CN101780605B - Wave-soldering brazing filler metal active agent - Google Patents
Wave-soldering brazing filler metal active agent Download PDFInfo
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- CN101780605B CN101780605B CN2010101206751A CN201010120675A CN101780605B CN 101780605 B CN101780605 B CN 101780605B CN 2010101206751 A CN2010101206751 A CN 2010101206751A CN 201010120675 A CN201010120675 A CN 201010120675A CN 101780605 B CN101780605 B CN 101780605B
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Abstract
The invention relates to a wave-soldering brazing filler metal active agent containing dimer acid, trimer acid or the mixture of the dimer acid and the trimer acid. The wave-soldering brazing filler metal active agent is oily liquid and forms a layer of protective film on the surface of fused brazing filler metal to protect the fused brazing filler metal from being oxidized and prevent the brazing filler metal from adsorbing with oxygen in air, thereby reducing the forming speed of tin slag, saving the consumption of soldering tin and power consumption and reducing production cost. The wave-soldering brazing filler metal active agent can also greatly improve the quality of products, enhance the soldering force of the products and simultaneously be convenient for the maintenance of equipment.
Description
Technical field
Patent application of the present invention relates to a kind of Wave-soldering brazing filler metal active agent, and described activating agent can prevent that fusion welding is oxidized and the tin slag reduction of oxidation is become available metal, belongs to the wave-soldering technical field.
Background technology
In industrial production, for realizing the combination of bi-material (or part), in gap or gap is other betwixt adds filler, and this filler is exactly solder, and the fusing point of solder must be lower than the material melting point of welding.And in Electronic Assemblies industry, topmost solder is exactly leypewter and ashbury metal, and numerous electronics producer often uses liquid leypewter (or ashbury metal) and welds various components and parts on pcb board to rise with fixation.Be the most all that the workman welds by hand, but manual welding production efficiency is low, can't adapt to large-scale production.So a kind of welding equipment---wave-soldering arises at the historic moment, wave-soldering can ceaselessly turn round and can disposable a plurality of solder joints be welded in 24 hours,, therefore greatly improved production efficiency while adopting Wave crest Welding, had improved the automatization level of producing.
But, while adopting wave soldering, the technological temperature of leypewter is 223 ℃-245 ℃, liquid solder in the tin stove at high temperature, by its aerial exposure and oxygen, be in contact with one another thereby oxidation generation scruff occurs, along with the reinforcement of people's environmental consciousness and coming into force of the ROHS of European Union rules, lead-free solder (ashbury metal) replaces leypewter gradually, and the technological temperature of lead-free solder is 230 ℃-260 ℃, higher than tin-lead solder temperature, more easily produce scruff.
The generation of scruff not only causes the waste of scolding tin, the production cost that has added vast electronic enterprise, and have a strong impact on the quality of product, tin solder is constantly oxidation under liquidization and flow high temperature, tin solder in the tin pot is constantly descended, depart from eutectic point, the quality problems such as gas hole, scolding tin is excessive, copper melts out tin on rear scolder, component wear, scolding tin pollution, even weldering, rosin joint, weld strength is inadequate, the solder joint surface gloss is gloomy can in succession occur.
Because the technological temperature of lead-free solder is higher, the scruff of its generation is just more, As time goes on, scruff will get more and more and occupy the most surfaces of whole tin stove, and the heat absorptivity of scruff is stronger, can absorb the part heat of scolder, thus the user be the technological temperature that reaches lead-free solder must must improve again temperature with overcome in response to, and the raising of furnace temperature is also had higher requirement to the heat resisting temperature of spare part and material.
Therefore, in order reducing production costs, to improve the quality of products, to need lead-free solder is carried out anti-oxidant treatment.Multiple product occurred on the market at present, it is divided into reduced powder substantially, anti-oxidant powder, solder splash reducing machine, antioxidant and install nitrogen device etc. additional.
1, reduced powder, it is processed after producing for scruff again, fail from the generation of source control scruff, and in use need constantly to stir, produce very large dust and penetrating odor, the working environment in workshop is produced larger impact, and the effect of reduced powder reduction scruff is not very desirable, percent reduction does not almost reach 60%.
2, anti-oxidant powder, anti-oxidant powder are to control the generation of scruff from source, but reality is in use more loaded down with trivial details and effect is also undesirable, and anti-oxidant powder will evenly be sprinkling upon the tin face while using, and wants to spread into very evenly to have certain difficulty.Chlorion or fluorine ion are generally contained in anti-oxidant powder the inside, all belong to the Halogen product, not only do not meet the Halogen product requirement of European Union, and can produce certain corrosivity to equipment.
3, solder splash reducing machine, solder splash reducing machine is the method for unique employing physics reduction, it does not add any product toward tin stove the inside, but being drawn out equipment of rear special use, scruff reduces, also belong to afterwards and process, also fail from the generation of source control scruff, and the present technology of reducing machine is also immature, the tin impurity content that restores is higher, can't meet the requirement of producing high-end product.
4, antioxidant, be fluid product, and advantage is that antioxygenic property is better, and shortcoming is that cigarette is large, and smell is heavier, antioxidant even can occur be stained with the situation on pcb board surface.
5, install the nitrogen device additional, can effectively reduce the scruff amount after installing the nitrogen device additional, but the nitrogen gas generator cost is high, later operating cost is higher, and practice is got up uneconomical.
Summary of the invention
In order better to solve the scruff problem, improve the quality of products, reduce production costs, the invention provides a kind of Wave-soldering brazing filler metal active agent, this activating agent not only can prevent the lead-free solder oxidation effectively, and the lead-free solder overwhelming majority of wrapping up in scruff can be restored, and has effectively solved the problem of scruff, and it is easy to maintenance to reach corrective maintenance again, and tin stove cleaning is clean.
At first activating agent contacts not oxidized at fusing solder surface formation monofilm protection brazing filler metal on surface with the fusing solder; next is active component and reactive metal oxide wherein and they is dissolved in this activating agent, as organo-metallic compound, is suspended between metal oxide particle and residual activating agent.Along with time lengthening until activator consumes is eliminated.Activating agent does not react with metal, and only with the oxidizing slag reaction, few cigarette is tasteless.When the metal oxide in the oxidation scruff was dissolved, it was open that interconnective metal oxide is arranged, and anyly was clipped in metal useful in slag and can dispersion train gets back to and melt in tin, and can not be subject to the impact of activating agent.This new technology can reduce scruff cost 75%～85% left and right.
Wave-soldering brazing filler metal active agent of the present invention is characterized in that: described activating agent comprises the mixture of dimeric dibasic acid, trimer acid or above-mentioned two kinds of acid.
Described a kind of Wave-soldering brazing filler metal active agent is characterized in that: described dimeric dibasic acid and trimer acid are organic acid.
Described a kind of Wave-soldering brazing filler metal active agent is characterized in that: described dimeric dibasic acid, its carbon atom number range of trimer acid are between 6-40.
Described a kind of Wave-soldering brazing filler metal active agent is characterized in that: contain NPE in described activating agent.
Described a kind of Wave-soldering brazing filler metal active agent is characterized in that: described activating agent contain the alcohol that can dissolve each other with activating agent.
Described a kind of Wave-soldering brazing filler metal active agent is characterized in that: can add different pigments to be made into shades of colour in described activating agent.
Find that in practice of the present invention dimeric dibasic acid or trimer acid all have good heat endurance, and can keep flowing in very wide temperature range, be faint yellow transparent thick liquid under normal temperature, avirulent, non-stimulated, flash-point, burning-point are high, the characteristic that low temperature does not freeze, can be dissolved in most of solvent, can be with the metal replacement in the part metals oxide out.
Contain a small amount of monomer acids and trimer acid in general in dimeric dibasic acid, the quality of sour quality can be used as the foundation of assortment.The dimeric dibasic acid that is dimer content 87%, 83%, 75% as the U.S. is decided to be respectively high, medium and low third gear dimeric dibasic acid.These products are commonly referred to as and just steam or single dimeric dibasic acid that steams, and as just steaming dimeric dibasic acid, again distill and must distill dimeric dibasic acid (or claiming two dimeric dibasic acids that steam), and its dimer content can reach more than 95%.If, with dimeric dibasic acid capable hydrogenation again, can obtain the hydrogenated dimer acids that color is very light, antioxygenic property is fabulous again.Distillation dimeric dibasic acid and hydrogenated dimer acids mostly are used for some and need the occasion of property.Commercially available prod is take single dimeric dibasic acid that steams as main.The dimeric dibasic acid that kind is different, its performance are also different, and same kind also has the difference of character because of raw materials used difference.About the quantitative analysis of monomer acids, dimeric dibasic acid and trimer acid in dimeric dibasic acid, the direct method for measuring of a standard is not yet arranged at present.The urea addition process of first vinegar is used to measure the monomer acids in the distillation dimeric dibasic acid at first, but this method is more time-consuming, and precision is not high, once proposed to improve this method with microlitre China process, to determine component of polymer, but during distillation, monomer vinegar is removed not exclusively or the loss of dimeric dibasic acid, all can cause error.
Its raw material of commercially available dimeric dibasic acid mainly contain peanut oil, corn oil, tall oil, cocounut oil, palm oil, the young oil of dish, olive wet goods, according to producing raw-material difference, can be divided into multiclass, can be used in different aspects, its dimerization by the saturated or unrighted acid of middle molecular weight produces, and its carbon number range is between 6 to 40, but the process experiment shows, they are used in Wave-soldering brazing filler metal and distinguish not quite, so preferred commercially available dimeric dibasic acid.
NPE can be made emulsifying agent, dispersant, and washing agent can be used as wetting agent and emulsifying agent in general industry, have reactivity preferably.Our experiments show that, NPE also can, effectively with tin slag reduction, simultaneously, add NPE and can effectively reduce the concentration of Wave-soldering brazing filler metal active agent in dimeric dibasic acid or trimer acid, reduce its adhesiveness to equipment, make equipment be easier to the cleaning maintenance.
The alcohol such as isopropyl alcohol have good reactivity, namely can effectively improve the reactivity of the Wave-soldering brazing filler metal active agent in the present invention, can reduce again the concentration of Wave-soldering brazing filler metal active agent.
The invention has the beneficial effects as follows:
A: with tin slag reduction out, save the scolder production cost
find in practice of the present invention, activating agent is slowly poured in the scolder of melting and can be found that the scruff that has produced can be reduced rapidly, if activating agent and scruff are stirred a few minutes gently, more can improve the percent reduction of scruff, find during through market survey all do not form piece or form very little bulk when most scruff is inside the tin stove, but also there is the scruff of part more serious at tin stove the inside caking phenomenon, the bulk of knot is larger, this may be relevant with its scolder used and scaling powder kind, comparatively speaking, the bulk of knot is larger, the tin that the scruff the inside contains is also more, time during reduction is also longer, can not find out effect while pouring activating agent into this class scruff at once, can find after 1-2 hour, forming the scolder that the scruff of shape piece wraps up is reduced out too.Our experiments show that, according to what of the stanniferous amount of scruff, percent reduction sometimes can be up to more than 95%.
B: scolder and air is isolated, prevent that scruff from producing
After activating agent being poured into tin stove the inside, can form on the fusion welding surface one deck oily diaphragm protection scolder not oxidized, prevent oxygen absorption in scolder and air, reduce scruff and form speed, guarantee simultaneously smoke-free and tasteless.
C: prevent that solder heat San Fa Damage from losing, improve solder wettability, can reach faster wetability
After activating agent is covered the fusion welding surface, can prevent effectively that fusion welding Re San Fa Damage from losing, 5 ℃ of-10 ℃ of soldering tin technique temperature can directly descend, save power consumption 20% left and right, liquid scolding tin heat is more evenly distributed, can effectively reduce the heat resisting temperature of spare part and material, improve welding procedure.Show by practice simultaneously, can effectively improve wetability and the mobility of scolder, this is particularly important to pb-free solder.
D: absorb impurity, improve the quality of products
After the tin sticky temperature descends without slicker solder to printed circuit board (PCB) below the molten copper rate of naked copper of tin sticky face also descend thereupon, tin oxide, not molten tin no longer occur, our experiments show that simultaneously, activating agent can effectively absorb impurity, purify the effect of scolding tin, it not only can effectively absorb the various impurity such as carbon, and can remove molten copper fast lifting, and also unnecessary periodic replacement of tin liquor.
E: the corrosion of inhibition scolder to equipment, reduce plant maintenance
The scolder particularly corrosivity of lead-free solder is larger,, even titanium alloy tin stove all easily pierces, just more easily pierce if added anti-oxidant reduced powder, and this activating agent has stronger rust inhibition, can effectively reduce the corrosion of lead-free solder to equipment, extension device service life.
Description of drawings
Fig. 1 is the solder wettability table with activating agent;
Fig. 2 is for adding the wetability table of activating agent scolder.
Fig. 1 and Fig. 2 are the wetability table with wetability tester test scolder, and wherein Fig. 1 is the solder wettability table with activating agent, and Fig. 2 is for adding the wetability table of activating agent scolder.Can find out from the contrast of Fig. 1 and Fig. 2, while reaching same wetability, add the wetting time (t1-t2 time period in Fig. 2) of the scolder of activating agent and lacked 0.52 second than the wetting time of the scolder that has not added activating agent (t1-t2 time period in Fig. 1), and the time of wave soldering several seconds namely itself, therefore can lack 0.52 second when reaching identical wetability has been quite big.
The specific embodiment
Use Wave-soldering brazing filler metal active agent of the present invention, can be the mixture of dimeric dibasic acid, trimer acid or above-mentioned two kinds of acid.In one embodiment of the invention, take commercially available dimeric dibasic acid and trimer acid as activating agent, in fact, dimeric dibasic acid or trimer acid or mixture both can be as activating agents, and as required, can also increase therein the alcohols materials such as NPE or isopropyl alcohol to reduce the concentration of activating agent.Use the concrete operation step of Wave-soldering brazing filler metal active agent of the present invention as follows:
1, melt under the tin state normal unlatching of crest, the cleaning scruff, the tin face stays approximately 2-3 kilogram scruff;
2, control the tin flow path direction with the sheet metal that meets ROHS in the tin stove, tin liquor and scruff are flowed out to tin stove one end of handled easily, then at this end, do a reducing zone, the length of reducing zone area is the width of tin stove, and width is 20-30 centimetre of left and right;
3, activating agent is poured into reserve on the scruff of scolding tin liquid level and stirred, addition is first: the general approximately 150-250 of kupper solder gram G is arranged, the general approximately 200-300 of lead-free solder gram, added once in general every 2-3 hour afterwards, the addition of each activating agent has been generally approximately 100 grams of kupper solder, lead-free solder is 150 grams approximately, and activating agent forms the anti-oxidation thing of pasty state and continues the new scruff that produces of reduction at the tin face;
4, before adding activating agent at every turn, activating agent and the formed residue of scruff must be stirred into pasty state gently, then clean out the not stanniferous material in upper strata, again the scruff of other position of tin stove is cleared up reducing zone, activating agent is poured in scruff and stirred by the method for step 3, approximately repeat this process and action after 2-3 hour, as the scruff sudden fast rush, looking actual conditions suitably increases addition or shortens the interpolation time;
5, this moment as do not continue to produce while not playing for a long time (be crest), need not to add activating agent, when needing to produce (while opening crest), then activating agent poured in scruff and stirred by the method for step 3, this process of repetition and action after 2-3 hour;
6, a small amount of scruff that in process, mobile liquid level produces is reduced rapidly, and reducing zone tin liquor face is isolated by anti-oxidation thing, can not produce scruff;
7, look what of product and tin stove size or scruff generation in process, add activating agent quantity also to take the circumstances into consideration plus-minus.
Use the technical essential of the described Wave-soldering brazing filler metal active agent of the present patent application:
Remake cleaning after the residue that 1, must will cover reducing zone tin face before each cleaning stirs into sposh shape material, and then add activating agent on request;
Must will be added on the scruff that just drags for activating agent and stir while 2, adding activating agent at every turn;
While 3, clearing up at every turn only the sposh shape material that upper strata is not stanniferous clear, the instrument that does not allow to clear up scruff drags for below stretching into tin stove tin liquor face from the bottom up, so will take away a large amount of useful tin and causes unnecessary waste.
Use the points for attention of the method for Wave-soldering brazing filler metal active agent of the present invention:
1. please note that tin stove suction opeing is good before the use activating agent, suction opeing gas velocity each second〉1.5 meters;
2., owing to being high-temperature operation, please wear mouth mask, safety goggles and super heated rubber gloves.
Claims (1)
1. the application of Wave-soldering brazing filler metal active agent in the printed circuit board wave peak weldering, it is characterized in that: described activating agent comprises the mixture of dimeric dibasic acid, trimer acid or above-mentioned two kinds of acid, also comprise NPE, and be used in wave soldering machine, comprise the following steps:
1) melt under the tin state normal unlatching of crest, the cleaning scruff, the tin face stays 2-3 kilogram scruff;
2) control the tin flow path direction with sheet metal in the tin stove, tin liquor and scruff are flowed out to tin stove one end of handled easily, then at this end, do a reducing zone, the length of reducing zone is the width of tin stove, and width is 20-30 centimetre;
3) activating agent is poured into reserve on the scruff of scolding tin liquid level and stirred, addition first, it is the 150-250 gram that kupper solder is arranged, lead-free solder is the 200-300 gram, added once in every 2-3 hour afterwards, the addition of each activating agent is for having kupper solder 100 grams, lead-free solder 150 grams, activating agent forms the anti-oxidation thing of pasty state at the tin face, and continues the new scruff that produces of reduction;
4) before adding activating agent at every turn, activating agent and the formed residue of scruff are stirred into pasty state gently, then clean out the not stanniferous material in upper strata, again the scruff of other position of tin stove is cleared up reducing zone, activating agent is poured in scruff and stirred by the method for step 3), repeat this process and action after 2-3 hour, as the scruff sudden fast rush, looking actual conditions suitably increases addition or shortens the interpolation time;
5) produce if not continuing this moment, when namely crest is not played for a long time, need not to add activating agent, when needing to produce, while namely opening crest, then activating agent is poured in scruff and stirred by the method for step 3), repeat this process and action after 2-3 hour.
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| Application Number | Priority Date | Filing Date | Title |
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| CN2010101206751A CN101780605B (en) | 2010-03-05 | 2010-03-05 | Wave-soldering brazing filler metal active agent |
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| CN2010101206751A CN101780605B (en) | 2010-03-05 | 2010-03-05 | Wave-soldering brazing filler metal active agent |
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| CN101780605A CN101780605A (en) | 2010-07-21 |
| CN101780605B true CN101780605B (en) | 2013-11-13 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104195351A (en) * | 2014-08-07 | 2014-12-10 | 安徽秋田电子有限公司 | Process for reducing solder splash in solder machine by peanut oil |
| CN105834546A (en) * | 2016-06-02 | 2016-08-10 | 陈浩 | Tin recovery device with hypersorber |
| JP6540788B1 (en) * | 2017-12-29 | 2019-07-10 | 千住金属工業株式会社 | Flux and solder paste |
| CN115302131A (en) * | 2022-09-01 | 2022-11-08 | 广东省索艺柏科技有限公司 | Simple smelting method of gold-tin alloy solder |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1972779A (en) * | 2004-05-28 | 2007-05-30 | P·凯金属公司 | Solder paste and process |
| CN101157168A (en) * | 2007-11-16 | 2008-04-09 | 北京工业大学 | Lead-free solder thread-use colophony type non-halide cleaning-free scaling powder |
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2010
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1972779A (en) * | 2004-05-28 | 2007-05-30 | P·凯金属公司 | Solder paste and process |
| CN101157168A (en) * | 2007-11-16 | 2008-04-09 | 北京工业大学 | Lead-free solder thread-use colophony type non-halide cleaning-free scaling powder |
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Granted publication date: 20131113 Termination date: 20160305 |