CN113113373A - Enhanced packaging welding column and processing method thereof - Google Patents
Enhanced packaging welding column and processing method thereof Download PDFInfo
- Publication number
- CN113113373A CN113113373A CN202110376691.5A CN202110376691A CN113113373A CN 113113373 A CN113113373 A CN 113113373A CN 202110376691 A CN202110376691 A CN 202110376691A CN 113113373 A CN113113373 A CN 113113373A
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- copper
- tin
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- alloy
- column
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- 238000003466 welding Methods 0.000 title claims abstract description 17
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 11
- 238000003672 processing method Methods 0.000 title claims description 5
- 239000012763 reinforcing filler Substances 0.000 claims abstract description 26
- 229910001128 Sn alloy Inorganic materials 0.000 claims abstract description 21
- 239000011247 coating layer Substances 0.000 claims abstract description 5
- 238000007747 plating Methods 0.000 claims description 29
- 239000000956 alloy Substances 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 21
- 238000007654 immersion Methods 0.000 claims description 19
- 229910045601 alloy Inorganic materials 0.000 claims description 17
- 239000010410 layer Substances 0.000 claims description 17
- 238000009713 electroplating Methods 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 13
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical group [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 claims description 10
- 238000005520 cutting process Methods 0.000 claims description 8
- 239000002994 raw material Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 5
- 229910000597 tin-copper alloy Inorganic materials 0.000 claims description 4
- 229910001174 tin-lead alloy Inorganic materials 0.000 claims description 4
- 238000004804 winding Methods 0.000 claims description 4
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical class [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 abstract description 2
- 230000004907 flux Effects 0.000 abstract 1
- 238000005253 cladding Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000005336 cracking Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005491 wire drawing Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004100 electronic packaging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/114—Manufacturing methods by blanket deposition of the material of the bump connector
- H01L2224/1146—Plating
- H01L2224/11462—Electroplating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/1301—Shape
- H01L2224/13012—Shape in top view
- H01L2224/13014—Shape in top view being circular or elliptic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
- H01L2224/13111—Tin [Sn] as principal constituent
Abstract
The invention discloses an enhanced packaging welding column which comprises a column core, wherein the column core is processed from tin alloy, a coating layer is arranged on the outer side of the column core, the coating layer comprises a copper-clad belt and a reinforcing welding flux, the copper-clad belt is wound on the outer side of the column core, and reinforcing fillers are arranged in gaps and grooves among the copper-clad belts, so that the strength of the column core can be increased, the column core is supported, and the column core is prevented from being easily deformed after being stressed.
Description
Technical Field
The invention relates to the technical field of electronic packaging, in particular to an enhanced packaging welding column.
Background
With the rapid development of technology, electronic devices and integrated circuits are used more frequently, wherein the integrated circuit package is one of the processes in the electronic device processing, the pillar grid array package is one of the commonly used packaging methods, and the solder pillars are the components required in the pillar grid array package. The existing welding column is generally made of lead-tin alloy materials, the lead-tin alloy materials are generally low in strength and weak in substrate warping resistance, welding spots are prone to cracking caused by warping deformation in the packaging process, and packaging performance is affected.
Disclosure of Invention
In view of this, the invention discloses an enhanced solder post, which is used for increasing the strength of the solder post and preventing cracking caused by warping deformation of a substrate.
The invention discloses an enhanced packaging welding column which is characterized by comprising a column core made of a tin alloy material, wherein a coating layer is arranged on the outer side of the column core and comprises a copper-clad belt and a reinforcing filler, the copper-clad belt is wound on the outer side of the column core, and the reinforcing filler is arranged in gaps and grooves among the copper-clad belts.
Furthermore, the outer surface of the copper-clad strip is provided with a tin coating, and is connected with the column core through the tin coating.
Furthermore, the reinforcing filler is a lead-tin alloy with 5% -95% of tin and 5% -95% of lead.
A method of fabricating an enhanced encapsulated solder column as claimed in any one of claims 1 to 3, comprising the steps of:
s1, drawing the tin alloy raw material to form an alloy wire with a certain diameter;
s2, wrapping the copper-clad strip with a tin-plated layer on the outer side in an electroplating or immersion plating mode;
s3, winding the copper-clad belt provided with the tin-plated layer on the alloy wire;
s4, filling reinforcing fillers in gaps and grooves of the copper-clad strip by the alloy wires wound with the copper-clad strip in an electroplating or dip plating mode;
s5, cutting the alloy wire provided with the reinforcing filler into a proper length through a cutting machine to form a welding column;
and S6, performing surface treatment on the welding column.
Further, the tin alloy raw material is a lead-tin alloy with 5% -95% of tin and 5% -95% of lead.
Further, the tin alloy raw material is a copper-tin alloy with the tin content of 60% -99% and the copper content of 1% -40%.
Further, filling reinforcing fillers in gaps and grooves of the copper-clad strip by the alloy wire wound with the copper-clad strip in a dipping mode, wherein the temperature of a tin bath for dipping is 195-280 ℃.
Further, the copper-clad strip is wrapped with a tin-plated layer on the outer side in an electroplating or immersion plating mode, and the tin-plated layer is a tin-copper alloy or a tin-lead alloy.
Compared with the prior art, the technical scheme disclosed by the invention has the beneficial effects that:
and the outer side of the column core is wrapped with a cladding layer, and the cladding layer comprises a copper-clad strip and a reinforcing filler and is used for increasing the overall strength of the column core so as to prevent cracking caused by warping deformation of the substrate.
Drawings
FIG. 1 is a schematic structural view of a solder post;
FIG. 2 is a cross-sectional view of a weld column;
FIG. 3 is a schematic view of a copper-clad strip being rectangular and wound around a cylindrical core;
FIG. 4 is a schematic view of the copper-clad strip being a copper braid and wrapped around a cylindrical core;
FIG. 5 is a flow chart of a weld column processing method;
Detailed Description
When one component is considered to be "connected" to another component, it can be directly connected to the other component, or intervening components may be present. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. It should also be noted that, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly and can include, for example, fixed connections, removable connections, or integral connections; either mechanically or electrically, and may be internal to both elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
It should be noted that in the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
As shown in fig. 1 and 2, the present invention discloses an enhanced package solder column 100, which includes a column core 10, wherein a cladding layer 20 is disposed on an outer side of the column core 10, and the column core 10 can be protected by the cladding layer 20, so as to increase strength of the column core 10, prevent the solder column 100 from being easily deformed by an external force, and prevent cracking caused by warpage of a substrate.
The core 10 is made of a tin alloy material and has a diameter of 0.2mm to 0.75mm, preferably 0.38 mm.
In one embodiment, the core 10 is a lead-tin alloy core, and the core 10 composition includes 5% to 95% tin and 5% to 95% lead. When the column core 10 is a lead-tin alloy column, the column core 10 has low strength and is soft, and is easy to deform during packaging work, thereby affecting the overall packaging effect. The outer side of the column core 10 is provided with the coating layer 20 with high strength, which coats the side surface of the column core 10 and supports the column core 10, so that the strength of the outer surface of the column core 10 is increased, and the column core 10 is prevented from being easily deformed after being stressed.
In another embodiment, the composition of the pillar core 10 includes 60% to 99% of tin and 1% to 40% of copper, and the pillar core 10 is a copper-tin alloy, which can increase the strength compared to a pillar core made of tin.
The cladding layer 20 comprises a copper-clad strip 21 and a reinforcing filler 22, the copper-clad strip 21 is attached to the outer surface of the column core 10, and the reinforcing filler 22 is arranged in a groove and a gap formed after the copper-clad strip 21 is connected with the column core 10 and used for cladding the column core 10, and the copper-clad strip 21 is connected into a whole, so that the copper-clad strip 21 and the reinforcing filler 22 wrap the outer surface of the column core 10.
The copper-clad strip 21 is made of one of copper, gold, silver or glass-copper alloy.
The outer surface of the copper-clad belt 21 is wrapped with a tin coating in an electroplating or immersion plating mode, and when the copper-clad belt 21 is arranged on the outer side of the column core 10, the copper-clad belt 21 is fixed on the column core 10 in an electroplating or immersion plating mode, so that the overall strength of the column core 10 is improved. The tin-plated layer may be a tin-copper alloy or a tin-lead alloy. When the tin coating is wrapped on the outer side of the copper-clad belt 21 by means of immersion plating, a plating assistant agent needs to be coated on the outer side of the copper-clad belt 21.
As shown in fig. 3, the copper-clad strip 21 may be a long copper strip in cross section, which is spirally wound around the core 10. The width of the copper strips is 0.1 mm-0.5 mm, the distance between the copper strips wound on the column core 10 is 0.2 mm-0.4 mm, and the reinforcing filler 22 is arranged in the gap between the copper-clad strips 21.
Further, the copper-clad strip 21 is a perforated copper strip.
As shown in fig. 4, the copper-clad strip 21 is a copper braided strip, the copper braided strip is a mesh structure formed by braiding a plurality of copper wires, and the copper braided strip is attached to the outer side of the column core 10 to support the column core 10. The copper braided strap is attached to the outer side of the column core 10 by electroplating or immersion plating, and the copper braided strap is net-shaped and can provide a certain amount of additional flexibility for the column core 10. When the copper braided strap is disposed outside the column core 10 by immersion plating, it is necessary to coat an auxiliary plating agent on the outer surface.
The reinforcing filler 22 is made of lead-tin alloy and is arranged in the gap or the groove of the copper-clad belt 21 in an electroplating or immersion plating mode. Wherein said reinforcing filler 22 made of a lead-tin alloy comprises, as a constituent, from 5% to 95% of tin and from 5% to 95% of lead.
As shown in fig. 5, the present invention also discloses a processing method of an enhanced package solder column, which is used for processing the solder column, and specifically includes the following steps:
s1, drawing the tin alloy raw material to form an alloy wire with a certain diameter;
s2, wrapping the copper-clad strip with a tin-plated layer on the outer side in an electroplating or immersion plating mode;
s3, winding the copper-clad belt provided with the tin-plated layer on the alloy wire;
s4, filling reinforcing fillers in gaps and grooves of the copper-clad strip by the alloy wires wound with the copper-clad strip in an electroplating or dip plating mode;
s5, cutting the alloy wire provided with the reinforcing filler into a proper length through a cutting machine to form a welding column;
and S6, performing surface treatment on the welding column.
When the alloy wire is processed, corresponding raw materials are selected and cast, and then the alloy wire is subjected to wire drawing treatment through corresponding wire drawing equipment, so that the raw materials are made into filaments with the diameter of 0.2 mm-0.75 mm.
And then processing the copper-clad belt, arranging a tin coating on the outer surface of the copper-clad belt in an electroplating or immersion plating mode, winding and fixing the copper-clad belt on the alloy wire, connecting the copper-clad belt and the column core into a whole, and increasing the strength of the column core through the copper-clad belt. When the copper-clad belt is wrapped with the tin coating in a dip plating mode, the outer surface of the copper-clad belt needs to be coated with a plating assistant agent to assist in dip plating.
And the copper-clad strip is wrapped with a tin-plated layer on the outer side in an electroplating or immersion plating mode, and the tin-plated layer can be a tin-copper alloy or a tin-lead alloy.
When the copper-clad belt is a copper belt with a rectangular section or a perforated copper belt, the copper-clad belt is wound on the column core, a certain gap is formed between the wound copper-clad belts, the reinforcing filler is filled in the gap in an electroplating or immersion plating mode and is used for further reinforcing the column core, and the copper-clad belts can be connected into a whole.
When the copper-clad strip is a netted copper woven belt, the copper woven belt can be set into a set of cylinder shape and then sleeved on the outer side of the column core, and is fixed with the column core in an electroplating or immersion plating mode, and the copper woven belt is provided with through holes, so that the column core can be supported and simultaneously can be added with certain flexibility.
When the reinforcing filler is subjected to immersion plating, the temperature of a tin bath for immersion plating is 195-280 ℃.
After the reinforcing filler is arranged, the reinforcing filler is cut into corresponding lengths by a cutting device to form the welding column, and then the outer surface of the welding column is subjected to surface treatment to smooth the surface, such as cutting, grinding and other surface treatments.
The present invention may be embodied in many different forms and modifications without departing from the spirit and scope of the present invention, and the above-described embodiments are intended to illustrate the present invention but not to limit the scope of the present invention.
Claims (8)
1. The enhanced packaging welding column is characterized by comprising a column core made of a tin alloy material, wherein a coating layer is arranged on the outer side of the column core and comprises a copper-clad belt and reinforcing fillers, the copper-clad belt is wound on the outer side of the column core, and the reinforcing fillers are arranged in gaps and grooves among the copper-clad belts.
2. The enhanced encapsulated solder post of claim 1 wherein said copper-clad tape is provided with a tin plating on its outer surface and is connected to said post core through said tin plating.
3. An enhanced encapsulated solder pillar as claimed in claim 2, wherein said reinforcing filler is a lead-tin alloy having a tin content of 5% to 95% and a lead content of 5% to 95%.
4. A method of manufacturing an enhanced encapsulated solder column as claimed in any one of claims 1 to 3, comprising the steps of:
s1, drawing the tin alloy raw material to form an alloy wire with a certain diameter;
s2, wrapping the copper-clad strip with a tin-plated layer on the outer side in an electroplating or immersion plating mode;
s3, winding the copper-clad belt provided with the tin-plated layer on the alloy wire;
s4, filling reinforcing fillers in gaps and grooves of the copper-clad strip by the alloy wires wound with the copper-clad strip in an electroplating or dip plating mode;
s5, cutting the alloy wire provided with the reinforcing filler into a proper length through a cutting machine to form a welding column;
and S6, performing surface treatment on the welding column.
5. The method as claimed in claim 4, wherein the tin alloy is a lead-tin alloy containing 5-95% of tin and 5-95% of lead.
6. The method as claimed in claim 4, wherein the tin alloy is a copper-tin alloy with a tin content of 60% to 99% and a copper content of 1% to 40%.
7. The processing method of the reinforced packaging solder column as recited in claim 4, wherein the alloy wire wound with the copper-clad strip is filled with reinforcing filler in the gaps and grooves of the copper-clad strip by immersion plating, and the immersion plating tin bath temperature is 195 ℃ to 280 ℃.
8. The method as claimed in claim 4, wherein the copper-clad tape is wrapped with a tin-plated layer, which is a tin-copper alloy or a tin-lead alloy, on the outside by electroplating or immersion plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110376691.5A CN113113373A (en) | 2021-04-08 | 2021-04-08 | Enhanced packaging welding column and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110376691.5A CN113113373A (en) | 2021-04-08 | 2021-04-08 | Enhanced packaging welding column and processing method thereof |
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| Publication Number | Publication Date |
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| CN113113373A true CN113113373A (en) | 2021-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110376691.5A Pending CN113113373A (en) | 2021-04-08 | 2021-04-08 | Enhanced packaging welding column and processing method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105618952A (en) * | 2016-03-20 | 2016-06-01 | 重庆群崴电子材料有限公司 | Enhanced type welding column for electronic assembling and manufacturing method thereof |
| CN106624423A (en) * | 2016-12-14 | 2017-05-10 | 北京时代民芯科技有限公司 | Device and method for manufacturing enhanced type welding columns |
| CN109411378A (en) * | 2018-11-16 | 2019-03-01 | 长江师范学院 | A kind of preparation method of copper strips winding-type welding column |
| US10477698B1 (en) * | 2019-04-17 | 2019-11-12 | Topline Corporation | Solder columns and methods for making same |
| US10937752B1 (en) * | 2020-08-03 | 2021-03-02 | Topline Corporation | Lead free solder columns and methods for making same |
-
2021
- 2021-04-08 CN CN202110376691.5A patent/CN113113373A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105618952A (en) * | 2016-03-20 | 2016-06-01 | 重庆群崴电子材料有限公司 | Enhanced type welding column for electronic assembling and manufacturing method thereof |
| CN106624423A (en) * | 2016-12-14 | 2017-05-10 | 北京时代民芯科技有限公司 | Device and method for manufacturing enhanced type welding columns |
| CN109411378A (en) * | 2018-11-16 | 2019-03-01 | 长江师范学院 | A kind of preparation method of copper strips winding-type welding column |
| US10477698B1 (en) * | 2019-04-17 | 2019-11-12 | Topline Corporation | Solder columns and methods for making same |
| US10937752B1 (en) * | 2020-08-03 | 2021-03-02 | Topline Corporation | Lead free solder columns and methods for making same |
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Application publication date: 20210713 |