JPH04135092A - Liquid flux for soldering printed board - Google Patents
Liquid flux for soldering printed boardInfo
- Publication number
- JPH04135092A JPH04135092A JP25246390A JP25246390A JPH04135092A JP H04135092 A JPH04135092 A JP H04135092A JP 25246390 A JP25246390 A JP 25246390A JP 25246390 A JP25246390 A JP 25246390A JP H04135092 A JPH04135092 A JP H04135092A
- Authority
- JP
- Japan
- Prior art keywords
- solvent
- flux
- liquid flux
- soldering
- alcohol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000004907 flux Effects 0.000 title claims abstract description 28
- 239000007788 liquid Substances 0.000 title claims abstract description 15
- 238000005476 soldering Methods 0.000 title claims abstract description 15
- 239000002904 solvent Substances 0.000 claims abstract description 17
- 150000001298 alcohols Chemical class 0.000 claims abstract description 13
- 239000012190 activator Substances 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 abstract description 5
- XHFGWHUWQXTGAT-UHFFFAOYSA-N dimethylamine hydrochloride Natural products CNC(C)C XHFGWHUWQXTGAT-UHFFFAOYSA-N 0.000 abstract description 5
- IQDGSYLLQPDQDV-UHFFFAOYSA-N dimethylazanium;chloride Chemical compound Cl.CNC IQDGSYLLQPDQDV-UHFFFAOYSA-N 0.000 abstract description 5
- 235000002906 tartaric acid Nutrition 0.000 abstract description 5
- 239000011975 tartaric acid Substances 0.000 abstract description 5
- 229940113115 polyethylene glycol 200 Drugs 0.000 abstract description 4
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 239000000126 substance Substances 0.000 abstract description 2
- AQYSYJUIMQTRMV-UHFFFAOYSA-N hypofluorous acid Chemical compound FO AQYSYJUIMQTRMV-UHFFFAOYSA-N 0.000 abstract 2
- PSQZJKGXDGNDFP-UHFFFAOYSA-N 2,2,3,3,3-pentafluoropropan-1-ol Chemical compound OCC(F)(F)C(F)(F)F PSQZJKGXDGNDFP-UHFFFAOYSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 239000003039 volatile agent Substances 0.000 abstract 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 8
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 8
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 8
- -1 amine hydrochloride Chemical class 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000010953 base metal Substances 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 239000004480 active ingredient Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 229920000151 polyglycol Polymers 0.000 description 2
- 239000010695 polyglycol Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- SWLVFNYSXGMGBS-UHFFFAOYSA-N ammonium bromide Chemical class [NH4+].[Br-] SWLVFNYSXGMGBS-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- YPHMISFOHDHNIV-FSZOTQKASA-N cycloheximide Chemical compound C1[C@@H](C)C[C@H](C)C(=O)[C@@H]1[C@H](O)CC1CC(=O)NC(=O)C1 YPHMISFOHDHNIV-FSZOTQKASA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、プリント基板に電子部品をはんだ付けする
場合に用いるはんだ付け用液体フラックスに関するもの
である。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a liquid flux for soldering used when soldering electronic components to a printed circuit board.
従来、プリント基板はんだ付け用液体フラックスとして
は、ロジン系フラックス及び水溶性フラックスが用いら
れている。Conventionally, rosin-based flux and water-soluble flux have been used as liquid flux for soldering printed circuit boards.
一般に液体フラックスは、活性剤、樹脂分及び溶剤から
成り、上記ロジン系フラックスは、活性剤として有機ア
ミン、有機アミン塩酸塩、あるいは有機アミン臭素化水
素塩など、樹脂分としてロジンが、そして溶剤として炭
化水素系低級アルコール、例えばイソプロピルアルコー
ルが用いられている。そして全体として固形分が数％〜
４０％程度となる様に構成されている。In general, liquid flux consists of an activator, a resin component, and a solvent.The rosin-based fluxes described above contain an organic amine, organic amine hydrochloride, or organic amine hydrobromide salt as the activator, rosin as the resin component, and rosin as the solvent. Hydrocarbon lower alcohols, such as isopropyl alcohol, are used. And the overall solid content is several percent ~
It is configured so that it is approximately 40%.
次に水溶性フラックスは、活性剤として有１１１Ｍ。Next, the water-soluble flux contains 111M as an activator.
有機アミンなど、樹脂分として上記ロジンのかわりにポ
リグリコール類、又溶剤としてロジン系と同様例えばイ
ソプロピルアルコールが用いられている。Organic amines, etc., polyglycols are used instead of the rosin as the resin component, and isopropyl alcohol, for example, is used as the solvent, similar to the rosin type.
更に場合によってはこれらに非イオン系界面活性側など
が少量添加されることもある。Furthermore, in some cases, a small amount of nonionic surfactant may be added to these.
上述した活性剤は、はんだ付けに際して母材金属表面の
酸化物を化学的反応によって除去し、該母材金属とはん
だとの直接接触作用を向上させるものであり、樹脂分は
、はんだ行中の加熱により母材金属表面の再酸化を防止
するための保護作用を行うと共に、はんだの表面張力を
低下させ、上記母材表面におけるはんだの所謂ぬれ性を
向上さセる作用があり、全体としてフン・ンクス作用を
良好にするものである。The above-mentioned activator removes oxides on the surface of the base metal through a chemical reaction during soldering, and improves the direct contact between the base metal and the solder. Heating has the effect of protecting the base metal surface from re-oxidation, lowering the surface tension of the solder, and improving the so-called wettability of the solder on the base metal surface.・Improves the effect of heat exchange.
又溶剤は、上記活性剤や樹脂分など有効成分を均一に分
散させると共に、プリント基板のはんだ付け部に均一に
フラツクスの有効成分が付着するよう流動性を持たせる
ものであり、これらの有効成分がはんだ付け部に付着す
れば揮発して除去されるのである。The solvent is used to uniformly disperse the active ingredients such as the above-mentioned activators and resins, and to provide fluidity so that the active ingredients of the flux adhere uniformly to the soldered parts of the printed circuit board. If it adheres to the soldering area, it will evaporate and be removed.
〔発明が解決しようとする課Ｂ］
従来の液体フラツクスは、以上のように溶剤として例え
ばイソプロピルアルコールのような引火性液体を用いて
居り、火災の発生する恐れがあるなど安全上の問題があ
った。そして又、防災上安全対策をとるための設備を防
爆構造とする必要があるなどはんだ付け設備が高価とな
るなどコスト上の問題点も免かれなかった。[Problem B to be Solved by the Invention] As described above, conventional liquid fluxes use flammable liquids such as isopropyl alcohol as solvents, which poses safety problems such as the risk of fire. Ta. In addition, there were also cost problems, such as the need for explosion-proof equipment for disaster prevention and the expensive soldering equipment.
この発明は上記のような問題点を解消するためになされ
たもので、フラックス作用が良好で十分な強度を有する
はんだ付けを行ない得ると共に、安全性の高いプリント
基板はんだ付け用液体フラックスを提供するこｔを目的
とする。This invention was made to solve the above-mentioned problems, and provides a liquid flux for soldering printed circuit boards that has good flux action, can perform soldering with sufficient strength, and is highly safe. This is the purpose.
〔課題を解決するための手段］
本発明は、活性剤、樹脂分を溶剤に溶解させてなるプリ
ント基板はんだ付け用液体フラツクスにおいて、溶剤と
して一般式、Ｃ，Ｆ、ｌ１１．ＯＨ（式中ｌ＝１〜５
、 ２１２ ＋ １ ＝ ｎ ＋ ｍ ）のフッ素化ア
ルコールを用いたことを特徴とする液体フラックスであ
る。[Means for Solving the Problems] The present invention provides a liquid flux for soldering printed circuit boards in which an activator and a resin are dissolved in a solvent. OH (in the formula l=1-5
, 212 + 1 = n + m).
この発明の液体フラツクスにおいては、上記の如く溶剤
として、不燃性のフッ素化アルコールを用いて居り、し
たがってフラックス全体としても不燃性が保持される。In the liquid flux of the present invention, nonflammable fluorinated alcohol is used as the solvent as described above, and therefore the flux as a whole maintains nonflammability.
そして該フッ素化アルコールは、揮発性に富み、フラツ
クスがプリント基板に塗布された後、速やかに揮発除去
され、はんだ付け作業性が向上する。そして更にフッ素
化アルコールは、低級炭化水素系アルコールと同様にプ
ラスチック類に対して悪影響を及ぼすことが少ない。The fluorinated alcohol is highly volatile, and after the flux is applied to the printed circuit board, it is quickly volatilized and removed, improving soldering workability. Further, fluorinated alcohols, like lower hydrocarbon alcohols, have little adverse effect on plastics.
以下この発明を具体的な実施例により説明する。 This invention will be explained below using specific examples.
実施例
ジメチルアミン塩酸塩 ０．８ｗｔ％酒 石
酸 ５．２ｈｔ
％ポリエチレングリコール２００ ３０ｗｔ％５フ
ツ化アルコール
ベフォール５ＦＰ（ダイキン） ６４ｉｉｔ％を混合
攪拌して常法のように液状フラックスを製造した。Example Dimethylamine hydrochloride 0.8wt% Tartaric acid 5.2ht
% polyethylene glycol 200, 30 wt%, 5 fluorinated alcohol Befor 5FP (Daikin), 64 iit% were mixed and stirred to produce a liquid flux in a conventional manner.
はんだ付け性の評価として、ＪＩＳ Ｚ ３１９７４．
１１項の広がり試験法を用い、市販のロジン系フラック
スＣＲＦ−５Ｖ（タムラ化研）との比較試験を行なった
結果を第１図に示す。For evaluation of solderability, JIS Z 31974.
Using the spreading test method in Section 11, a comparison test was conducted with a commercially available rosin flux CRF-5V (Tamura Kaken), and the results are shown in FIG.
同図の結果から明らかなように、本発明のフラツクス１
３は、従来のロジン系フラックスよりもむしろ優れたは
んだ付け性を有していた。そしてまた、不燃性のフン素
化アルコールを溶剤として使用しているので、引火する
ことがなく安全性に優れていた。As is clear from the results in the same figure, the flux 1 of the present invention
No. 3 had better solderability than conventional rosin-based fluxes. Furthermore, since nonflammable fluorinated alcohol was used as the solvent, it did not catch fire and was highly safe.
上記実施例において、ジメチルアミン塩酸塩及び酒石酸
は活性剤、ポリエチレングリコール２００は樹脂分、又
５ＦＰは化学構造ｃＦ、ｃＦｚｃＨｚＯＨの不燃性フン
化アルコール溶剤である。In the above examples, dimethylamine hydrochloride and tartaric acid are the activator, polyethylene glycol 200 is the resin component, and 5FP is a nonflammable fluorinated alcohol solvent with the chemical structure cF, cFzcHzOH.
これらの溶剤としては、一般式
％式％［１
（式中ｆ＝１〜５の整数、２Ｎ＋ １ ＝ｎ＋ｍである
）で表わされるフッ素化アルコールが用いられる。As these solvents, fluorinated alcohols represented by the general formula % [1 (in the formula, f=an integer of 1 to 5, and 2N+ 1 =n+m) are used.
そして全体の固形分は、１．０〜５０．０重量％とする
のが望ましい。The total solid content is preferably 1.0 to 50.0% by weight.
又上記実施例では、活性剤として、ジメチルアミン塩酸
塩、及び酒石酸を用いたが、溶削として用いる上記フッ
素化アルコールに溶解するものであれば、従来のフラッ
クスに用いられる例えばアミン類、アミンハロゲン化水
素塩や有機酸などいずれも使用可能である。又、樹脂分
としてポリエチレングリコール以外の他のポリグリコー
ル類又はその誘導体、ポリエーテル類を用いても良い。In the above example, dimethylamine hydrochloride and tartaric acid were used as the activator, but any activator used in conventional fluxes, such as amines and amine halogens, may be used as long as it dissolves in the fluorinated alcohol used for cutting. Both hydrogen salts and organic acids can be used. Moreover, other polyglycols other than polyethylene glycol, derivatives thereof, and polyethers may be used as the resin component.
以上のように、本発明によれば、特に不燃性のフッ素化
アルコールを溶剤として用いたので、フラックス全体と
して不燃性が保たれ安全性が著しく向上し、取扱い及び
保管などに防災上の配慮が殆んど不要となり、設備上の
経済性が高い。As described above, according to the present invention, since non-flammable fluorinated alcohol is used as a solvent, the flux as a whole maintains its non-flammability, significantly improving safety, and giving consideration to disaster prevention in handling and storage. It is almost unnecessary and is highly economical in terms of equipment.
そしてはんだ付け性にも優れ、更に基板上の部品に対す
る損傷発生の恐れが少ないプリント基板はんだ付け用液
体フラックスを提供することができるのであり、その工
業的効果は非常に大きい。Furthermore, it is possible to provide a liquid flux for soldering printed circuit boards that has excellent solderability and is less likely to cause damage to components on the circuit board, and its industrial effects are extremely large.
第１図ははんだ付け性評価特性図である。 代理人 大 岩 増 雄 ハＡＪ醒イ→け−・１内ぬ持１圧図 FIG. 1 is a solderability evaluation characteristic diagram. Agent Masuo Oiwa HA AJ wake up → Ke-・1 in-1 pressure figure
Claims (1)
んだ付け用液体フラックスにおいて、溶剤として一般式
、Ｃ＿ｌＦ＿ｎＨ＿ｍＯＨ（式中ｌ＝１〜５、２ｌ＋１
＝ｎ＋ｍ）のフッ素化アルコールを用いたことを特徴と
する液体フラックス。In liquid flux for printed circuit board soldering made by dissolving an activator and a resin in a solvent, the general formula, C_lF_nH_mOH (in the formula, l = 1 to 5, 2l + 1) is used as a solvent.
A liquid flux characterized by using a fluorinated alcohol of =n+m).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25246390A JPH04135092A (en) | 1990-09-21 | 1990-09-21 | Liquid flux for soldering printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25246390A JPH04135092A (en) | 1990-09-21 | 1990-09-21 | Liquid flux for soldering printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04135092A true JPH04135092A (en) | 1992-05-08 |
Family
ID=17237735
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25246390A Pending JPH04135092A (en) | 1990-09-21 | 1990-09-21 | Liquid flux for soldering printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04135092A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5919317A (en) * | 1994-12-07 | 1999-07-06 | Nippondenso Co., Ltd. | Soldering flux, soldering paste and soldering method using the same |
| US6218030B1 (en) | 1995-03-24 | 2001-04-17 | Nippondenso Co., Ltd. | Soldered product |
| US6488781B1 (en) | 1998-08-27 | 2002-12-03 | Denso Corporation | Soldering paste, soldering method, and surface-mounted type electronic device |
| US6605357B1 (en) | 1999-07-28 | 2003-08-12 | Denso Corporation | Bonding method and bonding structure of thermoplastic resin material |
-
1990
- 1990-09-21 JP JP25246390A patent/JPH04135092A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5919317A (en) * | 1994-12-07 | 1999-07-06 | Nippondenso Co., Ltd. | Soldering flux, soldering paste and soldering method using the same |
| US6142363A (en) * | 1994-12-07 | 2000-11-07 | Nippondenso Co., Ltd. | Soldering method using soldering flux and soldering paste |
| US6218030B1 (en) | 1995-03-24 | 2001-04-17 | Nippondenso Co., Ltd. | Soldered product |
| US6562147B2 (en) | 1995-03-24 | 2003-05-13 | Denso Corporation | Soldered product |
| US6488781B1 (en) | 1998-08-27 | 2002-12-03 | Denso Corporation | Soldering paste, soldering method, and surface-mounted type electronic device |
| US6605357B1 (en) | 1999-07-28 | 2003-08-12 | Denso Corporation | Bonding method and bonding structure of thermoplastic resin material |
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