CN108188613A - A kind of active solder and its preparation method and application - Google Patents
A kind of active solder and its preparation method and application Download PDFInfo
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- CN108188613A CN108188613A CN201711217784.3A CN201711217784A CN108188613A CN 108188613 A CN108188613 A CN 108188613A CN 201711217784 A CN201711217784 A CN 201711217784A CN 108188613 A CN108188613 A CN 108188613A
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- Prior art keywords
- solder
- active
- active solder
- alloy
- mass percentage
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 87
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 36
- 239000000956 alloy Substances 0.000 claims abstract description 36
- 238000003466 welding Methods 0.000 claims abstract description 28
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052742 iron Inorganic materials 0.000 claims abstract description 6
- 238000005476 soldering Methods 0.000 claims abstract description 6
- 239000011701 zinc Substances 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 15
- 229910052718 tin Inorganic materials 0.000 claims description 15
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 14
- 229910052725 zinc Inorganic materials 0.000 claims description 14
- 239000010936 titanium Substances 0.000 claims description 12
- 229910052684 Cerium Inorganic materials 0.000 claims description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 11
- 238000005266 casting Methods 0.000 claims description 11
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 11
- 229910052719 titanium Inorganic materials 0.000 claims description 11
- 239000000725 suspension Substances 0.000 claims description 7
- 238000001816 cooling Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000000498 cooling water Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 9
- 229910052709 silver Inorganic materials 0.000 abstract description 9
- 239000004332 silver Substances 0.000 abstract description 9
- 239000000843 powder Substances 0.000 abstract description 7
- 230000000052 comparative effect Effects 0.000 description 15
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 3
- 238000004321 preservation Methods 0.000 description 2
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photovoltaic Devices (AREA)
Abstract
The invention discloses a kind of active solders, are prepared by the component as follows in terms of mass percentage：Zn3 10%, Ti1 3%, Ce0.01 0.1%, Sn35 45% and surplus Pb；The sum of mass percentage of said components is 100%.The present invention also provides a kind of preparation methods of active solder.The present invention also provides a kind of applications of active solder.The active solder of the present invention has good welds performance at a temperature of less than 220 DEG C, use ultrasonic wave soldering iron, circuit is directly welded in photovoltaic battery panel, substitute silver paste, the welding for being coated with the activated solder is subjected to connection in series-parallel welding simultaneously, and scaling powder is not needed to, and activated solder junction has compared with low contact resistance and its higher-strength, while the cost of alloy is relatively low.
Description
Technical field
The present invention relates to photovoltaic battery panel fields more particularly to a kind of active solder and its preparation method and application.
Background technology
Photovoltaic battery panel is also known as solar panel, is to be assembled in one by certain way by several solar cell modules
Assembly on block plate, usually as a unit of photovoltaic arrays.Single solar cell cannot directly do power supply use.Make electricity
Several single battery series and parallels must be connected and tightly be packaged into component by source.Solar cell module (is also solar cell
Plate) it is most important part in core and solar power system in solar power system, effect is will too
Sun, which can be converted into electric energy or be sent in accumulator, stores or pushes loaded work piece, the quality and cost of solar panel
It will directly determine whole system quality and cost.At present, photovoltaic cell plate serioparallel is to be acted on by tin-coated copper strip in scaling powder
It is lower to weld together with photovoltaic battery panel printing silver layer.
But there are following defects for existing photovoltaic battery panel series-parallel system：
The technique of existing photovoltaic battery panel series-parallel system needs to use printing silver paste, increases cost；Also using to helping
Solder flux, scaling powder welding and with certain corrosivity shorten life of product.
Invention content
It, should it is an object of the present invention to improving a kind of active solder for overcome the deficiencies in the prior art
PbSnZnTiCe active solders have good welds performance at a temperature of less than 220 DEG C, using ultrasonic wave soldering iron, in photovoltaic electric
Pond plate directly welds circuit, substitutes silver paste, while the welding for being coated with the activated solder is carried out connection in series-parallel welding, and do not need to help
Solder flux, and activated solder junction has compared with low contact resistance and its higher-strength, while the cost of alloy is relatively low.
The second object of the present invention is to provide a kind of preparation method of active solder, and this method step is simple, easy to operate,
Active solder good welding performance obtained.
The third object of the present invention is to provide a kind of application of active solder, active solder is applied in welding photovoltaic electric
In the plate of pond, circuit is directly welded in photovoltaic battery panel, substitutes silver paste, while the welding for being coated with the activated solder is subjected to connection in series-parallel
Welding, and do not need to scaling powder.
An object of the present invention adopts the following technical scheme that realization：
A kind of active solder is prepared by the component as follows in terms of mass percentage：
Surplus is Pb；
The sum of mass percentage of said components is 100%.
Further, active solder is prepared by the component as follows in terms of mass percentage：
Surplus is Pb；
The sum of mass percentage of said components is 100%.
Further, active solder is prepared by the component as follows in terms of mass percentage：
The second object of the present invention adopts the following technical scheme that realization：
A kind of preparation method of active solder, including,
Material preparation step：Metallic zinc, titanium, cerium, tin and lead are weighed by proportioning, it is spare；
Molten alloy step：Titanium, cerium and tin are put into vacuum magnetic suspension crucible, then heated, sequentially add zinc and
Lead, heat preservation, obtains alloy, and alloy is poured into formation solder column in casting rod mold；
Pressing steps：Solder column is squeezed into solder line, solder band or solder item, obtains active solder.
Further, in molten alloy step, titanium, cerium and tin is put into vacuum magnetic suspension crucible, are then heated to
1900-2100 DEG C, after heating, 480-520 DEG C is cooled to, sequentially adds zinc and lead.
Further, in molten alloy step, after adding in zinc and lead, 25-35min is kept the temperature, obtains alloy.
Further, in molten alloy step, alloy is cooled to 250-300 DEG C, then the alloy is poured into casting rod mold.
Further, in molten alloy step, with recirculated cooling water in casting rod mold, circulating cooling coolant-temperature gage is 5-20
℃。
The third object of the present invention adopts the following technical scheme that realization：
A kind of application of active solder in photovoltaic battery panel is welded.
Further, applying step is as follows：Active solder is put into tin bath first and is melted, activity is plated in copper strip surface
Solder obtains welding, then welding is welded to solar panel with ultrasonic wave soldering iron, obtains welding photovoltaic battery panel.
Compared with prior art, the beneficial effects of the present invention are：
(1) active solder of the invention, the PbSnZnTiCe active solders have good weldering at a temperature of less than 220 DEG C
Performance is connect, using ultrasonic wave soldering iron, circuit is directly welded in photovoltaic battery panel, substitutes silver paste, while the activated solder will be coated with
Welding carry out connection in series-parallel welding, and do not need to scaling powder, and activated solder junction has compared with low contact resistance and its higher
Intensity, while the cost of alloy is relatively low；
(2) preparation method of the invention, this method step is simple, easy to operate, active solder good welding performance obtained；
(3) application of active solder of the present invention applies active solder in photovoltaic battery panel is welded, in photovoltaic battery panel
Circuit is directly welded, substitutes silver paste, while the welding for being coated with the activated solder is subjected to connection in series-parallel welding, and do not need to help weldering
Agent.
Description of the drawings
Fig. 1 is the welding effect figure of embodiment 1；
Fig. 2 is the welding effect figure of comparative example 1.
Specific embodiment
In the following, with reference to attached drawing and specific embodiment, the present invention is described further, it should be noted that not
Under the premise of conflicting, new implementation can be formed between various embodiments described below or between each technical characteristic in any combination
Example.
A kind of active solder is prepared by the component as follows in terms of mass percentage：
Surplus is Pb；
The sum of mass percentage of said components is 100%.
As the mode that further carries out, active solder is prepared by the component as follows in terms of mass percentage：
Surplus is Pb；
The sum of mass percentage of said components is 100%.
As the mode that further carries out, active solder is prepared by the component as follows in terms of mass percentage：
The preparation method of above-mentioned active solder, including,
Material preparation step：Metallic zinc, titanium, cerium, tin and lead are weighed by proportioning, it is spare；
Molten alloy step：Titanium, cerium and tin are put into vacuum magnetic suspension crucible, then heated, sequentially add zinc and
Lead, heat preservation, obtains alloy, and alloy is poured into formation solder column in casting rod mold；
Pressing steps：Solder column is squeezed into solder line, solder band or solder item, obtains active solder.
As the mode that further carries out, in molten alloy step, titanium, cerium and tin are put into vacuum magnetic suspension crucible,
1900-2100 DEG C, after heating is then heated to, is cooled to 480-520 DEG C, sequentially adds zinc and lead.
As the mode that further carries out, in molten alloy step, after adding in zinc and lead, 25-35min is kept the temperature, is closed
Gold.
As the mode that further carries out, in molten alloy step, alloy is cooled to 250-300 DEG C, then the alloy is fallen
Enter in casting rod mold.
As the mode that further carries out, in molten alloy step, with recirculated cooling water, circulating cooling in casting rod mold
Coolant-temperature gage is 5-20 DEG C.
Application of the above-mentioned active solder in photovoltaic battery panel is welded.
As the mode that further carries out, applying step is as follows：Active solder is put into tin bath first and is melted, in copper
Belt surface plates activated solder, obtains welding, then welding is welded to solar panel with ultrasonic wave soldering iron, obtains welding photovoltaic cell
Plate.
It is specific embodiment of the present invention below, used raw material, equipment etc. remove special limit in the following embodiments
It can be obtained outside fixed by buying pattern.
Embodiment 1-7：
The active solder of embodiment 1-7 is prepared by the component as follows in terms of mass percentage.
The proportioning of 1 embodiment 1-7 of table
| Pb | Sn | Zn | Ti | Ce | |
| Embodiment 1 | 53.94% | 38.2% | 6.5% | 1.3% | 0.06% |
| Embodiment 2 | 57.44 | 38.2% | 3% | 1.3% | 0.06% |
| Embodiment 3 | 50.24% | 38.2% | 6.5% | 5% | 0.06% |
| Embodiment 4 | 53.99% | 35% | 10% | 1% | 0.01% |
| Embodiment 5 | 47.90% | 45% | 4% | 3% | 0.1% |
| Embodiment 6 | 54.85% | 37% | 7% | 1.1% | 0.05% |
| Embodiment 7 | 52.42% | 39% | 7% | 1.5% | 0.08% |
The preparation method of the active solder of embodiment 1-7 follows these steps to carry out, including,
Material preparation step：Metallic zinc, titanium, cerium, tin and lead are weighed by proportioning, it is spare；
Molten alloy step：Titanium, cerium and tin are put into vacuum magnetic suspension crucible, are then heated to 1900-2100 DEG C, is added
After heat, 480-520 DEG C is cooled to, sequentially adds zinc and lead, 25-35min is kept the temperature, obtains alloy, alloy is cooled to 250-300
DEG C, alloy is poured into formation solder column in casting rod mold, recirculated cooling water is carried in casting rod mold, circulating cooling coolant-temperature gage is 5-
20℃；
Pressing steps：Solder column is squeezed into solder line, solder band or solder item, obtains active solder.
Comparative example 1：
Using Sn63Pb37+ scaling powders as comparative example 1.
Comparative example 2：
2 difference from Example 1 of comparative example is, without Zn in comparative example 2.
Comparative example 3：
2 difference from Example 1 of comparative example is, without Ti in comparative example 2.
Effect assessment and performance detection
First, comparative example 1-3 and embodiment 1-7 is subjected to pulling force and resistance test, it is as a result as follows.
2 the performance test results of table
As can be seen from Table 2, embodiment 1-3 is better than embodiment 5-7, wherein embodiment 1 is optimum embodiment, and embodiment 1-7
Comparative example 2-3 is superior to, the effect for illustrating the active solder of the present invention is to cooperate with to obtain according to the proportioning of component and component.This hair
The active solder of bright embodiment 1-9 is often compared with photovoltaic cell with solder, that is, comparative example 1SN63Pb37+Flux, and resistance is low, is drawn
Power is suitable with its, this illustrates that the active solder of the present invention can substitute comparative example 1 completely, and the activated solder of the present invention is combined and connect
Head is manufactured in the case of without using scaling powder or independent of silver (Ag) layer of deposition, this manufactures solar panel
Technique is more cost effective, eliminates silver, eliminates silver-plated step, and eliminates the needs of cleaning and/or smog of divulging information.
2nd, welding result
Embodiment 1 and comparative example 1 are welded on photovoltaic battery panel, by Fig. 1-2 as it can be seen that the active solder weldering of embodiment 1
Connect cavity less, the welding cavity of comparative example 1 is more, this illustrates that the active solder welding effect of the present invention is good.
The above embodiment is only the preferred embodiment of the present invention, it is impossible to the scope of protection of the invention is limited with this,
The variation and replacement for any unsubstantiality that those skilled in the art is done on the basis of the present invention belong to institute of the present invention
Claimed range.
Claims (10)
1. a kind of active solder, which is characterized in that it is prepared by the component as follows in terms of mass percentage：
The sum of mass percentage of said components is 100%.
2. active solder as described in claim 1, which is characterized in that it is by the component system as follows in terms of mass percentage
It is standby to form：
The sum of mass percentage of said components is 100%.
3. active solder as described in claim 1, which is characterized in that it is by the component system as follows in terms of mass percentage
It is standby to form：
It is 4. a kind of such as the preparation method of claim 1-3 any one of them active solders, it is characterised in that including,
Material preparation step：Metallic zinc, titanium, cerium, tin and lead are weighed by proportioning, it is spare；
Molten alloy step：Titanium, cerium and tin are put into vacuum magnetic suspension crucible, then heated, sequentially adds zinc and lead, is protected
Temperature obtains alloy, and alloy is poured into formation solder column in casting rod mold；
Pressing steps：Solder column is squeezed into solder line, solder band or solder item, obtains active solder.
5. the preparation method of active solder as claimed in claim 4, which is characterized in that in molten alloy step, by titanium, cerium and
Tin is put into vacuum magnetic suspension crucible, is then heated to 1900-2100 DEG C, after heating, is cooled to 480-520 DEG C, then add successively
Enter zinc and lead.
6. the preparation method of active solder as claimed in claim 5, which is characterized in that in molten alloy step, add in zinc and
After lead, 25-35min is kept the temperature, obtains alloy.
7. the preparation method of active solder as claimed in claim 4, which is characterized in that in molten alloy step, alloy cooling
It is poured into casting rod mold to 250-300 DEG C, then by the alloy.
8. the preparation method of active solder as claimed in claim 4, it is characterised in that：In molten alloy step, casting rod mold
In with recirculated cooling water, circulating cooling coolant-temperature gage is 5-20 DEG C.
It is 9. a kind of such as application of the claim 1-3 any one of them active solder in photovoltaic battery panel is welded.
10. application of the active solder as claimed in claim 9 in photovoltaic battery panel is welded, which is characterized in that applying step
It is as follows：Active solder is put into tin bath first and is melted, activated solder is plated in copper strip surface, obtains welding, then use ultrasonic wave
Welding is welded to solar panel by soldering iron, obtains welding photovoltaic battery panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711217784.3A CN108188613B (en) | 2017-11-28 | 2017-11-28 | Active solder and preparation method and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711217784.3A CN108188613B (en) | 2017-11-28 | 2017-11-28 | Active solder and preparation method and application thereof |
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| CN108188613A true CN108188613A (en) | 2018-06-22 |
| CN108188613B CN108188613B (en) | 2020-06-09 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109465567A (en) * | 2018-12-29 | 2019-03-15 | 郑州机械研究所有限公司 | A kind of diamond abrasive tool soldering active solder |
| CN110919233A (en) * | 2019-11-15 | 2020-03-27 | 东莞市输变电工程公司 | Welding flux, preparation method thereof and ignition agent |
| CN114799612A (en) * | 2022-05-27 | 2022-07-29 | 常州时创能源股份有限公司 | Photovoltaic brazing solder, and preparation method and application thereof |
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| US3744121A (en) * | 1970-08-15 | 1973-07-10 | Asahi Glass Co Ltd | Process for soldering difficultly solderable metals, such as si, ge, al, ti, zr and ta |
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| CN1235718C (en) * | 2003-07-25 | 2006-01-11 | 南昌大学 | Tin-zinc base plumbum-free solder alloy and its preparing technology |
| CN102534347A (en) * | 2010-12-31 | 2012-07-04 | 北京有色金属与稀土应用研究所 | Sn-Pb-Zn-Sb alloy and application and preparation method thereof |
| CN102319962A (en) * | 2011-08-24 | 2012-01-18 | 哈尔滨工业大学 | Sn-Zn-Ti activated brazing filler metal with melting point lower than 600 DEG C and preparation method thereof |
| CN102554491A (en) * | 2011-12-14 | 2012-07-11 | 河南科技大学 | Zn (zinc) based high-temperature lead-free soft solder and preparation method for same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109465567A (en) * | 2018-12-29 | 2019-03-15 | 郑州机械研究所有限公司 | A kind of diamond abrasive tool soldering active solder |
| CN110919233A (en) * | 2019-11-15 | 2020-03-27 | 东莞市输变电工程公司 | Welding flux, preparation method thereof and ignition agent |
| CN110919233B (en) * | 2019-11-15 | 2021-06-04 | 东莞市输变电工程公司 | Welding flux, preparation method thereof and ignition agent |
| CN114799612A (en) * | 2022-05-27 | 2022-07-29 | 常州时创能源股份有限公司 | Photovoltaic brazing solder, and preparation method and application thereof |
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