldering fluid, publication number CN1562554A (open day on January 12nd, 2005).Scaling powder composition described in this patent is similar to low solid-material content cleaning-free scaling powder in the past, and difference is to have added active reinforcing agent in the scaling powder composition, for the bromide of nonionic covalent bond, as dibromosuccinic acid.The wetting power of this scaling powder is strong, helps the weldering better performances, but contains halogen.The no-clean scaling powder that contains halogen, the postwelding residue is corrosive, and the residual ion amount is higher.When electronic product is worked under environmental conditions such as the high heat of high humidity for a long time, have corrosive postwelding residue and will cause potential harm the electrical insulation properties of product.
The electronic product of some high performance requirements, as military electronic products such as naval vessels, military aircrafts, owing to be on active service under the rugged environment through being everlasting, so the reliability requirement of butt welding point is very high, failure phenomenon can not occur in lifetime.If use no-clean scaling powder to weld the requirement that then is difficult to reach to reliability, because cleaning is exempted from the postwelding printed board, residue on the plate face might become some electrolyte under the situation of long-term humidity or heating, cause the circuit board insulating properties to descend, even the solder joint short circuit takes place.The best way is to adopt the water-soluble flux welding during this series products welding.Contain water or postwelding residue water soluble in such scaling powder composition, therefore, postwelding can wash with water totally, guarantee the cleaning of printed board plate face, obtain higher surface insulation resistance,, also can guarantee the high reliability request of electronic product under utmost point rugged environment even product is on active service like this.
Summary of the invention
Purpose of the present invention just provides a kind of water-soluble flux that can guarantee the lead-free solder special use of electronic product high reliability request.The present invention seeks at the inadaptability of existing solder containing pb scaling powder lead-free solder, a kind of water-soluble flux that can effectively cooperate lead-free solder to use is provided, the present invention considers from environmental requirement, the solvent of scaling powder replaces volatile organic matter (volatile organiccompound is called for short VOC) solvent with deionized water.This scaling powder is strong to the wettability of lead-free solder, can strengthen the solderability of lead-free solder, and the welding temperature requirement of energy adapted to leadless scolder, little to the leadless welding alloy corrosiveness, the postwelding residue is few, and can wash by water totally, and dried circuit board has higher insulating resistance value.
For adopting pb-free solder and needing to guarantee that the postwelding circuit board has for the product of high reliability request, this water-soluble flux is a kind of comparatively ideal selection.
Water-soluble soldering flux dedicated for lead-free solder of the present invention, its percetage by weight consists of:
Boric acid and organic acid activator 5.0-10.0%
Non-ionic surface active agent or cationic surfactant 0.1-1.0%
Cosolvent 8.0-20.0%
Film forming agent 0.1-1.0%
Corrosion inhibiter 0.1-0.5%
All the other are solvent deionized water.
Compound method: in having the reactor of agitator, add cosolvent and part deionized water earlier, stir adding film forming agent down, add surplus deionized water, activator and surfactant after the dissolving, add corrosion inhibiter then.Be stirred to solids and dissolve fully, mixing of materials is even, leaves standstill filtration back reservation filtrate and promptly gets scaling powder of the present invention.
Described boric acid and organic acid for activating agent, the proportion of composing of its percentage by weight is 16: 1-40: 1, organic acid is aliphatic monocarboxylic acid, dicarboxylic acids, aromatic acid, amino acid, and being selected from is ethanedioic acid, succinic acid, glutaric acid, adipic acid, 6-oxo enanthic acid, pyromucic acid, L-arginine, homogentisic acid, maleic acid, acrylic acid, citric acid, sorbic acid, lactic acid.Its mesoboric acid acidity is very weak, but adds polyol in BAS, can form complex and H
+And solution acidic is strengthened.Utilize this principle to select for use boric acid, and be used in combination with the organic acid activator as activator.Because boric acid and organic acid boiling point and decomposition temperature difference are bigger, can make the boiling point of scaling powder and the decomposition temperature of activating agent be a bigger interval distribution, scaling powder all has higher activity in the maintenance whole welding process, obtains good welding effect.Because the activation temperature of scaling powder must adapt with the fusing point of leadless welding alloy, just can play and improve its wetability and anti-oxidation, improve the effect of welding performance.
Described non-ionic surface active agent or cationic surfactant can be selected OPEO (abbreviating TX-10 as), isooctylphenol APEO (abbreviating the OP emulsifying agent as), non-ion fluorin carbon surface active agent F (CF for use
2CF
2)
m(CH
2CH
2O)
nH (abbreviating FSO as), m=1-7 wherein, n=1-15.Nonionic is more soluble in water than other type list surface-active agent, organic solvent (comprising acid, alkaline media), and is also better with the compatibility of other type activating agent.Since its unionization in water, high to pH value stability, be subjected to the influence of electrolyte, inorganic salts also little.Cationic surfactant forms very strong positively charged micella in the aqueous solution, impel the H of acid type ligand
+Dissociate out the formation of promotion complex compound and stable.The composite use of cationic surfactant and non-ionic surface active agent, can bring into play both synergies, can effectively reduce the surface tension of lead-free solder, obtain good welding effect, can also reduce simultaneously the surface tension of deionized water, improve the wettability of scaling powder.
Described cosolvent is polyalcohol and pure ethers, can be selected from glycerine, hexylene glycol, diethylene glycol (DEG), pentaerythrite, carbitol, diethylene glycol butyl ether and average molecular mass in 200-600 polyethylene glycol series.
Described film forming agent is unary fatty acid ester, binary fatty acid ester, aromatic esters, amino-acid ester, can be selected from single stearic acid glycerine lipoprotein, dimethyl adipate, ethyl benzoate, dimethyl maleate.
Described corrosion inhibiter is nitrogen heterocyclic, organic amine corrosion inhibiter, can select triethylamine, BTA for use.Addition is 0.1-1.0%, plays antopxidation, reduces the corrosivity of scaling powder to printed board.
The using method of water-soluble soldering flux dedicated for lead-free solder of the present invention is: can adopt spraying, foaming, impregnating method that scaling powder evenly is coated on the pcb board to be welded, pcb board is carried out preheating, preheat temperature is 100 ℃ (the plate top is measured), water is evaporated fully, connect through the wave solder slot welding again, the solder bath temperature is decided on lead-free solder, is generally 250 ℃-270 ℃, transfer rate 1.2-1.8m/min.
Water-soluble soldering flux dedicated for lead-free solder of the present invention is to develop at the performance of lead-free solder, and lead-free solder helped the weldering superior performance.Be particularly useful for Sn-0.7Cu, Sn-3.8Ag-0.7Cu, three kinds of lead-free brazings of Sn-3.0Ag-0.5Cu.The activator that the present invention selects for use has enough activity, can bring into play good striping effect under welding temperature, obtains the full solder joint of light.Because adopt deionized water as solvent, selected activator, cosolvent, corrosion inhibiter all are dissolvable in water water, some water-fast material can dissolve under the cooperation of co-solvent, and the postwelding residue is also water-soluble, is convenient to implement postwelding and cleans.
Water-soluble soldering flux dedicated for lead-free solder design science of the present invention, preparation rationally has the following advantages: no rosin, non-halogen thing, strong to the lead-free solder wetting power, scolder is sprawled evenly, postwelding residue water soluble, after water cleans, printed board insulaion resistance height.In addition, water-soluble soldering flux dedicated for lead-free solder of the present invention is nontoxic, has no irritating odor, and is safe in utilization, do not contain the VOC material substantially, compliance with environmental protection requirements, and nonflammable.
The present invention compares with the organic solvent type no-clean scaling powder with the rosin scaling powder has following advantage: in the production soldering technology of electronic product, use the rosin scaling powder, the postwelding residue is many, for guaranteeing the electric insulating quality of electronic product, must clean the flux residue in the printed board, need use the dichlorodifluoromethan compound for this reason.And this compound is the exhaustion material of atmospheric ozone layer, the row that belong to forbidding and be eliminated; Type no-clean scaling powder with an organic solvent, organic solvents a large amount of in welding process are gone out volatilization, so both improved production cost, also caused the wasting of resources, and these organic solvents evaporate in the atmosphere contaminated environment, and harm humans is healthy, and this class scaling powder is inflammable simultaneously, have potential safety hazard, this also is the material that green production and environmental requirement are forbidden gradually.Therefore, replacing volatile organic matter with deionized water is the trend of scaling powder development as solvent.Particularly for the higher electronic product of reliability requirement, use water-soluble flux, the easy cleaning of postwelding residue is even more important, and water can reduce or eliminate the hidden danger that printed board postwelding residue causes electronic product performance after cleaning, and guarantees the safe handling of product.
Water-soluble soldering flux dedicated for lead-free solder of the present invention is owing to the test stone that does not have special regulation, so test according to unite industrial standard J-STD-004 standard by the U.S. of relatively approving in the world at present, every technical indicator is all qualified.Can satisfy the welding requirements of the contour performance high-reliability electronic of military use product and Aero-Space product fully.
Water-soluble soldering flux dedicated for lead-free solder of the present invention provides in detail by following examples.
The specific embodiment
Embodiment 1:
Boric acid 6.2
Succinic acid 0.1
Glutaric acid 0.1
OP emulsifying agent 0.1
Glycerine 8.0
Glycerin monostearate 0.3
BTA 0.1
Deionized water 85.1
Compound method:
In having the reactor of agitator, add cosolvent and part deionized water earlier, stir and add film forming agent down, add surplus deionized water, activator and surfactant after the dissolving, add corrosion inhibiter then, being stirred to solids dissolves fully, mixing of materials is even, leaves standstill filtration back reservation filtrate and promptly gets scaling powder of the present invention.
After testing, the activation temperature interval of present embodiment water-soluble soldering flux dedicated for lead-free solder is 160 ℃-245 ℃, and the insulaion resistance 3.0 * 10 of back printed board is cleaned in content of halogen＜0.01
11Ω, the rate of spread 82.1%, simultaneously aridity, foaminess, copper coin corrosive nature are all qualified.There is not the penetrating odor of volatilizing during welding.
Embodiment 2:
Boric acid 6.2
Sorbic acid 0.1
Adipic acid 0.1
TX-10 0.2
Glycerine 10.0
Diethylene glycol (DEG) 2.0
Ethyl benzoate 0.3
BTA 0.1
Deionized water 81.0
After testing, the activation temperature interval of water-soluble soldering flux dedicated for lead-free solder of the present invention is 170 ℃-245 ℃, and the insulaion resistance 4.9 * 10 of back printed board is cleaned in content of halogen＜0.01
11Ω, the rate of spread 81.8%, simultaneously aridity, foaminess, copper coin corrosive nature are all qualified.There is not the penetrating odor of volatilizing during welding.
Embodiment 3:
Boric acid 4.8
6-oxo enanthic acid 0.2
L-arginine 0.1
OP emulsifying agent 0.3
FSO 0.1
Glycerine 8.0
Carbitol 2.0
Ethyl benzoate 0.3
Triethylamine 0.1
Deionized water 85.1
After testing, the activation temperature interval of water-soluble soldering flux dedicated for lead-free solder of the present invention is 150 ℃-245 ℃, and the insulaion resistance 6.0 * 10 of back printed board is cleaned in content of halogen＜0.01
11Ω, the rate of spread 80.9%, simultaneously aridity, foaminess, copper coin corrosive nature are all qualified.There is not the penetrating odor of volatilizing during welding.
Embodiment 4:
Boric acid 6.3
Pyromucic acid 0.2
Adipic acid 0.1
OP emulsifying agent 0.1
FSO 0.2
Glycerine 12.0
Macrogol 200 2.0
Glycerin monostearate 0.2
Ethyl benzoate 0.2
BTA 0.1
Deionized water 78.6
After testing, the activation temperature interval of water-soluble soldering flux dedicated for lead-free solder of the present invention is 160 ℃-235 ℃, and the insulaion resistance 4.7 * 10 of back printed board is cleaned in content of halogen＜0.01
11Ω, the rate of spread 81.5%, simultaneously aridity, foaminess, copper coin corrosive nature are all qualified.There is not the penetrating odor of volatilizing during welding.
Embodiment 5:
Boric acid 8.0
Ethanedioic acid 0.2
Acrylic acid 0.2
TX-10 0.4
FSO 0.2
Glycerine 12.0
PEG400 2.0
Butyl acetate 0.2
Ethyl benzoate 0.2
BTA 0.2
Deionized water 76.8
After testing, the activation temperature interval of water-soluble soldering flux dedicated for lead-free solder of the present invention is 180 ℃-230 ℃, and the insulaion resistance 2.2 * 10 of back printed board is cleaned in content of halogen＜0.01
11Ω, the rate of spread 82.0%, simultaneously aridity, foaminess, copper coin corrosive nature are all qualified.There is not the penetrating odor of volatilizing during welding.
Embodiment 6:
Boric acid 8.0
Maleic acid 0.1
Lactic acid 0.1
TX-10 0.8
FSO 0.2
Glycerine 12.0
Pentaerythrite 3.0
Glycerin monostearate 0.4
Ethyl benzoate 0.2
Dimethyl adipate 0.1
BTA 0.2
Deionized water 74.9
After testing, the activation temperature interval of water-soluble soldering flux dedicated for lead-free solder of the present invention is 165 ℃-245 ℃, and the insulaion resistance 5.3 * 10 of back printed board is cleaned in content of halogen＜0.01
11Ω, the rate of spread 80.8%, simultaneously aridity, foaminess, copper coin corrosive nature are all qualified.There is not the penetrating odor of volatilizing during welding.
Embodiment 7:
Boric acid 8.0
Citric acid 0.2
Adipic acid 0.2
TX-10 0.6
FSO 0.2
Glycerine 12.0
Macrogol 600 2.0
Glycerin monostearate 0.2
Ethyl benzoate 0.2
BTA 0.2
Deionized water 76.2
After testing, the activation temperature interval of water-soluble soldering flux dedicated for lead-free solder of the present invention is 182 ℃-245 ℃, and the insulaion resistance 3.2 * 10 of back printed board is cleaned in content of halogen＜0.01
11Ω, the rate of spread 81.5%, simultaneously aridity, foaminess, copper coin corrosive nature are all qualified.There is not the penetrating odor of volatilizing during welding.
Embodiment 8:
Boric acid 9.6
Succinic acid 0.2
Glutaric acid 0.2
Glycerine 16.0
Diethylene glycol butyl ether 4.0
OP emulsifying agent 0.3
FSO 0.1
Glycerin monostearate 0.5
Ethyl benzoate 0.3
Dimethyl maleate 0.2
BTA 0.5
Deionized water 68.1
Through complete detection, the activation temperature interval of water-soluble soldering flux dedicated for lead-free solder of the present invention is 150 ℃-245 ℃, and the insulaion resistance 1.9 * 10 of back printed board is cleaned in content of halogen＜0.01
11, the rate of spread 84.7%, simultaneously aridity, foaminess, copper coin corrosive nature are all qualified.There is not the penetrating odor of volatilizing during welding.
Above constituent content is percetage by weight.
Preparation method and using method are with embodiment 1.
The water-soluble soldering flux dedicated for lead-free solder that above embodiment makes is tested according to U.S.'s associating industrial standard J-STD-004 standard of relatively approving in the world at present, and every technical indicator is all qualified, is fit to the welding production of high-performance electronic product.
Claims (10)
1, a kind of water-soluble soldering flux dedicated for lead-free solder is characterized in that, it comprises following substances:
Boric acid and organic acid for activating agent 5.0-10.0%
Non-ionic surface active agent or cationic surfactant 0.1-1.0%
Cosolvent 8.0-20.0%
Film forming agent 0.1-1.0%
Corrosion inhibiter 0.1-0.5%
All the other are solvent deionized water, and described percentage is percetage by weight.
2, water-soluble soldering flux dedicated for lead-free solder according to claim 1 is characterized in that: described boric acid and organic acid for activating agent, the proportion that its percentage by weight is formed is 16: 1-40: 1.
3, water-soluble soldering flux dedicated for lead-free solder according to claim 2 is characterized in that: organic acid is aliphatic monocarboxylic acid, dicarboxylic acids, aromatic acid, amino acid.
4, according to claim 2 or 3 described water-soluble soldering flux dedicated for lead-free solder, it is characterized in that: organic acid is to be selected from ethanedioic acid, succinic acid, glutaric acid, adipic acid, 6-oxo enanthic acid, pyromucic acid, L-arginine, maleic acid, acrylic acid, citric acid, sorbic acid, lactic acid.
5, water-soluble soldering flux dedicated for lead-free solder according to claim 1 is characterized in that: described non-ionic surface active agent or cationic surfactant are OPEO, isooctylphenol APEO, non-ion fluorin carbon surface active agent F (CF
2CF
2)
m(CH
2CH
2O)
nH, m=1-7 wherein, n=1-15.
6, water-soluble soldering flux dedicated for lead-free solder according to claim 1 is characterized in that: described cosolvent is polyalcohol and pure ethers.
7, water-soluble soldering flux dedicated for lead-free solder according to claim 6 is characterized in that: described cosolvent is to be selected from glycerine, hexylene glycol, diethylene glycol (DEG), pentaerythrite, carbitol, diethylene glycol butyl ether and average molecular mass in 200-600 polyethylene glycol series.
8, water-soluble soldering flux dedicated for lead-free solder according to claim 1 is characterized in that: described film forming agent is unary fatty acid ester, binary fatty acid ester, aromatic esters, amino-acid ester.
9, water-soluble soldering flux dedicated for lead-free solder according to claim 1 is characterized in that: described corrosion inhibiter is nitrogen heterocyclic, organic amine corrosion inhibiter.
10, water-soluble soldering flux dedicated for lead-free solder its preparation method according to claim 1 is characterized in that, may further comprise the steps:
In having the reactor of agitator, add cosolvent and part deionized water earlier, stir and add film forming agent down, add surplus deionized water, activator and surfactant after the dissolving, add corrosion inhibiter then, being stirred to solids dissolves fully, mixing of materials is even, leaves standstill filtration back reservation filtrate and promptly gets scaling powder of the present invention.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100762725A CN100408257C (en) | 2006-04-21 | 2006-04-21 | Water-soluble soldering flux dedicated for lead-free solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100762725A CN100408257C (en) | 2006-04-21 | 2006-04-21 | Water-soluble soldering flux dedicated for lead-free solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1836825A true CN1836825A (en) | 2006-09-27 |
| CN100408257C CN100408257C (en) | 2008-08-06 |
Family
ID=37014409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100762725A Expired - Fee Related CN100408257C (en) | 2006-04-21 | 2006-04-21 | Water-soluble soldering flux dedicated for lead-free solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100408257C (en) |
Cited By (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100457375C (en) * | 2007-08-11 | 2009-02-04 | 厦门大学 | Cleaning-free water base type scaling powder capable of restraining welding point interface compound growth |
| CN100528462C (en) * | 2007-07-17 | 2009-08-19 | 西安理工大学 | Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof |
| CN101670504A (en) * | 2009-10-12 | 2010-03-17 | 东莞市焊宏爱法电子科技有限公司 | Halogen-free and rosin-free welding fluid |
| CN101327555B (en) * | 2008-07-31 | 2010-04-14 | 昆明三利特科技有限责任公司 | Water-washing type heat-resisting soft solder paste |
| CN101342649B (en) * | 2008-08-25 | 2010-06-02 | 杨嘉骥 | Soldering fluid for improving surface insulation resistance |
| CN101234460B (en) * | 2007-02-01 | 2010-11-10 | 上海化工研究院 | Water-solubility dip coating tin scaling powder and preparation thereof |
| CN101890596A (en) * | 2010-07-23 | 2010-11-24 | 深圳市亿铖达工业有限公司 | Low-carbon environmentally-friendly water-based soldering flux |
| CN101934440A (en) * | 2010-10-21 | 2011-01-05 | 江苏科技大学 | Soldering flux |
| CN102198572A (en) * | 2010-03-24 | 2011-09-28 | 瑞萨电子株式会社 | Soldering flux and method for manufacturing a semiconductor device using the same |
| CN102303200A (en) * | 2011-08-16 | 2012-01-04 | 浙江一远电子科技有限公司 | Alcohol and water mixed-base cleaning-free soldering flux for wire connection |
| CN102350599A (en) * | 2011-08-25 | 2012-02-15 | 华南理工大学 | Halogen-free high-impedance water-based washing-free scaling powder as well as preparation method and application thereof |
| CN102357748A (en) * | 2011-10-18 | 2012-02-22 | 苏州之侨新材料科技有限公司 | Halogen-and-rosin-free antibacterial no-clean soldering flux for lead-free solder |
| CN101497155B (en) * | 2008-01-31 | 2012-09-05 | 荒川化学工业株式会社 | Soldering flux and soldering paste |
| CN102699576A (en) * | 2012-04-18 | 2012-10-03 | 广东工业大学 | Low-VOC (volatile organic compound) non-cleaning flux comprising complex surfactant and method for preparing same |
| CN103111773A (en) * | 2012-12-13 | 2013-05-22 | 郴州金箭焊料有限公司 | Scaling powder for lead-free solder paste |
| CN103286477A (en) * | 2013-05-22 | 2013-09-11 | 中南大学 | Soldering flux for lead-free solder and preparation method of soldering flux |
| CN103551762A (en) * | 2013-10-28 | 2014-02-05 | 北京新立机械有限责任公司 | Hot air leveling-up scaling powder of nonvolatile organic compound and preparation method thereof |
| CN103846572A (en) * | 2014-03-17 | 2014-06-11 | 苏州龙腾万里化工科技有限公司 | Novel cleaning-free flux |
| CN103909358A (en) * | 2014-03-13 | 2014-07-09 | 江苏科技大学 | Water-washing type solder paste and preparation method thereof |
| CN104117787A (en) * | 2014-07-31 | 2014-10-29 | 宁国新博能电子有限公司 | Environment-friendly no-clean soldering flux |
| CN104708233A (en) * | 2015-02-28 | 2015-06-17 | 深圳市荣昌科技有限公司 | No-clean flux suitable for copper-aluminum soldering and preparation method thereof |
| CN105057923A (en) * | 2015-09-06 | 2015-11-18 | 湖北长海新能源科技有限公司 | Water-borne soldering flux for welding lead-acid storage battery pole plates |
| CN105583550A (en) * | 2016-03-21 | 2016-05-18 | 苏州柯仕达电子材料有限公司 | Novel environmental-protection flux |
| CN106271222A (en) * | 2016-09-12 | 2017-01-04 | 东莞市千岛金属锡品有限公司 | A kind of Solid flux for automatic tin soldering solder and preparation method thereof |
| CN106346170A (en) * | 2016-10-09 | 2017-01-25 | 常州亚环环保科技有限公司 | Method for preparing soldering flux for no-clean solder paste |
| CN107262972A (en) * | 2017-07-04 | 2017-10-20 | 合肥安力电力工程有限公司 | It is a kind of for scaling powder of welding circuit board and preparation method thereof |
| CN107962318A (en) * | 2017-12-01 | 2018-04-27 | 苏州市宽道模具机械有限公司 | A kind of scaling powder and preparation method thereof |
| CN108356445A (en) * | 2018-01-30 | 2018-08-03 | 深圳市合明科技有限公司 | Environment protection soldering fluid and its preparation method and application |
| CN108465984A (en) * | 2018-06-28 | 2018-08-31 | 广东剑鑫科技股份有限公司 | A kind of Halogen water-soluble flux and preparation method thereof |
| CN110181200A (en) * | 2019-07-03 | 2019-08-30 | 莱芜技师学院 | A kind of blender and preparation method thereof of tin carving handicraft article welding procedure |
| CN112643249A (en) * | 2020-12-29 | 2021-04-13 | 深圳市福英达工业技术有限公司 | Halogen-free water-washing soldering flux, lead-free halogen-free water-washing tin paste and preparation method thereof |
| CN113199170A (en) * | 2021-04-25 | 2021-08-03 | 江苏海宝电池科技有限公司 | Gel type storage battery soldering flux and preparation method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4478650A (en) * | 1983-10-19 | 1984-10-23 | At&T Technologies, Inc. | Water soluble flux |
| CA2042091C (en) * | 1990-05-15 | 1995-02-07 | Raymond L. Turner | Water-soluble soldering flux |
| CN1042809C (en) * | 1994-04-06 | 1999-04-07 | 化学工业部晨光化工研究院成都分院 | Non-halogen non-rosin type low solid content non-cleaning scaling powder |
| US5443660A (en) * | 1994-10-24 | 1995-08-22 | Ford Motor Company | Water-based no-clean flux formulation |
| CN1233499C (en) * | 2002-10-18 | 2005-12-28 | 深圳市唯特偶化工开发实业有限公司 | Halogen-free low-solid-contained water-base washing-free scaling powder |
| CN100336626C (en) * | 2005-08-12 | 2007-09-12 | 北京工业大学 | Rosin halogen-free scaling powder for lead-free soldering paste |
-
2006
- 2006-04-21 CN CNB2006100762725A patent/CN100408257C/en not_active Expired - Fee Related
Cited By (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101234460B (en) * | 2007-02-01 | 2010-11-10 | 上海化工研究院 | Water-solubility dip coating tin scaling powder and preparation thereof |
| CN100528462C (en) * | 2007-07-17 | 2009-08-19 | 西安理工大学 | Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof |
| CN100457375C (en) * | 2007-08-11 | 2009-02-04 | 厦门大学 | Cleaning-free water base type scaling powder capable of restraining welding point interface compound growth |
| CN101497155B (en) * | 2008-01-31 | 2012-09-05 | 荒川化学工业株式会社 | Soldering flux and soldering paste |
| CN101327555B (en) * | 2008-07-31 | 2010-04-14 | 昆明三利特科技有限责任公司 | Water-washing type heat-resisting soft solder paste |
| CN101342649B (en) * | 2008-08-25 | 2010-06-02 | 杨嘉骥 | Soldering fluid for improving surface insulation resistance |
| CN101670504A (en) * | 2009-10-12 | 2010-03-17 | 东莞市焊宏爱法电子科技有限公司 | Halogen-free and rosin-free welding fluid |
| CN102198572A (en) * | 2010-03-24 | 2011-09-28 | 瑞萨电子株式会社 | Soldering flux and method for manufacturing a semiconductor device using the same |
| CN101890596A (en) * | 2010-07-23 | 2010-11-24 | 深圳市亿铖达工业有限公司 | Low-carbon environmentally-friendly water-based soldering flux |
| CN101934440B (en) * | 2010-10-21 | 2012-08-15 | 江苏科技大学 | Soldering flux |
| CN101934440A (en) * | 2010-10-21 | 2011-01-05 | 江苏科技大学 | Soldering flux |
| CN102303200A (en) * | 2011-08-16 | 2012-01-04 | 浙江一远电子科技有限公司 | Alcohol and water mixed-base cleaning-free soldering flux for wire connection |
| CN102350599A (en) * | 2011-08-25 | 2012-02-15 | 华南理工大学 | Halogen-free high-impedance water-based washing-free scaling powder as well as preparation method and application thereof |
| CN102357748A (en) * | 2011-10-18 | 2012-02-22 | 苏州之侨新材料科技有限公司 | Halogen-and-rosin-free antibacterial no-clean soldering flux for lead-free solder |
| CN102699576A (en) * | 2012-04-18 | 2012-10-03 | 广东工业大学 | Low-VOC (volatile organic compound) non-cleaning flux comprising complex surfactant and method for preparing same |
| CN103111773A (en) * | 2012-12-13 | 2013-05-22 | 郴州金箭焊料有限公司 | Scaling powder for lead-free solder paste |
| CN103286477A (en) * | 2013-05-22 | 2013-09-11 | 中南大学 | Soldering flux for lead-free solder and preparation method of soldering flux |
| CN103551762A (en) * | 2013-10-28 | 2014-02-05 | 北京新立机械有限责任公司 | Hot air leveling-up scaling powder of nonvolatile organic compound and preparation method thereof |
| CN103909358B (en) * | 2014-03-13 | 2016-01-13 | 江苏科技大学 | A kind of washing tin cream and preparation method thereof |
| CN103909358A (en) * | 2014-03-13 | 2014-07-09 | 江苏科技大学 | Water-washing type solder paste and preparation method thereof |
| CN103846572A (en) * | 2014-03-17 | 2014-06-11 | 苏州龙腾万里化工科技有限公司 | Novel cleaning-free flux |
| CN104117787A (en) * | 2014-07-31 | 2014-10-29 | 宁国新博能电子有限公司 | Environment-friendly no-clean soldering flux |
| CN104117787B (en) * | 2014-07-31 | 2016-12-28 | 青岛申达众创技术服务有限公司 | A kind of Environmental-protection cleaning-free scaling powder |
| CN104708233B (en) * | 2015-02-28 | 2016-01-06 | 深圳市荣昌科技有限公司 | One is applicable to copper aluminum soft soldering cleaning-free scaling powder and preparation method thereof |
| CN104708233A (en) * | 2015-02-28 | 2015-06-17 | 深圳市荣昌科技有限公司 | No-clean flux suitable for copper-aluminum soldering and preparation method thereof |
| CN105057923A (en) * | 2015-09-06 | 2015-11-18 | 湖北长海新能源科技有限公司 | Water-borne soldering flux for welding lead-acid storage battery pole plates |
| CN105583550B (en) * | 2016-03-21 | 2018-06-15 | 苏州柯仕达电子材料有限公司 | A kind of environment protection soldering fluid |
| CN105583550A (en) * | 2016-03-21 | 2016-05-18 | 苏州柯仕达电子材料有限公司 | Novel environmental-protection flux |
| CN106271222A (en) * | 2016-09-12 | 2017-01-04 | 东莞市千岛金属锡品有限公司 | A kind of Solid flux for automatic tin soldering solder and preparation method thereof |
| CN106346170A (en) * | 2016-10-09 | 2017-01-25 | 常州亚环环保科技有限公司 | Method for preparing soldering flux for no-clean solder paste |
| CN107262972A (en) * | 2017-07-04 | 2017-10-20 | 合肥安力电力工程有限公司 | It is a kind of for scaling powder of welding circuit board and preparation method thereof |
| CN107962318A (en) * | 2017-12-01 | 2018-04-27 | 苏州市宽道模具机械有限公司 | A kind of scaling powder and preparation method thereof |
| CN108356445A (en) * | 2018-01-30 | 2018-08-03 | 深圳市合明科技有限公司 | Environment protection soldering fluid and its preparation method and application |
| CN108465984A (en) * | 2018-06-28 | 2018-08-31 | 广东剑鑫科技股份有限公司 | A kind of Halogen water-soluble flux and preparation method thereof |
| CN110181200A (en) * | 2019-07-03 | 2019-08-30 | 莱芜技师学院 | A kind of blender and preparation method thereof of tin carving handicraft article welding procedure |
| CN112643249A (en) * | 2020-12-29 | 2021-04-13 | 深圳市福英达工业技术有限公司 | Halogen-free water-washing soldering flux, lead-free halogen-free water-washing tin paste and preparation method thereof |
| CN112643249B (en) * | 2020-12-29 | 2022-07-22 | 深圳市福英达工业技术有限公司 | Halogen-free water-washing soldering flux, lead-free halogen-free water-washing tin paste and preparation method thereof |
| CN113199170A (en) * | 2021-04-25 | 2021-08-03 | 江苏海宝电池科技有限公司 | Gel type storage battery soldering flux and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100408257C (en) | 2008-08-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1836825A (en) | Water-soluble soldering flux dedicated for lead-free solder | |
| CN101049661A (en) | Free from cleaning soldering flux without halogen and rosin in use for solder without lead | |
| CN100336626C (en) | Rosin halogen-free scaling powder for lead-free soldering paste | |
| CN1233499C (en) | Halogen-free low-solid-contained water-base washing-free scaling powder | |
| CN101073862A (en) | Low-rosin and cleaning-free welding accessory without halogen for lead-free welding grease | |
| CN1290662C (en) | Welding flux agent of solder with no lead and free from cleaning | |
| CN1374168A (en) | Welding flux and brazing filler metal composition for brass solder | |
| CN101062536A (en) | Non-halide cleaning-free welding flux for leadless solder | |
| CN100528461C (en) | Non-rosin cleaning-free scaling powder for tin-lead soldering paste and preparation method thereof | |
| CN101269448B (en) | Cleaning-free lead-free solder soldering fluid | |
| JP6402213B2 (en) | Solder composition and electronic substrate | |
| CN1876311A (en) | Lead-free halogen-free tinol and preparation process | |
| JP6674982B2 (en) | Solder composition and electronic substrate | |
| JP5916674B2 (en) | Solder composition for jet dispenser | |
| CN1950172A (en) | Soldering process | |
| JP5863966B2 (en) | Soldering flux and solder composition | |
| FR2980729A1 (en) | POLYAMINE FONDANT COMPOSITION, CARBOXYLIC ACID, AND WELDING METHOD | |
| JP6713027B2 (en) | Solder composition and electronic substrate | |
| JP2020040120A (en) | Solder composition for jet dispenser, and method for manufacturing electronic substrate | |
| JP6370324B2 (en) | Solder composition and method for producing electronic substrate | |
| CN100588494C (en) | Cleaning-free scaling powder for tin-silver-zinc series lead-free solder | |
| JP5945914B2 (en) | Cleaning agent for removing flux residue | |
| JP2004176179A (en) | Water soluble treatment agent for improving solder wettability of electronic component terminal, and treatment method therefor | |
| CN103358053A (en) | Preparation method of environmental-friendly halogen-free smokeless soldering flux | |
| TWI832272B (en) | Soldering flux and soldering paste |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080806 Termination date: 20150421 |
|
| EXPY | Termination of patent right or utility model |