CN114833493A - Weakly alkaline smokeless tin spraying soldering flux and preparation method thereof - Google Patents
Weakly alkaline smokeless tin spraying soldering flux and preparation method thereof Download PDFInfo
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- CN114833493A CN114833493A CN202210679459.3A CN202210679459A CN114833493A CN 114833493 A CN114833493 A CN 114833493A CN 202210679459 A CN202210679459 A CN 202210679459A CN 114833493 A CN114833493 A CN 114833493A
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- Prior art keywords
- preparation
- tin spraying
- smokeless
- soldering flux
- percent
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- 230000004907 flux Effects 0.000 title claims abstract description 48
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 44
- 238000005507 spraying Methods 0.000 title claims abstract description 39
- 238000005476 soldering Methods 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims abstract description 24
- 238000007716 flux method Methods 0.000 title description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000002994 raw material Substances 0.000 claims abstract description 20
- 238000003756 stirring Methods 0.000 claims abstract description 17
- 239000013543 active substance Substances 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims abstract description 11
- 239000004094 surface-active agent Substances 0.000 claims abstract description 11
- 238000001914 filtration Methods 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- 230000007797 corrosion Effects 0.000 claims abstract description 8
- 238000005260 corrosion Methods 0.000 claims abstract description 8
- 239000003112 inhibitor Substances 0.000 claims abstract description 8
- 239000003381 stabilizer Substances 0.000 claims abstract description 8
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 7
- 239000002202 Polyethylene glycol Substances 0.000 claims description 28
- 229920001223 polyethylene glycol Polymers 0.000 claims description 28
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 18
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 18
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 18
- 239000012964 benzotriazole Substances 0.000 claims description 18
- 229960001231 choline Drugs 0.000 claims description 18
- OEYIOHPDSNJKLS-UHFFFAOYSA-N choline Chemical compound C[N+](C)(C)CCO OEYIOHPDSNJKLS-UHFFFAOYSA-N 0.000 claims description 17
- -1 perfluorooctyl sulfonic acid tetraethylene amine Chemical class 0.000 claims description 17
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 12
- 239000001089 [(2R)-oxolan-2-yl]methanol Substances 0.000 claims description 9
- BSYVTEYKTMYBMK-UHFFFAOYSA-N tetrahydrofurfuryl alcohol Chemical compound OCC1CCCO1 BSYVTEYKTMYBMK-UHFFFAOYSA-N 0.000 claims description 9
- QYMFNZIUDRQRSA-UHFFFAOYSA-N dimethyl butanedioate;dimethyl hexanedioate;dimethyl pentanedioate Chemical compound COC(=O)CCC(=O)OC.COC(=O)CCCC(=O)OC.COC(=O)CCCCC(=O)OC QYMFNZIUDRQRSA-UHFFFAOYSA-N 0.000 claims description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 4
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 claims description 2
- 239000011152 fibreglass Substances 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 125000001153 fluoro group Chemical group F* 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 239000002253 acid Substances 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 abstract description 6
- 238000000576 coating method Methods 0.000 abstract description 6
- 239000000779 smoke Substances 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 4
- 239000002131 composite material Substances 0.000 abstract description 2
- 239000002085 irritant Substances 0.000 abstract description 2
- 231100000021 irritant Toxicity 0.000 abstract description 2
- 239000008367 deionised water Substances 0.000 description 17
- 229910021641 deionized water Inorganic materials 0.000 description 17
- 238000005303 weighing Methods 0.000 description 8
- 238000003466 welding Methods 0.000 description 8
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical compound OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004100 electronic packaging Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- CIBMHJPPKCXONB-UHFFFAOYSA-N propane-2,2-diol Chemical compound CC(C)(O)O CIBMHJPPKCXONB-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Abstract
The invention discloses a weakly alkaline smokeless tin spraying soldering flux and a preparation method thereof, wherein the soldering flux comprises the following components in percentage by weight: 5.0 to 25.0 percent of auxiliary agent, 10.0 to 50.0 percent of film forming agent, 1.0 to 10.0 percent of active agent, 0.1 to 2.0 percent of stabilizing agent, 0.1 to 2.0 percent of surfactant, 0.1 to 2.0 percent of corrosion inhibitor and the balance of water. The preparation method of the tin spraying soldering flux comprises the following steps: sequentially adding the auxiliary agent, the film forming agent, the active agent, the stabilizer, the surfactant, the corrosion inhibitor and water into a reaction kettle, stirring to fully mix and dissolve the raw materials, standing and filtering to obtain the nano-silver/nano-silver composite material. Compared with the traditional soldering flux, the soldering flux does not generate strong acid smoke or irritant gas in the using process, is basically harmless to human bodies, can effectively improve the tin coating rate of small BGA bonding pads (the diameter is 0.5-0.1 mm), and effectively solves the problem of dense IC bit connection.
Description
Technical Field
The invention relates to the technical field of electronic packaging welding materials, in particular to a weakly alkaline smokeless tin spraying soldering flux and a preparation method thereof.
Background
The flux is an auxiliary material for ensuring the smooth operation of the welding process. The method is widely used in the welding process of electronic product manufacture, and greatly influences the quality of the electronic product. The soldering flux has the main function of removing oxides on the surfaces of the solder and the soldered parent metal so as to ensure that the metal surface reaches the necessary cleanness. It can prevent surface from being oxidized again during welding, reduce surface tension of solder and raise welding performance.
However, the commonly used inorganic flux usually contains strong acid, which not only pollutes the environment, but also causes strong acid smoke to be inhaled by the operator during the actual operation, so that it is very important to develop a flux which does not contain strong acid and has good fluxing performance.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, one of the purposes of the invention is to provide the tin spraying soldering flux which does not generate strong acid smoke and irritant gas in the using process, basically has no harm to human bodies, can effectively improve the tin coating rate of fine BGA bonding pads (the diameter is 0.5-0.1 mm) and effectively solves the problem of dense IC bit connection.
The technical purpose of the invention is realized by the following technical scheme:
a weakly alkaline tin spraying soldering flux comprises the following components in percentage by weight: 5.0 to 25.0 percent of auxiliary agent, 10.0 to 30.0 percent of film forming agent, 1.0 to 10.0 percent of active agent, 0.1 to 2.0 percent of stabilizing agent, 0.1 to 2.0 percent of surfactant, 0.1 to 2.0 percent of corrosion inhibitor and the balance of water.
Preferably, the film forming agent is one or at least two of polyethylene glycol and polyethylene glycol monomethyl ether 250.
Preferably, the auxiliary agent is one or at least two of ethylene glycol, isopropanol, butanol, glycerol, tetrahydrofurfuryl alcohol and dibasic ester (DBE).
Preferably, the active agent is 2-hydroxy-N, N-trimethylethanaminium (choline).
Preferably, the stabilizer is biphenol.
Preferably, the surfactant is a fluorosurfactant.
Preferably, the surfactant is perfluorooctyl sulfonic acid tetraethylene amine.
Preferably, the corrosion inhibitor is at least one of benzotriazole and tolyltriazole.
Preferably, the water is deionized water.
The invention also aims to provide a preparation method of the tin spraying soldering flux, which comprises the following steps:
the preparation method of the tin spraying soldering flux comprises the following steps: sequentially adding the auxiliary agent, the film forming agent, the active agent, the stabilizer, the surfactant, the corrosion inhibitor and water into a reaction kettle, stirring to fully mix and dissolve the raw materials, standing and filtering to obtain the nano-silver/nano-silver composite material.
In conclusion, the beneficial effects of the invention are as follows: the alkalescent tin spraying soldering flux disclosed by the invention does not contain strong acid, avoids pollution to the environment, is good in environmental protection performance, does not generate strong acid smoke in the actual operation process, and is high in safety. The alkalescent tin spraying soldering flux has the advantages of good soldering assisting performance, stable chemical performance and the like when being applied to the surface of a copper substrate, has wide market prospect in the aspect of soldering of the surface of the copper substrate, can improve the tin coating rate of small BGA and solves the problem of dense IC position connection.
Detailed Description
The present invention will be further described with reference to the following specific examples.
Example 1
A preparation method of the tin spraying soldering flux comprises the following steps: weighing the following raw materials in percentage by weight: 5% of choline, 1% of biphenol, 0.5% of perfluorooctyl sulfonic acid tetraethylene amine, 10% of tetrahydrofurfuryl alcohol, 0.3% of benzotriazole, 25015% of polyethylene glycol monomethyl ether, 20% of polyethylene glycol and 48.2% of deionized water; sequentially adding deionized water, choline and perfluorooctyl sulfonic acid tetraethylene amine into a reaction kettle, stirring, sequentially adding tetrahydrofurfuryl alcohol, polyethylene glycol monomethyl ether 250, benzotriazole and diphenol after completely dissolving, stirring for 1.5 hours to fully mix and dissolve the raw materials, standing for 30 minutes, and filtering to obtain the tin spraying flux.
Example 2
A preparation method of the tin spraying soldering flux comprises the following steps: weighing the following raw materials in percentage by weight: 4% of choline, 1% of biphenol, 0.5% of perfluorooctyl sulfonic acid tetraethylene amine, 15% of dibasic ester (DBE), 0.3% of benzotriazole, 25010% of polyethylene glycol monomethyl ether, 30% of polyethylene glycol and 39.2% of deionized water; deionized water, choline and perfluorooctyl sulfonic acid tetraethylene amine are sequentially added into a reaction kettle to be stirred, after the materials are completely dissolved, dibasic ester (DBE), polyethylene glycol monomethyl ether 250, benzotriazole and diphenol are sequentially added, stirred for 1.5 hours to fully mix and dissolve the raw materials, and then the raw materials are kept stand for 30 minutes and filtered to obtain the tin spraying flux.
Example 3
A preparation method of the tin spraying soldering flux comprises the following steps: weighing the following raw materials in percentage by weight: 6% of choline, 1.5% of biphenol, 1.5% of perfluorooctyl sulfonic acid tetraethylene amine, 10% of glycerol, 5% of ethylene glycol, 0.5% of benzotriazole, 25020% of polyethylene glycol monomethyl ether, 20% of polyethylene glycol and 41.5% of deionized water; sequentially adding deionized water, choline and perfluorooctyl sulfonic acid tetraethylene amine into a reaction kettle, stirring, sequentially adding glycerol, polyethylene glycol monomethyl ether 250, benzotriazole and diphenol after completely dissolving, stirring for 1.5 hours to fully mix and dissolve the raw materials, standing for 30 minutes, and filtering to obtain the tin spraying flux.
Example 4
A preparation method of the tin spraying soldering flux comprises the following steps: weighing the following raw materials in percentage by weight: 7% of choline, 1.5% of biphenol, 0.5% of perfluorooctyl sulfonic acid tetraethylene amine, 5% of ethylene glycol, 0.5% of benzotriazole, 25010% of polyethylene glycol monomethyl ether, 30% of polyethylene glycol and 42.2% of deionized water; sequentially adding deionized water, choline and perfluorooctyl sulfonic acid tetraethylene amine into a reaction kettle, stirring, sequentially adding ethylene glycol, polyethylene glycol monomethyl ether 250, benzotriazole and diphenol after completely dissolving, stirring for 1.5 hours to fully mix and dissolve the raw materials, standing for 30 minutes, and filtering to obtain the tin spraying flux.
Example 5
A preparation method of the tin spraying soldering flux comprises the following steps: weighing the following raw materials in percentage by weight: 6% of choline trichloride, 0.5% of perfluorooctyl sulfonic acid tetraethylene amine, 10% of isopropanol, 0.5% of benzotriazole, 25010% of polyethylene glycol monomethyl ether, 30% of polyethylene glycol and 41% of deionized water; sequentially adding deionized water and choline perfluorooctyl sulfonic acid tetraethylene amine into a reaction kettle, stirring, sequentially adding isopropanol alcohol, polyethylene glycol monomethyl ether 250, benzotriazole and biphenol after completely dissolving, stirring for 1.5 hours to fully mix and dissolve the raw materials, standing for 30 minutes, and filtering to obtain the tin spraying flux.
Comparative example 1
A preparation method of the tin spraying soldering flux comprises the following steps: weighing the following raw materials in percentage by weight: 1% of biphenol, 0.5% of perfluorooctyl sulfonic acid tetraethylene amine, 10% of tetrahydrofurfuryl alcohol, 0.3% of benzotriazole, 25015% of polyethylene glycol monomethyl ether, 20% of polyethylene glycol and 53.2% of deionized water; sequentially adding deionized water, choline and perfluorooctyl sulfonic acid tetraethylene amine into a reaction kettle, stirring, sequentially adding tetrahydrofurfuryl alcohol, polyethylene glycol monomethyl ether 250, benzotriazole and diphenol after completely dissolving, stirring for 1.5 hours to fully mix and dissolve the raw materials, standing for 30 minutes, and filtering to obtain the tin spraying flux.
Comparative example 2
A preparation method of the tin spraying soldering flux comprises the following steps: weighing the following raw materials in percentage by weight: 5% of choline, 1% of biphenol, 10% of tetrahydrofurfuryl alcohol, 0.3% of benzotriazole, 25015% of polyethylene glycol monomethyl ether, 20% of polyethylene glycol and 48.7% of deionized water; sequentially adding deionized water, choline and perfluorooctyl sulfonic acid tetraethylene amine into a reaction kettle, stirring, sequentially adding tetrahydrofurfuryl alcohol, polyethylene glycol monomethyl ether 250, benzotriazole and diphenol after completely dissolving, stirring for 1.5 hours to fully mix and dissolve the raw materials, standing for 30 minutes, and filtering to obtain the tin spraying flux.
Comparative example 3
A preparation method of the tin spraying soldering flux comprises the following steps: weighing the following raw materials in percentage by weight: 5% of choline, 1% of biphenol, 0.5% of perfluorooctyl sulfonic acid tetraethylene amine, 0.3% of benzotriazole, 25015% of polyethylene glycol monomethyl ether, 20% of polyethylene glycol and 58.2% of deionized water; sequentially adding deionized water, choline and perfluorooctyl sulfonic acid tetraethylene amine into a reaction kettle, stirring, sequentially adding tetrahydrofurfuryl alcohol, polyethylene glycol monomethyl ether 250, benzotriazole and diphenol after completely dissolving, stirring for 1.5 hours to fully mix and dissolve the raw materials, standing for 30 minutes, and filtering to obtain the tin spraying flux.
Table 1: test result of performance of tin spraying flux
As can be seen from Table 1, after the soldering flux is used, the tin coating rate of the BGA soldering pad can reach 100%, the board surface is clean and tidy without residues, the connection condition between IC circuits can not occur, meanwhile, smoke and smell are extremely small, and even the degree of no smoke and no smell can be reached. Meanwhile, the comparative examples 1 and 1-3 show that when the proportion of the active agent in the tin spraying soldering flux is not in the proportion range of the application or the active agent is not contained, the tin coating rate is reduced, and the connection between the IC circuits occurs, and the comparative examples 1 and 1 show that when the active agent choline is not contained in the tin spraying soldering flux, the tin coating rate is greatly influenced.
The invention has the beneficial effects that the strong acid-free high-performance weak alkaline tin-spraying welding flux suitable for copper-based surface welding is provided, the soldering flux which is good in performance and beneficial to environmental protection is prepared by controlling the weight proportion of each component in the matching system, and the soldering flux has the advantages of good soldering assisting performance, stable chemical performance and the like when being applied to the surface of a copper substrate, and has wide market prospect in the aspect of copper-based surface welding.
The above-described embodiments do not limit the scope of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the above-described embodiments should be included in the protection scope of the technical solution.
Claims (8)
1. A weakly alkaline smokeless tin spraying scaling powder and a preparation method thereof are characterized by comprising the following components, by weight, 5.0% -25.0% of an auxiliary agent, 10.0% -50.0% of a film forming agent, 1.0% -10.0% of an active agent, 0.1% -2.0% of a stabilizer, 0.1% -2.0% of a surfactant, 0.1% -2.0% of a corrosion inhibitor and the balance of water.
2. The weak alkaline smokeless tin spraying flux and the preparation method thereof according to claim 1, wherein the auxiliary agent is one or at least two of ethylene glycol, isopropanol, butanol, glycerol, tetrahydrofurfuryl alcohol and dibasic ester (DBE).
3. The weakly basic smokeless tin spraying flux and the preparation method thereof according to claim 1, wherein the film forming agent is one or two of polyethylene glycol and polyethylene glycol monomethyl ether 250.
4. The weakly basic smokeless tin spraying flux and the method for preparing the same according to claim 1, wherein the active agent is 2-hydroxy-N, N-trimethylethanaminium (choline).
5. The weakly basic smokeless tin spraying flux and the preparation method thereof according to claim 1, wherein the surfactant is a fluorine surfactant; preferably, the surfactant is perfluorooctyl sulfonic acid tetraethylene amine.
6. The weakly basic smokeless tin spraying soldering flux and the preparation method thereof according to claim 1, wherein the corrosion inhibitor is one or two of benzotriazole and methylbenzotriazole.
7. The weakly basic smokeless tin spraying flux and the preparation method thereof according to claim 1, wherein the stabilizer is biphenol.
8. The weakly basic smokeless tin spraying flux and the preparation method thereof according to claim 1, wherein the preparation method comprises the following steps: the preparation method comprises the steps of sequentially adding ethylene glycol, a film forming agent, an active agent, a stabilizer, a surfactant, a corrosion inhibitor and water into a reaction kettle, stirring to fully mix and dissolve the raw materials, standing and filtering to obtain the water-soluble glass fiber reinforced plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210679459.3A CN114833493A (en) | 2022-06-21 | 2022-06-21 | Weakly alkaline smokeless tin spraying soldering flux and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210679459.3A CN114833493A (en) | 2022-06-21 | 2022-06-21 | Weakly alkaline smokeless tin spraying soldering flux and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114833493A true CN114833493A (en) | 2022-08-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210679459.3A Pending CN114833493A (en) | 2022-06-21 | 2022-06-21 | Weakly alkaline smokeless tin spraying soldering flux and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114833493A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116252014A (en) * | 2023-02-11 | 2023-06-13 | 广东哈福技术股份有限公司 | Tin spraying soldering flux and preparation method thereof |
-
2022
- 2022-06-21 CN CN202210679459.3A patent/CN114833493A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116252014A (en) * | 2023-02-11 | 2023-06-13 | 广东哈福技术股份有限公司 | Tin spraying soldering flux and preparation method thereof |
| CN116252014B (en) * | 2023-02-11 | 2024-04-19 | 广东哈福技术股份有限公司 | Tin spraying soldering flux and preparation method thereof |
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