CN106624463A - Activating agent used for water-based soldering flux and preparing method of activating agent - Google Patents
Activating agent used for water-based soldering flux and preparing method of activating agent Download PDFInfo
- Publication number
- CN106624463A CN106624463A CN201611080448.4A CN201611080448A CN106624463A CN 106624463 A CN106624463 A CN 106624463A CN 201611080448 A CN201611080448 A CN 201611080448A CN 106624463 A CN106624463 A CN 106624463A
- Authority
- CN
- China
- Prior art keywords
- water
- acid
- activating agent
- scaling powder
- based scaling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3618—Carboxylic acids or salts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Abstract
The invention relates to the technical field of soldering flux used for the electronic industry, is an improvement on the existing technology and particularly relates to an activating agent used for water-based soldering flux. The activating agent comprises, by weight percent, 70.0%-95.0% of organic acid and 5.0%-30.0% of an oil-soluble film forming agent. Compared with the prior art, the activating agent has the beneficial effects that the activating agent is the activating agent obtained through pretreatment, the activating agent is added into the water-based soldering flux, corrosion of the water-based soldering flux on a printed circuit board and welding equipment can be obviously reduced, and the corrosion problem of the water-based soldering flux is solved.
Description
Technical field
The present invention relates to used in electronic industry scaling powder technical field, is improvements over the prior art, and in particular to Yi Zhongshui
Based scaling powder activator.
Background technology
Scaling powder is one of very important material in electronics industry, and current scaling powder is mainly with alcohols solvent
Composition that is main, being prepared from by organic cosolvent, addition activator, surfactant, rosin resin and other auxiliary agents.It is many
Well known, alcohols solvent and organic cosolvent are all combustible materials, the easy initiation fire during transport, storage and use,
Bring potential safety hazard；Additionally, alcohols solvent and organic cosolvent are used as VOC, gas can be produced and dissipated low
In atmosphere, photochemical fog is formed, direct damaging effect is produced to human body and air pollution is caused.For this purpose, one kind with
Deionized water is arisen at the historic moment for the water-based scaling powder of main component, and it is by adding in deionized water activator, surface-active
Agent and other auxiliary agents etc. are constituted, and it not only can effectively realize that electronic product is welded, and will not be to environment and operating personnel
Directly harm is caused, is the main product of following scaling powder.But, it is not steady enough also to there is electric property in current water-based scaling powder
The problems such as fixed, organic acid for activating agent produces strong corrosion to printed circuit board and welding equipment, hinders the big of water-based scaling powder
Sizable application.
The content of the invention
The purpose of the present invention is to avoid above-mentioned weak point of the prior art and a kind of water-based scaling powder for providing is lived
Agent.Water-based scaling powder activator of the present invention is pretreated activator, in being added to water-based scaling powder, can be significantly
Water-based scaling powder is reduced to printed circuit board and the corrosivity of welding equipment, the corrosion problems of water-based scaling powder are solved.This
Invention is practical, and market application foreground is wide.
The purpose of the present invention can be realized by following measure：
A kind of water-based scaling powder activator of the present invention, its ingredient percentage by weight（%）For：
Organic acid 70.0 ~ 95.0%,
Oil-soluble film forming agent 5.0 ~ 30.0%,
Each Ingredients Weight sum is 100%.
Described organic acid be 2 hydroxy propanoic acid, levo form 3- hydracrylic acids, glutaric acid, hydroxyacetic acid, citric acid, D- β-
Hydroxy-iso-butyric acid, 3- methyl -3, one kind in 5- dihydroxy-acids, positive valeric acid, DL- pantonines-hydroxypentanoic acid, fluoboric acid or
It is several.While its Main Function is that the oxide on surface by weldering mother metal and solder is removed in welding process, work is significantly reduced
Corrosiveness of the agent to printed circuit board, solves the problems, such as that organic acid for activating agent produces strong corrosion to printed circuit board.
Described oil-soluble film forming agent is by acrylic resin film forming agent, polyvinyl alcohol, polyvinylpyrrolidone, silica acrylic acid
One or more in ester.Its Main Function is for wrapping up organic acid.
A kind of preparation method of water-based scaling powder activator of the present invention, comprises the steps：（1）Weigh 70.0 ~ 95.0%
Organic acid is added in reactor, and adds the distilled water of 2 times of activating agent weight；（2）Be heated to 50 ± 5 DEG C stirring (1 ±
0.5) h, speed of agitator is 200 ~ 1000r/min；5.0 ~ 30.0% oil-soluble film forming agents are subsequently adding, are rapidly heated to (90 ± 5)
DEG C stirring (5 ± 1) h, speed of agitator be 500 ~ 1000r/min；（3）Water-cooled quick stirring simultaneously；（4）Drying, grinding are obtained final product
A kind of described water-based scaling powder activator.
The present invention has the advantage that compared to existing technology：Water-based scaling powder activator of the present invention is pretreated work
Agent, in being added to water-based scaling powder, can significantly reduce corrosion of the water-based scaling powder to printed circuit board and welding equipment
Property, solve the corrosion problems of water-based scaling powder.Of the invention practical, market application foreground is wide.
Specific embodiment
Embodiment 1：3- methyl -3,5- dihydroxy-acids 70.0%,
Acrylic resin film forming agent 30.0%.
Preparation method：（1）70.0% 3- methyl -3 are weighed, 5- dihydroxy-acids are added in reactor, and add 2 times
The distilled water of activating agent weight；（2）50 ± 5 DEG C of stirring (1 ± 0.5) h are heated to, speed of agitator is 800r/min；Then
30.0% acrylic resin film forming agent is added, is rapidly heated to (90 ± 5) DEG C stirring (5 ± 1) h, speed of agitator is 800r/min；
（3）Water-cooled quick stirring simultaneously；（4）Drying, grinding obtain final product a kind of described water-based scaling powder activator.
Embodiment 2：3- methyl -3,5- dihydroxy-acids 95.0%,
Polyvinylpyrrolidone 5.0%.
Preparation method：（1）95.0% 3- methyl -3 are weighed, 5- dihydroxy-acids are added in reactor, and add 2 times
The distilled water of activating agent weight；（2）50 ± 5 DEG C of stirring (1 ± 0.5) h are heated to, speed of agitator is 800r/min；Then
5.0% polyvinylpyrrolidone is added, is rapidly heated to (90 ± 5) DEG C stirring (5 ± 1) h, speed of agitator is 800r/min；（3）
Water-cooled quick stirring simultaneously；（4）Drying, grinding obtain final product a kind of described water-based scaling powder activator.
Embodiment 3：DL- pantonines-hydroxypentanoic acid 80.0%,
Polyvinyl alcohol 5.0%,
Polyvinylpyrrolidone 10.0%.
Preparation method：（1）DL- pantonines-the hydroxypentanoic acid for weighing 80.0% is added in reactor, and adds 2 times of work
The distilled water of property agent weight；（2）50 ± 5 DEG C of stirring (1 ± 0.5) h are heated to, speed of agitator is 800r/min；Then plus
Enter 5.0% polyvinyl alcohol and 10.0% polyvinylpyrrolidone, be rapidly heated to (90 ± 5) DEG C and stir (5 ± 1) h, speed of agitator is
800r/min；（3）Water-cooled quick stirring simultaneously；（4）Drying, grinding obtain final product a kind of described water-based scaling powder activator.
Claims (4)
1. a kind of water-based scaling powder activator, its ingredient percentage by weight（%）For：
Organic acid 70.0 ~ 95.0%
Oil-soluble film forming agent 5.0 ~ 30.0%,
Each Ingredients Weight sum is 100%.
2. water-based scaling powder according to claim 1, it is characterised in that：Described organic acid is 2 hydroxy propanoic acid, left-handed
Body 3- hydracrylic acids, glutaric acid, hydroxyacetic acid, citric acid, D- beta-hydroxy isobutyric acids, 3- methyl -3,5- dihydroxy-acids, positive penta
One or more in acid, DL- pantonines-hydroxypentanoic acid, fluoboric acid.
3. water-based scaling powder according to claim 1, it is characterised in that：Described oil-soluble film forming agent is by acrylic resin
One or more in film forming agent, polyvinyl alcohol, polyvinylpyrrolidone, Si acrylate.
4. a kind of preparation method of water-based scaling powder activator according to claim 1, comprises the steps：（1）Claim
Take 85.0 ~ 91.9% organic acids to be added in reactor, and add the distilled water of 2 times of activating agent weight；Then 50 are heated to
± 5 DEG C of stirring (1 ± 0.5) h, speed of agitator is 200 ~ 1000r/min；（2）8.1 ~ 15.0% oil-soluble film forming agents are added, quickly
(90 ± 5) DEG C stirring (5 ± 1) h is warmed up to, speed of agitator is 500 ~ 1000r/min；（3）Water-cooled quick stirring simultaneously；（4）Jing
Drying, grinding obtain final product a kind of described water-based scaling powder activator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611080448.4A CN106624463A (en) | 2016-11-30 | 2016-11-30 | Activating agent used for water-based soldering flux and preparing method of activating agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611080448.4A CN106624463A (en) | 2016-11-30 | 2016-11-30 | Activating agent used for water-based soldering flux and preparing method of activating agent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106624463A true CN106624463A (en) | 2017-05-10 |
Family
ID=58814489
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611080448.4A Pending CN106624463A (en) | 2016-11-30 | 2016-11-30 | Activating agent used for water-based soldering flux and preparing method of activating agent |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106624463A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006051532A (en) * | 2004-08-16 | 2006-02-23 | Harima Chem Inc | Flux for soldering, soldering method and printed board |
| CN102233495A (en) * | 2010-05-07 | 2011-11-09 | 宁波卓诚焊锡科技有限公司 | Water-soluble flux for lead-free solder |
| CN102303200A (en) * | 2011-08-16 | 2012-01-04 | 浙江一远电子科技有限公司 | Alcohol and water mixed-base cleaning-free soldering flux for wire connection |
| CN102357748A (en) * | 2011-10-18 | 2012-02-22 | 苏州之侨新材料科技有限公司 | Halogen-and-rosin-free antibacterial no-clean soldering flux for lead-free solder |
| CN102699576A (en) * | 2012-04-18 | 2012-10-03 | 广东工业大学 | Low-VOC (volatile organic compound) non-cleaning flux comprising complex surfactant and method for preparing same |
| CN102814603A (en) * | 2012-08-23 | 2012-12-12 | 广东普赛特电子科技股份有限公司 | Nano-raw-material water-based flux and preparation process thereof |
| CN105234591A (en) * | 2015-10-10 | 2016-01-13 | 广州有色金属研究院 | Halogen-free soldering tin wire activator and preparation method thereof |
-
2016
- 2016-11-30 CN CN201611080448.4A patent/CN106624463A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006051532A (en) * | 2004-08-16 | 2006-02-23 | Harima Chem Inc | Flux for soldering, soldering method and printed board |
| CN102233495A (en) * | 2010-05-07 | 2011-11-09 | 宁波卓诚焊锡科技有限公司 | Water-soluble flux for lead-free solder |
| CN102303200A (en) * | 2011-08-16 | 2012-01-04 | 浙江一远电子科技有限公司 | Alcohol and water mixed-base cleaning-free soldering flux for wire connection |
| CN102357748A (en) * | 2011-10-18 | 2012-02-22 | 苏州之侨新材料科技有限公司 | Halogen-and-rosin-free antibacterial no-clean soldering flux for lead-free solder |
| CN102699576A (en) * | 2012-04-18 | 2012-10-03 | 广东工业大学 | Low-VOC (volatile organic compound) non-cleaning flux comprising complex surfactant and method for preparing same |
| CN102814603A (en) * | 2012-08-23 | 2012-12-12 | 广东普赛特电子科技股份有限公司 | Nano-raw-material water-based flux and preparation process thereof |
| CN105234591A (en) * | 2015-10-10 | 2016-01-13 | 广州有色金属研究院 | Halogen-free soldering tin wire activator and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5119247B2 (en) | No-clean low-residue solder paste for semiconductor device applications | |
| US10610981B2 (en) | Solder paste for reduction gas, and method for producing soldered product | |
| CN107150190B (en) | A kind of scaling powder and preparation method thereof | |
| CN100528462C (en) | Low-rosin cleaning-free scaling powder for SnAgCu series lead-free soldering paste and preparation method thereof | |
| WO2019172410A1 (en) | Flux, solder paste, soldering process, method for producing soldering product, and method for producing bga package | |
| CN102398124A (en) | Water-based cleaning-free flux for lead-free welding flux and preparation method thereof | |
| CN106624464A (en) | Water-based flux | |
| CN101352788B (en) | Scaling powder for leadless soldering tin | |
| WO2016104458A1 (en) | Flux for fast-heating method, and solder paste for fast-heating method | |
| JP2016078095A (en) | Formation method of solder bump | |
| JP6136851B2 (en) | Solder flux and solder paste | |
| CN102909493A (en) | Soldering flux | |
| CN108788520A (en) | A kind of soldering flux of low solid and free cleaning and preparation method thereof | |
| CN106624463A (en) | Activating agent used for water-based soldering flux and preparing method of activating agent | |
| CN111318832A (en) | Low-temperature lead-free soldering paste and preparation method thereof | |
| CN106624457A (en) | Low-corrosiveness water-based soldering flux composite | |
| US3424625A (en) | Process for welding lead onto lead utilizing a special flux composition | |
| EP3834982A1 (en) | Flux and solder paste | |
| Tao et al. | Reflow of tiny 01005 capacitor/SAC305 solder joints in protective atmosphere | |
| KR20200035208A (en) | Flux composition and solder paste | |
| CN110722237A (en) | Soldering flux with high insulation resistance characteristic for power supply type PCB assembly tool | |
| CN106001999B (en) | A kind of brazing flux and preparation method for being used to be brazed magnesium-rare earth | |
| TW201607992A (en) | Solder flux composition | |
| CN108406166A (en) | A kind of halogen-free spray printing tin cream scaling powder and preparation method thereof | |
| CN108453435A (en) | A kind of soldering flux of low solid and free cleaning and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170510 |
|
| WD01 | Invention patent application deemed withdrawn after publication |