TWI587327B - Electrical component and the fabrication method thereof - Google Patents
Electrical component and the fabrication method thereof Download PDFInfo
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- TWI587327B TWI587327B TW104122342A TW104122342A TWI587327B TW I587327 B TWI587327 B TW I587327B TW 104122342 A TW104122342 A TW 104122342A TW 104122342 A TW104122342 A TW 104122342A TW I587327 B TWI587327 B TW I587327B
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- 238000004519 manufacturing process Methods 0.000 title claims description 35
- 238000000034 method Methods 0.000 title claims description 35
- 229910052751 metal Inorganic materials 0.000 claims description 141
- 239000002184 metal Substances 0.000 claims description 141
- 239000010410 layer Substances 0.000 claims description 88
- 239000011888 foil Substances 0.000 claims description 53
- 239000000463 material Substances 0.000 claims description 38
- 239000011241 protective layer Substances 0.000 claims description 28
- 239000000853 adhesive Substances 0.000 claims description 26
- 230000001070 adhesive effect Effects 0.000 claims description 26
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 11
- 238000009713 electroplating Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 10
- 238000005240 physical vapour deposition Methods 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 229910052718 tin Inorganic materials 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000000151 deposition Methods 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 2
- 238000004804 winding Methods 0.000 description 12
- 239000011135 tin Substances 0.000 description 11
- 239000006247 magnetic powder Substances 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 238000010276 construction Methods 0.000 description 4
- 210000003298 dental enamel Anatomy 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000000227 grinding Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
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- 238000010409 ironing Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/045—Fixed inductances of the signal type with magnetic core with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/10—Inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F3/00—Cores, Yokes, or armatures
- H01F3/10—Composite arrangements of magnetic circuits
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Manufacturing & Machinery (AREA)
Description
本發明涉及一種電子元件及其製造方法，特別是電子元件的電極構造。The present invention relates to an electronic component and a method of manufacturing the same, and more particularly to an electrode structure of an electronic component.
由於電子元件或電子器件變得越來越小，電極結構的尺寸和可靠性成為影響電子元件之電氣性能和可靠性的技術瓶頸。電極結構係用於電性連接電子元件和一外部電路例如印刷電路板(PCB)，而電子元件的導電元件的端子係電性連接於相應的電極例如表面黏著焊墊(surface-mount pads)用以焊接於PCB的相應焊接點。導線架(lead frame)通常焊接到電子元件的端子，然而，導線框架通常會佔用和電子元件相當大小的空間，因此，導線框架不適合被作為一些要求更小尺寸的電子元件或電子器件的電極。As electronic components or electronic devices become smaller and smaller, the size and reliability of the electrode structure become a technical bottleneck affecting the electrical performance and reliability of electronic components. The electrode structure is used for electrically connecting the electronic component and an external circuit such as a printed circuit board (PCB), and the terminals of the conductive component of the electronic component are electrically connected to the corresponding electrode such as a surface-mount pad. To solder to the corresponding solder joints of the PCB. The lead frame is usually soldered to the terminals of the electronic component. However, the lead frame usually occupies a space equivalent to that of the electronic component, and therefore, the lead frame is not suitable as an electrode of an electronic component or an electronic device requiring a smaller size.
表面黏著技術(Surface Mount Technology, SMT)是減少的電子元件或電子設備的整體尺寸的可行方法，例如電阻器，電容器或電感器。然而，隨著電子元件的整體尺寸變得愈來愈小，如何維持表面黏著焊墊在機械和電氣方面的可靠度是一個非常重要的課題。通過傳統的電鍍方式製造的電極的電阻值變化很大，這降低了在某些應用的電氣性能，甚至會影響電子元件的生產良率。另一方面，化學電鍍容易發生電鍍蔓延的問題，令電鍍材料擴散到某些不需要的區域甚至產生短路。Surface Mount Technology (SMT) is a viable method of reducing the overall size of electronic components or electronic devices, such as resistors, capacitors or inductors. However, as the overall size of electronic components has become smaller and smaller, maintaining mechanical and electrical reliability of surface mount pads is a very important issue. The resistance values of electrodes fabricated by conventional electroplating vary widely, which reduces the electrical performance in some applications and may even affect the production yield of electronic components. On the other hand, chemical plating is prone to the problem of electroplating spread, causing the plating material to diffuse to some undesired areas and even cause a short circuit.
據此，本發明提出了一種電極構造以克服上述的問題。Accordingly, the present invention proposes an electrode configuration to overcome the above problems.
本發明的目的之一在提供一種電子元件及其製造方法，可以解決電子元件之電極的電鍍蔓延問題且具有增加繞線面積的功效。One of the objects of the present invention is to provide an electronic component and a method of manufacturing the same that can solve the problem of electroplating spread of electrodes of electronic components and have an effect of increasing the winding area.
本發明的一實施例，揭露了一種電子元件，所述電子元件包括：一本體；一導電元件，設於本體之中，其中導電元件的一端子的至少一部分露出本體的外側；一金屬箔片，金屬箔片的底面具有一黏著材料，金屬箔片藉由黏著材料黏著於本體並且覆蓋導電元件的端子的一第一部分，其中導電元件的端子的一第二部分未被金屬箔片及黏著材料覆蓋；以及一金屬層，覆著於金屬箔片並且覆蓋導電元件的端子的第二部分，其中金屬層電性連接於導電元件的端子的第二部分，用於電性連接一外部電路(例如印刷電路板的電路)。An embodiment of the invention discloses an electronic component, the electronic component comprising: a body; a conductive component disposed in the body, wherein at least a portion of a terminal of the conductive component is exposed outside the body; a metal foil The bottom surface of the metal foil has an adhesive material, and the metal foil is adhered to the body by the adhesive material and covers a first portion of the terminal of the conductive component, wherein a second portion of the terminal of the conductive component is not a metal foil and an adhesive material And a metal layer covering the metal foil and covering the second portion of the terminal of the conductive element, wherein the metal layer is electrically connected to the second portion of the terminal of the conductive element for electrically connecting an external circuit (eg Printed circuit board circuit).
在本發明的一實施例，其中金屬箔片係為背膠銅箔。In an embodiment of the invention, the metal foil is a backed copper foil.
在本發明的一實施例，其中金屬箔片係由銅製成。In an embodiment of the invention, the metal foil is made of copper.
在本發明的一實施例，其中金屬層係由錫製成。In an embodiment of the invention, the metal layer is made of tin.
在本發明的一實施例，其中金屬層係由電鍍製程製成。In an embodiment of the invention, the metal layer is made by an electroplating process.
在本發明的一實施例，其中金屬箔片係黏著於導電元件的端子的第一部分和一第三部分，其中第二部分設於第一部分和第三部分之間。In an embodiment of the invention, the metal foil is adhered to the first portion and the third portion of the terminal of the conductive member, wherein the second portion is disposed between the first portion and the third portion.
在本發明的一實施例，其中導電元件的端子的一第三部分未被金屬箔片覆蓋，其中該導電元件的該端子的該第一部分設於該第二部分和該第三部分之間。In an embodiment of the invention, a third portion of the terminal of the conductive element is not covered by the metal foil, wherein the first portion of the terminal of the conductive element is disposed between the second portion and the third portion.
在本發明的一實施例，其中本體的頂面形成有一凹陷部，其中導電元件的端子設置於凹陷部。In an embodiment of the invention, the top surface of the body is formed with a recessed portion, wherein the terminal of the conductive element is disposed at the recessed portion.
在本發明的一實施例，其中電子元件係為電感，導電元件係為線圈，線圈係設置於本體之中，線圈的端子設置於本體的一表面。In an embodiment of the invention, the electronic component is an inductor, the conductive component is a coil, and the coil is disposed in the body, and the terminal of the coil is disposed on a surface of the body.
在本發明的一實施例，其中電子元件係為電感，導電元件係為線圈，其中本體係為一磁性體且線圈設置於磁性體之中，線圈的端子設置於本體的底面的一凹陷部，其中磁性體包括一T形磁芯，T形磁芯具有一磁柱，其中線圈繞設於磁柱，且線圈的端子通過T型磁芯的側面而設置於本體之底面的凹陷部。In an embodiment of the invention, the electronic component is an inductor, and the conductive component is a coil, wherein the system is a magnetic body and the coil is disposed in the magnetic body, and the terminal of the coil is disposed on a recess of the bottom surface of the body. The magnetic body comprises a T-shaped magnetic core, and the T-shaped magnetic core has a magnetic column, wherein the coil is wound around the magnetic column, and the terminal of the coil is disposed on the bottom surface of the body through the side surface of the T-shaped magnetic core.
本發明的一實施例，揭露了一種電感，包括：一磁性體；一線圈，設於磁性體之中，其中線圈的一端子的至少一部分露出磁性體之外側；一金屬箔片，被黏著於磁性體並且覆蓋線圈的端子的一第一部分，其中線圈的端子的一第二部分未被金屬箔片及黏著材料覆蓋；以及一金屬層，覆著於金屬箔片並且覆蓋線圈的端子的一第二部分，其中金屬層電性連接於線圈的端子的第二部分，用於電性連接一外部電路。An embodiment of the invention discloses an inductor comprising: a magnetic body; a coil disposed in the magnetic body, wherein at least a portion of a terminal of the coil is exposed to the outside of the magnetic body; a metal foil is adhered to a magnetic body and covering a first portion of the terminal of the coil, wherein a second portion of the terminal of the coil is not covered by the metal foil and the adhesive material; and a metal layer covering the metal foil and covering the terminal of the coil The second part, wherein the metal layer is electrically connected to the second portion of the terminal of the coil for electrically connecting an external circuit.
在本發明的一實施例，其中磁性體包括一T形磁芯，T形磁芯具有一磁柱，其中線圈繞設於磁柱，且線圈的端子通過T型磁芯的側面而設置於磁性體之底面的一第一凹陷部。In an embodiment of the invention, the magnetic body includes a T-shaped magnetic core, and the T-shaped magnetic core has a magnetic column, wherein the coil is wound around the magnetic column, and the terminal of the coil is disposed on the magnetic side through the side of the T-shaped magnetic core. a first recessed portion of the bottom surface of the body.
本發明的一實施例，揭露了一種電子元件的製造方法，包括：提供一本體，其中一導電元件設於本體之中，其中導電元件的一第一端子的至少一部分露出本體之外側；利用一物理氣相沈積製程沈積一第一金屬層於本體，其中第一金屬層覆蓋導電元件的第一端子的該至少一部分。An embodiment of the present invention discloses a method of manufacturing an electronic component, comprising: providing a body, wherein a conductive component is disposed in the body, wherein at least a portion of a first terminal of the conductive component is exposed to an outer side of the body; The physical vapor deposition process deposits a first metal layer on the body, wherein the first metal layer covers the at least a portion of the first terminal of the conductive element.
在本發明上述方法的一實施例，其中導電元件的一第二端子的至少一部分露出本體之外側，所述方法還包括利用物理氣相沈積製程沈積一第二金屬層於本體，其中第二金屬層覆蓋導電元件的第二端子的至少一部分。In an embodiment of the above method, wherein at least a portion of a second terminal of the conductive element is exposed to the outside of the body, the method further includes depositing a second metal layer on the body by a physical vapor deposition process, wherein the second metal The layer covers at least a portion of the second terminal of the conductive element.
在本發明上述方法的一實施例，其中電子元件係為電感，其中本體為一磁性體，導電元件為一線圈，其中線圈設置於磁性體之中，線圈的端子設置於本體之表面的一凹陷部。In an embodiment of the above method, the electronic component is an inductor, wherein the body is a magnetic body, and the conductive component is a coil, wherein the coil is disposed in the magnetic body, and the terminal of the coil is disposed on a surface of the body. unit.
在本發明上述方法的一實施例，其中電子元件係為電感，本體係為磁性體且導電元件係為線圈，其中線圈設置於磁性體之中，線圈的端子設置於本體之底面的一凹陷部，其中磁性體包括一T形磁芯，T形磁芯具有一磁柱，其中線圈繞設於磁柱，且線圈的端子通過T型磁芯的側面而設置於磁性體之底面的凹陷部。In an embodiment of the above method, the electronic component is an inductor, the system is a magnetic body, and the conductive component is a coil, wherein the coil is disposed in the magnetic body, and the terminal of the coil is disposed on a recess of the bottom surface of the body. The magnetic body includes a T-shaped magnetic core, and the T-shaped magnetic core has a magnetic column, wherein the coil is wound around the magnetic column, and the terminal of the coil is disposed on the bottom surface of the magnetic body through the side surface of the T-shaped magnetic core.
本發明的一實施例，揭露了一種電子元件，包括：一本體；一導線，設置於本體之中，其中導線的一第一端的一第一軸面以及導線的一第二端的一第二軸面露出本體之外側，其中第一軸面和第二軸面係在本體的同一表面或是二相對表面處露出；一第一電極構造，設置於本體並且電性連接於導線的第一端的第一軸面；一第二電極構造，設置於本體並且電性連接於導線的第二端的第二軸面。An embodiment of the invention discloses an electronic component comprising: a body; a wire disposed in the body, wherein a first axial surface of a first end of the wire and a second end of the second end of the wire The shaft surface is exposed on the outer side of the body, wherein the first axial surface and the second axial surface are exposed on the same surface or opposite surfaces of the body; a first electrode structure is disposed on the body and electrically connected to the first end of the wire a first axial surface; a second electrode structure disposed on the body and electrically connected to the second axial surface of the second end of the wire.
在本發明上述電子元件的一實施例，進一步包括一保護層，保護層覆蓋於本體的外表面，且保護層未覆蓋導線的第一端的第一軸面以及導線的第二端的第二軸面。In an embodiment of the electronic component of the present invention, the method further includes a protective layer covering the outer surface of the body, and the protective layer does not cover the first axial surface of the first end of the wire and the second axis of the second end of the wire surface.
在本發明所述電子元件的一實施例，其中電子元件係為電感，本體係為磁性體且導線係為線圈，其中線圈設置於磁性體之中。In an embodiment of the electronic component of the present invention, wherein the electronic component is an inductor, the system is a magnetic body and the wire is a coil, wherein the coil is disposed in the magnetic body.
在本發明所述電子元件的一實施例，其中電子元件係為電感，導線係為線圈，本體係為磁性體且線圈設置於磁性體之中，線圈的端子設置於本體之底面的一凹陷部，其中磁性體包括一T形磁芯，T形磁芯具有一磁柱，其中線圈繞設於磁柱，且線圈的端子通過T型磁芯的側面而設置於磁性體之底面的凹陷部。In an embodiment of the electronic component of the present invention, the electronic component is an inductor, the wire is a coil, the system is a magnetic body and the coil is disposed in the magnetic body, and the terminal of the coil is disposed on a recess of the bottom surface of the body. The magnetic body includes a T-shaped magnetic core, and the T-shaped magnetic core has a magnetic column, wherein the coil is wound around the magnetic column, and the terminal of the coil is disposed on the bottom surface of the magnetic body through the side surface of the T-shaped magnetic core.
有關本發明的具體實施方式及其技術特點和功效，下文將配合圖式說明如下。Specific embodiments of the present invention and its technical features and effects will be described below in conjunction with the drawings.
以下配合圖式所描述的內容係為用於實現本發明上述之目的、實施例、技術特徵及其功效的較佳實施方式，並非用以限定本發明。The following description of the drawings is a preferred embodiment of the present invention, and is not intended to limit the invention.
首先請參閱圖1，為本發明電子元件的電極構造的一實施例，圖中繪示之電子元件的電極構造可用於電性連接電子元件的一導電元件的端子和一外部電路例如印刷電路板(PCB)，值得注意的是，在下文本發明揭露的使用於電子元件的電極構造包含數種實施例構造，依據需要，電子元件的兩個端子可以採用同一種的電極構造，或是兩個端子分別採用不同的電極構造，本發明並不加以限制。如圖1繪示之一實施例，本發明電子元件的一實施例構造包括：Referring first to FIG. 1 , an embodiment of an electrode structure of an electronic component according to the present invention is shown. The electrode structure of the electronic component can be used to electrically connect a terminal of a conductive component of the electronic component and an external circuit such as a printed circuit board. (PCB), it is worth noting that the electrode structure used in the electronic component disclosed in the following text includes several embodiment configurations, and the two terminals of the electronic component may adopt the same electrode configuration or two terminals as needed. Different electrode configurations are employed, respectively, and the invention is not limited. As shown in FIG. 1 , an embodiment of an electronic component of the present invention includes:
一本體10；一導電元件20設於本體10之中，其中導電元件20之兩端的端子(terminal part)21a和21b的至少一部分露出本體10的外側；一金屬箔片31，金屬箔片31的底面具有一黏著材料311(見圖2)，金屬箔片31藉由黏著材料311黏著於本體10並且覆蓋導電元件20的端子21a的一第一部分211a，其中導電元件20的端子21a的一第二部分212a未被金屬箔片31及黏著材料311覆蓋；以及一第一金屬層32，第一金屬層32覆著(overlaying)於金屬箔片31並且覆蓋導電元件20的端子21a的第二部分212a，其中第一金屬層32電性連接於導電元件20的端子21a的第二部分212a進而形成第一種電極構造，用於電性連接一外部電路(例如印刷電路板的電路)。同理，前述的形成於端子21a的第一種電極構造亦可形成於端子21b，下文不再複述。在本發明的一實施例，金屬箔片31藉由黏著材料311黏著於本體10並且可以覆蓋導電元件20的端子21a的至少一第一部分211a，在另一實施例，金屬箔片31藉由黏著材料311黏著於本體10並且可以覆蓋導電元件20的端子21a的兩個部分以上，例如圖2中所繪示的第一部分211a和一第三部分213a。a body 10; a conductive element 20 is disposed in the body 10, wherein at least a portion of the terminal parts 21a and 21b of the two ends of the conductive element 20 are exposed outside the body 10; a metal foil 31, the metal foil 31 The bottom surface has an adhesive material 311 (see FIG. 2). The metal foil 31 is adhered to the body 10 by the adhesive material 311 and covers a first portion 211a of the terminal 21a of the conductive member 20, wherein a second portion of the terminal 21a of the conductive member 20 The portion 212a is not covered by the metal foil 31 and the adhesive material 311; and a first metal layer 32, the first metal layer 32 is overlaid on the metal foil 31 and covers the second portion 212a of the terminal 21a of the conductive member 20. The first metal layer 32 is electrically connected to the second portion 212a of the terminal 21a of the conductive element 20 to form a first electrode structure for electrically connecting an external circuit (such as a circuit of a printed circuit board). Similarly, the aforementioned first electrode structure formed on the terminal 21a may be formed on the terminal 21b, which will not be described again. In an embodiment of the invention, the metal foil 31 is adhered to the body 10 by the adhesive material 311 and may cover at least a first portion 211a of the terminal 21a of the conductive member 20. In another embodiment, the metal foil 31 is adhered by The material 311 is adhered to the body 10 and may cover more than two portions of the terminal 21a of the conductive member 20, such as the first portion 211a and the third portion 213a illustrated in FIG.
在一實施例中，黏著材料311包括混合有導電材料的聚合物材料，例如混合有銀粉的環氧樹脂(epoxy resin)；而前述的導電材料不限於銀粉，導電材料也可以是銅粉或其他適合的導電材料或合金；在一實施例中，第一金屬層32包含錫；在一實施例中，黏著材料311包括樹脂(resin)或是混合有導電材料的樹脂。在一實施例，其中金屬箔片31的材質可以是銅(Cu)、金(Au)、錫(Sn)和鋁(Al)其中的任一種，在一實施例，金屬箔片31可以是背膠銅箔(Resin Coated Copper, RCC)。因此，在一實施例中，第一金屬層32係與端子21a直接電性連接，在另一實施例中，第一金屬層32係可透過金屬箔片31電性連接於端子21a。本發明的電子元件係為一電感(inductor)，其中導電元件20可為一線圈(coil)，圖1繪示的導電元件20係為一種螺旋式線圈但不以此為限。In an embodiment, the adhesive material 311 comprises a polymer material mixed with a conductive material, such as an epoxy resin mixed with silver powder; and the foregoing conductive material is not limited to silver powder, and the conductive material may also be copper powder or other. A suitable electrically conductive material or alloy; in one embodiment, the first metal layer 32 comprises tin; in one embodiment, the adhesion material 311 comprises a resin or a resin mixed with a conductive material. In an embodiment, the material of the metal foil 31 may be any one of copper (Cu), gold (Au), tin (Sn), and aluminum (Al). In an embodiment, the metal foil 31 may be a back. Resin Coated Copper (RCC). Therefore, in an embodiment, the first metal layer 32 is directly electrically connected to the terminal 21a. In another embodiment, the first metal layer 32 is electrically connected to the terminal 21a through the metal foil 31. The electronic component of the present invention is an inductor, wherein the conductive component 20 can be a coil, and the conductive component 20 illustrated in FIG. 1 is a spiral coil but is not limited thereto.
在一實施例，第一金屬層32係可利用一薄膜製程例如電鍍製程覆著於金屬箔片31。In one embodiment, the first metal layer 32 can be overlaid on the metal foil 31 by a thin film process such as an electroplating process.
在圖1繪示之電感的製造流程及其構造係用於舉例說明本發明電子元件及其製造方法的一種實施例，並非用於限制該電子元件及其製造方法，圖1繪示的製造流程包括下列步驟： S11、提供一磁芯11，磁芯11可為T型磁芯(T Core)、I型磁芯(I Core)和壺型磁芯(Port Core)其中的任一種，圖1繪示的磁芯11係為T型磁芯，其中T型磁芯具有一磁柱12； S12、提供一導電元件20，導電元件20為一螺旋式線圈並且繞設於磁柱12，在一實施例，螺旋式線圈的繞線方式可以是外外繞，內外繞和臥繞其中的任一種，導電元件20兩端的端子21a和21b可彎折再利用點焊或黏著材料固定於磁芯11的頂面111，其中導電元件20可使用漆包線，導電元件20可以是圓線、方線或扁線其中的任一種，在一實施例，磁芯11的頂面111形成有一凹陷部112，其中導電元件20兩端的端子21a和21b可彎折再利用點焊或黏著材料設置於凹陷部112； S13、將磁芯11和導電元件20置於一模具中，再將磁性粉狀材料填入模具之中，然後進行熱壓成型製程利用磁性粉狀材料包覆磁芯11和導電元件20形成本體10，並將導電元件20封裝於其中，在一實施例，本體10係為一磁性體； S14、移除覆蓋在導電元件20兩端的端子21a和21b的材料以露出導電元件20兩端的端子21a和21b，例如以雷射移除漆包的製程移除導電元件20兩端的端子21a、21b的漆包層； S15、將金屬箔片31(可為背膠銅箔)黏著於本體10；以及 S16、以電鍍、沾、噴或燙的製程形成第一金屬層32，第一金屬層32係覆著於金屬箔片31並且電性連接於導電元件20的端子21a的第二部分212a，用於電性連接一外部電路，其中第一金屬層32的材質可為錫(Sn)、鎳(Ni) 或其他適合的金屬或合金。The manufacturing process of the inductor shown in FIG. 1 and its configuration are used to illustrate an embodiment of the electronic component of the present invention and a manufacturing method thereof, and are not intended to limit the electronic component and the manufacturing method thereof, and the manufacturing process illustrated in FIG. The method includes the following steps: S11, providing a magnetic core 11, the magnetic core 11 can be any one of a T core, an I Core, and a Port Core, Figure 1 The magnetic core 11 is a T-shaped magnetic core, wherein the T-shaped magnetic core has a magnetic column 12; S12, a conductive element 20 is provided, and the conductive element 20 is a spiral coil and is wound around the magnetic column 12 in one In the embodiment, the winding manner of the spiral coil may be external and external winding, and the inner and outer windings and the winding of the coils. The terminals 21a and 21b at both ends of the conductive member 20 may be bent and fixed to the magnetic core 11 by spot welding or adhesive materials. The top surface 111, wherein the conductive element 20 can use an enameled wire, and the conductive element 20 can be any one of a round wire, a square wire or a flat wire. In an embodiment, the top surface 111 of the magnetic core 11 is formed with a recess 112, wherein The terminals 21a and 21b at both ends of the conductive member 20 can be bent and then spot welded The adhesive material is disposed on the concave portion 112; S13, the magnetic core 11 and the conductive member 20 are placed in a mold, and the magnetic powder material is filled into the mold, and then the hot press forming process is performed by magnetic magnetic material. The core 11 and the conductive member 20 form the body 10, and the conductive member 20 is encapsulated therein. In an embodiment, the body 10 is a magnetic body; S14, the material of the terminals 21a and 21b covering the both ends of the conductive member 20 is removed. Exposing the terminals 21a and 21b at both ends of the conductive member 20, for example, removing the enamel layer of the terminals 21a, 21b at both ends of the conductive member 20 by a process of removing the enamel by laser; S15, the metal foil 31 (which may be a copper backing) a foil is adhered to the body 10; and S16, a first metal layer 32 is formed by a plating, dipping, spraying or ironing process. The first metal layer 32 is attached to the metal foil 31 and electrically connected to the terminal of the conductive component 20. The second portion 212a of the 21a is electrically connected to an external circuit, wherein the material of the first metal layer 32 may be tin (Sn), nickel (Ni) or other suitable metal or alloy.
本發明揭露的第一種電極構造的一種實施例如圖2所繪示，金屬箔片31覆蓋導電元件20的端子21a的一第一部分211a和一第三部分213a，導電元件20的端子21a的一第二部分212a未被金屬箔片31及黏著材料311覆蓋，其中第二部分212a設於第一部分211a和第三部分213a之間，第一金屬層32覆著(overlaying)於金屬箔片31並且覆蓋導電元件20的端子21a的第二部分212a，其中第一金屬層32電性連接於導電元件20的端子21a的第二部分212a，用於電性連接一外部電路(例如印刷電路板的電路)；圖3繪示了第一種電極構造的另一實施例，與圖2所繪示之實施例的差異處僅在於金屬箔片31在端子21a的表面的覆著位置不同，如圖3繪示的實施例，其中金屬箔片31覆蓋導電元件20的端子21a的第一部分211a，導電元件20的端子21a的第二部分212a和第三部分213a未被金屬箔片31覆蓋，導電元件20的端子21a的第一部分211a設於第二部分212a和第三部分213a之間，第一金屬層32覆著於金屬箔片31並且覆蓋導電元件20的端子21a的第二部分212a和第三部分213a，其中第一金屬層32電性連接於導電元件20的端子21a的第二部分212a和第三部分213a，用於電性連接一外部電路(例如印刷電路板的電路)。雖然圖2及圖 3繪示了金屬箔片31在端子21a或21b之表面的兩種不同覆著位置，其並非限制金屬箔片31在端子21a或21b之表面的覆著位置，換言之，金屬箔片31在端子21a或21b之表面的覆著位置也可以是其他適合的圖樣。An embodiment of the first electrode structure disclosed in the present invention is illustrated in FIG. 2. The metal foil 31 covers a first portion 211a and a third portion 213a of the terminal 21a of the conductive member 20, and one of the terminals 21a of the conductive member 20. The second portion 212a is not covered by the metal foil 31 and the adhesive material 311, wherein the second portion 212a is disposed between the first portion 211a and the third portion 213a, and the first metal layer 32 is overlaid on the metal foil 31 and Covering the second portion 212a of the terminal 21a of the conductive member 20, wherein the first metal layer 32 is electrically connected to the second portion 212a of the terminal 21a of the conductive member 20 for electrically connecting an external circuit (for example, a circuit of a printed circuit board) FIG. 3 illustrates another embodiment of the first electrode configuration. The difference from the embodiment illustrated in FIG. 2 is only that the metal foil 31 has a different coverage position on the surface of the terminal 21a, as shown in FIG. The illustrated embodiment in which the metal foil 31 covers the first portion 211a of the terminal 21a of the conductive member 20, and the second portion 212a and the third portion 213a of the terminal 21a of the conductive member 20 are not covered by the metal foil 31, and the conductive member 20 The first part of the terminal 21a 211a is disposed between the second portion 212a and the third portion 213a, and the first metal layer 32 covers the metal foil 31 and covers the second portion 212a and the third portion 213a of the terminal 21a of the conductive member 20, wherein the first metal The layer 32 is electrically connected to the second portion 212a and the third portion 213a of the terminal 21a of the conductive member 20 for electrically connecting an external circuit (for example, a circuit of a printed circuit board). 2 and 3 illustrate two different overlapping positions of the metal foil 31 on the surface of the terminal 21a or 21b, which do not limit the position of the metal foil 31 on the surface of the terminal 21a or 21b, in other words, metal. The position at which the foil 31 is placed on the surface of the terminal 21a or 21b may be other suitable patterns.
請參閱圖4，揭露本發明電子元件的另一實施例的製造流程及其構造圖。如圖4繪示之一實施例，本發明電子元件的一實施例構造包括： S41、提供一磁芯11，磁芯11可為T型磁芯，其中T型磁芯具有一磁柱12； S42、提供一導電元件20，導電元件20為一螺旋式線圈並且繞設於磁柱12，在一實施例，導電元件20兩端的端子21a和21b可彎折再利用點焊或黏著材料固定於磁芯11的表面； S43、將磁芯11和導電元件20置於一模具中，再將磁性粉狀材料填入模具之中，然後進行熱壓成型製程利用磁性粉狀材料包覆磁芯11和導電元件20形成本體10，並將導電元件20封裝於其中，如圖4所繪示的一實施例，本體10係為一磁性體，導電元件20兩端的端子21a和21b設置於本體10之底面13的一凹陷部131，導電元件20兩端的端子21a和21b通過T型磁芯的側面而設置於本體10之底面13的凹陷部131； S44、移除覆蓋在導電元件20兩端的端子21a和21b的材料以露出導電元件20兩端的端子21a和21b，例如以雷射移除漆包的製程移除導電元件20兩端的端子21a、21b的漆包層；以及 S45、利用一物理氣相沈積(Physical Vapor Deposition, PVD)製程沈積一金屬層35於本體10，其中金屬層35覆蓋導電元件20兩端的端子21a、21b至少一部分；在一實施例，其中金屬層35的材質可為錫(Sn)、鎳(Ni)或其他適合的金屬或合金。Referring to FIG. 4, a manufacturing process and a configuration diagram of another embodiment of the electronic component of the present invention are disclosed. As shown in FIG. 4, an embodiment of the electronic component of the present invention comprises: S41, providing a magnetic core 11, the magnetic core 11 can be a T-shaped magnetic core, wherein the T-shaped magnetic core has a magnetic column 12; S42, a conductive element 20 is provided. The conductive element 20 is a spiral coil and is wound around the magnetic column 12. In an embodiment, the terminals 21a and 21b at both ends of the conductive element 20 can be bent and then fixed by spot welding or adhesive material. a surface of the magnetic core 11; S43, placing the magnetic core 11 and the conductive member 20 in a mold, filling the magnetic powder material into the mold, and then performing a hot press forming process to coat the magnetic core 11 with the magnetic powder material The conductive element 20 is formed in the body 10, and the conductive element 20 is encapsulated therein. As shown in FIG. 4, the body 10 is a magnetic body, and the terminals 21a and 21b at both ends of the conductive element 20 are disposed on the body 10. a recessed portion 131 of the bottom surface 13, the terminals 21a and 21b at both ends of the conductive member 20 are disposed on the recessed portion 131 of the bottom surface 13 of the body 10 through the side surface of the T-shaped magnetic core; S44, removing the terminal 21a covering the both ends of the conductive member 20 And 21b material to expose the guide The terminals 21a and 21b at both ends of the component 20, for example, the enamel layer of the terminals 21a, 21b at both ends of the conductive member 20 are removed by a process of removing the enamel by laser; and S45, using a physical vapor deposition (Physical Vapor Deposition, PVD) a metal layer 35 is deposited on the body 10, wherein the metal layer 35 covers at least a portion of the terminals 21a, 21b at both ends of the conductive member 20. In an embodiment, the metal layer 35 may be made of tin (Sn) or nickel (Ni). Or other suitable metal or alloy.
請參閱圖5及圖6，為本發明電子元件之另一實施例的製造流程圖，其中繪示一種電感例如扼流器的一實施例構造及其製造流程。如圖5繪示之電感的另一實施例構造包括：一本體10、一導線60、一保護層40和一電極構造，導線60被封裝於本體10中且導線60的第一端61的第一軸面611，以及導線60的第二端62的第二軸面621露出本體10(見圖6所示)，保護層40覆蓋於本體10的外表面且未覆蓋導線60的第一端61的第一軸面611以及導線60的第二端62的第二軸面621，電極構造附著於保護層40且分別與導線20的第一端61的第一軸面611以及導線60的第二端62的第二軸面621電連接。本發明首先在本體10的外表面形成保護層40，再移除部分保護層40並露出導線20的第一端61的第一軸面611以及導線60的第二端62的第二軸面621，然後形成與導線20的第一端61的第一軸面611，以及導線60的第二端62的第二軸面621電連接的電極構造，可以解決以磁性粉狀材料製造之本體10容易產生電鍍蔓延的問題。5 and FIG. 6 are manufacturing flow diagrams of another embodiment of an electronic component according to the present invention, wherein an embodiment of an inductor such as a choke and a manufacturing process thereof are illustrated. Another embodiment of the inductor shown in FIG. 5 includes a body 10, a wire 60, a protective layer 40, and an electrode structure. The wire 60 is encapsulated in the body 10 and the first end 61 of the wire 60 is A shaft face 611, and a second axial face 621 of the second end 62 of the wire 60 expose the body 10 (shown in Figure 6), and the protective layer 40 covers the outer surface of the body 10 and does not cover the first end 61 of the wire 60. The first axial surface 611 and the second axial surface 621 of the second end 62 of the wire 60 are attached to the protective layer 40 and respectively with the first axial surface 611 of the first end 61 of the wire 20 and the second of the wire 60 The second axial face 621 of the end 62 is electrically connected. The present invention first forms a protective layer 40 on the outer surface of the body 10, and then removes a portion of the protective layer 40 and exposes the first axial surface 611 of the first end 61 of the wire 20 and the second axial surface 621 of the second end 62 of the wire 60. And then forming an electrode structure electrically connected to the first axial surface 611 of the first end 61 of the wire 20 and the second axial surface 621 of the second end 62 of the wire 60, which can solve the body 10 made of magnetic powder material The problem of electroplating spread.
在一實施例中，圖5繪示的電子元件係為一電感，其中導線60可為一種螺旋式線圈但不以此為限。電極構造的一實施例如圖5所繪示，包括：一第一金屬層33、一導電膠34(例如銀膠)和一第二金屬層36，其中第一金屬層33分別附著於導線60的第一端61的第一軸面611以及導線60的第二端62的第二軸面621，並與導線60的第一端61的第一軸面611以及導線60的第二端62的第二軸面621電連接，導電膠34未覆蓋第一金屬層33或覆蓋部份的第一金屬層33或覆蓋全部的第一金屬層33，第二金屬層36覆蓋住導電膠34和部分保護層40並且與第一金屬層33電連接，其中導電膠34具有固定的作用可以幫助第二金屬層36附著於第一金屬層33或是保護層40。In one embodiment, the electronic component illustrated in FIG. 5 is an inductor, wherein the wire 60 can be a spiral coil but is not limited thereto. An embodiment of the electrode structure, as shown in FIG. 5, includes: a first metal layer 33, a conductive paste 34 (such as silver paste), and a second metal layer 36, wherein the first metal layer 33 is attached to the wire 60, respectively. The first axial surface 611 of the first end 61 and the second axial surface 621 of the second end 62 of the wire 60, and the first axial surface 611 of the first end 61 of the wire 60 and the second end 62 of the wire 60 The biaxial surface 621 is electrically connected, the conductive adhesive 34 does not cover the first metal layer 33 or the first metal layer 33 covering the portion or covers all of the first metal layer 33, and the second metal layer 36 covers the conductive adhesive 34 and partially protects The layer 40 is electrically connected to the first metal layer 33, wherein the conductive paste 34 has a fixed function to help the second metal layer 36 adhere to the first metal layer 33 or the protective layer 40.
關於圖5繪示之電感的製造方法，包括：提供一導線60；形成一本體10將導線60封裝於其中；在本體10的外表面形成一保護層40；移除覆蓋在導線60的第一端61以及導線60的第二端62的材料，用以露出導線60的第一端61的第一軸面611以及導線60的第二端62的第二軸面621；形成電極構造，其中一第一電極構造附著於保護層40且與導線60的第一端61的第一軸面611電性連接，一第二電極構造附著於保護層40且與導線60的第二端62的第二軸面621電性連接。在一實施例，導線60可以是圓線、方線或扁線其中的任一種。在一實施例，導線60的第一端61的第一軸面611以及導線60的第二端62的第二軸面621係在本體10的同一表面或是二相對表面處露出(如圖6繪示之實施例)。The manufacturing method of the inductor shown in FIG. 5 includes: providing a wire 60; forming a body 10 to encapsulate the wire 60 therein; forming a protective layer 40 on the outer surface of the body 10; removing the first covering the wire 60 The end 61 and the second end 62 of the wire 60 are used to expose the first axial surface 611 of the first end 61 of the wire 60 and the second axial surface 621 of the second end 62 of the wire 60; forming an electrode configuration, one of which The first electrode structure is attached to the protective layer 40 and electrically connected to the first axial surface 611 of the first end 61 of the wire 60, and a second electrode structure is attached to the protective layer 40 and to the second end 62 of the wire 60. The shaft surface 621 is electrically connected. In an embodiment, the wire 60 can be any of a round wire, a square wire, or a flat wire. In one embodiment, the first axial surface 611 of the first end 61 of the wire 60 and the second axial surface 621 of the second end 62 of the wire 60 are exposed on the same surface or opposite surfaces of the body 10 (see FIG. 6). Illustrated embodiment).
在圖5繪示之電感的製造流程係用於舉例說明上述製造方法的一種實施例，並非用於限制該製造方法，圖5繪示的製造流程包括： S51、提供一導線60，導線60係為一螺旋式線圈，導線60可使用漆包線，導線60可以是圓線、方線或扁線其中的任一種；在一實施例，螺旋式線圈的繞線方式可以是外外繞，內外繞和臥繞其中的任一種；在另一實施例，包括提供一導線架50，導線60的第一端61和第二端62分別與導線架50連接，可利用導線架50固定導線60的位置； S52、將導線60和導線架50置於一模具中，再將磁性粉狀材料填入模具之中，先進行冷壓成型再以熱壓成型製程利用磁性粉狀材料包覆導線60及導線架50形成本體10，並將導線60封裝於其中，在此一步驟先形成較大的本體10，其中本體10係為一種磁性體； S53、裁切導線架50和多餘的本體10，令導線架50和經過裁切後的本體10的表面齊平，再對本體10的外表進行球磨； S54、在本體10的外表面形成保護層40，在一實施例，本體10為一矩形體(但不以此為限)，保護層40包覆矩形體的六面； S55、裁切導線架50和移除(可採用研磨方式)多餘的本體10以露出導線60的第一端61的第一軸面611以及導線60的第二端62的第二軸面621，本體10的裁切位置如圖6所繪示之裁切線L1，本發明先將導線60封裝於較大的本體10之中，再移除覆蓋在導線60的第一端61和第二端62的材料以露出導線20的第一端61的第一軸面611以及導線60的第二端62的第二軸面621，再於後續製程形成與導線60的第一端61的第一軸面611以及導線60的第二端62的第二軸面621電連接的電極構造，透過先作大再縮小本體10的方式，可以增加電感的繞線面積； S56、形成電極構造，電極構造包括：一第一金屬層33、一導電膠34(例如銀膠)和一第二金屬層36，其中第一金屬層33分別附著(attach)於導線60的第一端61的第一軸面611以及導線60的第二端62的第二軸面621並與導線60的第一端61的第一軸面611以及導線60的第二端62的第二軸面621電連接，導電膠34未覆蓋第一金屬層33或覆蓋部份的第一金屬層33或覆蓋全部的第一金屬層33，第二金屬層36覆蓋住導電膠34和部分保護層40並且與第一金屬層33電連接，其中導電膠34具有固定的作用可以幫助第二金屬層36附著於第一金屬層33或是保護層40。在一實施例，第一金屬層33可以利用電鍍或是物理汽相沈積製程形成，第一金屬層33的材質可為銅、金、錫和鋁其中的任一種，第二金屬層36可以利用電鍍、沾、噴或燙的製程形成，第二金屬層36覆著於第一金屬層33，其中第二金屬層36的材質可為錫(Sn)、鎳(Ni) 或其他適合的金屬或合金。The manufacturing process of the inductor shown in FIG. 5 is used to exemplify an embodiment of the above manufacturing method, and is not intended to limit the manufacturing method. The manufacturing process illustrated in FIG. 5 includes: S51, providing a wire 60, and a wire 60 system. For a spiral coil, the wire 60 can be an enameled wire, and the wire 60 can be any one of a round wire, a square wire or a flat wire; in one embodiment, the winding of the spiral coil can be an outer winding, an inner and outer winding, and Any of the above embodiments; in another embodiment, including providing a lead frame 50, the first end 61 and the second end 62 of the wire 60 are respectively connected to the lead frame 50, and the position of the wire 60 can be fixed by the lead frame 50; S52, placing the wire 60 and the lead frame 50 in a mold, and then filling the magnetic powder material into the mold, first performing cold pressing forming, and then coating the wire 60 and the lead frame with the magnetic powder material by a hot press forming process. Forming the body 10 and encapsulating the wire 60 therein, in this step, first forming a larger body 10, wherein the body 10 is a magnetic body; S53, cutting the lead frame 50 and the excess body 10, and making the lead frame 50 and The surface of the body 10 after cutting is flush, and then the outer surface of the body 10 is ball-milled; S54, a protective layer 40 is formed on the outer surface of the body 10. In an embodiment, the body 10 is a rectangular body (but not For example, the protective layer 40 covers the six sides of the rectangular body; S55, cutting the lead frame 50 and removing (using the grinding method) the excess body 10 to expose the first axial surface 611 of the first end 61 of the wire 60 And the second axial surface 621 of the second end 62 of the wire 60, the cutting position of the body 10 is as shown in FIG. 6 , the cutting line L1, the present invention first encapsulates the wire 60 in the larger body 10, and then moves In addition to the material covering the first end 61 and the second end 62 of the wire 60 to expose the first axial face 611 of the first end 61 of the wire 20 and the second axial face 621 of the second end 62 of the wire 60, and thereafter The process forms an electrode structure electrically connected to the first axial surface 611 of the first end 61 of the wire 60 and the second axial surface 621 of the second end 62 of the wire 60. The inductance can be increased by first reducing the size of the body 10 first. a winding area; S56, forming an electrode structure, the electrode structure comprises: a first metal layer 33, a conductive adhesive 3 4 (eg, silver paste) and a second metal layer 36, wherein the first metal layer 33 is attached to the first axial face 611 of the first end 61 of the wire 60 and the second end 62 of the second end 62 of the wire 60, respectively. The shaft surface 621 is electrically connected to the first axial surface 611 of the first end 61 of the wire 60 and the second axial surface 621 of the second end 62 of the wire 60. The conductive adhesive 34 does not cover the first metal layer 33 or the covering portion. The first metal layer 33 covers the entire first metal layer 33, and the second metal layer 36 covers the conductive paste 34 and the partial protective layer 40 and is electrically connected to the first metal layer 33, wherein the conductive paste 34 has a fixed function to help The second metal layer 36 is attached to the first metal layer 33 or the protective layer 40. In one embodiment, the first metal layer 33 may be formed by an electroplating or physical vapor deposition process, and the material of the first metal layer 33 may be any one of copper, gold, tin, and aluminum, and the second metal layer 36 may be utilized. A process of electroplating, dip, spray or hot is formed, and the second metal layer 36 is coated on the first metal layer 33, wherein the second metal layer 36 may be made of tin (Sn), nickel (Ni) or other suitable metal or alloy.
請參閱圖7，為本發明電感之另一實施例的製造流程圖，圖7繪示之製造流程中的步驟S51～S55和圖5繪示之製造流程中的步驟步驟S51～S55相同。其中圖7繪示電感之一實施例構造的製造流程與圖5的差異處在於二者具有不同的電極構造。圖7繪示之實施例的電極構造如步驟S76所繪示，包括：一導電膠34和一第二金屬層36，第二金屬層36覆蓋住導電膠34和部分保護層40並且分別與導線60的第一端61的第一軸面611以及導線60的第二端62的第二軸面621電連接，導電膠34介於第二金屬層36與保護層40之間。在圖7繪示之實施例，其中導電膠34係附著於本體10之保護層40的底面，導電膠34具有固定的作用可以幫助第二金屬層36附著於保護層40。在本發明的一實施例，第二金屬層36係以L型(見圖5之步驟S56所繪示之構造)或ㄈ型分佈於保護層40的外表面。在本發明的另一實施例，第二金屬層 36也可以形成於本體10之底部的保護層40的外表面。Please refer to FIG. 7 , which is a manufacturing flowchart of another embodiment of the inductor of the present invention. Steps S51 - S55 in the manufacturing flow shown in FIG. 7 are the same as steps S51 - S55 in the manufacturing flow shown in FIG. 5 . FIG. 7 illustrates a manufacturing process in which one embodiment of the inductor is different from that in FIG. 5 in that the two have different electrode configurations. The electrode structure of the embodiment shown in FIG. 7 is as shown in step S76, comprising: a conductive paste 34 and a second metal layer 36. The second metal layer 36 covers the conductive paste 34 and the partial protective layer 40 and is respectively connected to the wires. The first axial surface 611 of the first end 61 of the 60 and the second axial surface 621 of the second end 62 of the wire 60 are electrically connected, and the conductive paste 34 is interposed between the second metal layer 36 and the protective layer 40. In the embodiment shown in FIG. 7 , the conductive adhesive 34 is attached to the bottom surface of the protective layer 40 of the body 10 , and the conductive adhesive 34 has a fixed function to help the second metal layer 36 adhere to the protective layer 40 . In an embodiment of the invention, the second metal layer 36 is distributed on the outer surface of the protective layer 40 in an L-type (see the configuration shown in step S56 of FIG. 5) or a meandering type. In another embodiment of the present invention, the second metal layer 36 may also be formed on the outer surface of the protective layer 40 at the bottom of the body 10.
請參閱圖8及圖9，為本發明電感之另一實施例的製造流程圖，其中繪示電感之一實施例構造的製造流程及其局部構造。圖8繪示電感之一實施例構造的製造流程與圖5的差異處在於二者的本體10具有不同的構造，其中圖8繪示電感之一實施例構造的本體10包含一磁芯11。Please refer to FIG. 8 and FIG. 9 , which are manufacturing flow diagrams of another embodiment of the inductor of the present invention, illustrating a manufacturing flow of a configuration of an embodiment of the inductor and a partial configuration thereof. 8 is a diagram showing a manufacturing process of an embodiment of an inductor. The difference between FIG. 5 and FIG. 5 is that the body 10 has a different configuration, and FIG. 8 illustrates that the body 10 constructed in one embodiment of the inductor includes a magnetic core 11.
圖8繪示電感之一實施例構造的製造流程，包括： S81、提供一磁芯11，磁芯11可為T型磁芯(T Core)、I型磁芯(I Core)和壺型磁芯(Port Core)其中的任一種，圖8繪示的磁芯11係為T型磁芯，其中T型磁芯具有一磁柱12； S82、提供一導線60，導線60係為一螺旋式線圈並且繞設於磁柱12，在一實施例，螺旋式線圈的繞線方式可以是外外繞，內外繞和臥繞其中的任一種； S83、將導線60的第一端61和第二端62彎折再利用點焊或黏著材料固定於磁芯11的表面，其中導線60可使用漆包線，導線60可以是圓線、方線或扁線其中的任一種； S84、將磁芯11和導線60置於一模具中，再將磁性粉狀材料填入模具之中，然後進行熱壓成型製程利用磁性粉狀材料包覆磁芯11和導線60形成本體10，並將導線60封裝於其中，在此一步驟先形成較大的本體10，其中本體10係為磁性體，在一實施例，其中導線60的第一端61和第二端62係通過T型磁芯的側面而設置於本體10之底面13的一凹陷部131； S85、在本體10的外表面形成保護層40，在一實施例，本體10為一矩形體(但不以此為限)，保護層40包覆矩形體的六面； S86、移除(可採用研磨方式)多餘的本體10以露出導線60的第一端61和第二端62的一部分，本體10的研磨位置如圖9所繪示之研磨線L2，本發明先將導線60封裝於較大的本體10之中，再移除覆蓋在導線60的第一端61以及第二端62的材料以露出導線60的第一端61和第二端62的一部分，再於後續製程形成與導線60的第一端61和第二端62電連接的電極構造，透過先作大再縮小本體10的方式，可以增加電感的繞線面積； S87、形成第一金屬層33，第一金屬層33可以利用電鍍或是物理汽相沈積製程形成，第一金屬層33的材質可為銅、銀或其他適合的金屬或合金； S88、形成導電膠34，例如沾銀膠；以及 S89、形成第二金屬層36，第二金屬層36可以利用電鍍、沾、噴或燙的製程形成。8 is a manufacturing flow of a configuration of an embodiment of an inductor, comprising: S81, providing a magnetic core 11, the magnetic core 11 being a T core, an I Core, and a pot magnet. The magnetic core 11 of the core is a T-shaped magnetic core, wherein the T-shaped magnetic core has a magnetic column 12; S82, a wire 60 is provided, and the wire 60 is a spiral type. The coil is wound around the magnetic column 12. In an embodiment, the winding of the spiral coil may be externally wound, inner and outer winding and lying around; S83, the first end 61 and the second end of the wire 60 The end 62 is bent and fixed to the surface of the magnetic core 11 by spot welding or adhesive material, wherein the wire 60 can use an enameled wire, and the wire 60 can be any one of a round wire, a square wire or a flat wire; S84, the magnetic core 11 and The wire 60 is placed in a mold, and the magnetic powder material is filled into the mold, and then subjected to a hot press forming process to cover the magnetic core 11 and the wire 60 with the magnetic powder material to form the body 10, and the wire 60 is encapsulated therein. In this step, a larger body 10 is first formed, wherein the body 10 is a magnetic body, in a real For example, the first end 61 and the second end 62 of the wire 60 are disposed on a bottom surface 13 of the body 10 through a side surface of the T-shaped core; S85, a protective layer 40 is formed on the outer surface of the body 10. In one embodiment, the body 10 is a rectangular body (but not limited thereto), and the protective layer 40 covers the six sides of the rectangular body; S86, removing (using the grinding method) the excess body 10 to expose the wire 60 A portion of the first end 61 and the second end 62, the grinding position of the body 10 is as shown in FIG. 9 . The present invention first encapsulates the wire 60 in the larger body 10 and then removes the cover. The material of the first end 61 and the second end 62 of the wire 60 exposes a portion of the first end 61 and the second end 62 of the wire 60, and is then formed in a subsequent process with the first end 61 and the second end 62 of the wire 60. The connected electrode structure can increase the winding area of the inductor by first reducing the size of the body 10; S87, forming the first metal layer 33, and the first metal layer 33 can be formed by electroplating or physical vapor deposition process. The material of the first metal layer 33 may be copper, silver or other suitable metal or Gold; S88, conductive paste 34 is formed, for example, silver stained gel; and S89, the second metal layer 36 is formed, the second metal layer 36 may be by electroplating, dip, spray, or hot forming process.
請參閱圖10，為本發明電感之另一實施例的製造流程圖，圖10繪示之製造流程中的步驟S81～S86和圖8繪示之製造流程中的步驟步驟S81～S86相同。其中圖10繪示電感之一實施例構造的製造流程與圖8的差異處在於，圖10中所繪示之實施例的電極構造未設有第一金屬層33且與圖7之步驟S76所繪示之構造相同，所述電極構造包括：一導電膠34和一第二金屬層36，第二金屬層36覆蓋住導電膠34和部分保護層40並且分別與導線60的第一端61和第二端62的露出的部分電連接，導電膠34介於第二金屬層36與保護層40之間。圖10繪示步驟S98及步驟S99分別為： S98、形成導電膠34，例如沾銀膠(Ag glue)；以及 S99、形成第二金屬層36，第二金屬層36可以利用電鍍、沾、噴或燙的製程形成。Please refer to FIG. 10 , which is a manufacturing flowchart of another embodiment of the inductor of the present invention. Steps S81 - S86 in the manufacturing flow shown in FIG. 10 are the same as steps S81 - S86 in the manufacturing flow shown in FIG. 8 . FIG. 10 illustrates a manufacturing process of an embodiment of an inductor and a difference between FIG. 8 in that the electrode structure of the embodiment illustrated in FIG. 10 is not provided with the first metal layer 33 and with the step S76 of FIG. The structure is the same. The electrode structure includes a conductive paste 34 and a second metal layer 36. The second metal layer 36 covers the conductive paste 34 and the partial protective layer 40 and is respectively connected to the first end 61 of the wire 60. The exposed portion of the second end 62 is electrically connected, and the conductive paste 34 is interposed between the second metal layer 36 and the protective layer 40. 10, step S98 and step S99 are respectively: S98, forming a conductive paste 34, such as Ag glue; and S99, forming a second metal layer 36, and the second metal layer 36 can be plated, dipped, sprayed Or a hot process is formed.
雖然本發明已透過上述之實施例揭露如上，然其並非用以限定本發明，任何熟習相像技藝者，在不脫離本發明之精神和範圍內，當可作些許之更動與潤飾，因此本發明之專利保護範圍須視本說明書所附之請求項所界定者為準。While the present invention has been described above by way of example, the present invention is not intended to limit the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of patent protection is subject to the terms of the claims attached to this specification.
10‧‧‧本體
11‧‧‧磁芯
111‧‧‧頂面
112‧‧‧凹陷部
12‧‧‧磁柱
13‧‧‧底面
131‧‧‧凹陷部
20‧‧‧導電元件
21a、21b‧‧‧端子
211a‧‧‧第一部分
212a‧‧‧第二部分
213a‧‧‧第三部分
31‧‧‧金屬箔片
311‧‧‧黏著材料
32‧‧‧第一金屬層
33‧‧‧第一金屬層
34‧‧‧導電膠
35‧‧‧金屬層
36‧‧‧第二金屬層
40‧‧‧保護層
50‧‧‧導線架
60‧‧‧導線
61‧‧‧第一端
611‧‧‧第一軸面
62‧‧‧第二端
621‧‧‧第二軸面
L1‧‧‧裁切線
L2‧‧‧研磨線10‧‧‧ Ontology
11‧‧‧ magnetic core
111‧‧‧ top surface
112‧‧‧Depression
12‧‧‧ magnetic column
13‧‧‧ bottom
131‧‧‧Depression
20‧‧‧Conducting components
21a, 21b‧‧‧ terminals
211a‧‧‧Part 1
212a‧‧‧Part II
213a‧‧‧Part III
31‧‧‧metal foil
311‧‧‧Adhesive materials
32‧‧‧First metal layer
33‧‧‧First metal layer
34‧‧‧ conductive adhesive
35‧‧‧metal layer
36‧‧‧Second metal layer
40‧‧‧Protective layer
50‧‧‧ lead frame
60‧‧‧ wire
61‧‧‧ first end
611‧‧‧First axis
62‧‧‧ second end
621‧‧‧second axis
L1‧‧‧ cutting line
L2‧‧‧ grinding line
圖1，為本發明電子元件之一實施例構造的製造流程圖。 圖2，為圖1在II-II位置的一種實施例的構造斷面圖。 圖3，為圖1在II-II位置的另一種實施例的構造斷面圖。 圖4 ，為本發明電子元件之一實施例構造的製造流程圖。 圖5，為本發明電子元件之另一實施例構造的製造流程圖。 圖6，為圖5之實施例中的局部構造斷面圖。 圖7，為本發明電子元件之另一實施例構造的製造流程圖。 圖8，為本發明電子元件之另一實施例構造的製造流程圖。 圖9，為圖8之實施例中的局部構造斷面圖。 圖10，為本發明電子元件之另一實施例構造的製造流程圖。BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a flow chart showing the construction of an embodiment of an electronic component of the present invention. Figure 2 is a cross-sectional view showing the construction of an embodiment of Figure 1 at the II-II position. Figure 3 is a cross-sectional view showing the construction of another embodiment of Figure 1 at the II-II position. 4 is a manufacturing flow diagram of a construction of an embodiment of an electronic component of the present invention. Fig. 5 is a flow chart showing the manufacture of another embodiment of the electronic component of the present invention. Figure 6 is a partial structural sectional view of the embodiment of Figure 5. Figure 7 is a flow chart showing the fabrication of another embodiment of an electronic component of the present invention. Figure 8 is a flow chart showing the fabrication of another embodiment of the electronic component of the present invention. Figure 9 is a partial structural sectional view of the embodiment of Figure 8. Figure 10 is a flow chart showing the fabrication of another embodiment of the electronic component of the present invention.
10‧‧‧本體 10‧‧‧ Ontology
11‧‧‧磁芯 11‧‧‧ magnetic core
111‧‧‧頂面 111‧‧‧ top surface
112‧‧‧凹陷部 112‧‧‧Depression
12‧‧‧磁柱 12‧‧‧ magnetic column
20‧‧‧導電元件 20‧‧‧Conducting components
21a、21b‧‧‧端子 21a, 21b‧‧‧ terminals
31‧‧‧金屬箔片 31‧‧‧metal foil
32‧‧‧第一金屬層 32‧‧‧First metal layer
Claims (20)
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| US10224138B2 (en) | 2019-03-05 |
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