CN102069324B - No-clean low-splashing soldering flux for lead-free solder wire and preparation method thereof - Google Patents
No-clean low-splashing soldering flux for lead-free solder wire and preparation method thereof Download PDFInfo
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- CN102069324B CN102069324B CN2010106108399A CN201010610839A CN102069324B CN 102069324 B CN102069324 B CN 102069324B CN 2010106108399 A CN2010106108399 A CN 2010106108399A CN 201010610839 A CN201010610839 A CN 201010610839A CN 102069324 B CN102069324 B CN 102069324B
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Abstract
The invention discloses a no-clean low-splashing rosin-based soldering flux for a lead-free solder wire and a preparation method thereof. The soldering flux comprises the following components in percentage by mass: 2 to 7 percent of high-boiling point alcohol solvent, 0.5 to 5 percent of organic amine hydrogen halide, 0.5 to 5 percent of organic acid and 80 to 97 percent of rosin. The preparation method comprises the following steps of: mixing and stirring the organic amine hydrogen halide and the high-boiling point alcohol solvent into uniform and transparent liquid; and adding the uniform and transparent liquid into mixed solution of the rosin and the organic acid to prepare uniform and transparent liquid. Therefore, the defect of splashing of the traditional soldering flux for the lead-free solder wire is improved, and the soldering flux has high solderability and electric insulativity.
Description
Technical field
The present invention relates to the scolder field, refer in particular to and a kind ofly exempt to clean the low spatter lead-free soldering wire with scaling powder and preparation method thereof.
Background technology
Along with the raising day by day of human environmental requirement, it is unleaded that electronic solder has lead to be converted into from tradition.Because the fusing point of lead-free solder is than having about the high 30-50 of kupper solder ℃, tradition has plumbous solder stick to be used in scaling powder can't satisfy the requirement of welding procedure to braze ability on the lead-free soldering wire.For the braze ability that improves lead-free soldering wire need increase the content of activating agent in the solder flux, but can produce the scaling powder important disadvantages of splashing simultaneously again.Patent 200710022404 has announced that a kind of lead-free soldering wire uses scaling powder, but this patent solubilizer not, the solubility of organic amine hydrohalide in rosin is very low, is prone to produce scaling powder during welding and splashes.Patent 200810195090 has announced that a kind of lead-free soldering wire uses scaling powder, and this patent contains the high boiling ester kind solvent, and is bad to the activating agent dissolubility in the solder flux, also is prone to produce scaling powder during welding and splashes.
Summary of the invention
Main purpose of the present invention is to provide a kind of the minimizing to splash, and is active high, and the postwelding insulaion resistance is high, and the high no-cleaning leadless solder of reliability is with scaling powder and preparation method thereof.
For realizing above-mentioned purpose, the present invention takes following technical scheme:
A kind ofly exempt to clean the low spatter lead-free soldering wire, by mass percentage, comprise 2-7% high-boiling point alcohol kind solvent, 0.5-5% organic amine hydrohalide, 0.5-5% organic acid, 80-97% rosin with scaling powder and preparation method thereof.
Said high-boiling point alcohol kind solvent be at least glycerine, diethylene glycol (DEG), tetrahydrofurfuryl alcohol, 2-ethyl (1-) hexanol, 2-ethyl (1, the 3-) mixture of one or more in the hexylene glycol.
Said organic amine hydrohalide is at least one or more mixtures in the diphenylguanidine hydrogen bromic acid salt ﹑ hexamethylene amine hydrogen bromic acid salt ﹑ two ethamine hydrogen bromic acid salt ﹑ dimethylamine hydrochloric acid salt ﹑ diethylamine hydrogen salt hydrochlorates.
Said organic acid is at least 6 carbon atoms above monobasic or binary organic acid, wherein is at least one or more mixtures in suberic acid, decanedioic acid, 12 diacid, dodecoic acid, tetradecylic acid, palmitic acid, the stearic acid.
Preparation method of the present invention mixes the organic amine hydrohalide earlier with the high-boiling point alcohol kind solvent, be stirred to homogeneous transparent liquid with high speed dispersor at normal temperatures; Again rosin is added in the container and heat with 150 ± 10 ℃ and be stirred to fusing; Under 150 ± 10 ℃ of temperature, add organic acid; Treat that organic acid is dissolved in the mixing material that adds aforementioned organic amine hydrohalide and alcohols solvent behind the rosin solution again, continue to stir and be dissolved into transparent uniform liquid after 10～30 minutes and get final product.
The invention has the advantages that adding the high-boiling point alcohol kind solvent can well dissolve organic amine hydrohalide; Splash thereby reduce scaling powder, and after adopting the high-boiling point alcohol kind solvent that the organic amine hydrohalide is dissolved earlier with high speed dispersor at normal temperatures, mix with rosin and organic acid heating again; The scaling powder transparency that is made is high; Basically do not have during welding and splash, braze ability is good, and insulaion resistance is high.
The specific embodiment
Below in conjunction with specific embodiment the present invention is further described.
The present invention is a kind of to exempt to clean the low spatter lead-free soldering wire with scaling powder and preparation method thereof, by mass percentage, comprises 2-7% high-boiling point alcohol kind solvent, 0.5-5% organic amine hydrohalide, 0.5-5% organic acid, 80-97% rosin.Specifically see following embodiment 1-4 for details.
Said high-boiling point alcohol kind solvent be at least Bing San Chun ﹑ Er Gan Chun ﹑ Si hydrogen Kang Chun ﹑ 2-ethyl (1-) Ji Chun ﹑ 2-ethyl (1, the 3-) mixture of one or more in the hexylene glycol.Because the solubility of organic amine hydrohalide in rosin is very low; As the organic amine hydrohalide is not dissolved with solvent; Can cause the skewness of organic amine hydrohalogenation in rosin, the place that wherein concentration is big causes scaling powder to splash seriously owing to instant vaporization when welding.The high-boiling point alcohol kind solvent all has excellent dissolubility to organic amine hydrohalide, organic acid and rosin, even organic amine hydrohalide, organic acid are evenly distributed in the rosin, thereby reduce or avoids scaling powder to splash.
Of the present inventionly exempt to clean the low spatter lead-free soldering wire and be lower than 2% (mass percent with the amount of the high-boiling point alcohol kind solvent that adds in the scaling powder; In the time of down together); The high-boiling point alcohol kind solvent can not improve organic acid, the solubility of organic amine hydrohalide in rosin, thereby splashes and do not have positive effect suppressing scaling powder; When being higher than 7%, the high-boiling point alcohol kind solvent can make splashing of scaling powder more obvious owing to the vaporization of self.Therefore, of the present invention exempt to clean the low spatter lead-free soldering wire must be with the addition of high-boiling point alcohol kind solvent in the scaling powder in 2%～7% scope.More preferably 4%～6% scope.
Described organic acid activator is above monobasic or binary organic acids of at least 6 carbon atoms, wherein is at least: one or more mixtures in Xin Er Suan ﹑ Gui Er Suan ﹑ 12 Er Suan ﹑ Shi Er Suan ﹑ ten Si Suan ﹑ palmitic acids, the stearic acid.Be lower than the organic acid below 6 carbon atoms because boiling point is low, when welding, be prone to vaporization, volatilization, cause scaling powder to splash.
Said organic amine hydrohalide is at least one or more mixtures in the diphenylguanidine hydrogen bromic acid salt ﹑ hexamethylene amine hydrogen bromic acid salt ﹑ two ethamine hydrogen bromic acid salt ﹑ dimethylamine hydrochloric acid salt ﹑ diethylamine hydrogen salt hydrochlorates.This type of material has the ability of stronger removal oxide, but also is the component that has the greatest impact to splashing of scaling powder, therefore controls the scope of its content in scaling powder at 0.5-5%.
Said rosin can be common rosin or modified rosin, any one or two kinds of mixing in preferred superfine rosin, the polymerization Song Xiang ﹑ Qiization Song Xiang ﹑ Foral.Two kinds of mixed rosins are formed residual not easy to crack, and the postwelding insulaion resistance is high, and it is few to splash.
Following each embodiment all adopts following preparation method to carry out: weigh up organic amine hydrohalide and high-boiling point alcohol kind solvent in proportion, it is subsequent use to be stirred to homogeneous transparent liquid with high speed dispersor at normal temperatures in the adding container; Rosin is weighed up in proportion again and put into another container, maintain the temperature at 150 ± 10 ℃ of heating and be stirred to fusing fully, under 150 ± 10 ℃ of temperature, add organic acid activator, stirring is dissolved in the rosin organic acid; Add the subsequent use organic amine hydrohalide and the mixture of high-boiling point alcohol kind solvent again, the continuation stirring was dissolved into transparent uniform liquid in 10～30 minutes and is got final product.
Following table is embodiment of the invention 1-4 and comparative example, and is specific as follows:
Following table is embodiment 1-4 and comparative example characteristic test:
See and go up shown in the table that each component intermiscibility of the scaling powder in the comparative example is bad, cause the scaling powder outward appearance muddy; It is serious to splash, in contrast, and according to prescription of the present invention and preparation method; After with the high-boiling point alcohol kind solvent organic amine hydrohalide being dissolved earlier with high speed dispersor at normal temperatures earlier in proportion, mix with rosin and organic acid heating, the scaling powder transparency that is made is high again; Basically do not have during welding and splash, braze ability is good, and insulaion resistance is high.
The above; It only is preferred embodiment of the present invention; Be not that technical scope of the present invention is done any restriction, so every foundation technical spirit of the present invention all still belongs in the scope of technical scheme of the present invention any trickle modification, equivalent variations and modification that above embodiment did.
Claims (1)
1. exempt to clean the low spatter lead-free soldering wire and use scaling powder for one kind, it is characterized in that: by mass percentage, comprising:
Diethylamine hydrobromide 0.2%
Diphenylguanidine hydrobromate 4%
Diethylene glycol 5%
Decanedioic acid 2%
Suberic acid 2%
Superfine rosin 25%
Newtrex 61.8%.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010106108399A CN102069324B (en) | 2010-12-29 | 2010-12-29 | No-clean low-splashing soldering flux for lead-free solder wire and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010106108399A CN102069324B (en) | 2010-12-29 | 2010-12-29 | No-clean low-splashing soldering flux for lead-free solder wire and preparation method thereof |
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| Publication Number | Publication Date |
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| CN102069324A CN102069324A (en) | 2011-05-25 |
| CN102069324B true CN102069324B (en) | 2012-08-15 |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013187363A1 (en) * | 2012-06-11 | 2013-12-19 | 千住金属工業株式会社 | Flux composition, liquid flux, resin flux cored solder, and solder paste |
| CN102689113B (en) * | 2012-06-15 | 2014-06-18 | 东莞市剑鑫电子材料有限公司 | Cleaning-free and residue-free scaling powder and preparation method thereof |
| CN103394824B (en) * | 2013-08-02 | 2017-04-05 | 北京鹏瑞中联科技有限公司 | A kind of tin silk low spatter Halogen welding agent and preparation method thereof |
| DE102015108485A1 (en) * | 2015-05-29 | 2016-12-01 | ELSOLD GmbH & Co. KG | Tube solder, in particular for soldering aluminum |
| CN105234591B (en) * | 2015-10-10 | 2017-12-05 | 广东省焊接技术研究所（广东省中乌研究院） | A kind of Halogen solder stick activating agent and preparation method thereof |
| CN108127292A (en) * | 2018-01-12 | 2018-06-08 | 广东省焊接技术研究所（广东省中乌研究院） | Effective unleaded tin silk medicine core scaling powder of temp sensing controller ripple and preparation method thereof |
| CN110788522A (en) * | 2019-10-31 | 2020-02-14 | 苏州万山锡业有限公司 | Manufacturing method of low-splashing active solder wire |
| CN110783013B (en) * | 2019-11-06 | 2021-06-15 | 英利能源（中国）有限公司 | Solar cell electrode slurry, cell and preparation method of assembly of cell |
| CN111482730A (en) * | 2020-04-24 | 2020-08-04 | 深圳市博士达焊锡制品有限公司 | Solder wire for automatic soldering robot and preparation method thereof |
| CN112621012A (en) * | 2020-12-09 | 2021-04-09 | 东莞市千岛金属锡品有限公司 | Brazing solder wire of antistatic low-splashing solid soldering flux and preparation method thereof |
| CN114012304A (en) * | 2021-12-01 | 2022-02-08 | 东莞市千岛金属锡品有限公司 | High-temperature-resistant high-lead low-tin alloy welding material and preparation method and application thereof |
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| WO2001047660A1 (en) * | 1999-12-27 | 2001-07-05 | Sumitomo Bakelite Company, Ltd. | Hardening flux, soldering resist, semiconductor package reinforced by hardening flux, semiconductor device and method of producing semiconductor package and semiconductor device |
| JP5067565B2 (en) * | 2008-05-30 | 2012-11-07 | 荒川化学工業株式会社 | Solder flux and cream solder |
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| CN1562554A (en) * | 2004-03-30 | 2005-01-12 | 深圳市唯特偶化工开发实业有限公司 | Welding flux agent of solder with no lead and free from cleaning |
| CN1709638A (en) * | 2005-08-12 | 2005-12-21 | 北京工业大学 | Rosin halogen-free scaling powder for lead-free soldering paste |
| CN101049663A (en) * | 2007-05-09 | 2007-10-10 | 昆山成利焊锡制造有限公司 | Soldering flux in use for soft soldering wire, and preparation method |
| CN101269448A (en) * | 2008-04-22 | 2008-09-24 | 太仓市首创锡业有限公司 | Cleaning-free lead-free solder soldering fluid |
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| CN102069324A (en) | 2011-05-25 |
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