CN105234591B - A kind of Halogen solder stick activating agent and preparation method thereof - Google Patents
A kind of Halogen solder stick activating agent and preparation method thereof Download PDFInfo
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- CN105234591B CN105234591B CN201510651313.8A CN201510651313A CN105234591B CN 105234591 B CN105234591 B CN 105234591B CN 201510651313 A CN201510651313 A CN 201510651313A CN 105234591 B CN105234591 B CN 105234591B
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- halogen
- activating agent
- rosin
- acid
- solder stick
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A kind of Halogen solder stick activating agent, is made up of following component and mass percent：Organic acid activator 0.5~6%；Surfactant 0.1~2%；Organic solvent 0.5~5%；Modified rosin 90~96%.Its preparation method is：Modified rosin is heated to 130~150 DEG C, to its be completely melt keep constant temperature, sequentially add organic acid activator, surfactant and organic solvent be stirred until homogeneous it is transparent, constant temperature stand 5 minutes it is not stratified.The Halogen solder stick activating agent of the present invention be free of any halogen, and flue dust is small, taste is small, splashings is small during welding and with preferably active, wettability is good, postwelding surface insulation resistance height, the full light of solder joint.
Description
Technical field
The present invention relates to a kind of solder stick activating agent, more particularly to a kind of Halogen solder stick activating agent and preparation method thereof.
Background technology
Traditional activating agent contains halogen mostly, and corrosivity is strong, although can reach good welding effect, postwelding is residual
Corrosivity is left, the mechanical property and electric property to product have potential harmful effect.Due to the easy moisture absorption of halogen, make moist
Activating agent easily produces splashing, fried tin in welding process, influences welding quality, and for cleaning the cleaning agent of postwelding residue
It can be damaged the ozone layer after volatilization, influence environment, not meet environmental requirement.
In recent years, according to International Typographic Association and industry regulation and《Fluxes for soft soldering requirement》（J-STD-004B）'s
Formulate, the use for halogen proposes new regulation, it is desirable to which chlorine, bromine content are less than 900ppm, and halogen total amount is less than
1500ppm, therefore, non-halogen activating agent has been inexorable trend.But in the Halogen tin silk product occurred in the market, greatly
More poor activities, the rate of spread are low, and many enterprises blindly increase the percentage composition of activating agent to reach preferably activity, cause again
Flue dust during welding use is big, the problems such as big, postwelding residual is on the high side, reliability reduces of splashing.
CN101049662A " no-lead soft soldering silk with halogen-free solder flux and preparation method " discloses mass percent such as
Under material composition：Organic acid activator 0.2~3%, nonionic surfactant 0.2~3%, surplus are modified rosin, its table
Face activating agent closes the one or more in FSN100 from dibromo butene glycol, dibromo ethyl benzene, bromide sixteen alkyls pyridine.Should
Solder flux content of halogen is higher, and postwelding residual easily causes corrosion, causes surface insulation resistance to decline, especially runs into moist ring
Border, cause the generation of short-circuit leaky.
CN101157168A " lead-free solder thread-use colophony type non-halide element no-clean scaling powder " discloses mass percent such as
Under material composition：Organic acid 4~18%, organic solvent 0.5~5%, modified rosin are surplus；The scaling powder is free of halogen, but
It is that organic acid activator usage amount is substantially on the high side, polyethylene glycol 2000 that its paste making agent uses, Macrogol 4000, polyethylene glycol
One or more in 6000, thermal cracking can be occurred by being heated in welding process, therefore welding fume is larger, and one is caused to environment
Fixed influence, in the case where exhaust equipment is incomplete using also there is certain damage to health.
The content of the invention
The defects of it is an object of the invention to overcome prior art, there is provided a kind of Halogen solder stick activating agent, the activating agent
The features such as active good, welding fume is small, splashing is small, solder joint is full bright, the few corrosivity of postwelding residual is low.
It is another object of the present invention to provide a kind of preparation method of the Halogen solder stick activating agent.
Halogen solder stick activating agent of the present invention is made up of following component and mass percent：Organic acid activator
0.5~6%；Surfactant 0.1~2%；Organic solvent 0.5~5%；Modified rosin 90~96%.
Preferable Halogen solder stick activating agent is made up of following component and mass percent：Adipic acid：1%；Suberic acid：1%；
FSN-100：0.3%；TX-10：0.7%；200 ﹟ solvent naphthas：0.5%；Turpentine oil：0.5%；Hydrogenated rosin 101：50%；Perhydrogenating pine
It is fragrant：40% and 150 high-softening-point rosins：6%.
Described organic acid activator is one kind in succinic acid, adipic acid, decanedioic acid, suberic acid or dimethylolpropionic acid
It is or two or more.
Described surfactant is one or both of TX-10, OP-10, FC-4430 or FSN-100.
Described organic solvent is 120 ﹟ solvent naphthas, 200 ﹟ solvent naphthas, turpentine oil or mixed dibasic acid ester（DBE）In one
Kind or two kinds.
Described modified rosin is in hydrogenated rosin 101, hydrogenated rosin 301, perhydrogenated rosin or 150 high-softening-point rosins
One or two.
Preparation method is：Modified rosin is heated to 130~150 DEG C, is completely melt to keep constant temperature to it, has sequentially added
The agent of machine acid activity, surfactant and organic solvent be stirred until homogeneous it is transparent, constant temperature stand 5 minutes it is not stratified.
Organic acid activator selected by the present invention is succinic acid, adipic acid, decanedioic acid, suberic acid or dimethylolpropionic acid
One or both of more than, for melting range from 108~188 DEG C, boiling point and decomposition temperature, can be wider below 240 DEG C
In the range of it is lasting activity is provided, remove metal pad surface film oxide, prevent metal surface from reoxidizing, effectively facilitate solder and exist
Wetting on pad；While most of and can is after welding（There is 245 DEG C of lead, unleaded 260 DEG C）Decompose or volatilization, postwelding remain
Few, insulaion resistance is high, ensure that postwelding reliability.
Surfactant selected by the present invention is one or both of TX-10, OP-10, FC-4430 or FSN-100,
It is nonionic surfactant.Nonionic surfactant stability height, acid and alkali-resistance, it is nontoxic, without halogen, energy
Metal pad surface tension is effectively reduced, cationic surfactant, anion surfactant, amphoteric surface live by contrast
Property agent has the shortcomings that respective or deficiency.Cationic surfactant some contains halogen, and some has middle and high toxicity；
Anion surfactant not acid and alkali-resistance, it is unstable, it is easily destroyed, it can not be played completely in the solder stick activating agent of slant acidity
Reduce the effect of surface tension；Amphoteric ionic surfactant shows the property of cationic surfactant in sour environment
Energy.
The addition of organic solvent is the characteristic of the present invention, and organic solvent selected by the present invention is 120 ﹟ solvent naphthas, 200 ﹟ are molten
Agent oil, turpentine oil or mixed dibasic acid ester（DBE）One or both of, extremely strong dissolubility is respectively provided with, other compositions can be made
More uniformly in being distributed in rosin, prevent because uneven heated produce of component distributing is splashed, while the viscosity of rosin can be reduced, improve
Liquid rosin mobility, it ensure that rosin being uniformly distributed in solder stick.
Modified rosin selected by the present invention is hydrogenated rosin 101, hydrogenated rosin 301, perhydrogenated rosin or 150 height soften
One or both of point rosin.Hydrogenated rosin antioxidant is good, fragility is small, heat endurance is high, compatibility, caking property, ageing-resistant
Function admirable, it is highly suitable for applying in solder stick activating agent；The softening point of 150 high-softening-point rosins is at 150 DEG C or so, in work
Make that there is higher inoxidizability, anti-crystallization at 300 ~ 400 DEG C of temperature.
Activating agent of the present invention, without any halogen, during welding, flue dust is small, taste is small, splashing is small and with preferable
Activity, wettability is good, and postwelding surface insulation resistance is high, the full light of solder joint.
Embodiment
Embodiment 1
Halogen solder stick activating agent is by following component and mass percent：Adipic acid：2%；Succinic acid：2%；TX-10：
0.2%；FC-4430：0.3%；120 ﹟ solvent naphthas：5%；150 high-softening-point rosins：5% and hydrogenated rosin 101：85.5%.
150 high-softening-point rosins and hydrogenated rosin 101 are added in reactor, are heated to 145 DEG C to whole fusings；According to
Secondary addition adipic acid, succinic acid, TX-10, FC-4430 and 120 ﹟ solvent naphthas；It is stirred continuously to homogeneous transparent, constant temperature and stands 5 points
Clock is not stratified.
Embodiment 2
Component and mass percent：Suberic acid：3%；Decanedioic acid：1%；TX-10：0.2%；FSN-100：0.3%；200 ﹟ solvents
Oil：5%；150 high-softening-point rosins：5% and hydrogenated rosin 301：85.5%.
150 high-softening-point rosins and hydrogenated rosin 301 are added in reactor, are heated to 145 DEG C to whole fusings；According to
Secondary addition suberic acid, decanedioic acid, TX-10, FSN-100 and 200 ﹟ solvent naphthas；It is stirred continuously to homogeneous transparent, constant temperature and stands 5 points
Clock is not stratified.
Embodiment 3
Component and mass percent：Suberic acid：4%；OP-10：0.2%；FSN-100：0.3%；200 ﹟ solvent naphthas：3%；DBE：
2% and perhydrogenated rosin：90.5%.
Perhydrogenated rosin is added in reactor, is heated to 145 DEG C to whole fusings；Sequentially add suberic acid, OP-
10th, FSN-100,200 ﹟ solvent naphthas and DBE；Be stirred continuously to homogeneous transparent, constant temperature stand 5 minutes it is not stratified.
Embodiment 4
Component and mass percent：Suberic acid：2%；Adipic acid：1%；Dimethylolpropionic acid：1%；OP-10：0.2%；FC-
4430：0.3%；120 ﹟ solvent naphthas：3%；Turpentine oil：2%；150 high-softening-point rosins：5% and perhydrogenated rosin：85.5%.
150 high-softening-point rosins and perhydrogenated rosin are added in reactor, are heated to 145 DEG C to whole fusings；According to
Secondary addition suberic acid, adipic acid, dimethylolpropionic acid, OP-10, FC-4430,120 ﹟ solvent naphthas and turpentine oil；Be stirred continuously to
Homogeneous transparent, constant temperature stand 5 minutes it is not stratified.
Embodiment 5
Component and mass percent：Adipic acid：1%；FSN-100：0.3%；OP-10：1.2%；200 ﹟ solvent naphthas：3%；Turpentine
Oil：1%；Hydrogenated rosin 101：50% and perhydrogenated rosin：43.5%.
Perhydrogenated rosin and hydrogenated rosin 101 are added in reactor, are heated to 145 DEG C to whole fusings；Successively plus
Enter adipic acid, FSN-100, OP-10,200 ﹟ solvent naphthas and turpentine oil；It is stirred continuously to homogeneous transparent, constant temperature and stands 5 minutes not
Layering.
Embodiment 6
Component and mass percent：Adipic acid：1%；Suberic acid：1%；FSN-100：0.3%；TX-10：0.7%；200 ﹟ solvents
Oil：0.5%；Turpentine oil：0.5%；Hydrogenated rosin 101：50%；Perhydrogenated rosin：40% and 150 high-softening-point rosins：6%.
Perhydrogenated rosin, the high-softening-point rosin of hydrogenated rosin 101 and 150 are added in reactor, are heated to 145 DEG C extremely
All fusings；Sequentially add adipic acid, suberic acid, FSN-100, TX-10,200 ﹟ solvent naphthas and turpentine oil；It is stirred continuously to equal
It is even transparent, constant temperature stand 5 minutes it is not stratified.
Embodiment 7
Component and mass percent：Adipic acid：2%；Suberic acid：1%；Decanedioic acid：1%；Dimethylolpropionic acid：1%；FSN-
100：0.2%；200 ﹟ solvent naphthas：1%；Turpentine oil：1%；Hydrogenated rosin 301：45%；Perhydrogenated rosin：40% and 150 high softening-points
Rosin：7.8%.
Perhydrogenated rosin, the high-softening-point rosin of hydrogenated rosin 301 and 150 are added in reactor, are heated to 145 DEG C extremely
All fusings；Sequentially add adipic acid, suberic acid, decanedioic acid, dimethylolpropionic acid, FSN-100,200 ﹟ solvent naphthas and turpentine
Oil；Be stirred continuously to homogeneous transparent, constant temperature stand 5 minutes it is not stratified.
According to the Ministry of Information Industry of China《Liquid scaling powder standard SJ/T11273-2002 free of cleaning》It is more than standard testing real
Apply the Halogen solder stick activating agent of example, the results showed that, Halogen solder stick activating agent of the invention is free of halogen, and outward appearance is orange
Yellow, have no irritating odor in welding process, splash small, postwelding residual is less and sprawls uniformly, spreading ratio all 80% with
On, postwelding insulaion resistance is all higher than 5.0 × 1010Ω, copper corrosion test corrode without penetrability, comply fully with wanting for standard
Ask, the performance of Halogen solder stick activating agent of the invention has obvious advantage with traditional activating agent ratio.
Claims (1)
1. a kind of Halogen solder stick activating agent, it is characterised in that be made up of following component and mass percent：Adipic acid：1%；It is pungent
Diacid：1%；FSN-100：0.3%；TX-10：0.7%；200 ﹟ solvent naphthas：0.5%；Turpentine oil：0.5%；Hydrogenated rosin 101：
50%；Perhydrogenated rosin：40% and 150 high-softening-point rosins：6%.
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| CN201510651313.8A CN105234591B (en) | 2015-10-10 | 2015-10-10 | A kind of Halogen solder stick activating agent and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510651313.8A CN105234591B (en) | 2015-10-10 | 2015-10-10 | A kind of Halogen solder stick activating agent and preparation method thereof |
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| CN105234591A CN105234591A (en) | 2016-01-13 |
| CN105234591B true CN105234591B (en) | 2017-12-05 |
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| CN201510651313.8A Expired - Fee Related CN105234591B (en) | 2015-10-10 | 2015-10-10 | A kind of Halogen solder stick activating agent and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106624463A (en) * | 2016-11-30 | 2017-05-10 | 重庆微世特电子材料有限公司 | Activating agent used for water-based soldering flux and preparing method of activating agent |
| CN108788521B (en) * | 2018-06-28 | 2021-08-10 | 广东剑鑫科技股份有限公司 | Transformer flux and preparation method thereof |
| CN114005663A (en) * | 2021-09-26 | 2022-02-01 | 深圳市岑科实业有限公司 | NR inductor, tin wire and manufacturing method of NR inductor |
| CN114871629B (en) * | 2022-06-21 | 2024-07-16 | 浙江亚通新材料股份有限公司 | Nickel-ball-containing solder wire and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH653939A5 (en) * | 1982-04-07 | 1986-01-31 | Landis & Gyr Ag | METHOD FOR MACHINING SOFT SOLDERING OF HEAVY METALS USING A FLUID. |
| US6887319B2 (en) * | 2002-04-16 | 2005-05-03 | Senju Metal Industry Co., Ltd. | Residue-free solder paste |
| CN100591461C (en) * | 2007-05-09 | 2010-02-24 | 昆山成利焊锡制造有限公司 | Halogen-free soldering flux for soft welding wire without lead, and preparation method |
| CN101269448B (en) * | 2008-04-22 | 2010-07-14 | 太仓市首创锡业有限公司 | Cleaning-free lead-free solder soldering fluid |
| CN102069324B (en) * | 2010-12-29 | 2012-08-15 | 东莞永安科技有限公司 | No-clean low-splashing soldering flux for lead-free solder wire and preparation method thereof |
| CN102554518A (en) * | 2012-01-19 | 2012-07-11 | 广东中实金属有限公司 | Halogen-free high-impedance soldering flux and preparation method |
| CN103264241B (en) * | 2013-06-17 | 2015-04-01 | 北京朝铂航科技有限公司 | Cored solder wire solid soldering flux capable of reducing flyoff |
| CN103394824B (en) * | 2013-08-02 | 2017-04-05 | 北京鹏瑞中联科技有限公司 | A kind of tin silk low spatter Halogen welding agent and preparation method thereof |
| JP5916674B2 (en) * | 2013-08-30 | 2016-05-11 | 株式会社タムラ製作所 | Solder composition for jet dispenser |
| CN103464932B (en) * | 2013-08-30 | 2015-07-01 | 深圳市唯特偶新材料股份有限公司 | Soldering flux for solder wires for robotic automatic welding and preparation method thereof |
| CN104070308A (en) * | 2014-06-23 | 2014-10-01 | 华南理工大学 | Abietyl-based soldering flux for halogen-free no-clean bright solder wire and preparation method thereof |
| CN104191108B (en) * | 2014-08-28 | 2016-03-02 | 华南理工大学 | A kind of Halogen high activity low spatter solder stick scaling powder and preparation method thereof |
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Effective date of registration: 20161111 Address after: 510651 Changxin Road, Guangzhou, Guangdong, No. 363, No. Applicant after: Guangdong Institute of welding technology (Guangdong Institute of China and Ukraine) Address before: 510651 Changxin Road, Guangzhou, Guangdong, No. 363, No. Applicant before: Guangzhou Research Institute of Non-ferrous Metals |
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