CN100336626C - Rosin halogen-free scaling powder for lead-free soldering paste - Google Patents
Rosin halogen-free scaling powder for lead-free soldering paste Download PDFInfo
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- CN100336626C CN100336626C CNB2005100902590A CN200510090259A CN100336626C CN 100336626 C CN100336626 C CN 100336626C CN B2005100902590 A CNB2005100902590 A CN B2005100902590A CN 200510090259 A CN200510090259 A CN 200510090259A CN 100336626 C CN100336626 C CN 100336626C
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- acid
- rosin
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- scaling powder
- lead
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- 238000005476 soldering Methods 0.000 title claims abstract description 55
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to soldering flux which is especially suitable for preparing alloy systems, such as SnAgCu, SnAgCuRE, SnAg, etc. The existing soldering flux has the defects of serious oxidation in high temperature, and corrosion of contained halogen residues after soldering. The present invention comprises 4 to 30 wt% of organic acid type activating agent, 29 to 67 wt% of modified rosin, 1 to 20 wt% of paste forming agent, 0.5 to 8 wt% of stabilizing agent paraffin wax, 1 to 8 wt% of thixotropic agent, and high boiling solvent with the rest weight percent, wherein the organic acid type activating agent contains fatty groups, dibasic acid, tribasic acid, hydroxy acid and aromatic acid; the modified rosin is one kind of polymerized rosin, hydrogenated rosin and disproportionated rosin, or the mixture of polymerized rosin, hydrogenated rosin and disproportionated rosin in different mixing modes; the paste forming agent contains one kind of polyethylene glycol 2000, polyethylene glycol 4000 and polyethylene glycol 6000, or the mixture of polyethylene glycol 2000, polyethylene glycol 4000 and polyethylene glycol 6000 in different mixing modes; the thixotropic agent contains one kind of hydrogenated castor oil and amide compounds, or the mixture of hydrogenated castor oil and amide compounds; the high boiling solvent contains one kind of butyl cellosolve, methyl carbitol and ethyl carbitol, or the mixture of two kinds of butyl cellosolve, methyl carbitol and ethyl carbitol. The present invention has the advantages of no halogen, no penetration of bronze mirrors after soldering, high insulation resistance and high soldering assisting performance. The present invention solves the problem of serious oxidation in high temperature, and the degree of viscosity of the matched soldering paste is proper.
Description
Technical field
The present invention relates to a kind of scaling powder, be particularly useful for preparing the rosin halogen-free scaling powder for lead-free soldering paste of alloy systems such as SnAgCu, SnAgCuRE and SnAg.
Background technology
Sn-Pb solder technology maturation possesses the incomparable advantage of other scolder, is widely used in the electrical and electronic product.But when waste electronic electrical equipment landfill disposal, the Pb in the scolder meets acid rain or underground water, forms Pb
2+, be dissolved in underground water, thereby the water supply chain that enters people enters in the human body, causes lead poisoning.
European Union (EU) considers for environmental protection, has passed through the discarded decree (WEEE) of electric/electronic device, clearly announce from July 1st, 2006 electrical and electronic product must realize unleaded.
The best substitute that current people are actively seeking the substitute .SnPb scolder of SnPb scolder is brazing filler metal alloys such as SnCu, SnAg, SnZn, SnAgCu, SnAgCuRE.For surface-assembled for soldering paste, brazing filler metal alloys such as current SnAgCu, SnAgCuRE, SnAg are best substitutes, because the fusing point of SnPb eutectic solder is 187 ℃, SnAgCu is that the fusing point of nearly eutectic alloy is 217 ℃-220 ℃, thereby bring welding temperature totally to improve about 30 ℃, with regard to having brought the serious problem of high-temperature oxydation in the welding process, proposed more harsh requirement to lead-free solder paste with scaling powder like this, traditional scaling powder adapts no longer with it.Based on the unleaded active demand of electric equipment products, lead-free solder paste is extremely urgent with the developmental research of scaling powder.
The existence of halogen strengthens the corrosion of film of flux residue butt welding point, and its corrosion mechanism is as follows:
Take a broad view of the patent of the current domestic and international colophony type soldering paste that occurs with scaling powder, the patent research of finding to be applicable to the common resin type soldering flux without halogen that lead-free solder paste is used seldom.The soldering paste scaling powder announced of patent 95117301.4 (U.S. is in Chinese patents) for example, it mainly is that solution SnPb is that nearly eutectic alloy soldering paste hardens or coagulation problem in time, but can't resolve the nearly serious problems of eutectic alloy lead-free solder paste high-temperature oxydation such as SnAgCu is; The soldering paste scaling powder that patent 99810452.3 (Japan is in Chinese patents) and patent 01117345.9 (Japan is in Chinese patents) and 01800016.9 (Japan is in Chinese patents) are announced, they mainly are at SnZn or SnPb scolder, solve be the SnZn soldering paste through the time effect and aging problem, but, make the postwelding residue produce etching problem because scaling powder contains halogen; The soldering paste scaling powder that patent 00137388.9 (Japan is in Chinese patents) is announced, mainly be solve take place in the past owing to have dewdrop or adhere to the problem of the decline of the reliability that dust causes, but it mainly is at the SnPb scolder, thereby also causes the postwelding residue to produce corrosion because of containing halogen simultaneously; The colophony type scaling powder that patent 89105911.3 is announced mainly is to be applied to wave-soldering, is not to be used to prepare soldering paste, and what adopt because of it simultaneously is low boiling point solvent, can't resolve the serious problem of lead-free solder high-temperature oxydation in the brazing process; The scaling powder that patent 200410026717.X announced is applicable to lead-free solder, but it also mainly is to be used for wave-soldering, is not suitable for the preparation lead-free solder paste.Patent 200410022403.2 has been announced a kind of scaling powder for preparing lead-free solder paste, but contains halogen, is not to exempt from the cleaning-type scaling powder.
The present invention is exactly needs of complying with the preparation of the lead-free solder paste of alloy systems such as SnAgCu, SnAgCuRE and SnAg, the plain no-clean scaling powder of exploitation colophony type non-halide.
Summary of the invention
The problem that the objective of the invention is the solder joint corrosion that brings at the serious problem of the above-mentioned solder joint high-temperature oxydation that brings because of unleaded trend with because of the existence of halogen, providing a kind of is solvent carrier with the high boiling solvent, not halogen-containing lead-free solder paste colophony type scaling powder.This lead-free solder paste can overcome the shortcoming of prior art with scaling powder, helps the weldering performance good, and it uses more compliance with environmental protection requirements.Be applicable to the needs of the lead-free solder paste preparation of alloy systems such as SnAgCu, SnAgCuRE and SnAg.
Rosin halogen-free scaling powder for lead-free soldering paste of the present invention, its component and content are: organic acid activator 4-30wt%; Modified rosin 29-67wt%; Paste making agent 1-20wt%; Stabilizing agent 0.5-8wt%; Thixotropic agent 1-8wt%; Surfactant 0.5-10wt%, high boiling solvent are surplus.
Described organic acid activator is aliphatic monoacid, binary acid, ternary acid, carboxylic acid, aromatic acid, olefin(e) acid, amino acid, particularly acetate, butanedioic acid, glue acid, adipic acid, oxalic acid, salicylic acid, benzoic acid, lactic acid, tartaric acid, citric acid, malic acid, oleic acid, glutamic acid, glycine, optional one or more mixing wherein.This type of activator has and enough helps weldering active, especially with the quality mixing match be 1: 1 two kinds of organic acid mixed acid help weldering performance the best.The mechanism of action of active component in helping the weldering process is in the scaling powder, at first, more than activation point, active component ionization in solvent go on a tour from H
+Ion is with the oxide reaction of mother metal and solder surface.Its reaction equation is:
2H
++MO＝M
2++H
2O
Like this, the oxide-film of mother metal and solder surface is removed, and the metal of mother metal partly exposes.Secondly,, help mother metal and scolder sprawling under brazing temperature, reach good soldering purpose because the metal of mother metal partly exposes.
Described activator can decompose under brazing temperature, distils or volatilize, and makes printed circuit board (PCB) (PCB) postwelding organic acid residue low, does not have corrosion.
Described modified rosin is one or more mixtures of newtrex, Foral, disproportionated rosin.The colophony type soldering paste is a kind of lyophobic sol with solder flux essence.A certain amount of rosin is dissolved in the organic solvent,, can be prepared into colloidal sol by the supersaturation method.What this colloidal sol did not influence soldering paste helps the weldering performance, because this colloidal sol is a kind of thermodynamic instability system, more than the activation temperature, this colloidal sol becomes solution again at it, and the abietic acid ionization in the solution goes out H
+Ion is removed oxide-film, helps the weldering effect.
It is solid-state that described modified rosin is at normal temperatures; unionization; after the soldering; the formation air-tightness is good; transparent organic film can wrap up bump, has completely cut off contacting of metal and atmosphere and other Korrosionsmediums; have the excellent protection performance, solved activity and corrosive contradiction of scaling powder well.
Described paste making agent is Macrogol 2000, Macrogol 4000, Macrogol 6000, optional one or more mixing wherein.The effect of paste making agent is to strengthen the ability that rosin colloidal sol becomes the thickness paste, and the suggestion consumption is the 1-20wt% of scaling powder content.
Described stabilizing agent is a paraffin.Function of stabilizer is to strengthen the thick stability of rosin colloidal sol.The stablizing effect of paraffin is very strong, but consumption seldom, and consumption is too much, itself can separate out a large amount of white waxs, does not have stabilization; Consumption does not have stabilization very little yet.Its consumption is the 0.5-8wt% of scaling powder content.
Described thixotropic agent is rilanit special, amide compound, optional one or both mixing wherein.The effect of thixotropic agent is the thinning behavior of shear force that strengthens the soldering paste fluid, improves the printing performance of soldering paste, makes soldering paste be easy to demoulding, and the phenomenon of not caving in.Its consumption is the 1-8wt% of scaling powder content.
Described solvent is a high boiling solvent.The effect of organic solvent provides a kind of ionization environment, allow the ionization in organic solvent of rosin acid and organic acid go on a tour from H
+Ion.Simultaneously, solvent also plays a kind of carrier function, in welding process, carries free H
+The ion remaval oxide-film simultaneously, carries other scaling powder composition and plays the weldering effect that helps.
Because the fusing point of leadless welding alloy such as SnAgCu exceeds about 35 ℃ than traditional solder containing pb fusing point, this with regard to having occurred because the serious problem of scolder high-temperature oxydation that the raising of brazing temperature brings.Like this, choice of Solvent is most important.If the boiling point of solvent is low excessively, and in welding process, solvent volatilizees too early, H
+Ion loses the ionization environment too early; If the boiling point of solvent is too high, and then the postwelding residue increases.The high boiling solvent of selecting for use is butyl cellosolve, methyl carbitol, ethyl carbitol, BC or diethyl carbitol one or both mixtures wherein, boiling point is all very high, but all be lower than welding temperature simultaneously, therefore, just solved this problem well.
Rosin halogen-free scaling powder for lead-free soldering paste of the present invention has also added certain amount of surfactant.Add an amount of surfactant and can reduce interfacial tension between PCB surface and the molten braze alloy, strengthen wetting power, that improves scaling powder whereby helps the weldering performance, thereby reduces the formation of solder balls and solder flux bridge.Surfactant is not volatile, and dosage of surfactant is generally at 0.5-10wt%, and described surfactant is OPEO, NPE, FSN, FSO, optional one or more mixing wherein.
More than various auxiliary agents important parameter, i.e. a viscosity of mixing the decision soldering paste.The soldering paste that viscosity is big can form good printing shape, reduces " subsiding " phenomenon, but is not easy by template, occurs consent easily or drags a phenomenon, for welding later on produces rosin joint, defective such as holds up and stay hidden danger.The soldering paste that viscosity is little prints easily, but " subsiding " occur easily, can produce bad defectives such as soldered ball, short circuit again after the welding.In high-precision surface-assembled technology (SMT), both required soldering paste can print out good shape, require the soldering paste can be again by the template of little opening.In addition, that the viscosity of soldering paste should can keep before and after printing for a long time is stable (4～8hr), otherwise can not guarantee the reliability of repeating print, reduce First Pass Yield, increase the SMT cost.Especially to the printing of thin space components and parts, after soldering paste must pass through abundant centrifugal stirring, and to guarantee that the soldering paste viscosity number is not less than 800kPas, could guarantee printing quality.
The viscosity of rosin halogen-free scaling powder for lead-free soldering paste of the present invention is 10-155PaS, the soldering paste of being prepared can form good printing shape, has " subsiding " phenomenon seldom, easily demoulding, consent do not occur or drag a phenomenon, hidden danger such as no rosin joint, perpendicular, soldered ball, short circuit.
Rosin halogen-free scaling powder for lead-free soldering paste of the present invention, be applicable to the needs of the lead-free solder paste preparation of alloy systems such as preparation SnAgCu, SnAgCuRE and SnAg, design science, preparation rationally, not halogen-containing, help weldering property good, having solved lead-free solder paste increases the serious problem of bringing of high-temperature oxydation because of fusing point, and the postwelding bronze mirror does not have and penetrates; The lead-free solder paste of being prepared has good flowability, ease for operation, quality stability and good helps weldering.Adopt this scaling powder to test by GB GB/T9491-2002 and electron trade standard SJ/T11186-1998, every index is all up to standard.Can satisfy motherboard solder reflow process requirements such as communication apparatus, computer, high-end audio equipment fully.
The specific embodiment
The concrete preparation program of rosin halogen-free scaling powder for lead-free soldering paste of the present invention has following examples to provide in detail.Yet, should be appreciated that provided specific embodiment of the present invention particularly though these are described, these embodiment mainly are illustrative purposes for example, and the present invention can be explained at it aspect broader, and is not subjected to the restriction of these embodiment.
Embodiment 1: this is a kind of rosin halogen-free scaling powder for lead-free soldering paste that does not contain surfactant, and each material content mass percent is:
Newtrex: 67
Glutaric acid 4
Macrogol 2000 1
DGDE 26.5
Rilanit special 1
Paraffin 0.5
Concrete preparation method: concrete preparation method is a conventional method, just organic solvent is added in the enamel still of clean band stirring, newtrex is joined in the solvent again, heating is stirred, after dissolving, the clarification, add other raw material successively, continue to be stirred to solid matter and all dissolve, mix, stop stirring,, supply the quantity of solvent that reduces because of volatilization by calculating, mix again, leave standstill, water cooling is rosin halogen-free scaling powder for lead-free soldering paste; Again scaling powder and leadless welding powder are mixed with 12: 88 ratio, stir, promptly get halogen-free lead-free solder paste.
Embodiment 2: this is a kind of surfactant and bi-component organic acid rosin halogen-free scaling powder for lead-free soldering paste of containing, and each material content mass percent is:
Newtrex: 19
Foral 10
Succinic acid 15
Glutaric acid 15
NPE 0.5
Macrogol 6000 2
Butyl carbitol 22.5
Rilanit special 8
Paraffin 8
The preparation method is identical with embodiment 1.
Embodiment 3: this is that another kind contains surfactant and one pack system organic acid rosin halogen-free scaling powder for lead-free soldering paste, and each material content mass percent is:
Newtrex: 25
Disproportionated rosin 15
Salicylic acid 4
OPEO 10
Macrogol 4000 11
Butyl cellosolve 25
Rilanit special 5
Paraffin 5
The preparation method is identical with embodiment 1.
Embodiment 4: this is that another kind contains one pack system organic acid rosin halogen-free scaling powder for lead-free soldering paste, and each material content mass percent is:
Newtrex 25
Foral 15
Disproportionated rosin 12
Succinic acid 4
NPE 0.5
Macrogol 2000 10
DGDE 20
Rilanit special 8
Paraffin 3.5
The preparation method is identical with embodiment 1.
Embodiment 5: this is that another kind contains one pack system organic acid rosin halogen-free scaling powder for lead-free soldering paste, and each material content mass percent is:
Newtrex 39
Salicylic acid 30
OPEO 2
Macrogol 2000 2
Diethylene glycol methyl ether 23.5
Rilanit special 3
Paraffin 0.5
The preparation method is identical with embodiment 1.
Embodiment 6: this is that another kind contains one pack system organic acid rosin halogen-free scaling powder for lead-free soldering paste, and each material content mass percent is:
Foral 44.5
Citric acid 9.5
NPE 5
Macrogol 2000 8
DGDE 20
Rilanit special 5
Paraffin 8
The preparation method is identical with embodiment 1.
Embodiment 7: this is a kind of bi-component organic acid rosin halogen-free scaling powder for lead-free soldering paste that contains, and each material content mass percent is:
Newtrex: 33
Disproportionated rosin 20
Succinic acid 2
Glutaric acid 2
OPEO 5
Macrogol 4000 5
Butyl cellosolve 26
Rilanit special 5
Paraffin 2
The preparation method is identical with embodiment 1.
Embodiment 8: this is a kind of three component organic acid rosin halogen-free scaling powder for lead-free soldering paste that contain, and each material content mass percent is:
Foral 11
Newtrex 25
Salicylic acid 10
Lactic acid 10
Glutaric acid 10
NPE 4
Macrogol 2000 4.5
Diethyl carbitol 20
Rilanit special 4
Paraffin 1.5
The preparation method is identical with embodiment 1.
Embodiment 9: this is that another kind contains one pack system organic acid rosin halogen-free scaling powder for lead-free soldering paste, and each material content mass percent is:
Newtrex 20
Foral 20
Disproportionated rosin 10
Lactic acid 10
Macrogol 4000 20
Paraffin 5
N, N-ethylenebisstearamide 5
OPEO 10
The assessment of rosin halogen-free scaling powder for lead-free soldering paste: evaluating standard is according to GB GB/T9491-2002 and electronics rower SJ/T 11273-2002 and SJ/T11186-1998 and measure evaluation.The assessment result of embodiment 1 to embodiment 9 sees Table 1.
Table 1
The lead-free solder paste of embodiment 1 to embodiment 9 assessment result of scaling powder
| Scaling powder | Content of halogen | The rate of spread | Bronze mirror corrosivity | Insulaion resistance | Solder flux viscosity (20 ℃) |
| Embodiment 1 | Do not have | 80％ | Do not penetrate | 1.1×10 12Ω | 121.9Pa·S |
| Embodiment 2 | Do not have | 82％ | Do not penetrate | 1.2×10 12Ω | 115.5Pa·S |
| Embodiment 3 | Do not have | 81％ | Do not penetrate | 1.3×10 12Ω | 119.6Pa·S |
| Embodiment 4 | Do not have | 80.5％ | Do not penetrate | 1.5×10 12Ω | 118.3Pa·S |
| Embodiment 5 | Do not have | 82％ | Do not penetrate | 1.4×10 12Ω | 108.4Pa·S |
| Embodiment 6 | Do not have | 80.8％ | Do not penetrate | 1.2×10 12Ω | 116.8Pa·S |
| Embodiment 7 | Do not have | 81.5％ | Do not penetrate | 1.1×10 12Ω | 117.5Pa·S |
| Embodiment 8 | Do not have | 82％ | Do not penetrate | 1.2×10 12Ω | 109.7Pa·S |
| Embodiment 9 | Do not have | 80.9％ | Do not penetrate | 1.4×10 12Ω | 114.6Pa·S |
Can find out from table 1, scaling powder shown in the embodiment 1 to embodiment 9 is not halogen-containing, the postwelding bronze mirror does not have and penetrates, the insulaion resistance height, help weldering property good, having solved lead-free solder paste increases the high-temperature oxydation serious problem of bringing because of fusing point, and scaling powder has certain viscosity simultaneously, makes the lead-free solder paste of being prepared have suitable viscosity, good flowability and ease for operation.
Though the present invention is showed particularly with reference to its embodiment and is described, but the people who is familiar with this technology will understand aspect form and details various changes and can carry out without departing from the scope of the invention, and scope of the present invention is limited by claims only.
Claims (3)
1, a kind of rosin halogen-free scaling powder for lead-free soldering paste, it is characterized in that it is made up of following materials by weight: organic acid activator 4-30wt%, modified rosin 29-67wt%, paste making agent 1-20wt%, stabilizing agent paraffin 0.5-8wt%, thixotropic agent 1-8wt%, surfactant 0.5-10wt%, high boiling solvent are surplus; Described organic acid activator is aliphatic dibasic acid, ternary acid, carboxylic acid, one or more mixing of aromatic acid; Described modified rosin is the mixture of newtrex and Foral or disproportionated rosin; Described paste making agent is Macrogol 2000, Macrogol 4000, Macrogol 6000, optional one or more mixing wherein; Described thixotropic agent is rilanit special, amide compound, optional one or both mixing wherein; Described high boiling solvent is butyl cellosolve, methyl carbitol, ethyl carbitol, BC, diethyl carbitol, optional one or both mixing wherein; Described surfactant is OPEO, NPE, FSN, FSO, optional one or more mixing wherein.
2, rosin halogen-free scaling powder for lead-free soldering paste according to claim 1 is characterized in that: described organic acid activator is butanedioic acid, glue acid, salicylic acid, lactic acid, citric acid particularly, optional one or more mixing wherein.
3, rosin halogen-free scaling powder for lead-free soldering paste according to claim 1 is characterized in that: described organic acid activator especially with the quality mixing match be 1: 1 two kinds of organic acid mixed acid help weldering performance the best.
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