CN100532003C - Colophony type non-halide cleaning-free soldering flux for lead-free solder wire - Google Patents
Colophony type non-halide cleaning-free soldering flux for lead-free solder wire Download PDFInfo
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- CN100532003C CN100532003C CNB2007101774673A CN200710177467A CN100532003C CN 100532003 C CN100532003 C CN 100532003C CN B2007101774673 A CNB2007101774673 A CN B2007101774673A CN 200710177467 A CN200710177467 A CN 200710177467A CN 100532003 C CN100532003 C CN 100532003C
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Abstract
The invention relates to a halogen-free non-cleaning soldering flux for a lead-free solder wire, and belongs to the soldering flux field. According to the weight ratio, the invention comprises the following elements that: 4 to 18 wt percent of organic acid active agent, 10 to 30 wt percent of organic solvent, 1 to 6 wt percent of pasting agent, 0.2 to 3wt percent of stabilizer, 0.5 to 5wt percent of thixotropic agent, 0.5 to 4wt percent of surface active agent, 0.5 to 5wt percent of rust inhibition, and the rest comprises colophony. The invention includes no halogen, the speculummetal has no breakthrough after being welded, the insulation resistance is high, and the soldering performance is good, the problem of the potential solder joint short circuit caused by the soldering flux of the prior welding wire that the colophony content is too high, the smoke is large and the derelict is easy to be flaked away is solved, the invention is smooth and has no absorption of moisture under normal temperature, no cleaning is required after being welded, and the welding requirement of normal product can be met.
Description
Technical field
The present invention relates to a kind of scaling powder, be particularly useful for the plain no-clean scaling powder of lead-free solder thread-use colophony type non-halide.
Background technology
Welding is the important process in the electronic product assembling process.The quality of welding quality directly influences the service behaviour of electronic circuit and electronic installation.Good welding quality can be circuit good stable, reliability is provided, and the process and poor welding method can cause components and parts to damage, and brings very big difficulty to test, also can stay hidden danger sometimes, the reliability of electronic equipment of influence.Along with the raising of electronic product complexity, the components and parts of use are more and more, and some electronic product (especially some large scale electronic equipment) will use thousands of components and parts of hundreds of, and number of welds is then thousands of.And bad solder joint all can influence the reliability of entire product.Welding quality is the key of electronic product quality.Therefore, the quality of scaling powder directly has influence on the whole technical process and the product quality of surface installation technique (SMT).In electronics industry, the result of use of traditional colophony type scaling powder is reliable and stable, thereby is used widely.But this class scaling powder postwelding leaves residues such as a large amount of halide ions, easily causes corrosion.Too high rosin content increases the non-volatile content of postwelding, and the postwelding residuals content is too much, can produce a large amount of flue dust in the welding process simultaneously, is detrimental to health.So the postwelding residue must thoroughly clean, and will thoroughly eliminate these residues, generally will clean with fluorine Lyons gas phase, has not only improved cost, and has used fluorine Lyons seriously to destroy atmospheric ozone layer in a large number, this certainly will will exert an influence to electron trade.
Aspect brazing material and since lead-free brazing substitute solder containing lead development, accelerated the speed of scaling powder update itself, this just requires high-quality scaling powder to satisfy present current situation.The best substitute of SnPb scolder mainly contains solder alloys such as SnCu, SnAg, SuZn, SnAgCu, SnAgCuRE at present.But this class lead-free solder fusing point height, easily oxidation.The rising of fusing point means that welding temperature must improve, and has so just brought the serious problem of high-temperature oxydation in the welding process, increases the volatilization of activating agent in the scaling powder, causes the inefficacy of solder flux performance, the reduction of activation and protective effect.This has proposed more harsh requirement to lead-free solder with scaling powder, and lead-free solder is extremely urgent with the developmental research of scaling powder.
Summary of the invention
The objective of the invention is at the above-mentioned postwelding residue that causes because of rosin content is too high provides higher alcohols of a kind of boiling point or ethers as solvent, not halogen-containing colophony type no-clean scaling powder too much with because of the existence of halogen brings the problem of solder joint corrosion.This scaling powder can overcome the shortcoming of prior art, helps the weldering performance good, and the postwelding residue is water white membranoid substance, stablizes nonhygroscopicly under the normal temperature, and postwelding can clean, more compliance with environmental protection requirements.
The plain no-clean scaling powder of lead-free solder thread-use colophony type non-halide of the present invention, its component and quality percentage composition are: organic acid for activating agent 4-18wt%, organic solvent 10-30wt%, paste making agent 1-6wt%, stabilizing agent 0.2-3wt%, thixotropic agent 0.5-5wt%, surfactant 0.5-4wt%, corrosion inhibiter 0.5-5wt%, modified rosin are surplus.
Wherein the organic acid activator is aliphatic monoacid, binary acid, ternary acid, carboxylic acid, aromatic acid, amino acid, oleic acid, glutamic acid, glycine, is selected from succinic acid, glutaric acid, malonic acid, adipic acid, decanedioic acid, salicylic acid, itaconic acid, azelaic acid, glycolic, DL-malic acid, stearic one or more mixing.It is active that this type of activator has enough helping to weld, and helps the weldering better performances.Active component ionization in solvent go on a tour from H
+Ion is with the oxide reaction of mother metal and solder surface.Like this, the oxide-film of mother metal and solder surface is removed, and the metal of mother metal partly exposes.Thereby help mother metal and scolder sprawling under brazing temperature, reach good soldering purpose.Its consumption is the 4-18wt% of scaling powder total amount.
Described organic solvent is alcohols or ether solvent.The effect of organic solvent provides a kind of ionization environment, allow the ionization in organic solvent of rosin acid and organic acid go on a tour from H
+Ion.Simultaneously, solvent also plays a kind of carrier function, in brazing process, carries free H
+The ion remaval oxide-film simultaneously, carries other scaling powder composition and plays the weldering effect that helps.Organic solvent can be selected tetrahydrofurfuryl alcohol, ethylene glycol, ethylene glycol monobutyl ether, one or both mixing of glycerine, propylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethyl carbitol, diethylene glycol monobutyl ether, diglycol monotertiary hexyl ether, diglycol monotertiary octyl ether and 2 ethyls-1,3 hexylene glycol.Its consumption is the 10-30wt% of scaling powder total amount.
Described paste making agent is Macrogol 2000, Macrogol 4000, Macrogol 6000, optional one or more mixing wherein.The effect of paste making agent is to strengthen the ability that rosin colloidal sol becomes the thickness paste, and its consumption is the 1-6wt% of scaling powder total amount.
Described thixotropic agent is rilanit special, amide compound, optional one or both mixing wherein.The effect of thixotropic agent is the thinning behavior of shear force that strengthens the soldering paste fluid, improves the printing performance of soldering paste, makes soldering paste be easy to demoulding, and the phenomenon of not caving in.Its consumption is the 0.5-5wt% of scaling powder total amount.
Described stabilizing agent is a paraffin.Effect is to strengthen the thick stability of rosin colloidal sol.Its consumption is the 0.2-3wt% of scaling powder total amount.
Described corrosion inhibiter is nitrogen heterocyclic, organic amine corrosion inhibiter, can select triethylamine, triethanolamine, BTA for use.The effect of corrosion inhibiter is to play the effect that suppresses oxidation, increases the pH value of solution, reduces the highly acid of original solution, reduces the corrosion of scaling powder to printed panel.Added after the corrosion inhibiter, not only can regulate the acidity of scaling powder, can make the solder joint light, under the situation that does not reduce flux activity, postwelding corrosivity is reduced to minimum.Improved the storage stability of solder flux and soldering paste simultaneously.Consumption is the 0.5-5wt% of scaling powder total amount.
Described surfactant is OPEO, NPE, non-ion fluorin surfactant FCH
2CH
2O (CH
2CH
2O) nH (being called for short FSN), non-ion fluorin carbon surface active agent F (CF
2CF
2)
n(CH
2CH
2O)
nN (being called for short FSO) etc.Optional one or more mixing wherein.Add an amount of surfactant and can reduce surface tension, promote the dissolving of various auxiliary agents in the scaling powder, and scolder and braze surface are played the effect of quick humidification, and the synergistic activity agent is played and helped the weldering function.But consumption too much can reduce the surface insulation resistance of postwelding.Dosage of surfactant is generally at 0.5-4wt%.
Described modified rosin is one or more mixing of newtrex, perhydrogenated rosin, leadless rosin, rosin KE-604, water-white rosin.This class rosin structure is relatively stable; it is solid-state that modified rosin is at normal temperatures; unionization; after the soldering, form good, the transparent organic film of air-tightness; bump can be wrapped up; isolate contacting of metal and atmosphere and other Korrosionsmediums, had the excellent protection performance, solved activity and corrosive contradiction of scaling powder well.
The plain no-clean scaling powder of lead-free solder thread-use colophony type non-halide of the present invention, not halogen-containing, solved the too high problem of the too high non-volatile content that causes of rosin content in the lead-free solder paste.Scolder is sprawled evenly, helps the weldering performance good, with " soldering with liquid flux (abietyl) GB/T9491-2002 " national standard this scaling powder is detected, its rate of spread 〉=75%, wetting time was less than 2 seconds, and the postwelding residue is the membranaceous material of one deck water white transparency, can exempt cleaning, printing board surface insulaion resistance height, the postwelding bronze mirror does not have and penetrates, and is nontoxic, has no irritating odor, safe in utilization, and nonflammable.Has good welding effect.
The specific embodiment
The concrete preparation program of the plain no-clean scaling powder of lead-free solder thread-use colophony type non-halide of the present invention has following examples to provide in detail.Yet, should be appreciated that provided specific embodiment of the present invention particularly though these are described, these embodiment mainly are illustrative purposes for example, and the present invention can be explained at it aspect broader, and is not subjected to the restriction of these embodiment.
Embodiment 1:
Succinic acid 13
Macrogol 2000 5
Diethyl carbitol 10
Glycerine 12
Rilanit special 3
Paraffin 2
Triethanolamine 5
OPEO 2
Newtrex 48
Concrete preparation method: concrete preparation method is a conventional method, adds solvent in having the reactor of agitator earlier, adds reactor behind the weighing activator, add the thermal control temperature at 150 ℃, stirring is dissolved it fully, adds newtrex and treats that it dissolves the back fully and adds stabilizing agent, paste making agent, thixotropic agent, surfactant adds corrosion inhibiter then, be stirred to the solution clear, leave standstill, the room temperature cooling is the plain no-clean scaling powder of lead-free solder thread-use colophony type non-halide.Again solder is compressed into aerostatic press in scaling powder heating back, pull into all size line solder stick directly by wire drawing machine at last and get final product.
Embodiment 2:
Adipic acid 15
Glutaric acid 3
OPEO 0.5
Macrogol 2000 6
Diethylene glycol monoethyl ether 5
Ethylene glycol 5
Rilanit special 5
Triethylamine 0.5
Paraffin 3
Newtrex 30
Leadless rosin 27
The preparation method is identical with example 1.
Embodiment 3:
Decanedioic acid 12
NPE 4
Macrogol 4000 1
Diglycol monotertiary octyl ether 10
Tetrahydrofurfuryl alcohol 5
Rilanit special 0.5
BTA 4
Paraffin 0.5
Water-white rosin 20
Perhydrogenated rosin 43
The preparation method is identical with embodiment 1.
Embodiment 4:
Salicylic acid 4
NPE 1.5
Macrogol 2000 2.5
Diglycol monotertiary hexyl ether 15.5
Glycerine 12
Rilanit special 4
Triethanolamine 3
Paraffin 0.2
Rosin KE-604 57.3
The preparation method is identical with embodiment 1.
Embodiment 5:
Itaconic acid 5
Glycolic 8
NPE 3
Macrogol 6000 5
Diethylene glycol monobutyl ether 8
Tetrahydrofurfuryl alcohol 10
Rilanit special 3
Triethylamine 2
Paraffin 3
Water-white rosin 23
Rosin KE-604 30
The preparation method is identical with example 1.
Embodiment 6:
DL-malic acid 4
FSN 1
Macrogol 6000 2
Diethylene glycol monobutyl ether 18
2 ethyls-1,3 hexylene glycol 12
Rilanit special 2.5
BTA 1.5
Paraffin 1
Rosin KE-604 58
The preparation method is identical with example 1.
Embodiment 7:
Malonic acid 7
Azelaic acid 7
OPEO 3
Macrogol 4000 2
Ethylene glycol monobutyl ether 8
Propylene glycol monomethyl ether 8
Rilanit special 2
BTA 3
Paraffin 2
Leadless rosin 20
Perhydrogenated rosin 38
The preparation method is identical with example 1.
Embodiment 8:
Stearic acid 5
Succinic acid 5
Adipic acid 5
FSO 1
Macrogol 2000 4.5
Ethylene glycol monobutyl ether 5
Glycerine 13
Rilanit special 4
Triethylamine 4
Paraffin 1.5
Newtrex 28
Water-white rosin 24
The preparation method is identical with embodiment 1.
The plain no-clean scaling powder of lead-free solder thread-use colophony type non-halide that above embodiment makes is tested according to national standard " soldering with liquid flux (abietyl) GB/T9491-2002 ", and every index is as shown in the table.
After testing, the plain no-clean scaling powder of lead-free solder thread-use colophony type non-halide of the present invention is all not halogen-containing, and printed board is after the welding and power up insulaion resistance 1.0 * 10 after carrying out moisture test
8Ω, the rate of spread 〉=75%, simultaneously physical stability, bronze mirror corrosion test, viscosity are all qualified, the postwelding residue is water white membranoid substance, stablize nonhygroscopicly under the normal temperature, postwelding can clean, and is fit to the cleaning-free lead-free welding procedure of general electronic products.
Claims (1)
1, the plain no-clean scaling powder of a kind of lead-free solder thread-use colophony type non-halide is characterized in that, is made up of following materials by weight:
Organic acid for activating agent 4-18wt%
Organic solvent 10-30wt%
Paste making agent 1-6wt%
Stabilizing agent paraffin 0.2-3wt%
Thixotropic agent 0.5-5wt%
Surfactant 0.5-4wt%
Corrosion inhibiter 0.5-5wt%
All the other are modified rosin;
Described organic acid activator is succinic acid, glutaric acid, malonic acid, adipic acid, decanedioic acid, salicylic acid, itaconic acid, azelaic acid, glycolic, DL-malic acid, stearic one or more mixing;
Organic solvent is a tetrahydrofurfuryl alcohol, ethylene glycol monobutyl ether, one or both mixing of glycerine, propylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethyl carbitol, diethylene glycol monobutyl ether, diglycol monotertiary hexyl ether, diglycol monotertiary octyl ether and 2 ethyls-1,3 hexylene glycol;
Described paste making agent is one or more mixing of Macrogol 2000, Macrogol 4000, Macrogol 6000;
Described thixotropic agent is one or both mixing of rilanit special, amide compound;
Described surfactant is OPEO, NPE, non-ion fluorin surfactant FCH
2CH
2O (CH
2CH
2O)
nH, non-ion fluorin carbon surface active agent F (CF
2CF
2)
n(CH
2CH
2O)
nOne or more mixing of N;
Described corrosion inhibiter is triethylamine, triethanolamine, one or more mixing of BTA;
Described modified rosin is one or more mixing of newtrex, perhydrogenated rosin, leadless rosin, rosin KE-604, water-white rosin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101774673A CN100532003C (en) | 2007-11-16 | 2007-11-16 | Colophony type non-halide cleaning-free soldering flux for lead-free solder wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101774673A CN100532003C (en) | 2007-11-16 | 2007-11-16 | Colophony type non-halide cleaning-free soldering flux for lead-free solder wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101157168A CN101157168A (en) | 2008-04-09 |
| CN100532003C true CN100532003C (en) | 2009-08-26 |
Family
ID=39305468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007101774673A Expired - Fee Related CN100532003C (en) | 2007-11-16 | 2007-11-16 | Colophony type non-halide cleaning-free soldering flux for lead-free solder wire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100532003C (en) |
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-
2007
- 2007-11-16 CN CNB2007101774673A patent/CN100532003C/en not_active Expired - Fee Related
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