CN100366376C - Leadless brazing filler metal containing cerium - Google Patents
Leadless brazing filler metal containing cerium Download PDFInfo
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- CN100366376C CN100366376C CNB2005100225631A CN200510022563A CN100366376C CN 100366376 C CN100366376 C CN 100366376C CN B2005100225631 A CNB2005100225631 A CN B2005100225631A CN 200510022563 A CN200510022563 A CN 200510022563A CN 100366376 C CN100366376 C CN 100366376C
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- cerium
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- plumbum
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Abstract
The present invention relates to plumbum-free solder containing cerium, which belongs to soldering material. The plumbum-free solder has the chemical components with the mass percent of 0.08% to 3.0% of cuprum (Cu), 0.01% to 1.6% of nickel (Ni), 0.005% to 0.2% of plumbum (Pb), 0.001% to 0.10% of cerium (Ce) and residual stannum (Sn). Commercial electrolytic cuprum, metallic nickel, stannum ingots, plumbum ingots and metallic cerium are proportioned as required, and smelted and cast by a conventional manufacturing process to obtain bars; the bars are extruded and drawn to obtain required solder threads. According to production requirements, metallic nickel, the electrolytic cuprum and the metallic cerium can be smelted into alloys in advance, and then added into stannum-cuprum-plumbum alloys for smelting and casting to obtain the bars; the bars are extruded and drawn to obtain required solder threads. The plumbum-free solder has the characteristics of favorable wettability, spreadability and soldering seam mechanical property.
Description
One, technical field
The present invention relates to a kind of Sn-Cu-Ni solder that contains cerium, belong to the brazing material of class of metal materials and field of metallurgy.
Two, background technology
According to the WEEE and the RoHS instruction of European Union's promulgation, clearly propose will or forbid in restriction on July 1st, 2006 in household electrical appliance, using plumbous and other several poisonous and harmful substances, force Research of Lead-free Solders to enter practical stage.The Sn-Ag-Cu alloy has excellent wetting capacity energy and mechanical property, is considered to the substitute of the most potential Sn-Pb solder.It is on the high side that but Sn-Ag-Cu is an alloy, therefore uses and limited to.The Sn-Cu-Ni solder is owing to have better comprehensive performance, and moderate cost has a good application prospect.This invention " lead-free brazing that contains cerium " is promptly finished under this technical background, and solders such as its combination property and Sn-Pb, Sn-Cu, Sn-Ag-Cu are close.
Three, summary of the invention
The task of this invention provides a kind of wetability, the solder of the wave-soldering that can be used for electron trade, reflow welding and other welding method of spreadability and brazed seam good mechanical properties.
This invention has mainly solved following two key technical problems: the melting range of the solder of 1) developing is at 225 ℃～260 ℃; By optimizing the chemical composition of " solder that contains cerium ", obtained mother metal (and PCB substrate) wetability, good, the good solder of brazed seam mechanical property (σ b, τ) of spreadability; 2) in containing the solder of cerium, add an amount of lead (Pb) to reduce the fusing point of principal component alloy (Sn-Cu alloy), improve the wetability of solder on red copper, brass and PCB substrate that contains cerium; Add an amount of nickel, suppress the formation of Cu6Sn5 intermetallic compound, add rare-earth element cerium (Ce) simultaneously, improve the plasticity and the comprehensive mechanical property of the Sn-Cu-Ni solder that contains cerium with the neoteric crystal grain that contains the Sn-Cu-Ni solder of cerium of refinement.
The technical scheme that addresses the above problem is 1), use commercially available cathode copper, metallic nickel, tin slab, lead pig, metallic cerium, proportioning on demand adopts that conventional manufacturing process is smelted, casting, can obtain bar.By extruding, drawing, promptly obtain needed solder wire material.2), according to producing needs, metallic nickel, cathode copper, metallic cerium can be smelted into alloy in advance, add then in tin-copper-metal smelt, casting, can obtain bar.By extruding, drawing, promptly obtain needed solder wire material.
" the Sn-Cu-Ni solder that contains cerium " that this is bright, chemical composition (mass percent) is: 0.08%～3.0% copper (Cu), 0.01%～1.6% nickel (Ni), 0.005%～0.2% lead (Pb), 0.001%～0.10% cerium (Ce), all the other are tin (Sn).Use commercially available cathode copper, metallic nickel, tin slab, lead pig, metallic cerium, proportioning adopts conventional manufacturing process to smelt, cast on demand, can obtain bar.By extruding, drawing, promptly obtain needed solder wire material.According to producing needs, metallic nickel, cathode copper, metallic cerium can be smelted into alloy in advance, add then in tin-copper-metal and smelt, cast, can obtain bar.By extruding, drawing, promptly obtain needed solder wire material.
Technical characterstic of the present invention is also to contain the lead element of trace in " the Sn-Cu-Ni solder that contains cerium ".Though lead is harmful element, its adding can significantly improve wetability, the spreadability of tin-based solder to mother metal, and very little to other performance impact of solder.Therefore, contained harmful element lead can be adjusted according to the relevant regulations of countries such as the WEEE of European Union's promulgation and RoHS instruction and Japan, China, the U.S. in the neoteric solder that contains cerium, to meet the requirement of various criterion and regulation.Simultaneously, still in solder, keep the lead of an amount of (trace), to improve wetability, the spreadability of solder to mother metal.
Four, explanation accompanying drawing-nothing
Five, the specific embodiment
According to the quality recipe ratio of " the Sn-Cu-Ni solder that contains cerium " of the present invention, narration the specific embodiment of the present invention.
The specific embodiment one:
Press the mass percent proportioning, its composition is: 0.08% bronze medal (Cu), and 1.6% nickel (Ni), 0.2% lead (Pb), 0.10% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 245 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment two:
Press the mass percent proportioning, its composition is: 3.0% bronze medal (Cu), and 0.01% nickel (Ni), 0.2% lead (Pb), 0.10% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 225 ℃, liquidus temperature (considered experimental error) about 240 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment three:
Press the mass percent proportioning, its composition is: 0.7% bronze medal (Cu), and 0.01% nickel (Ni), 0.005% lead (Pb), 0.001% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 227 ℃, liquidus temperature (considered experimental error) about 240 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment four:
Press the mass percent proportioning, its composition is: 0.7% bronze medal (Cu), and 0.1% nickel (Ni), 0.02% lead (Pb), 0.03% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 227 ℃, liquidus temperature (considered experimental error) about 240 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment five:
Press the mass percent proportioning, its composition is: 0.2% bronze medal (Cu), and 0.5% nickel (Ni), 0.05% lead (Pb), 0.03% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 245 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment six:
Press the mass percent proportioning, its composition is: 1.0% bronze medal (Cu), and 1.0% nickel (Ni), 0.1% lead (Pb), 0.05% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 245 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment seven:
Press the mass percent proportioning, its composition is: 0.12% bronze medal (Cu), and 0.01% nickel (Ni), 0.02% lead (Pb), 0.10% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 227 ℃, liquidus temperature (considered experimental error) about 235 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment eight:
Press the mass percent proportioning, its composition is: 2.5% bronze medal (Cu), and 1.0% nickel (Ni), 0.02% lead (Pb), 0.03% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 235 ℃, liquidus temperature (considered experimental error) about 250 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment nine:
Press the mass percent proportioning, its composition is: 2.0% bronze medal (Cu), and 1.6% nickel (Ni), 0.02% lead (Pb), 0.03% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 235 ℃, liquidus temperature (considered experimental error) about 260 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment ten:
Press the mass percent proportioning, its composition is: 3.0% bronze medal (Cu), and 1.6% nickel (Ni), 0.02% lead (Pb), 0.01% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 240 ℃, liquidus temperature (considered experimental error) about 260 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 11:
Press the mass percent proportioning, its composition is: 3.0% bronze medal (Cu), and 1.6% nickel (Ni), 0.2% lead (Pb), 0.001% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 235 ℃, liquidus temperature (considered experimental error) about 255 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 12;
Press the mass percent proportioning, its composition is: 3.0% bronze medal (Cu), and 1.6% nickel (Ni), 0.1% lead (Pb), 0.01% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 240 ℃, liquidus temperature (considered experimental error) about 260 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 13:
Press the mass percent proportioning, its composition is: 0.9% bronze medal (Cu), and 0.03% nickel (Ni), 0.02% lead (Pb), 0.02% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 235 ℃, liquidus temperature (considered experimental error) about 245 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 14:
Press the mass percent proportioning, its composition is: 0.4% bronze medal (Cu), and 0.02% nickel (Ni), 0.05% lead (Pb), 0.05% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 245 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 15:
Press the mass percent proportioning, its composition is: 0.8% bronze medal (Cu), and 0.02% nickel (Ni), 0.03% lead (Pb), 0.02% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 235 ℃, liquidus temperature (considered experimental error) about 245 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 16:
Press the mass percent proportioning, its composition is: 1.4% bronze medal (Cu), and 0.02% nickel (Ni), 0.10% lead (Pb), 0.08% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 245 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 17:
Press the mass percent proportioning, its composition is: 1.8% bronze medal (Cu), and 0.6% nickel (Ni), 0.12% lead (Pb), 0.08% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 240 ℃, liquidus temperature (considered experimental error) about 255 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 18:
Press the mass percent proportioning, its composition is: 1.8% bronze medal (Cu), and 0.6% nickel (Ni), 0.10% lead (Pb), 0.08% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 240 ℃, liquidus temperature (considered experimental error) about 255 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 19:
Press the mass percent proportioning, its composition is: 0.6% bronze medal (Cu), and 0.1% nickel (Ni), 0.02% lead (Pb), 0.03% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 235 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 20:
Press the mass percent proportioning, its composition is: 0.5% bronze medal (Cu), and 0.2% nickel (Ni), 0.02% lead (Pb), 0.03% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 235 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
The specific embodiment 21:
Press the mass percent proportioning, its composition is: 0.7% bronze medal (Cu), and 0.1% nickel (Ni), 0.02% lead (Pb), 0.03% cerium (Ce), all the other are tin (Sn).
" the Sn-Cu-Ni solder that contains cerium " solidus temperature that the mentioned component proportioning obtains about 230 ℃, liquidus temperature (considered experimental error) about 235 ℃, cooperate commercially available brazing flux (scaling powder), wetability, spreading property on red copper, brass and PCB substrate are good.
Claims (1)
1. a Sn-Cu-Ni solder that contains cerium is characterized in that, by the mass percent proportioning is: 0.08%～3.0% copper (Cu), 0.01%～1.6% nickel (Ni), 0.005%～0.2% lead (Pb), 0.001%～0.10% cerium (Ce), all the other are tin (Sn).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100225631A CN100366376C (en) | 2005-12-23 | 2005-12-23 | Leadless brazing filler metal containing cerium |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100225631A CN100366376C (en) | 2005-12-23 | 2005-12-23 | Leadless brazing filler metal containing cerium |
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| Publication Number | Publication Date |
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| CN1792539A CN1792539A (en) | 2006-06-28 |
| CN100366376C true CN100366376C (en) | 2008-02-06 |
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| CNB2005100225631A Active CN100366376C (en) | 2005-12-23 | 2005-12-23 | Leadless brazing filler metal containing cerium |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101564803B (en) * | 2008-07-15 | 2011-11-23 | 广州冶炼厂 | Leadless solder of silverless Sn-Bi-Cu system and preparation method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101862921B (en) * | 2010-06-25 | 2012-02-15 | 南京航空航天大学 | Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB671079A (en) * | 1949-11-16 | 1952-04-30 | Richard Chadwick | Improvements in or relating to solders |
| JPS57160594A (en) * | 1981-03-30 | 1982-10-02 | Nippon Genma:Kk | Soldering alloy for preventing silver-disolving |
| CN85108518A (en) * | 1985-10-19 | 1987-04-22 | 郴州电光源焊料厂 | Rare earth-tin-lead solder and preparation method |
| JP2003211283A (en) * | 2002-01-22 | 2003-07-29 | Japan Science & Technology Corp | Lead-free solder material |
| CN1481970A (en) * | 2003-07-25 | 2004-03-17 | 南昌大学 | Tin-zinc base plumbum-free solder alloy and its preparing technology |
| NL1022976C1 (en) * | 2003-03-20 | 2004-09-21 | Mat Tech B V | Solder alloy, comprises zinc or bismuth, zinc, titanium, gallium, nickel, manganese, chromium, cerium and tin |
| CN1554511A (en) * | 2003-12-26 | 2004-12-15 | 杨嘉骥 | Anti-oxidation lead-free solder and its preparing method |
-
2005
- 2005-12-23 CN CNB2005100225631A patent/CN100366376C/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB671079A (en) * | 1949-11-16 | 1952-04-30 | Richard Chadwick | Improvements in or relating to solders |
| JPS57160594A (en) * | 1981-03-30 | 1982-10-02 | Nippon Genma:Kk | Soldering alloy for preventing silver-disolving |
| CN85108518A (en) * | 1985-10-19 | 1987-04-22 | 郴州电光源焊料厂 | Rare earth-tin-lead solder and preparation method |
| JP2003211283A (en) * | 2002-01-22 | 2003-07-29 | Japan Science & Technology Corp | Lead-free solder material |
| NL1022976C1 (en) * | 2003-03-20 | 2004-09-21 | Mat Tech B V | Solder alloy, comprises zinc or bismuth, zinc, titanium, gallium, nickel, manganese, chromium, cerium and tin |
| CN1481970A (en) * | 2003-07-25 | 2004-03-17 | 南昌大学 | Tin-zinc base plumbum-free solder alloy and its preparing technology |
| CN1554511A (en) * | 2003-12-26 | 2004-12-15 | 杨嘉骥 | Anti-oxidation lead-free solder and its preparing method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101564803B (en) * | 2008-07-15 | 2011-11-23 | 广州冶炼厂 | Leadless solder of silverless Sn-Bi-Cu system and preparation method thereof |
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| Publication number | Publication date |
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| CN1792539A (en) | 2006-06-28 |
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Application publication date: 20060628 Assignee: Huayin Welding Material Co., Ltd., Changshu City Assignor: Nanjing University of Aeronautics and Astronautics Contract record no.: 2010320000278 Denomination of invention: Sn-Cu-Ni solder containing cerium Granted publication date: 20080206 License type: Exclusive License Record date: 20100323 |