CN1481970A - Tin-zinc base plumbum-free solder alloy and its preparing technology - Google Patents
Tin-zinc base plumbum-free solder alloy and its preparing technology Download PDFInfo
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Abstract
The present invention relates to non-ferrous alloy material. The alloy contains Zn 4-11 wt%, P 0.001-1 wt%, except Sn, and may have some La and/or Ce. The preparation process of the alloy includes smelting Sn-Zn mother material with Zn content of 9.0 wt% and graphite protected surface in a resistive furnace; smelting intermediate alloy in a vacuum inducing furnace via adding La and Ce; melting the mother material inside a corundum crucible inside the resistive furnace and raising the temperature to 350 deg.c, pressing Sn foil coated intermediate alloy and red phosphorus powder into the melt quickly via stirring, maintaining the temperature for 10 min before reducing to 290-320 deg.c; and casting in iron mold into circular rod of 20 mm diameter. The alloy has copper moistening and spreading area greater than that of corresponding Sn-Zn alloy, up to 62 %.
Description
Technical field:
The invention belongs to the non-ferrous alloy material, what relate to is a kind of unleaded brazing material of used for electronic device, particularly a kind of tin-zinc-based leadless solder alloy and preparation technology thereof.
Background technology:
Various electron devices comprise that microelectronic device generally adopts soldering to connect and the assembling means as circuit, for a long time, and the plumbous eutectic of tin and nearly eutectic alloy is low owing to fusing point, advantages such as the wettability of copper base is good are used as the braze material widespread use.Expansion along with the electronic product production and the scale of application; the enhancing of acceleration that updates and human environment protection consciousness; plumbous potential hazard to environment and human body causes showing great attention to of international community in a large amount of waste electronic products, and some countries have put into effect the statute of limitation of solder containing pb in succession and set up the time limit of comprehensively eliminating solder containing pb.The exploitation lead-free brazing is imperative to replace existing tin-lead solder.
Countries in the world have been carried out big quantity research in recent years, have produced multiple lead-free solder alloy, but do not find all gratifying tin-lead solder substitute of various aspects of performance so far as yet.At present relative performance better, what be subjected to how tame authoritative research institution recommends by general acclaim, is applied in some occasions is Xi Yin and SAC alloy.But this class alloy melting point surpasses 220 ℃, and is too high with respect to 183 ℃ of existing eutectic tin-lead alloy solder fusing points, be difficult to and existing circuit sheet material, electronics soldering production technique and hardware compatibility, and raw materials cost is also higher.Zinc content is that 9.0% tin Zn based alloy of alloy gross weight is 198 ℃ at its eutectic point fusing point, near the eutectic tin-lead alloy scolder; Its intensity reaches 65MPa, 40MPa apparently higher than eutectic tin-lead alloy, thereby work-ing life and reliability are than the eutectic tin-lead alloy height, and its solder joint tensile strength still can remain 50MPa in insulation under 125 ℃ after 100 hours, and tin-plumbous eutectic alloy is just reduced to 17MPa after same insulation; It is the cheapest with respect to other leadless welding alloy price in addition, and development potentiality is arranged very much; But this class alloy exists distinct issues to need to solve: it is relatively poor to the wettability of metals such as copper.
At present occurred several the patented technologies of improving the red brass wettability in the world, comprised to the US6241942 of red brass interpolation nickel, silver, copper, bismuth, indium and phosphorus with in the surperficial technology such as US20030059642 that coat the tin film of tin zinc powder grain.To these technology, at present from lead-free brazing production and application present situation and its technology itself, first does not have large-scale commercial applications to use, and the effort of various countries' researchdevelopment lead-free brazing did not all stop, and new relevant patent is still continuing to bring out; The second, the alloy that wherein adds silver, bismuth, indium and the multiple constituent element of phosphorus has the shortcoming of raw materials cost costliness and complex process, in fact works as silver, bismuth, indium equal size above 2%, and alloy can not have been seen simple tin zinc base alloy as; When estimating as silver-colored bismuth indium tin zinc composite alloy category.The technology that tin zinc powder grain surface coats the tin film also has complex process, increases the shortcoming of cost.
In addition, add high level, the bismuth that for example surpasses gross weight 3% can improve the wettability of red brass, and can reduce alloy melting point, this has been a kind of disclosed knowledge, but higher bismuth can make alloy become fragile, and the bismuth resource is less, itself also have certain toxicity, use bismuth can not become a kind of ideal solution in a large number.
Summary of the invention:
Goal of the invention:
Improve the wettability of tin-zinc alloy by adding the such short-cut method of suitable micro-constituent element, but make it to reach the industrial application level, thereby a kind of tin-zinc base lead-free solder alloy and preparation technology thereof of new formulation are provided copper.
Technical scheme of the present invention is as follows:
A kind of tin-zinc-based leadless solder alloy, its zinc content is 4～11% of alloy gross weight, remaining is tin, is added with the phosphorus of 0.001-1% by the alloy gross weight.
More excellent technical scheme of the present invention is as follows:
A kind of tin-zinc-based leadless solder alloy also is added with the single of 0.001-0.5% or blended lanthanum and cerium by the alloy gross weight.
A kind of tin-zinc-based leadless solder alloy is added with the phosphorus of 0.001-0.09% by the alloy gross weight.
A kind of tin-zinc-based leadless solder alloy is added with the phosphorus of 0.12-1% by the alloy gross weight.
A kind of preparation technology of tin-zinc-based leadless solder alloy joins the tin-zinc-based leadless solder alloy mother metal with plumbago crucible is molten in resistance furnace, and wherein zinc content is 9.0% of alloy gross weight, and the surface is protected with graphite; Melting prepares alloy in vacuum induction furnace; Mother metal 100 gram melt in resistance furnace with corundum crucible and be warming up to 370 ℃, coat the red phosphorus powder, be pressed into also stirring of melt rapidly, be incubated and be cooled to 290-320 ℃ after 10 minutes, be cast into the pole of φ 20mm with swage with tinfoil paper.
A kind of preparation technology of tin-zinc-based leadless solder alloy joins the tin-zinc-based leadless solder alloy mother metal with plumbago crucible is molten in resistance furnace, and wherein zinc content is 9.0% of alloy gross weight, and the surface is protected with graphite; Add single or blended lanthanum and cerium in vacuum induction furnace, melting prepares master alloy; Mother metal 100 gram melt in resistance furnace with corundum crucible and be warming up to 350 ℃, coat the red phosphorus powder, be pressed into also stirring of melt rapidly, be incubated and be cooled to 290-320 ℃ after 10 minutes, be cast into the pole of φ 20mm with swage with tinfoil paper.
Advantage of the present invention: add phosphorus and can suppress the alloy melt surface oxidation; Add a spot of rare earth and can reduce the alloy melt surface tension.The two directly and indirectly improves the wettability of alloy melt to copper respectively.Weigh the wettability of alloy with the test of copper surface spreading to copper, the red brass that adds a spot of phosphorus or rare earth significantly improves than simple red brass wettability, though relative wettability does not also reach the level of tinsel, but its wettability has reached the level of industrial application; The phosphorated tinsel is not leaded, meets the development trend of lead-free brazing; Zinc content is that 9.0% tin Zn based alloy of alloy gross weight is 198 ℃ at its eutectic point fusing point, its eutectic point fusing point is almost constant behind the phosphorus of interpolation 0.001-1%, also near wiping solder, easily with existing circuit sheet material, electronics soldering production technique and hardware compatibility; Its intensity is higher than the tin Pb alloy, thereby work-ing life and reliability are higher; With respect to other unleaded Welding Sn-Zn material alloy that adds silver, bismuth, indium, the multiple constituent element of phosphorus, the present invention adds phosphorus, rare earth, and the cost of additive is comparatively cheap, and preparation technology is simple, and good development potentiality is arranged.Comprehensive considering various effects, the present invention has cost performance and practicality preferably.
The present invention found through experiments and adds phosphorus, lanthanum, cerium simultaneously and synergy is arranged, the effect that its relative wetting areas is higher than independent interpolation phosphorus and adds lanthanum, cerium separately.In addition in the solder field, the solder alloy of other non-tin zinc-bases has the report of micro-composite additives such as adding silver, bismuth, indium and phosphorus, and the addition of phosphorus is controlled at 0.01-0.1% more under the simultaneous state of other additives.The present invention finds by the contrast experiment, the addition of phosphorus is greater than 0.01% and add separately, the wettability of the solder of tin zinc-base is had more significantly improve, and has broken conventional thinking, and because do not adopt other trace mineral supplements of interpolation, the solder manufacture craft of tin zinc-base is simple.The addition of phosphorus is higher than 0.1% and add separately, the wettability of the solder of tin zinc-base is had more significantly improve equally.The present invention also by adding the heavy rare earth element yttrium, finds that yttrium improves DeGrain to the wettability of the solder of tin zinc-base, screens by experiment with the interpolation scheme of phosphorus compound lanthanum, cerium to draw.
Description of drawings:
Fig. 1 is for adding phosphorus content and add lanthanum, cerium mixed light rare earth content, and add phosphorus and lanthanum, cerium mixed light rare earth jointly, add in the heavy rare earth element yttrium to the impact effect figure of red brass to the wettability of copper.
Wherein the weight ratio of lanthanum and cerium is 1: 1.
Ordinate zou is the ratio of wetting areas with the traditional tin-lead solder alloy wetting areas of red brass under the equal conditions.Wherein zinc content is 9.0% of red brass gross weight; Lead content is 37% of a tinsel gross weight in traditional tin-lead solder alloy of contrast.
Wherein the optimum addition of P+La+Ce phosphorus, lanthanum, cerium is respectively 0.042% of alloy gross weight; 0.01%; 0.01%;
The content that adds metal Y yttrium separately is 0.025% of alloy gross weight.
Specific embodiment
Embodiment 1:
A kind of preparation technology of tin-zinc-based leadless solder alloy joins the tin-zinc-based leadless solder alloy mother metal with plumbago crucible is molten in resistance furnace, and wherein zinc content is 9.0% of alloy gross weight, and the surface is protected with graphite; Recording prepared mother metal fusing point is 198 ℃.Melting prepares alloy in vacuum induction furnace; Mother metal 100 gram melt in resistance furnace with corundum crucible and be warming up to 370 ℃, coat the red phosphorus powder, be pressed into also stirring of melt rapidly, be incubated and be cooled to 300 ℃ after 10 minutes, be cast into the pole of φ 20mm with swage with tinfoil paper.
Molten as stated above tin zinc base alloy of having joined a series of different phosphate content is measured for wettability; Zinc content is 37% of tinsel gross weight in traditional tin-lead solder alloy of contrast.This wiping solder alloy bar is a commercial Yunnan Xi Chang product.Different phosphate content can be referring to accompanying drawing to the influence of relative wetting and spreading area effect.
Each alloy characterizes with its spreading area at red copper surface the wettability of copper.Measuring method is: the annealed red copper sheet with 600#SiC sand papering scale removal, and is cleaned with ethanol.It is placed on it to get the 10g alloy, and covers with colophonium powder, is warming up to 285 ℃ in drying oven, be incubated taking-up after 60 seconds, to be cooledly measures spreading area to room temperature.Every kind of alloy comprises that the wetting and spreading experiment of the wiping solder alloy of the commercial Yunnan Xi Chang that supplies contrast usefulness is done three times, and spreading area is got its mean value, and with its per-cent with respect to wiping solder alloy spreading area, promptly spreading area is represented relatively.Accompanying drawing 1 hollow core round spot has marked the gained result, and wherein content is that to represent zinc content be the wettability level of 9.0% tin zinc mother metal of alloy gross weight for 0 point.The result shows, the red brass wettability of several interpolation trace amounts of phosphorus is that 9.0% pure tin zinc alloy of alloy gross weight all is significantly increased with respect to zinc content, wherein the best wetting and spreading area of effect reaches 71% of wiping solder alloy wetting and spreading area, have only 45% relative wetting and spreading area with respect to the pure tin zinc alloy, be greatly improved.
Embodiment 2:
A kind of preparation technology of tin-zinc-based leadless solder alloy joins the tin-zinc-based leadless solder alloy mother metal with plumbago crucible is molten in resistance furnace, and wherein zinc content is 9.0% of alloy gross weight, and the surface is protected with graphite; Recording prepared mother metal fusing point is 198 ℃.Add single or blended lanthanum and cerium in vacuum induction furnace, melting prepares master alloy; Mother metal 100 gram melt in resistance furnace with corundum crucible and be warming up to 350 ℃, be pressed into also stirring of melt rapidly, be incubated and be cooled to 290 ℃ after 10 minutes, be cast into the pole of φ 20mm with swage
Molten as stated above tin zinc base alloy of having joined a series of different phosphate content is measured for wettability; Zinc content is 37% of tinsel gross weight in traditional tin-lead solder alloy of contrast.This wiping solder alloy bar is a commercial Yunnan Xi Chang product.Each alloy characterizes with its spreading area at red copper surface the wettability of copper.Measuring method is: identical with the method that is adopted among the embodiment 1.Solid round spot has marked the gained result in the accompanying drawing 1, and wherein content is the wettability level that 0 point is represented tin 9%wt zinc mother metal.The result shows, micro-lanthanum of several interpolations and cerium the red brass wettability be that 9.0% pure tin zinc alloy of alloy gross weight all is significantly increased with respect to zinc content, wherein the best wetting and spreading area of effect reaches 64% of wiping solder alloy wetting and spreading area, have only 45% relative wetting and spreading area with respect to the pure tin zinc alloy, be greatly improved.Embodiment 3
A kind of preparation technology of tin-zinc-based leadless solder alloy joins the tin-zinc-based leadless solder alloy mother metal with plumbago crucible is molten in resistance furnace, and wherein zinc content is 9.0% of alloy gross weight, and the surface is protected with graphite; Recording prepared mother metal fusing point is 198 ℃.In vacuum induction furnace, add single or blended lanthanum and cerium, melting prepares master alloy, mother metal 100 gram is melted in resistance furnace with corundum crucible and be warming up to 370 ℃, coat master alloy with tinfoil paper, be pressed into melt and stirring rapidly, coat the red phosphorus powder with tinfoil paper then, be pressed into melt and stirring rapidly, be incubated and be cooled to 290 ℃ after 10 minutes, be cast into the pole of φ 20mm with swage.
Molten as stated above to have joined phosphorus content be 0.009% of gross weight, and weight ratio is that 1: 1 lanthanum, cerium mishmetal content is 0.062% tin zinc base alloy of gross weight, measures for wettability; For zinc content in traditional tin-lead solder alloy of contrast is 37% of tinsel gross weight.This wiping solder alloy bar is a commercial Yunnan Xi Chang product.Each alloy characterizes with its spreading area at red copper surface the wettability of copper.Measuring method is: identical with the method that is adopted among the embodiment 1.The solid diamond point has marked the gained result in the accompanying drawing 1, and wherein content is the wettability level that 0 point is represented tin 9%wt zinc mother metal.The result shows, its wettability is that 9.0% pure tin zinc alloy of alloy gross weight is significantly increased with respect to zinc content, and the wetting and spreading area reaches 73% of wiping solder alloy wetting and spreading area, is greatly improved with respect to the pure tin zinc alloy.The relative wetting and spreading area that the relative wetting and spreading area 73% of the compound interpolation phosphorus of present embodiment, lanthanum, cerium adds lanthanum, cerium with independent interpolation phosphorus, is separately compared, and also increases.Proof phosphorus, lanthanum, cerium have synergy.
Embodiment 4:
A kind of tin-zinc-based leadless solder alloy, its zinc content is 4～11% of alloy gross weight, remaining is tin, also is added with the phosphorus of 0.001-1% by the alloy gross weight.All the other preparation methods are with embodiment 3.The contrast experiment of wetting and spreading area is with reference to embodiment 1 relatively.
Embodiment 5:
A kind of tin-zinc-based leadless solder alloy, its zinc content is 4～11% of alloy gross weight, remaining is tin, also is added with the single of 0.001-0.5% or blended lanthanum and cerium by the alloy gross weight.All the other preparation methods are with embodiment 3.The contrast experiment of wetting and spreading area is with reference to embodiment 1 relatively.
Embodiment 5:
A kind of tin-zinc-based leadless solder alloy is added with the phosphorus of 0.001-0.09% by the alloy gross weight.All the other preparation methods are with embodiment 3.The contrast experiment of wetting and spreading area is with reference to embodiment 1 relatively.
Embodiment 6:
A kind of tin-zinc-based leadless solder alloy is added with the phosphorus of 0.12-1% by the alloy gross weight.All the other preparation methods are with embodiment 3.The contrast experiment of wetting and spreading area is with reference to embodiment 1 relatively.
Embodiment 7:
A kind of preparation technology of tin-zinc-based leadless solder alloy joins the tin-zinc-based leadless solder alloy mother metal with plumbago crucible is molten in resistance furnace, and wherein zinc content is 9.0% of alloy gross weight, and the surface is protected with graphite; Melting prepares alloy in vacuum induction furnace; Mother metal 1010 gram melt in resistance furnace with corundum crucible and be warming up to 370 ℃, coat the red phosphorus powder, be pressed into also stirring of melt rapidly, be incubated and be cooled to 290 ℃ after 10 minutes, be cast into the pole of φ 20mm with swage with tinfoil paper.All the other preparation methods are with embodiment 3.The contrast experiment of wetting and spreading area is with reference to embodiment 1 relatively.
Embodiment 8:
A kind of preparation technology of tin-zinc-based leadless solder alloy is characterized in that: join the tin-zinc-based leadless solder alloy mother metal with plumbago crucible is molten in resistance furnace, wherein zinc content is 9.0% of alloy gross weight, and the surface is protected with graphite; Add single or blended lanthanum and cerium in vacuum induction furnace, melting prepares master alloy; Mother metal 880 gram melt in resistance furnace with corundum crucible and be warming up to 350 ℃, coat the red phosphorus powder, be pressed into also stirring of melt rapidly, be incubated and be cooled to 320 ℃ after 10 minutes, be cast into the pole of φ 20mm with swage with tinfoil paper.All the other preparation methods are with embodiment 3.The contrast experiment of wetting and spreading area is with reference to embodiment 1 and accompanying drawing relatively.
Embodiment 9:
A kind of preparation technology of tin-zinc-based leadless solder alloy joins the tin-zinc-based leadless solder alloy mother metal with plumbago crucible is molten in resistance furnace, and wherein zinc content is 9.0% of alloy gross weight, and the surface is protected with graphite; Melting prepares alloy in vacuum induction furnace; Mother metal 1250 gram melt in resistance furnace with corundum crucible and be warming up to 370 ℃, coat the red phosphorus powder, be pressed into also stirring of melt rapidly, be incubated and be cooled to 290 ℃ after 10 minutes, be cast into the pole of φ 20mm with swage with tinfoil paper.All the other preparation methods are with embodiment 3.The contrast experiment of wetting and spreading face is with reference to embodiment 1 and accompanying drawing relatively.
Embodiment 10:
A kind of preparation technology of tin-zinc-based leadless solder alloy is characterized in that: join the tin-zinc-based leadless solder alloy mother metal with plumbago crucible is molten in resistance furnace, wherein zinc content is 9.0% of alloy gross weight, and the surface is protected with graphite; Add single or blended lanthanum and cerium in vacuum induction furnace, melting prepares master alloy; 5 kilograms of mother metals are melted in resistance furnace with corundum crucible and be warming up to 350 ℃, coat the red phosphorus powder, be pressed into melt rapidly and stir, be incubated and be cooled to 320 ℃ after 10 minutes, be cast into the pole of φ 20mm with swage with tinfoil paper.All the other preparation methods are with embodiment 3.The contrast experiment of wetting and spreading area is with reference to embodiment 1 and accompanying drawing relatively.
Embodiment 11:
A kind of tin-zinc-based leadless solder alloy, its zinc content is 4% of alloy gross weight, remaining is tin, also is added with 0.001% single or blended lanthanum and cerium by the alloy gross weight.Also be added with 0.001% phosphorus by the alloy gross weight.All the other preparation methods are with embodiment 3.The contrast experiment of wetting and spreading area is with reference to embodiment 1 and accompanying drawing relatively.
Embodiment 12:
A kind of tin-zinc-based leadless solder alloy, its zinc content is 11% of alloy gross weight, remaining is tin, also is added with 0.5% single or blended lanthanum and cerium by the alloy gross weight.Also be added with 1% phosphorus by the alloy gross weight.All the other preparation methods are with embodiment 3.The contrast experiment of wetting and spreading face is with reference to embodiment 1 and accompanying drawing relatively.
Embodiment 13:
A kind of tin-zinc-based leadless solder alloy, its zinc content is 5% of alloy gross weight, remaining is tin, also is added with 0.01% lanthanum by the alloy gross weight.Also be added with 0.01% phosphorus by the alloy gross weight.All the other preparation methods are with embodiment 3.The contrast experiment of wetting and spreading face is with reference to embodiment 1 and accompanying drawing relatively.
Embodiment 14:
A kind of tin-zinc-based leadless solder alloy, its zinc content is 6% of alloy gross weight, remaining is tin, also is added with 0.1% cerium by the alloy gross weight.Also be added with 0.1% phosphorus by the alloy gross weight.All the other preparation methods are with embodiment 3.The contrast experiment of wetting and spreading face is with reference to embodiment 1 and accompanying drawing relatively.
Embodiment 15:
A kind of tin-zinc-based leadless solder alloy, its zinc content is 7% of alloy gross weight, remaining is tin, also is added with 0.2% lanthanum and 0.3% cerium by the alloy gross weight.Also be added with 0.3% phosphorus by the alloy gross weight.All the other preparation methods are with embodiment 3.The contrast experiment of wetting and spreading face is with reference to embodiment 1 and accompanying drawing relatively.
Embodiment 16:
A kind of tin-zinc-based leadless solder alloy, its zinc content is 8% of alloy gross weight, remaining is tin, also is added with 0.05% lanthanum and 0.1% cerium by the alloy gross weight., also be added with 0.5% phosphorus by the alloy gross weight.All the other preparation methods are with embodiment 3.The contrast experiment of wetting and spreading face is with reference to embodiment 1 and accompanying drawing relatively.
Embodiment 17:
A kind of preparation technology of tin-zinc-based leadless solder alloy joins tin-zinc base lead-free solder alloy mother metal with plumbago crucible is molten in resistance furnace, and wherein zinc content is 8.0% of alloy gross weight, and the surface is protected with graphite; Add single or blended lanthanum and cerium in vacuum induction furnace, melting prepares master alloy; Mother metal 150 gram melt in resistance furnace with corundum crucible and be warming up to 340 ℃, coat the red phosphorus powder, be pressed into also stirring of melt rapidly, be incubated and be cooled to 300 ℃ after 8 minutes, be cast into the pole of φ 18mm with swage with tinfoil paper.All the other preparation methods are with embodiment 3.The contrast experiment of wetting and spreading face is with reference to embodiment 1 and accompanying drawing relatively.Embodiment 18:
A kind of tin-zinc-based leadless solder alloy, its zinc content are the 7-9% of alloy gross weight, and remaining is tin, also are added with separately or add phosphorus, lanthanum, cerium jointly by the alloy gross weight.The contrast experiment of wetting and spreading face is with reference to embodiment 1 relatively, and the preparation method is with embodiment 3.
The relative wetting and spreading area correlation data of part is as follows:
| Sequence number | Zinc % | Phosphorus % | Lanthanum % | Cerium % | The tin % of surplus | Relative wetting and spreading % |
| 2003511 | ?9 | ?0.042 | ?0.01 | ?0.01 | ?90.94 | ?73 |
| 2003512 | ?9 | ?0.3 | ?0.02 | ?0.02 | ?90.66 | ?54 |
| 2003513 | ?9 | ?0.03 | ?0.02 | ?0.02 | ?90.93 | ?64 |
| 2003514 | ?9 | ?0.006 | ?0 | ?0 | ?91.00 | ?55 |
| 2003515 | ?7 | ?0.003 | ?0.02 | ?0.02 | ?92.96 | ?53 |
| 2003516 | ?8 | ?0.006 | ?0 | ?0.02 | ?91.98 | ?57 |
| 2003517 | ?9 | ?0.005 | ?0.02 | ?0 | ?90.98 | ?60 |
| 2003518 | ?9 | ?0.005 | ?0 | ?0.02 | ?90.98 | ?61 |
| 2003519 | ?9 | ?0.2 | ?0.02 | ?0.02 | ?90.76 | ?57 |
| 2003520 | ?9 | ?0.3 | ?0.02 | ?0.02 | ?90.66 | ?54 |
| 2003521 | ?9 | ?0.5 | ?0 | ?0 | ?90.50 | ?52 |
| 2003522 | ?9 | ?1.0 | ?0 | ?0 | ?90.00 | ?53 |
Can find that from above-mentioned data the addition of phosphorus is greater than 0.01% and add separately, the wettability of the solder of tin zinc-base is had more significantly improve, and because do not need to add other trace mineral supplements, the solder manufacture craft of tin zinc-base be simple.The addition of phosphorus is higher than 0.1% and add separately, according to the preparation method of embodiment 3, the wettability of the solder of tin zinc-base is had more significantly improve equally.According to the present invention, add phosphorus separately, can obtain wetting and spreading face tin-zinc-based leadless solder alloy preferably with simple technology, better the wetting and spreading face can add lanthanum, cerium more if desired.
Claims (4)
1, a kind of tin-zinc-based leadless solder alloy, its zinc content is 4～11% of alloy gross weight, remaining is tin, it is characterized in that: the phosphorus that is added with 0.001-1% by the alloy gross weight.
2, a kind of tin-zinc-based leadless solder alloy as claimed in claim 1 is characterized in that: also be added with the single of 0.001-0.5% or blended lanthanum and cerium by the alloy gross weight.
3, the preparation technology of a kind of tin-zinc-based leadless solder alloy as claimed in claim 1 is characterized in that: join the tin-zinc-based leadless solder alloy mother metal with plumbago crucible is molten in resistance furnace, wherein zinc content is 9.0% of alloy gross weight, and the surface is protected with graphite; Melting prepares alloy in vacuum induction furnace; Mother metal 100 gram melt in resistance furnace with corundum crucible and be warming up to 370 ℃, coat the red phosphorus powder, be pressed into also stirring of melt rapidly, be incubated and be cooled to 290-320 ℃ after 10 minutes, be cast into the pole of φ 20mm with swage with tinfoil paper.
4, the preparation technology of the described a kind of tin-zinc-based leadless solder alloy of claim 2 is characterized in that: join the tin-zinc-based leadless solder alloy mother metal with plumbago crucible is molten in resistance furnace, wherein zinc content is 9.0% of alloy gross weight, and the surface is protected with graphite; Add single or blended lanthanum and cerium in vacuum induction furnace, melting prepares master alloy; Mother metal 100 gram melt in resistance furnace with corundum crucible and be warming up to 350 ℃, coat the red phosphorus powder, be pressed into also stirring of melt rapidly, be incubated and be cooled to 290-320 ℃ after 10 minutes, be cast into the pole of φ 20mm with swage with tinfoil paper.
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| CN101585120B (en) * | 2009-06-29 | 2012-08-22 | 铜陵森泰金属材料有限公司 | Tin-zinc-based leadless solder alloy |
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| CN108866364A (en) * | 2018-06-04 | 2018-11-23 | 深圳市亿铖达工业有限公司 | A method of oxidizable element is added into Sn base solder |
| CN110468302A (en) * | 2019-08-26 | 2019-11-19 | 封安钰 | A kind of manufacturing method of the strong Sn-P-Cu alloy part of wear-resisting, heatproof, seizure resistance |
| CN110819845A (en) * | 2019-11-20 | 2020-02-21 | 四川朗峰电子材料有限公司 | Preparation method of tin-phosphorus oxidation resistant alloy |
| WO2020118613A1 (en) * | 2018-12-13 | 2020-06-18 | 北京联金高新科技有限公司 | Sn-zn lead-free solder material and preparation method therefor |
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2003
- 2003-07-25 CN CN 03128396 patent/CN1235718C/en not_active Expired - Fee Related
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| CN100366376C (en) * | 2005-12-23 | 2008-02-06 | 南京航空航天大学 | Leadless brazing filler metal containing cerium |
| CN1974108B (en) * | 2006-08-21 | 2011-02-09 | 南昌大学 | Hypoeutectic no-lead SnZn alloy brazing alloy |
| CN101585120B (en) * | 2009-06-29 | 2012-08-22 | 铜陵森泰金属材料有限公司 | Tin-zinc-based leadless solder alloy |
| WO2014032215A1 (en) * | 2012-08-28 | 2014-03-06 | 苏州金仓合金新材料有限公司 | Environmentally friendly tin, zinc and manganese alloy bar for welding and preparation method therefor |
| CN103831543B (en) * | 2012-11-23 | 2016-08-24 | 吴永恒 | Leadless welding material and preparation method thereof |
| CN103831543A (en) * | 2012-11-23 | 2014-06-04 | 吴永恒 | Lead-free soldering material and preparing method thereof |
| CN104588909A (en) * | 2014-12-11 | 2015-05-06 | 徐国华 | Environment-friendly lead-free solder and preparation method |
| CN107848076A (en) * | 2015-07-27 | 2018-03-27 | 住友金属矿山株式会社 | Coated solder line and its manufacture method |
| CN108188613A (en) * | 2017-11-28 | 2018-06-22 | 深圳市福摩索金属制品有限公司 | A kind of active solder and its preparation method and application |
| CN108188613B (en) * | 2017-11-28 | 2020-06-09 | 深圳市福摩索金属制品有限公司 | Active solder and preparation method and application thereof |
| CN108866364A (en) * | 2018-06-04 | 2018-11-23 | 深圳市亿铖达工业有限公司 | A method of oxidizable element is added into Sn base solder |
| CN108866364B (en) * | 2018-06-04 | 2020-08-07 | 深圳市亿铖达工业有限公司 | Method for adding easily-oxidizable elements into Sn-based brazing filler metal |
| WO2020118613A1 (en) * | 2018-12-13 | 2020-06-18 | 北京联金高新科技有限公司 | Sn-zn lead-free solder material and preparation method therefor |
| CN110468302A (en) * | 2019-08-26 | 2019-11-19 | 封安钰 | A kind of manufacturing method of the strong Sn-P-Cu alloy part of wear-resisting, heatproof, seizure resistance |
| CN110819845A (en) * | 2019-11-20 | 2020-02-21 | 四川朗峰电子材料有限公司 | Preparation method of tin-phosphorus oxidation resistant alloy |
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