CN109411378A - A kind of preparation method of copper strips winding-type welding column - Google Patents
A kind of preparation method of copper strips winding-type welding column Download PDFInfo
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- CN109411378A CN109411378A CN201811366847.6A CN201811366847A CN109411378A CN 109411378 A CN109411378 A CN 109411378A CN 201811366847 A CN201811366847 A CN 201811366847A CN 109411378 A CN109411378 A CN 109411378A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0671—Selective plating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/114—Manufacturing methods by blanket deposition of the material of the bump connector
- H01L2224/1146—Plating
- H01L2224/11462—Electroplating
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- Manufacturing & Machinery (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacture Of Motors, Generators (AREA)
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Abstract
The invention discloses a kind of preparation methods of copper strips winding-type welding column, comprising the following steps: S1, prepares core wire precast body；S2, welding column precast body is prepared；The soldering of S3, welding column.The present invention can be effectively improved the height of welding column porosity caused by Reflow Soldering, the defective workmanships such as core wire liquefaction failure, realize the high quality melting welding of copper strips Yu Pb-Sn core wire, reduce the scrappage of copper strips winding-type welding column, reduce the power consumption cost of melting welding, and it is effectively shortened the time of welding column preparation, while realizing preparation high-quality copper band winding-type welding column, reduce manufacturing cost.
Description
Technical field
The present invention relates to electronic component encapsulation fields, and in particular to a kind of preparation method of copper strips winding-type welding column.
Background technique
With the fast development of electronic information technology, the integrated level and complexity of semiconductor components and devices are higher and higher, phase
Ying Di, pin number, pin density involved in electronic-packaging processes, working frequency and power consumption are continuously increased, so that passing
System encapsulation technology faces new challenges.The logic and Wei Chu that this trend is on active service under the special operation conditions such as military affairs, aerospace
It is especially pronounced in reason.Traditional packaging method electrical property, hot property and in terms of cannot increasingly expire
The reliability requirement of sufficient electronic device connection.
In order to cope with the above problem, IBM Corporation, the U.S. and RAYCHEM company successfully have developed 90Pb10Sn material respectively
" the copper strips winding-type welding column " of " cast moulding welding column " and 80Pb20Sn material, applied to novel ceramic column grid array
In (Ceramic Column Grid Array, CCGA) encapsulation technology, the highly reliable of multi-layer ceramics material and circuit board is realized
Property connection.Wherein, " copper strips winding-type welding column " with its more excellent thermal shock resistance, higher reliability has been obtained extensively
Application.
In recent years, China is including that multiple high-grade, precision and advanced fields such as military project science and technology, space technology achieve significant progress,
The utilization rate of CCGA technology is also rapidly promoted therewith.It should be noted, however, that the scientific research personnel of country's CCGA industry is more
Energy concentrated on the development of CCGA array structure, welding column is reinforced, polishing and automatic plants the auxiliary CCGA packaging technology such as column
Field, and the core technology of CCGA welding column preparation is then monopolized by developed country for a long time.The military CCGA welding column in China is whole at present
From imported from America.The study found that the Key technique problem for preparing qualified copper strips winding-type welding column is: due to (the letter of welding column core
Claim core wire, be Pb-Sn alloy) be wound between the copper strips on the outside of core wire with hole, the presence of these holes can improve copper
The removing of band and core wire under high power consumption military service and thermal shock conditions is inclined to, once the two generates removing, the reliability meeting of welding column
It substantially reduces, or even causes the failure of entire electronic device.Therefore, reducing welding column porosity produced during the preparation process is to extend
The service life is encapsulated, the key problem in technology of welding spot reliability is promoted.The CCGA correlation standard that NASA (NASA) formulates,
Porosity between copper strips and core wire must be strictly controlled below 5%.This standard also obtains countries in the world CCGA industry
Approve, becomes the gauge copper passage standard qualified or not with winding-type welding column.
Homogeneity connection for the pure Sn that copper strips winding-type welding column is related to, i.e. core wire outer surface Sn coating and copper strips inner surface
Sn coating), the method being widely used at present is single heat source heating, i.e. Reflow Soldering.It heats up under controlled atmosphere, makes Sn softening very
To fusing, the effect of Sn-Sn interface alternation occurs, to form the technology of connection.Although reflow soldering process is in the side such as atmosphere, temperature control
Face is excellent in, but but there are many difficulties in the preparation process of CCGA welding column.On the one hand, if when melting welding temperature compared with
Low, the mobility of the wetability and adherent metal that will lead to the interface Sn-Sn is poor, and the Gas Phase Adsorption at interface is easy by Sn melt packet
It wraps up in and is difficult to exclude, form hole at interface cohesion after causing cooling, cause porosity excessively high；On the other hand, if melting welding
Shi Wendu higher can then make the Pb-Sn alloy of core wire deform, or even outflow, directly result in welding column and scrap.And due to core
The fusing point (usually less than 210 DEG C) of Pb-Sn alloy is always lower than the fusing point (232 DEG C) of coating Sn, and therefore, whole hot-working generates
Defective workmanship it is almost inevitable.
Summary of the invention
In view of the above shortcomings of the prior art, the invention reside in solve existing copper strips winding-type welding column using reflux
The excessively high problem of porosity caused by Welding, and since the fusing point of core wire causes to weld in the welding process lower than the fusing point of coating
Core deforms the problem for even flowing out and causing welding column scrappage high, provides a kind of preparation method of copper strips winding-type welding column.
In order to solve the above-mentioned technical problem, the present invention adopts the following technical scheme:
A kind of preparation method of copper strips winding-type welding column, which comprises the following steps:
The pretreatment of S1 core wire
S11 carries out plating Cu processing to Pb-Sn alloy core wire, makes uniform plating Cu layers of core wire surface；
S12 to the plating Sn processing of Cu layers of plating of core wire further progress, Cu layer outside again one layer of plating it is Sn layers uniform；
S13 immerses treated core wire in neutral scaling powder, and scaling powder is made to be sufficiently adhering to the core wire appearance of S12 preparation
Face obtains core wire precast body；
The preparation of S2 welding column precast body
S21 selects the copper strips of width suitable, carries out one-side electroplating Sn processing to copper strips；
S22 contacts the prefabricated external surface of core wire that the plating face Sn of the copper strips is prepared with S13, using electronic spiral filament forming machine by copper strips
Welding column precast body is made in the prefabricated external surface of core wire in uniform winding；
The soldering of S3 welding column
S31 by welding column precast body made from step S22 in the resistance-heated furnace that current field couples, specific device mode are as follows:
Firstly, a termination core wire of electrode, another termination electrode connects copper strips by welding column both ends clamping in direct current electrical circuit, it then will dress
It presss from both sides in the part merging resistance-heated furnace of welding column precast body；Secondly, then regulation furnace temperature, which is 170-195 DEG C, adjusts current field
Parameter makes the part of copper strips Yu core wire solid-solid contact with the electric current and voltage strength in double temperature double control DC power supply regulating loop
Obtain additional local joule heat source；Jointly control fusion welding process by two heat sources of electric furnace and current field, prepares copper strips winding
Type welding column；
Copper strips winding-type welding column is cut into standard size by S32.
Further, the diameter of the core wire precast body in the step S1 is 0.3-0.4mm.
Further, in the step S2, the width of the copper strips is 0.3 ± 0.1mm, and the distance between copper strips of winding is
0.23±0.05mm。
Further, in the step S3, the heating temperature of resistance-heated furnace is lower than the fusing point 5 ~ 20 of Pb-Sn alloy core wire
℃。
Further, 5 ± 3A of current strength in the step S3, in the DC power supply regulating loop.
Further, 5 ± 3min of conduction time in the step S3, in the DC power supply regulating loop.
The mechanism that the present invention can reduce CCGA welding column porosity is: being directed to reflow soldering process melting welding mid-term (holding stage)
Caused adhesion work is lower, wetability is poor and melting welding later period (temperature-fall period) metal stream in the presence of aoxidizing for core wire and the interface Sn-Sn
After solidification caused by dynamic property is deteriorated the problem of hole, integrally heated using low temperature provided by the invention and DC electric field local heating
Technique can be solved effectively.Firstly, in the holding stage of melting welding, the interface metal Sn-Sn is influenced wetting by aoxidizing
Property is poor；Low adhesion strength results in the generation of interfacial gap, forms hole after cooling to room temperature, and the application energy of direct current
It is enough effectively to abolish metal oxide film surface, to reduce the generation of interfacial gap.Secondly, being approached in the temperature-fall period of melting welding
The metal fluidity of molten state is deteriorated, and when boundary material cooling meat, surrounding metal is difficult to " feeding ", can also cause the production of hole
It is raw.And when applying DC current to welding column precast body, due to bulk temperature in interface Sn fusing point hereinafter, what copper strips and core wire were formed
Solid phase contact resistance is very big, therefore, as long as imposing enough voltage and currents, it will be able to the joule's heat energy at contact interface be made to exist
It is obviously improved in short time.The promotion of contact interface temperature can be such that the metal fluidity at the position enhances, and obtain and sufficiently " mend
The ability of contracting " largely reduced core Pb-Sn alloy melting, outflow causes since this fuel factor only occurs in the micro- part of welding column
Make the tendency that workpiece is scrapped.Third is completed in " feeding ", after the formation high quality melting welding of interface, and " solid phase poor contact, causes
The effect of interfacial resistivity height " can disappear therewith automatically, and DC current no longer plays the role of local heating, welding column bulk temperature
Alloy melting point is come back to hereinafter, to further avoid the overheating failure in fusion welding process.
Compared with prior art, the invention has the following beneficial effects:
1, the present invention can be effectively improved the height of welding column porosity caused by Reflow Soldering, and the defective workmanships such as core wire liquefaction failure are realized
The high quality melting welding of copper strips and Pb-Sn core wire, reduces the scrappage of copper strips winding-type welding column.Due to being adopted to core wire and copper strips
It is integrally heated with resistance-heated furnace and the heating method of current field local heating, it is whole to welding column precast body to first pass through resistance-heated furnace
Body heating, and by heating and temperature control lower than Pb-Sn alloy fusing point temperature, then by welding column both ends clamping direct current return
Lu Zhong；In this way, effectively preventing, the works such as core wire liquefaction failure high using welding column porosity caused by single heat source heating (Reflow Soldering)
Skill defect realizes the high quality melting welding of copper strips Yu Pb-Sn core wire, maintains the stability of the whole solid phase of welding column tissue.
2, the temperature that the present invention solves melting welding needs is greater than the contradiction of the fusing point of core wire, is translated into lower than core wire
It is kept the temperature at a temperature of fusing point, then applies current field state modulator.Since the high phenomenon of contact interface resistivity can be complete with melting welding
At and die away, therefore, electric current auxiliary melting welding avoid influence of the melting welding time to fusion welding quality, simplify technique, increase
The Modulatory character of technique, while improving the serious forgiveness of parameter adjustment.
3, the current field local heating mode that the present invention uses, reduces the power consumption cost of melting welding, and be effectively shortened
The time of welding column preparation reduces manufacturing cost while realizing preparation high-quality copper band winding-type welding column.
Detailed description of the invention
Fig. 1 is the present invention a kind of the current field local heating technique and schematic illustration of copper strips winding-type welding column: (a) electric current
Field local heating artwork；(b) the interface current line distribution schematic diagram in fusion welding process；(c) melting welding is completed (to melt completely at interface
Close) after current line distribution schematic diagram.
Fig. 2 is that the copper strips prepared under different technology conditions winds Pb-Sn820 welding column microstructure photograph: (d) single heat source
(Reflow Soldering): 225 DEG C of heating temperature, 20min is kept the temperature；(f) resistance-heated furnace integrally heats compound with current field local heating
Heating: 185 DEG C of resistance heating furnace temperature, current strength 0.5A, voltage 0.35V, 4min is kept the temperature.
Specific embodiment
Present invention will be further explained below with reference to the attached drawings and examples.
Embodiment:
Referring to Fig. 1, using Pb-Sn alloy as core wire, fine copper strip is wrapped in production copper strips winding-type welding column on core wire.
Firstly, the pretreatment of core wire: taking " Pb-Sn-820 " alloy as core wire, wherein Pb:80wt%；Sn:20wt%.?
The surface of core wire carries out plating Cu processing, makes uniform plating Cu layers of core wire surface；The core wire of the plating Cu obtained again carries out further
Be electroplated Sn processing, core wire Cu layer outside again one layer of plating it is Sn layers uniform.Diameter after entire core wire plating is 0.51 ±
0.05mm.Core wire after plating is immersed in neutral scaling powder, scaling powder is made to be sufficiently adhering to the core wire outer surface of S12 preparation,
Core wire precast body is made.
Then, prepare welding column precast body: taking the fine copper strip that width is 0.3mm is the copper strips of winding, is carried out to the copper strips
One-side electroplating Sn processing, makes uniform plating Sn layers of the side of copper strips；Copper strips is plated with to Sn layers of side and core wire precast body
Appearance face contact makes the Sn layer of copper strips be in contact with the Sn of core wire precast body layer.And copper strips is uniformly twined using electronic spiral filament forming machine
It is wound on the prefabricated external surface of core wire, the distance between copper strips is 0.23mm after winding, obtains welding column precast body.
Finally, to welding column precast body soldering: by the prefabricated body device of welding column in the resistance-heated furnace that current field couples.Specifically
, first by welding column both ends clamping in direct current electrical circuit, one end of electrode is connected with the core wire of welding column one end, electrode it is another
End is connected with the copper strips of the welding column other end, as shown in Fig. 1 (a).Welding column precast body is placed in resistance-heated furnace again and is kept the temperature,
In, the temperature of the resistance-heated furnace is 185 DEG C, the slightly below fusing point of core wire.The Sn-Sn solid phase of copper strips and core wire is not at this time
Good contact interface resistivity is very high.Bistable dual control DC power supply is adjusted to constant current mode, setting current strength is 0.5A, then
Current turns ON switch is opened, the voltage strength after record is stablized is about 0.35V.At energization initial stage, electric current is in the interface Sn-Sn partial shape
At building-up effect, and biggish joule's heat energy is generated, as shown in Fig. 1 (b).Part temperature increase be interface metal flowing,
Repel hole and provide additional driving force, interface is promoted to form the melting welding of better quality.In addition, interface is formed after melting welding,
Since interface does not re-form bad contact, resistivity falls back to normal level, and current gathering effect disappears, as shown in Fig. 1 (c),
So as to avoid the generation of overheat.After energization 4min, DC power supply and resistance furnace are closed, the copper strips of melting welding completion is obtained after cooling
Winding-type welding column.By obtained copper strips winding-type welding column wicking and it is cut into standard size, as finished product copper strips winding-type welding column.
The copper strips winding-type weldering that single heat source heating (i.e. reflow soldering process does not apply the DC electric field of auxiliary heating) is obtained
Copper strips winding-type welding column obtained in column and the embodiment of the present invention carries out the characterization of microstructure, wherein single heat source heating
The heating temperature of mode is 225 DEG C, soaking time 20min；Composite heating used in the embodiment of the present invention: resistance heating furnace temperature
Degree is 185 DEG C, current strength 0.5A, voltage 0.35V, soaking time 4min.
Microstructure using copper strips winding-type welding column made from two kinds of techniques is as shown in Figure 2.It can from Fig. 2 (d)
To find out, when preparing winding-type welding column with reflow soldering process, copper strips and core wire binding site hole are more.Using Image J
Software carries out the statistical analysis of hole to 20 random cross sectional images, finds its porosity between 8%-16%.And from Fig. 2
(f) it can be seen that the copper strips winding-type welding column prepared using the composite heating mode of the embodiment of the present invention in, between copper strips and core wire
Hole it is then seldom, take 50 random welding column cross sections to carry out statistical analysis with above-mentioned software, the porosity of acquisition is
1.2-3.4%, the industry for meeting CCGA welding column use standard.
In addition, melting welding temperature of the present invention is lower (185 DEG C), the melting welding time is also shorter (4min), is realizing copper strips
Production is greatly reduced while maintaining the stability of whole solid phase of welding column tissue with the high quality melting welding of Pb-Sn core wire
Power consumption shortens preparation time, reduces production cost, and effectively improve production efficiency.
Finally, it should be noted that technical side the above examples are only used to illustrate the technical scheme of the present invention and are not limiting
Case, those skilled in the art should understand that, modification or equivalent replacement of the technical solution of the present invention are made for those, and
The objective and range for not departing from the technical program, are intended to be within the scope of the claims of the invention.
Claims (6)
1. a kind of preparation method of copper strips winding-type welding column, which comprises the following steps:
The pretreatment of S1 core wire
S11 carries out plating Cu processing to Pb-Sn alloy core wire, makes uniform plating Cu layers of core wire surface；
S12 to the plating Sn processing of Cu layers of plating of core wire further progress, Cu layer outside again one layer of plating it is Sn layers uniform；
S13 immerses treated core wire in neutral scaling powder, and scaling powder is made to be sufficiently adhering to the core wire appearance of S12 preparation
Face obtains core wire precast body；
The preparation of S2 welding column precast body
S21 selects the copper strips of width suitable, carries out one-side electroplating Sn processing to copper strips；
S22 contacts the prefabricated external surface of core wire that the plating face Sn of the copper strips is prepared with S13, using electronic spiral filament forming machine by copper strips
Welding column precast body is made in the prefabricated external surface of core wire in uniform winding；
The soldering of S3 welding column
S31 by welding column precast body made from step S22 in the resistance-heated furnace that current field couples, specific device mode are as follows:
Firstly, a termination core wire of electrode, another termination electrode connects copper strips by welding column both ends clamping in direct current electrical circuit, it then will dress
It presss from both sides in the part merging resistance-heated furnace of welding column precast body；Secondly, then regulation furnace temperature, which is 170-195 DEG C, adjusts current field
Parameter makes the part of copper strips Yu core wire solid-solid contact with the electric current and voltage strength in double temperature double control DC power supply regulating loop
Obtain additional local joule heat source；Jointly control fusion welding process by two heat sources of electric furnace and current field, prepares copper strips winding
Type welding column；
Copper strips winding-type welding column is cut into standard size by S32.
2. the preparation method of copper strips winding-type welding column according to claim 1, which is characterized in that the weldering in the step S1
The diameter of core precast body is 0.3-0.4mm.
3. the preparation method of copper strips winding-type welding column according to claim 1, which is characterized in that in the step S2, institute
The width for stating copper strips is 0.3 ± 0.1mm, and the distance between copper strips of winding is 0.23 ± 0.05mm.
4. the preparation method of copper strips winding-type welding column according to claim 1, which is characterized in that in the step S3, electricity
The heating temperature for hindering heating furnace is lower than 5 ~ 20 DEG C of fusing point of Pb-Sn alloy core wire.
5. the preparation method of copper strips winding-type welding column according to claim 1, which is characterized in that in the step S3, institute
State 5 ± 3A of current strength in DC power supply regulating loop.
6. the preparation method of copper strips winding-type welding column according to claim 5, which is characterized in that in the step S3, institute
State 5 ± 3min of conduction time in DC power supply regulating loop.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811366847.6A CN109411378B (en) | 2018-11-16 | 2018-11-16 | Preparation method of copper strip winding type welding column |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811366847.6A CN109411378B (en) | 2018-11-16 | 2018-11-16 | Preparation method of copper strip winding type welding column |
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| Publication Number | Publication Date |
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| CN109411378A true CN109411378A (en) | 2019-03-01 |
| CN109411378B CN109411378B (en) | 2020-03-17 |
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| CN201811366847.6A Expired - Fee Related CN109411378B (en) | 2018-11-16 | 2018-11-16 | Preparation method of copper strip winding type welding column |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113113373A (en) * | 2021-04-08 | 2021-07-13 | 重庆群崴电子材料有限公司 | Enhanced packaging welding column and processing method thereof |
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| CN102148215A (en) * | 2011-01-21 | 2011-08-10 | 哈尔滨理工大学 | Interconnection structure for improving reliability of soldering spot of soft soldering of CCGA (Ceramic Column Grid Array) device and implementation method |
| CN102357697A (en) * | 2011-09-29 | 2012-02-22 | 北京时代民芯科技有限公司 | Method for improving melting point of welding spot after reflux welding of ball/column attachment for CBGA (ceramic ball grid array)/CCGA (ceramic column grid array) packaging |
| CN105215569A (en) * | 2015-10-30 | 2016-01-06 | 苏州优诺电子材料科技有限公司 | A kind of leadless welding alloy |
| CN105618952A (en) * | 2016-03-20 | 2016-06-01 | 重庆群崴电子材料有限公司 | Enhanced type welding column for electronic assembling and manufacturing method thereof |
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2018
- 2018-11-16 CN CN201811366847.6A patent/CN109411378B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102148215A (en) * | 2011-01-21 | 2011-08-10 | 哈尔滨理工大学 | Interconnection structure for improving reliability of soldering spot of soft soldering of CCGA (Ceramic Column Grid Array) device and implementation method |
| CN102357697A (en) * | 2011-09-29 | 2012-02-22 | 北京时代民芯科技有限公司 | Method for improving melting point of welding spot after reflux welding of ball/column attachment for CBGA (ceramic ball grid array)/CCGA (ceramic column grid array) packaging |
| CN105215569A (en) * | 2015-10-30 | 2016-01-06 | 苏州优诺电子材料科技有限公司 | A kind of leadless welding alloy |
| CN105618952A (en) * | 2016-03-20 | 2016-06-01 | 重庆群崴电子材料有限公司 | Enhanced type welding column for electronic assembling and manufacturing method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113113373A (en) * | 2021-04-08 | 2021-07-13 | 重庆群崴电子材料有限公司 | Enhanced packaging welding column and processing method thereof |
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