CN101092709A - Composite board of lead / copper, and production method - Google Patents
Composite board of lead / copper, and production method Download PDFInfo
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- CN101092709A CN101092709A CNA2007100984797A CN200710098479A CN101092709A CN 101092709 A CN101092709 A CN 101092709A CN A2007100984797 A CNA2007100984797 A CN A2007100984797A CN 200710098479 A CN200710098479 A CN 200710098479A CN 101092709 A CN101092709 A CN 101092709A
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Abstract
This invention discloses a method for producing Pb/Cu composite plate, which is composed of Cu plate coated with Pb or Pb alloy layer. The method adopts one or more of casting, hot dip plating, welding, rolling, hot pressing, electroplating and hot spray coating. The Pb/Cu composite plate has such advantages as high conductivity, high corrosion resistance, light weight and low cost. The Pb/Cu composite plate can be used to substitute for Pb alloy inert anode plate in electrolysis, and has reduced resistance and tank voltage (0.1-1.0 V), and uniform current distribution. The method has such advantages as simple process and low cost.
Description
Technical field
The invention belongs to the electrolysis tech field, relate in particular to used composite board of lead/copper and the production method thereof of anode in the electrolysis tech.
Background technology
It is inert anode that traditional electrolysis process generally adopts lead alloy, as lead antimony alloy, lead-calcium alloy, plumbous silver-antimony alloy, slicker solder calcium, plumbous silver-colored calcium strontium or the like, but because the resistance of lead alloy is bigger, cause bath voltage to increase, generate heat seriously, the result increases the lead content in the electrolytic production.
What research was more at present is the titanium inert anode, is matrix with the metal titanium, at precious metal or its oxide compounds such as its surface applied iridium, rutheniums.But kind electrode cost height has limited and has applied.
Therefore be badly in need of seeking that resistance is little, good conductivity and the low inert anode material of cost.
Summary of the invention
One of the object of the invention provides that a kind of good conductivity, solidity to corrosion are good, light weight and the low composite board of lead/copper of cost.
Another object of the present invention provides the production method of composite board of lead/copper.
For achieving the above object, the present invention is achieved through the following technical solutions:
A kind of composite board of lead/copper has lead or lead alloy layer 2 exactly on copper coin 1.
Above-mentioned composite board of lead/copper, its described lead alloy is meant a kind of of lead antimony alloy, lead-calcium alloy, plumbous silver-antimony alloy, slicker solder calcium, plumbous silver-colored calcium strontium etc.
The production method of above-mentioned composite board of lead/copper can adopt one or more of methods such as casting, pressure die casting, hot dip process, welding, rolling, hot pressing, plating, thermospray, obtains lead or lead alloy layer on copper coin.
The production method of above-mentioned composite board of lead/copper, its described castmethod comprises the steps: at first the copper coin surface to be carried out processing such as oil removing, cleaning, sandblast, copper coin being put into again and being filled temperature is 250～400 ℃ the fusion of lead or the rectangle crucible of lead alloy, freely cool off then, promptly get composite board of lead/copper.Present method is suitable for preparing the composite board of lead/copper of the thick lead layer of 1～100mm;
The production method of above-mentioned composite board of lead/copper, its described pressure die casting method comprises the steps: at first the copper coin surface to be carried out processing such as oil removing, cleaning, sandblast, again copper coin is put into empty rectangle crucible, under 1～40MPa pressure, carry out pressure die casting then, lead or lead alloy are injected in the slit between copper coin and the crucible, and composite board of lead/copper is prepared in cooling then.The composition board of 0.5～100mm lead or lead alloy layer can be prepared by present method, can be rolled or machining according to dimensional requirement.
The production method of above-mentioned composite board of lead/copper, its described hot dip coating method comprises the steps: the copper coin surface carried out processing such as oil removing, cleaning, sandblast, again with copper coin surface applied flux, slowly put into the rectangle crucible that fills fusion of lead or lead alloy then, kept 0.5～10 minute, again copper coin is taken out, cools off, promptly get composite board of lead/copper.Above-mentioned steps can repeatedly repeat, and makes the thickening of lead or lead alloy layer, and present method is suitable for preparing the composite board of lead/copper of the thin lead layer of 0.01～5mm.
The production method of above-mentioned composite board of lead/copper, its described welding process comprises the steps: the copper coin surface carried out processing such as oil removing, cleaning, sandblast, reusable lead or lead alloy plate encase copper coin, and with methods such as argon arc welding, flame welding or solderings lead or lead alloy plate are welded, can be rolled into desired composite board of lead/copper then as required; Perhaps the lead alloy soldering paste is coated in the copper coin surface, heats 250～400 ℃ then and make the composite board of lead/copper that copper coin surface pricker is coated with last layer 0.01～1mm lead alloy coating.
The production method of above-mentioned composite board of lead/copper, its described rolling method comprises the steps: the copper coin surface carried out processing such as oil removing, cleaning, sandblast, the lead cover that difform copper cores such as circular, square or rectangle is close with shape carries out at room temperature rolling together, deflection is 1～100%, 100～200 ℃ of annealing are carried out in the centre, but repeat-rolling makes composite board of lead/copper up to reaching requirement.
The production method of above-mentioned composite board of lead/copper, its described hot-press method comprises the steps: the copper coin surface carried out processing such as oil removing, cleaning, sandblast, with two identical lead or lead alloy plates copper coin is encased with blind groove, be placed on then in the mould that is slightly larger than stereotype outside dimension 1～5mm, heating and pressurizing on thermocompressor, processing condition are respectively 50～300 ℃, 1～30MPa, and heat-insulation pressure keeping 5～40 minutes makes composite board of lead/copper.
The production method of above-mentioned composite board of lead/copper, its described electro-plating method comprises the steps: the copper coin surface is carried out oil removing, sandblast, processing such as cleaned up, copper coin is placed plating tank as negative electrode, make lead or the lead alloy coating of 0.1～3mm, make composite board of lead/copper.
The production method of above-mentioned composite board of lead/copper, its described heat spraying method comprise the steps: with the copper coin surface carry out oil removing, clean up, processing such as sandblast, with lead or lead alloy silk, powder is raw material, adopt hot-spraying techniquess such as flame, electric arc, supersonic speed, in the coating of copper coin surface spraying 0.1～10mm, make composite board of lead/copper.
Advantage of the present invention and beneficial effect: (1), composite board of lead/copper good conductivity of the present invention, solidity to corrosion are good; (2) composite board of lead/copper light weight of the present invention, bath voltage reduces, and distribution of current is even in the inert anode plate;
(3), production method of the present invention is simple, cost is low, be easy to apply.
Description of drawings
Fig. 1 is the structural representation of composite board of lead/copper of the present invention.
1 is copper coin
2 is lead or lead alloy
Fig. 2 is the structural representation of composite board of lead/copper of the present invention.
1 is copper coin
2 is lead or lead alloy
Embodiment
Embodiment 1
Processing such as oil removing, cleaning, sandblast are carried out on 250 * 300 * 5mm copper coin surface, the copper coin of handling is put into 260 * 260 * 8mm rectangle crucible that fills fusion of lead, wherein plumbous liquid temp is 250～300 ℃, freely cools off then, makes composite board of lead/copper.
Embodiment 2
Processing such as oil removing, cleaning, sandblast are carried out on 500 * 550 * 5mm copper coin surface, put into empty 510 * 560 * 10mm rectangle crucible then, under 5～10MPa pressure, 450～480 ℃ of silver-colored calcium alloy melts of lead are pressed onto then in the slit between copper coin and the crucible, freely cool off then, make 2.5mm lead alloy/copper composition board, can be rolled or machining according to dimensional requirement.
Embodiment 3
With 500 * 550 * 5mm copper coin surface carry out oil removing, clean up, processing such as sandblast, copper coin being put into the rectangle crucible that fills the fusion of lead antimony alloy kept 2 minutes again, then cooling is proposed copper coin, the composite board of lead/copper of the thin lead antimony alloy layer of preparation 0.5mm.
Embodiment 4
With 100 * 100 * 10mm copper coin surface carry out oil removing, clean up, processing such as sandblast, the slicker solder calcium alloy plate thick with 2mm encases copper coin, and slicker solder calcium alloy plate is welded with flame welding technology, make composite board of lead/copper, be rolled as required then, processing such as annealing handles and make composite board of lead/copper.
Embodiment 5
Lead-tin alloy solder paster is coated in the copper coin surface, heats 250～400 ℃ then and make the composite board of lead/copper that copper coin surface pricker is coated with last layer 0.01～1mm pb-sn alloy plating, be rolled then, make composite board of lead/copper.
Embodiment 6
With the copper coin surface of Φ 50 * 100mm carry out oil removing, clean up, processing such as sandblast, be assemblied in lead cover with Φ 51 * Φ 80 * 101mm, at room temperature be rolled, deflection is 20%, carry out 200 ℃ of process annealings then, 1 hour, be rolled again-anneal, make the composite board of lead/copper that thickness is 40mm.
Embodiment 7
With 200 * 200 * 10mm copper coin surface carry out oil removing, clean up, processing such as sandblast, with two blocks of plumbous silver-colored calcium alloy plates of identical 4mm copper coin is encased with blind groove, be placed on then in the graphite jig that is slightly larger than stereotype outside dimension 1mm, be evacuated to 4Pa, heating and pressurizing on thermocompressor, processing condition were respectively 200 ℃, 15MPa, heat-insulation pressure keeping 30 minutes, made plumbous silver-colored calcium alloy/copper composition board.
Embodiment 8
The copper coin surface is carried out oil removing, sandblast, processing such as cleaned up, copper coin is placed plating tank as negative electrode, make the pb-sn alloy plating of 0.3mm, make composite board of lead/copper.
Embodiment 9
With the copper coin surface carry out oil removing, clean up, processing such as sandblast, be raw material with slicker solder calcium alloy silk, adopt flame plating technology, in the slicker solder calcium alloy coating of copper coin surface spraying 1mm, make composite board of lead/copper.
Embodiment 10
Choose the composite board of lead/copper of embodiment 2 plumbous silver-colored calcium alloys and embodiment 3 lead antimony alloys respectively, and the lead alloy plate of corresponding plumbous silver-colored calcium alloy and lead antimony alloy, be 180g/L at sulfuric acid concentration, Cu
2+Concentration is 7.5g/L, and current density is 1800A/m
2, electrolyte temperature is under 58 ℃ the condition, has carried out the simultaneous test of bath voltage, result's (seeing Table 1) shows that the voltage of the corresponding alloy lead anode plate of voltage ratio of composite board of lead/copper significantly reduces.
Table 1 bath voltage comparative test result
| Test sample | Bath voltage |
| Plumbous silver-colored calcium alloy positive plate | 3.9V |
| Lead/the copper anode plate (embodiment 2) of plumbous silver-colored calcium alloy | 3.7V |
| The lead antimony alloy positive plate | 4.4V |
| Lead/the copper anode plate of lead antimony alloy (embodiment 3) | 3.9V |
Claims (10)
1, a kind of composite board of lead/copper is covered with lead or lead alloy layer (2) on copper coin (1).
2, composite board of lead/copper according to claim 1 is characterized in that described lead alloy is a kind of of lead antimony alloy, lead-calcium alloy, plumbous silver-antimony alloy, slicker solder calcium, plumbous silver-colored calcium strontium etc.
3, the production method of claim 1 or 2 described composite board of lead/copper can adopt one or more productions of methods such as casting, pressure die casting, hot dip process, welding, rolling, hot pressing, plating, thermospray, obtains lead or lead alloy layer on copper coin.
4, production method according to claim 3, it is characterized in that described castmethod comprises the steps: at first the copper coin surface to be carried out processing such as oil removing, cleaning, sandblast, copper coin being put into again and being filled temperature is 250～400 ℃ the fusion of lead or the rectangle crucible of lead alloy, freely cool off then, promptly get composite board of lead/copper.
5, production method according to claim 3, it is characterized in that described hot dip coating method comprises the steps: the copper coin surface carried out processing such as oil removing, cleaning, sandblast, again with copper coin surface applied flux, slowly put into the rectangle crucible that fills fusion of lead or lead alloy then, kept 0.5～10 minute, again copper coin is taken out, cools off, promptly get composite board of lead/copper.
6, production method according to claim 3, it is characterized in that described welding process comprises the steps: the copper coin surface carried out processing such as oil removing, cleaning, sandblast, reusable lead or lead alloy plate encase copper coin, and with methods such as argon arc welding, flame welding or solderings lead or lead alloy plate are welded, can be rolled into desired composite board of lead/copper then as required; Perhaps the lead alloy soldering paste is coated in the copper coin surface, heats 250～400 ℃ then and make the composite board of lead/copper that copper coin surface pricker is coated with last layer 0.01～1mm lead alloy coating.
7, production method according to claim 3, it is characterized in that described rolling method comprises the steps: the copper coin surface carried out processing such as oil removing, cleaning, sandblast, the lead cover that difform copper cores such as circular, square or rectangle is close with shape carries out at room temperature rolling together, deflection is 1～100%, 100～200 ℃ of annealing are carried out in the centre, make composite board of lead/copper.
8, production method according to claim 3, it is characterized in that described hot-press method comprises the steps: the copper coin surface carried out processing such as oil removing, cleaning, sandblast, with two identical lead or lead alloy plates copper coin is encased with blind groove, be placed on then in the mould that is slightly larger than stereotype outside dimension 1～5mm, heating and pressurizing on thermocompressor, processing condition are respectively 50～300 ℃, 1～30MPa, and heat-insulation pressure keeping 5～40 minutes makes composite board of lead/copper.
9, production method according to claim 3, it is characterized in that described electro-plating method comprises the steps: the copper coin surface is carried out oil removing, sandblast, processing such as cleaned up, copper coin is placed plating tank as negative electrode, make lead or the lead alloy coating of 0.1～3mm, make composite board of lead/copper.
10, production method according to claim 3, it is characterized in that described heat spraying method comprise the steps: with the copper coin surface carry out oil removing, clean up, processing such as sandblast, with lead or lead alloy silk, powder is raw material, adopt heat spraying methods such as flame, electric arc or supersonic speed, in the coating of copper coin surface spraying 0.1～10mm, make composite board of lead/copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CNA2007100984797A CN101092709A (en) | 2007-04-18 | 2007-04-18 | Composite board of lead / copper, and production method |
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| CNA2007100984797A CN101092709A (en) | 2007-04-18 | 2007-04-18 | Composite board of lead / copper, and production method |
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| CN101092709A true CN101092709A (en) | 2007-12-26 |
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| CNA2007100984797A Pending CN101092709A (en) | 2007-04-18 | 2007-04-18 | Composite board of lead / copper, and production method |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102489864A (en) * | 2011-12-07 | 2012-06-13 | 新兴县德纳斯金属制品有限公司 | Method for covering edge and bonding compound pot bottom of stainless steel pot provided with hole and chimney in the middle |
| CN102489871A (en) * | 2011-12-05 | 2012-06-13 | 贵研铂业股份有限公司 | Welding method of copper and copper alloy |
| CN102554186A (en) * | 2012-02-17 | 2012-07-11 | 重庆重冶铜业有限公司 | Method for preparing copper electrolysis anode plate |
| CN102921922A (en) * | 2009-06-08 | 2013-02-13 | 昆明理工大学 | Method for preparing Ti-Cu layered composite electrode plate through casting |
| CN103695960A (en) * | 2014-01-09 | 2014-04-02 | 申中军 | Manufacturing method of electrolytic manganese metal alloy lead-plastic composite anode |
| CN104148615A (en) * | 2014-08-14 | 2014-11-19 | 昆明理工大学 | Method for preparing lead-base layer-shaped composite material |
| CN105537312A (en) * | 2015-12-21 | 2016-05-04 | 洛阳铜一金属材料发展有限公司 | Copper-lead composite board strip and preparation method thereof |
| CN105803513A (en) * | 2016-03-15 | 2016-07-27 | 昆明理工大学 | Preparation method for lead-coated copper-based inert composite anode material used for trivalent chromium plating |
| CN105925839A (en) * | 2016-06-13 | 2016-09-07 | 华克医疗科技（北京）股份公司 | Radiation resistant red copper lead plate |
| CN114030264A (en) * | 2021-10-29 | 2022-02-11 | 丹阳丹金航空材料科技有限公司 | Preparation method of high-strength laminated composite board for airplane deicing |
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2007
- 2007-04-18 CN CNA2007100984797A patent/CN101092709A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102921922A (en) * | 2009-06-08 | 2013-02-13 | 昆明理工大学 | Method for preparing Ti-Cu layered composite electrode plate through casting |
| CN102489871A (en) * | 2011-12-05 | 2012-06-13 | 贵研铂业股份有限公司 | Welding method of copper and copper alloy |
| CN102489864A (en) * | 2011-12-07 | 2012-06-13 | 新兴县德纳斯金属制品有限公司 | Method for covering edge and bonding compound pot bottom of stainless steel pot provided with hole and chimney in the middle |
| CN102554186A (en) * | 2012-02-17 | 2012-07-11 | 重庆重冶铜业有限公司 | Method for preparing copper electrolysis anode plate |
| CN103695960A (en) * | 2014-01-09 | 2014-04-02 | 申中军 | Manufacturing method of electrolytic manganese metal alloy lead-plastic composite anode |
| CN104148615A (en) * | 2014-08-14 | 2014-11-19 | 昆明理工大学 | Method for preparing lead-base layer-shaped composite material |
| CN104148615B (en) * | 2014-08-14 | 2017-01-25 | 昆明理工大学 | Method for preparing lead-base layer-shaped composite material |
| CN105537312A (en) * | 2015-12-21 | 2016-05-04 | 洛阳铜一金属材料发展有限公司 | Copper-lead composite board strip and preparation method thereof |
| CN105803513A (en) * | 2016-03-15 | 2016-07-27 | 昆明理工大学 | Preparation method for lead-coated copper-based inert composite anode material used for trivalent chromium plating |
| CN105925839A (en) * | 2016-06-13 | 2016-09-07 | 华克医疗科技（北京）股份公司 | Radiation resistant red copper lead plate |
| CN105925839B (en) * | 2016-06-13 | 2018-08-14 | 华克医疗科技（北京）股份公司 | Radiation protection red copper stereotype |
| CN114030264A (en) * | 2021-10-29 | 2022-02-11 | 丹阳丹金航空材料科技有限公司 | Preparation method of high-strength laminated composite board for airplane deicing |
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Open date: 20071226 |