CN100469511C - No-lead soft brazing alloy - Google Patents
No-lead soft brazing alloy Download PDFInfo
- Publication number
- CN100469511C CN100469511C CNB2006100519697A CN200610051969A CN100469511C CN 100469511 C CN100469511 C CN 100469511C CN B2006100519697 A CNB2006100519697 A CN B2006100519697A CN 200610051969 A CN200610051969 A CN 200610051969A CN 100469511 C CN100469511 C CN 100469511C
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- CN
- China
- Prior art keywords
- solder
- lead
- intermediate alloy
- free solder
- present
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910045601 alloy Inorganic materials 0.000 title abstract description 40
- 239000000956 alloy Substances 0.000 title abstract description 40
- 238000005219 brazing Methods 0.000 title abstract description 6
- 229910000679 solder Inorganic materials 0.000 claims description 78
- 229910052718 tin Inorganic materials 0.000 abstract description 19
- 229910052738 indium Inorganic materials 0.000 abstract description 6
- 229910052698 phosphorus Inorganic materials 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 5
- 229910052759 nickel Inorganic materials 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 4
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000010949 copper Substances 0.000 description 47
- 229910052802 copper Inorganic materials 0.000 description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 15
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 15
- 238000005476 soldering Methods 0.000 description 15
- 238000012360 testing method Methods 0.000 description 15
- 238000002844 melting Methods 0.000 description 14
- 230000008018 melting Effects 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 238000003756 stirring Methods 0.000 description 13
- 238000003723 Smelting Methods 0.000 description 12
- 238000004090 dissolution Methods 0.000 description 12
- 238000003466 welding Methods 0.000 description 12
- 229910018956 Sn—In Inorganic materials 0.000 description 8
- 229910009038 Sn—P Inorganic materials 0.000 description 8
- 229910000831 Steel Inorganic materials 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 230000014759 maintenance of location Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000010935 stainless steel Substances 0.000 description 7
- 229910001220 stainless steel Inorganic materials 0.000 description 7
- 239000010959 steel Substances 0.000 description 7
- 229910020938 Sn-Ni Inorganic materials 0.000 description 6
- 229910008937 Sn—Ni Inorganic materials 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 5
- 238000001816 cooling Methods 0.000 description 5
- 229910020888 Sn-Cu Inorganic materials 0.000 description 4
- 229910019204 Sn—Cu Inorganic materials 0.000 description 4
- 230000003026 anti-oxygenic effect Effects 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910017944 Ag—Cu Inorganic materials 0.000 description 2
- 229910020994 Sn-Zn Inorganic materials 0.000 description 2
- 229910009069 Sn—Zn Inorganic materials 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- HDITUCONWLWUJR-UHFFFAOYSA-N diethylazanium;chloride Chemical compound [Cl-].CC[NH2+]CC HDITUCONWLWUJR-UHFFFAOYSA-N 0.000 description 1
- 230000005662 electromechanics Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical group [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007712 rapid solidification Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000004154 testing of material Methods 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Embodiment and Comparative Examples | Hot strength (MPa) | Percentage elongation (%) | The rate of spread (%) |
Embodiment 1 | 34.4 | 45.6 | 78.06 |
Embodiment 2 | 43.7 | 30.4 | 78.65 |
Embodiment 3 | 45.4 | 33.0 | 76.67 |
Embodiment 4 | 45.5 | 33.1 | 76.04 |
Embodiment 5 | 39.8 | 49.5 | 78.25 |
Embodiment 6 | 36.4 | 47.8 | 78.49 |
Embodiment 7 | 42.0 | 25.9 | 77.07 |
Comparative Examples | 38.4 | 23.6 | 71.32 |
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100519697A CN100469511C (en) | 2006-06-14 | 2006-06-14 | No-lead soft brazing alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100519697A CN100469511C (en) | 2006-06-14 | 2006-06-14 | No-lead soft brazing alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101088698A CN101088698A (en) | 2007-12-19 |
CN100469511C true CN100469511C (en) | 2009-03-18 |
Family
ID=38942285
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100519697A Active CN100469511C (en) | 2006-06-14 | 2006-06-14 | No-lead soft brazing alloy |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100469511C (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101381826B (en) * | 2008-09-26 | 2012-11-07 | 南昌大学 | Sn-Cu base leadless solder alloy and preparation method |
CN101417374B (en) * | 2008-11-28 | 2011-05-18 | 广州瀚源电子科技有限公司 | Leadless solder dregs-reducing method |
CN102642098A (en) * | 2012-04-23 | 2012-08-22 | 浙江省冶金研究院有限公司 | High-temperature antioxidant lead-free welding rod for dip soldering of enameled wire |
CN109702374B (en) * | 2019-02-13 | 2021-02-09 | 南昌大学 | Sn-Cu-Ni-In lead-free solder alloy and preparation method thereof |
CN115319221A (en) * | 2022-07-26 | 2022-11-11 | 云南电网有限责任公司昆明供电局 | Cable core joint brazing method based on Sn-based material |
-
2006
- 2006-06-14 CN CNB2006100519697A patent/CN100469511C/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN101088698A (en) | 2007-12-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG YATONG WELDING MATERIALS CO., LTD. Free format text: FORMER OWNER: YATONG ELECTRONIC CO., LTD. Effective date: 20081031 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20081031 Address after: Hangzhou City, Zhejiang province Jianggan District Jianding Road No. 22 post encoding: 310021 Applicant after: ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL Co.,Ltd. Address before: Hangzhou City, Zhejiang province Jianggan District Jianding Road No. 22 post encoding: 310021 Applicant before: Yatong Electronic Co.,Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: SHENZHEN TONG FANG ELECTRONIC NEW MATERIAL Co.,Ltd. Assignor: ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL Co.,Ltd. Contract fulfillment period: 2009.4.3 to 2014.4.5 Contract record no.: 2009440001527 Denomination of invention: Lead-free solder Granted publication date: 20090318 License type: Exclusive license Record date: 20091014 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.4.3 TO 2014.4.5; CHANGE OF CONTRACT Name of requester: SHENZHEN TONGFANG ELECTRONIC NEW MATERIAL CO., LTD Effective date: 20091014 |
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CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 310000 No. 372, Jinpeng street, Sandun Town, Xihu District, Hangzhou City, Zhejiang Province Patentee after: Zhejiang Yatong New Materials Co.,Ltd. Address before: Hangzhou City, Zhejiang province 310021 Jianggan District Jianding Road No. 22 Patentee before: ZHEJIANG ASIA GENERAL SOLDERING & BRAZING MATERIAL Co.,Ltd. |