CN1154127C

CN1154127C - Wire wound electronic component and method for manfacturing the same

Info

Publication number: CN1154127C
Application number: CNB971141355A
Authority: CN
Inventors: 天田义弘; 青叶秀夫; 大塜一彦; 梅山信浩; 小泉胜男; 侭田信雄; 藤川岩; 柴信康; 上原孝行
Original assignee: Taiyo Yuden Co Ltd
Current assignee: Taiyo Yuden Co Ltd
Priority date: 1996-11-29
Filing date: 1997-11-14
Publication date: 2004-06-16
Anticipated expiration: 2017-11-14
Also published as: US6144280A; EP0845792A3; CN1187014A; US6727792B2; US6449830B1; DE69727543D1; EP0845792A2; EP0845792B1; US20020190832A1

Abstract

A wire wound electronic component of the present invention includes a bobbin having a core 1a having a substantially circular cross-section and rectangular flanges 1b formed at both ends of the core. A groove 2 is formed in each side of each flange 1b. A conductive film or external electrode 3 is formed on each flange 1b. A coil or wire 4 is wound round the core 1a and has a conductor protruding from opposite stripped ends thereof. The opposite ends 5 of the conductor are respectively received in the grooves 2 of the flanges 1b and connected to the conductive films 3. A coating or armor 6 is formed on the coil 4 and has a flat surface 6a. The coating 6 has a rectangular configuration complementary to the configuration of the flanges 1b.

Description

Coil type electronic component and manufacture method thereof

Technical field

The present invention relates to coil type electronic components such as inductor, transformer, choke.

Background technology

Various coil type electronic components are practicability, and carried out various improvement.Real opening a kind of fixed inductance element is disclosed in the clear 51-115547 communique for example, it is the core that coil is had the bobbin of flange around its end, simultaneously on the circumferential surface of flange, form conductive layer, the lead-in wire end of coil is connected on this conductive layer, but also is connected on the current-carrying part of printed circuit board (PCB).A kind of inductance element that is housed at flange part formation groove, with end winding in this groove is disclosed in the clear 56-110612 communique real opening.

Open in the clear 57-73916 communique the spy and to disclose a kind of midget inductor, it is that the coil terminal around core central authorities is connected on the conductor layer that the flange part in the core end forms, simultaneously with the resin-sealed electrode that then formed on end face.In addition, disclose a kind of chip coil real opening in the clear 61-144616 communique, it is that the coil lead groove is located on the square flange part, and lead-in wire is drawn, and also is provided with electrode in the side of flange simultaneously.

As mentioned above, the coil type electronic component is to constitute like this, is about to coil on core, simultaneously with the wire bond of this coil on the electrode of flange part.Such coil type electronic component is for example used method manufacturing shown in Figure 27.At first, shown in the profile among this figure (A), be ready to have respectively the bobbin of flange part 902 in the end of core 900.Secondly, shown in this figure (B), on the side and end face of flange part 902, form electrode 904 with infusion process.Secondly, shown in this figure (C), coil 906 on core 900, is utilized for example thermal pressure welding method simultaneously, its lead-in wire 908 is combined on the above-mentioned electrode 904.

Secondly, shown in this figure (D), with resin or applying coating on the core that has twined coil 906 as encapsulated layer 910.After this, shown in this figure (E), on electrode 904 parts, form electrodeposited coating 912 with Ni etc.Should scheme for another example shown in (F) integral body to be shaped to for example square column type.

, follow the miniaturization of e-machine, light-weighted progress in recent years, also strong request coil type electronic component miniaturization, lightweight.In addition, from the viewpoint that reduces cost, require to improve installation method and enhance productivity.

Summary of the invention

The present invention is conceived to these problems and finishes, and its purpose is not make Performance And Reliability to descend and seeks miniaturization, the lightweight of coil type electronic component.Another purpose is to improve the installation method of coil type electronic component and enhance productivity.

A kind of coil type electronic component of the present invention is characterized in that having: comprise core and be located at the bobbin of the flange at its two ends; The outer electrode that on the end face of above-mentioned flange and side, forms; On above-mentioned core, lead-in wire is connected coil on the said external electrode; The groove that is formed at least one side of above-mentioned flange, above-mentioned lead-in wire is accommodated; The encapsulated layer that flat surfaces is arranged that on above-mentioned coil, forms.

The manufacture method of a kind of coil type electronic component of the present invention is characterized in that comprising following operation: the processing bobbin comprises the operation of the bobbin of core and flange with blank, acquisition; On the end face of above-mentioned flange and side, form the operation of outer electrode; With coil on above-mentioned core, its lead-in wire is connected operation on the said external electrode simultaneously; The encapsulating material of resin is located on the above-mentioned coil, and above-mentioned encapsulating material is pressed into operation between the coil; With operation with above-mentioned encapsulating material planarization.

Above-mentioned and other purpose, feature and advantage of the present invention just can have been understood by following detailed description and accompanying drawing.

Description of drawings

Fig. 1 is the side view of oblique view, profile and variation of one of grown form example of the inductor of expression sheet of the present invention.

Fig. 2 represents to have the outer electrode different with Fig. 1 to use conduction by the profile of the bobbin of overlay film, and the plane graph of the syndeton of different coils.

Fig. 3 is the oblique view and the profile of example of the inductor of the another kind of sheet of expression.

Fig. 4 is the profile of example of the inductor of another sheet of expression.

Fig. 5 is the oblique view and the profile of the master operation of one of the manufacture method of expression bobbin of the present invention example.

Fig. 6 is the profile of the manufacture method example of the another kind of bobbin of expression.

Fig. 7 is oblique view, end view drawing and the side view of the another manufacture method example of expression.

Fig. 8 is the profile of another manufacture method example of expression bobbin and electrode.

Fig. 9 is side view, end view drawing and the profile of the manufacture method example of another kind of bobbin of expression and electrode.

Figure 10 is the profile of another manufacture method example of expression coil type electronic component.

Figure 11 is the oblique view that is illustrated in the example of the cap that uses in the method shown in Figure 10.

Figure 12 is the oblique view and the profile of the manufacture method example of the another kind of bobbin of expression.

Figure 13 is the profile and the end view drawing of the manufacture method example of the another kind of bobbin of expression.

Figure 14 is the profile of manufacture method example of the another kind of coil type electronic component of expression and the enlarged drawing of major part.

Figure 15 is the side view and the oblique view of the another kind of coil type electronic component example of expression.

Figure 16 is the profile of the another kind of coil type electronic component example of expression.

Figure 17 is the profile of the another kind of coil type electronic component example of expression.

Figure 18 is the profile of the associated methods example of expression lead-in wire of coil and electrode.

Figure 19 is the profile of the associated methods example of the lead-in wire of the coil of expression in another example and electrode.

Figure 20 is the profile and the oblique view of variation of the associated methods of expression lead-in wire of coil and electrode.

Figure 21 is the oblique view of the bobbin in another example of expression and the profile of conductor associated methods.

Figure 22 is the oblique view and the profile of the associated methods example of expression lead-in wire of another coil and electrode.

Figure 23 is the oblique view of the associated methods example of expression lead-in wire of another coil and electrode.

Figure 24 is another routine profile, end view drawing and the side view of expression encapsulated layer.

Figure 25 is side view, profile and the end view drawing of one of expression another example of encapsulated layer and installment state example.

Figure 26 is the oblique view of the another kind of bobbin example of expression and the oblique view of representing the major part of coil type electronic component example.

Figure 27 is the profile of the main manufacturing process of the coil type electronic component in the expression background technology.

Embodiment

Though the present invention can have many kinds of forms, only provide suitable several forms and embodiment here, and explain.

One of Fig. 1 (A), (B) expression chip inductor example.Among this figure, Yi Bian magnetic bobbin 1 by the rounded core 1a of section and be located at the two ends of core 1a, for example for the square-shaped flange 1b of 0.8mm, 1b constitute, for example make with ferrite.Formed on its each limit formed on the lateral surface of

flange

1b, 1b of V-shaped groove 2 that the degree of depth for example is 0.06mm and the side face outer electrode with conduction by

overlay film

3,3, it is to utilize to electroplate or the dipping baking method, is made of silver, silver-platinum or copper and the nickel that is covered in the above, lead-Xi etc.

With diameter for example be 20～120 μ m, lining material be the insulation-coated lead of Polyurethane, polyamide-imide etc. on the core 1a of this magnetic bobbin 1, turn to coil 4.The

terminal

5,5 of coil 4 is inserted in the V-

shaped groove

2,2 on the flange 1b, by welding, thermo-compressed or ultrasonic vibration carry out combination be connected outer electrode with conduction by on the overlay film 3,3.In these methods, when adopting the hot pressing connection, be to be pressed on the terminal 5 of insulation-coated lead by the heating head that will be heated, make this terminal 5 distortion, be flat form, be combined in above-mentioned conduction by on the overlay film 3.In addition, in the ultrasonic vibration method, utilize the vibration of heating head, the insulation-coated layer on the terminal 5 is removed, copper cash and the above-mentioned conduction cleaned out are pressurizeed by overlay film 3, both are combined with heating head.

Because the section of core 1a is roughly rounded, so insulation-coated lead closely can be wrapped on the surface of core 1a, compares with the situation that the section of core is square, the deviation of inductance value is little, and the insulation-coated layer of lead is sustained damage.Encapsulated layer 6 is made of for example synthetic resin of epoxy series insulating material such as (also can mix compound), for example by the cast encapsulation, this material is covered on whole outer peripheral faces of coil 4.The surface that forms this encapsulated layer 6 is being in the side face inboard of above-mentioned

flange

1b, 1b, and along above-mentioned side face planarization, the limit surperficial intersecting each other that these are flattened is positioned at the outside of the inscribed circle of flange 1b, 1b.Promptly shown in Fig. 1 (B), formed encapsulated layer 6 is flat column along the shape of

flange

1b, 1b, and its surface is positioned at the inboard of

flange

1b, 1b.

This inductor has used magnetic bobbin 1, but under the situation of the inductor that is used for high frequency, also the bobbin that can constitute with insulators such as aluminium oxide.In addition, shown in Fig. 1 (C), (D), also can encapsulated layer 6 be covered on whole outer peripheral faces of coil 4, but be overlayed on the mid portion of the coil 4 except the part at axial two ends, and be covered with identical width or change width along whole circumference.

The attraction mouth contact of above-mentioned chip inductor by making automatic mounting machine adsorbed on the flattened surperficial 6a of above-mentioned encapsulated layer 6, can easily carry and be configured on the printed circuit board (PCB).Then, will be on the current-carrying part that the outer electrode that forms on flange 1b conduction is welded on the printed circuit board (PCB) by

overlay film

3,3, thus be installed on the printed circuit board (PCB).When being installed to such chip inductor on the printed circuit board (PCB), do not need to consider especially installed surface.In addition, because the flange 1b of bobbin 1 is square, so do not roll can not resemble round flange the time.

By changing to the flange 1b of bobbin 1, the impregnating depth of 1b, shown in Fig. 2 (A), the said external electrode is overlayed on along on a part of side face of the width of

flange

1b, 1b by

overlay film

3,3 with conduction, perhaps shown in Fig. 2 (B), be layed onto till the medial surface of

flange

1b, 1b always.

In addition, on flange 1b, the 1b of above-mentioned bobbin 1, formed the terminal 5 of coil 4 has been inserted the

groove

2,2 of usefulness, but also can not form this groove 2,2.In addition, shown in Fig. 2 (C), (D), the terminal 5 that also can make coil 4 tilt with thickness direction with respect to flange 1b or along the lateral surface of

flange

1b, 1b with the state of bending be connected outer electrode with conduction by on the overlay film 3,3.In these cases, also the situation with shown in Figure 1 is identical, and the

terminal

5,5 of coil 4 is deformed into flat by welding, thermo-compressed or ultrasonic vibration and is bonded on the outer electrode of flange 1b with conducting electricity by on the overlay film 33.

Fig. 3 represents the example of another chip inductor.In this inductor, above-mentioned encapsulated layer 6 is overlayed on the outer peripheral face of the coil 4 corresponding with a limit of the side face of square flange 1b, 1b.The surperficial 6a of this encapsulated layer 6 is positioned at the side face inboard of

flange

1b, 1b, and flattened.Other structure has nothing different with shown in Figure 1.This encapsulated layer 6 equally also can be overlayed on the outer peripheral face of the coil 4 corresponding with another limit of the side face of

square flange

1b, 1b or two limits.

In inductor shown in Figure 1, on the groove 2 that forms on the flange 1b is each limit at

flange

1b, 1b, form, but also can set suitable number as required.When all forming groove 2 on whole 4 limits at flange 1b, in order to obtain desirable inductance value, the

terminal

5,5 of coil 4 can be inserted some in 4 grooves 2 and carry out combination.

Fig. 4 (A), (B) show the example of another chip inductor.The section of the magnetic of these inductors or insulating properties bobbin 11 is roughly rounded, with insulation-coated lead above it, turn to coil 4, for the terminal 5 of crimping coil 4, that square outer electrode is chimeric and be fixed on the two ends of above-mentioned bobbin 11 with conductive cap 7.The encapsulated layer 6 that lining one deck is made of for example synthetic resin on whole outer peripheral faces of above-mentioned coil 4.This encapsulated layer 6 also with Fig. 1 in embodiment be made like, it is along outer electrode with the flat column of

conductive cap

7,7, the surperficial 6a of planarization is in the inboard of

conductive cap

7,7.

Fig. 4 (C), (D) are the variation of Fig. 4 (A), (B).These inductors are after square outer electrode is entrenched in the two ends of rounded magnetic of section or insulating properties bobbin 11 with conductive cap 7, two

terminals

5,5 of the coil 4 that will make on this bobbin 11 are connected according to above-mentioned associated methods and form on the outer peripheral face of above-mentioned

cap

7,7 again, other structure identical with shown in Fig. 4 (A), (B).

In inductor shown in Figure 4, shown in Fig. 1 (C), (D), can be on whole outer peripheral faces of the mid portion except axial two ends of coil 4 with encapsulated layer 6 linings, perhaps as shown in Figure 3, can be overlayed on square outer electrode outer peripheral face with the corresponding coil 4 at least on one side of the side face of conductive cap 7 on.

In addition, can make the surface planarization of encapsulated layer 6, so that can adsorb without barrier by the attraction mouth of automatic mounting machine as in precedent.That is, section configuration can not be the concentric circles of core 1a, and can be the shape that makes along the concavo-convex mitigation of the insulation-coated lead generation of the axial winding of core 1a.In addition, encapsulated layer 6 all is to form in that the side face of any one flange 1b or above-mentioned conductive cap 7 is inboard, but the needs when installing also can be in on the one side with these side faces, perhaps can also be in the outside of these side faces.Can also adopt the material that for example magnetic such as ferrite powder, croci powder is made as encapsulated layer 6 in the resin material of epoxy resin series etc. in addition.If use such material, then can improve inductance value, the corresponding number of turns of value of minimizing and this increase can also produce magnetic screening effect simultaneously.In addition, in previous embodiment, make being shaped as of flange 1b of bobbin 1 make its bight, outside be curved flat column, but if prismatic also can be the polygon prism shape.The Machining of Curved Surface in bight also is arbitrarily.

Figure 5 illustrates the manufacture method of the bobbin of another embodiment.Among this figure, (B) be the section of seeing towards the direction of arrow along the #1-#1 line in (A).As shown in these figures, form the recess of using at the center of aligning 12 at the bobbin of flat column respectively with the central authorities of the end face of blank 10.Shown in the arrow F1 among this figure (B), be that the center makes this bobbin with blank 10 rotations with recess 12, middle body is pruned, can obtain the bobbin 18 that the end at columned core 14 shown in this figure (C) has the flange part 16 of column.If desired, shown in this figure (D), also can carry out R processing at the top.

In addition, by on the part of core 14 and flange part 16, forming slick and sly part 20, can seek to improve the bond strength of core 14 and flange part 16.In addition, also it doesn't matter still to keep recess 12, but also can it be cut away from the position shown in the arrow F2 of this figure (C), carries out R processing again at the top, forms the shape shown in this figure (D).

Secondly, at the end formation protuberance 24 of the bobbin shown in Fig. 6 (A), be pivot with it with blank 22, shown in this figure (B), carry out the processing of core 26 and flange part 28.In this embodiment, shown in this figure (C), also can cut off protuberance 24 as required.Secondly, the example shown in this figure (D) is with 32 examples that are combined on the bobbin usefulness end of blank 30 that go between.And, be that the center makes its rotation with these lead-in wires 32, shown in this figure (E), processing core 34 and flange part 36.Certainly still can use lead-in wire 32, perhaps also can resemble and it be cut away recess 12 in the precedent or the protuberance 24.

Shown in Fig. 7 (A), form groove 42 in each side of blank 40.Then, shown in the arrow F3 among this figure (B), clamp these grooves 42, keep bobbin with blank 40, resemble and process core and flange part the example.Example shown in this figure (C) is to use each survey face of blank 44 and end face to form V-shaped groove 46 at the bobbin of flat column, intersects in the central authorities of end face.Shown in the arrow F4 among this figure (D), carry out clamping in this crosspoint 48, keep bobbin with blank 44, resemble and process core and flange part the example.This figure (D) is the state after the processing in addition.

As implied above, if adopt Fig. 5～example shown in Figure 7, owing to can align machining center well, so can obtain high machining accuracy.Therefore, can improve the operating efficiency of later formation electrode and winding around etc.In addition,, concavo-convex that the center of aligning of a side uses formed at flange part, the forming of opposite side at core when only when an end of core forms flange part.

Secondly, example shown in Figure 8 is about form the schematic diagram of the method for electrode at flange part.For example, shown in this figure (C), being immersed in flange part 50 with silver etc. is in the paste 52 of main component, forms electrode.In the method, the degree of depth that is impregnated in the paste 52 owing to flange part 50 can change, so can not form electrode accurately.

The end is pre-formed electrode 56.Also can on whole blank, form electrically conductive film.Then, for example resemble and process this bobbin the precedent, form core 56, flange part 60 respectively with blank 54.At this moment, shown in this figure (B), the part of electrode 56 is carried out cut, just can form electrode 56 accurately.If adopt this method, then can adjust L (inductance value) and Q (quality factor) accurately.

In addition, if the viscosity of paste 52 or viscosity are low, shown in this figure (E), form electrode 56 along the ledge surface rather level areas.On the other hand, if the viscosity of paste 52 is big, shown in this figure (D), electrode 56 form bulging, be suitable in the bight or the top makes the electrode film thickening.According to this reason, preferably use tough paste.In addition, also can carry out twice coating with viscosity low paste and the high paste of viscosity.For example, lay a foundation with the low paste of viscosity at first, secondly carry out the top layer coating with the high paste of viscosity, it is suitable doing like this.

Secondly, under the situation of using pottery as the bobbin material, has the character of burning till the back hardening.Therefore, in example shown in Figure 9, before burning till, process.At first shown in this figure (A), utilize and burn till the bobbin blank 62 that preceding pottery is ready to flat column.In addition, shown in the end face among this figure (B), at the side formation groove 64 of bobbin with blank 62.Secondly, under the state of before this burns till, easily processing, shown in this figure (C), processing core 66, flange part 68.In addition, in this processing, also can carry out the center that aligns such in the foregoing description.After this processing, carry out bobbin burning till with blank 62.

Figure 10 shows another embodiment.In this embodiment, shown in the section among this figure (A), at the cap 84 of the two ends of bobbin 80 covering band lead-in wire 82.Bobbin 80 is to form flange part 85 at the two ends of core 86, forms electrode 81 on flange part 85.In addition, also can replace bobbin 80 with following method, be about to cap 84 and be combined on the bobbin blank of above-mentioned column, 82 be the center to go between, and processing flange part and core get final product.For example cap 84 is the shape shown in Figure 11 (A), has the recess 89A of the flange part 85 that can embed bobbin 80, forms the window 83 of slit-shaped accordingly with the coil lead connecting portion on the flange part 85.The state of cap 84 after combination has been shown in Figure 10 (B).

Secondly, shown in this figure (C), under this state,, stride across flange part 85 to core 86 winding arounds 90 from going between 82.After this, shown in this figure (D), the lead portion of coil 90 utilizes scolding tin 91 to be welded on the electrode 81 by the window 83 on the cap 84.In addition, coat the encapsulated layer 92 of resin etc. to being wrapped in coil 90 on the core 86.Secondly, push down the welding position of coil lead Yi Bian adopt, Yi Bian draw suitable method such as cap 84 grades, cap 84 is separated from bobbin 80, the cut-out that will go between becomes the form shown in this figure (E).Then, electroplate (not shown) at electrode 81 and weld with Ni etc.

Another example of cap 84 has been shown in Figure 11 (B), (C).To be bobbins be the example of flat column situation with blank 80 with cap 84 shown in this figure (A), has the recess 89A of the flat column corresponding with it.To be bobbin be the example of cylindric situation with blank 80 to cap 84A shown in this figure (B), has columned recess 89B, the window 83A corresponding with it.Also to be bobbin be the example of cylindric situation with blank 80 to cap 84B shown in this figure (C), has columned recess 89C, the window 83B corresponding with it.If the employing present embodiment by the blank of different shape and the cap of band lead-in wire are made up, then can directly utilize the manufacturing equipment of band lead-in wire part, make the coil type electronic component.

Secondly, example shown in Figure 12 is to use the example of cap equally.As mentioned above, from the angle of installing at substrate, flange part preferably is tabular surface, from the angle of a large amount of installations, does not preferably have directivity in addition.One of flange shape that satisfies these conditions is square., from the angle of easy processing, preferably cylindric.Therefore in the present embodiment, shown in this figure (A), square flange cap is combined in the end of cylindric core, then satisfies such condition.

In detail, on cylindric core 100, form the core 102 of thicker slightly end 104 and central authorities.With the recess 106 that forms on end face is that these processing are carried out at the center.On the other hand, flange cap 108 has the columned recess 110 corresponding with above-mentioned end 104, and the end 104 of cylindric core 100 is pressed into this part, perhaps uses bonding agent bonding.Vertical section after bonding is shown in this figure (B).Do like this and just can obtain core and be bobbin cylindric, that flange part is flat column.In addition, also can be pre-formed groove in the side of flange cap 108.

Figure 13 shows the variation of above embodiment.At first, the example of this figure (A) is the example that is bonded in the end of columned core 120 with the flange cap 124 that bonding agent 126 will have a recess 122.As flange cap 124, the cap that adopts the end face shown in this figure (B) for example to be square.In addition, shown in this figure (C), also can form groove 128 in the side of flange cap 124.Example shown in this figure (D) is the example that is bonded in the end of columned core component 130 with the flange cap 134 that bonding agent 136 will have a through hole 132.From end face, shown in figure (E).

In addition, in any example of Figure 12, Figure 13, as required, also can on cap, form groove.Can form cap with pottery, form electrode more in its surface, also can form whole cap with metal.If do like this, then radiator body plays in entire flange portion, and good exothermal effect can be arranged.In addition, can use various materials such as the adhesives of resin, conductivity of insulating properties or scolding tin as bonding agent.

Secondly, the embodiment among Figure 14 (A) is described.This embodiment is the embodiment of relevant coil.Coil 142 is wrapped on the bobbin 140, again on coil applying coatings 144 as encapsulated layer.In this embodiment, shown in arrow F5, coating 144 is pressed into coil 142 sides.So, amplifying shown in the back as this figure (B), coating 144 enters in the coil 142, can improve the insulation property of coil 142.Secondly, the example shown in this figure (C) is the example that the surface of the core 152 of coil-winding skeleton 150 is matsurface.If adopt this example, amplify shown in the back as this figure (D), utilize rough surface to prevent the offset of coil 154.

Secondly, Figure 15 shows the embodiment of coil lead to the link position of electrode part (being equivalent to flange part and electrode).At first, the example shown in this figure (A) represents that groove 204,206 on the electrode part 200,202 is with respect to the situation of the vertical misalignment of bobbin configuration.The lead-in wire 210,212 of coil 208 utilizes groove 204,206 to be combined on the electrode respectively.By such configured slot, can obtain to relax the effect of the stress that the contraction owing to the encapsulated layer resin produces.Example shown in this figure (B) is to form groove 222,224,226,228 on electrode part 220, forms the example of groove 232,234,236,238 on electrode part 230.By coil lead 210,212 is combined in any one groove, the number of turns of coil 208 can be changed, and then L and Q can be adjusted easily, can enhance productivity.Example shown in this figure (C) be the groove 242 that forms on the electrode part 204 with at the groove 246 that forms on the flange part 244 be the example that forms on the different face at square column respectively.In this embodiment, the number of turns that changes coil can be adjusted L and Q.In addition, if, then can adjust L, Q more accurately with (B) and (C) combine.

Secondly, with reference to Figure 16 another example is described.This example is that coating or resin are coated in example on the coil for twice.At first, as the sectional arrangement drawing in (A) and shown in the drawing in side sectional elevation (B), coating 314 is is coated on the coil 312 that is wrapped on the bobbin 310 (not shown electrode) cylindricly.Secondly, as the sectional arrangement drawing in (C) and shown in the drawing in side sectional elevation (D), coating 316 is coated on the coating 314 with being flat column.Laying a foundation with the low coating of viscosity forms bottom 314, and making coating immerse wire rod is between the coil 312, can seek to improve insulation property between the fixing and wire rod of wire rod.In addition, become face coat 316, can adjust the thickness of coating, carry out shaping well with the big applying coating of viscosity.As required, can also repeatedly apply.

Secondly, the example among Figure 17 is described.At first, in this figure (A), the lead-in wire of the coil 352 on the core 350 is bonded between part on the electrode 356 of flange part 354 and the encapsulated layer 358 and has gap 360.If such gap 360 is arranged, then it can become the reason that bad phenomenon such as broken string take place.Therefore in this example, on the encapsulated layer 358 of coil 352, add one deck protection encapsulated layer 362 again.In order to combine with electrode 356, utilize infusion process or replica method etc. on the bobbin end face, to form electroconductive resin 364, on it, form electrodeposited coating 366 again.By protecting such gap 360 with encapsulated layer 362, can prevent broken string etc. with protection.In addition, also can be individually formed encapsulated layer 358 and protection encapsulated layer 362 on the coil 352, but shown in this figure (B), also can form simultaneously.In addition, also can be banded ground at gap portion and only form the protection encapsulated layer.Figure 17 (C) is the example with electroconductive resin 363 protection gaps 360.

Secondly, with reference to Figure 18 another embodiment is described.Shown in Figure 18 (A), the line that uses as coil is the lead of the coating 412 that formed by insulant of being covered on conductor 410.Therefore, when being connected to coil lead on the electrode, can coating 412 be removed with any method.

At this moment, in the present embodiment, shown in this figure (B), make the rough surface of conductor 410, form concavo-convex (matsurface) 414.For example when coating 412 is peelled off, if, just can form concavo-convex 414 simply with the surface of mechanical means friction conductor 410.The vertical section that has formed concavo-convex 414 conductor 410 is shown in this figure (C), be shown in this figure (D) perpendicular to section longitudinally, shown in this figure (C), (D), conductor 410 is placed on the electrode 418 that forms on the flange part 416, utilize methods such as thermo-compressed, welding, ultrasonic wave crimping, conductor 410 is combined on the electrode 418.The bonding state of conductor 410 and electrode 418 utilizes so-called grappling (ア Application カ-) effect shown in this figure (E), (F), utilize concavo-convex 414 to make conductor 410 bite electrode 418 securely, improves bond strength.

This figure (G)～(K) shows variation.This example is the example (with reference to this figure (G), (H)) of the groove 420 that the formation section takes the shape of the letter U on flange part 416.Conductor 410 combines with electrode 418 in groove 420, at this moment, electrode 418 can with conductor 410 on concavo-convex 414 collude together, the same with the foregoing description, can improve both bond strengths (with reference to this figure (I), (J)).In addition, shown in this figure (K), also conductor 410 can be housed in the groove 420.Do like this and can make installation surface easy to use.

If adopt these embodiment, owing to formed groove 420, increased the bonded area of conductor 410 and electrode 418, also can increase bond strength thus.In addition, conductor 410 is housed in the groove 420, has reduced the degree of giving prominence to from electrode 418.Therefore, can improve with the substrate (not shown) on the bond strength of electrode pattern, have stable advantage be installed.

Secondly, with reference to Figure 19 another embodiment is described.This figure (A) shows vertical section of coil-winding skeleton, (B), (C) show the major part of its section of seeing along the #2-#2 line and along the direction of arrow.On the side of the flange part 432 of bobbin 430 and end face, form electrode 434 respectively.

, in for example silver-colored paste of conductive paste that forms electrode 434, contain frit as bond.In addition, under the situation of conductive adhesive (or electroconductive resin), contain organic principle (for example epoxy resin, phenolic resin, allyl resin) as bond.Therefore in the present embodiment, shown in the direction of the arrow F6 among this figure (B), electrode 434 is to form like this, and promptly the closer to flange part 432 1 sides, the concentration of frit is high more, and the closer to a surperficial side, the concentration of frit is low more.In other words, at the concentration height of flange one side frit 434A, otherwise, at the concentration height of a surperficial side silver granuel 434B, a surperficial side concavo-convex big.Adopt the methods such as wetability of adjusting stoving temperature or adjustment and flange part blank, just can form such concentration gradient.Shown in this figure (C), utilize methods such as thermo-compressed, coil lead conductor 436 is combined on such electrode 436.

In general, the concentration of frit is high more, and bond strength is just big more.Therefore, form the core material of flange part 432 and form the concentration height of the silver-colored paste of electrode 434, so together with high strength bond owing to frit.On the other hand, the combination of silver-colored paste and coil lead conductor 436 shown in figure (B), (C) since exist by silver granuel 34B forms concavo-convex, so the same with the above embodiments because anchoring effect, the adhesion enhancing.

As mentioned above, if adopt present embodiment, then cementability two aspects of the combining closely property of electrode and flange part and electrode and coil lead conductor can both improve, and can obtain good reliability.In addition, in the present embodiment, also can on flange part 432, form groove, to strengthen adhesion.

Also can on a plurality of layers, form electrode, for example, shown in Figure 20 (A), on flange part 432, form silver electrode 431, on it, form Sn-Pb electrodeposited coating 433 simultaneously again, utilize the ultrasonic heating that involves, with leading-in conductor 436 adhere (comprise alloy in conjunction with) on above-mentioned electrodeposited coating, also can obtain with Figure 19 in routine same effect.As the method for combination, except mechanical bond shown in Figure 19, methods such as adhere shown in Figure 20, conductor and primer are spread and the diffusion-bonded of combination.Mechanical bond, adhere, the two or more method of diffusion-bonded can certainly be combined.

In addition, shown in this figure (B), change the end position 434P of the electrode 434 of flange part 432 sides by resembling shown in the arrow F7, its result can adjust the bond strength of electrode 434 and lead-in wire 436.In addition, in this embodiment, groove 438 form broad, can make lead-in wire 436 with respect to bobbin vertically (direction of the arrow F7 among the figure) be combined in obliquely on the electrode 434.Therefore can make the angle of bend of lead-in wire 436 obtain relaxing, can prevent broken string.

Secondly, with reference to Figure 21 another embodiment is described.In this figure (A), bobbin has been shown, has formed the flange part 442 of flat column in the end of the columned core 440 of central authorities respectively.Form the groove 444 of back taper respectively in each substantial middle position, side of flange part 442.The section of the groove of seeing from the direction of arrow F8 444 has been shown in this figure (B), on the surface of flange part 442, has formed electrode 448.And coil lead conductor 446 is inserted in the groove 444, is crimped on the electrode 448.

Therefore, in the present embodiment, as mentioned above, groove 444 is back taper.Therefore shown in this figure (C), the coil lead conductor 446 after the crimping is embedded in the groove 444.The bond strength of electrode and coil lead conductor along with in conjunction with the time condition different and different, along with the difference of situation, leading-in conductor might be stripped from., if adopt present embodiment, even in conjunction with the time condition deviation more or less, but because leading-in conductor is embedded in the groove 444 of back taper, so can keep bonding state, what can prevent to go between peels off.

Secondly, with reference to Figure 22 another embodiment is described.The outward appearance of embodiment has been shown in this figure (A), has illustrated in (B) along #3-#3 line and its section of seeing along the direction of arrow.In addition, the bound fraction of coil lead conductor and electrode is shown in (C) after amplifying.

Coil 452 is wrapped on the core 450 of bobbin central authorities.And on the flange part 454 of bobbin end, be respectively equipped with from the bobbin inboard laterally through hole 456, on side and end face, form electrode 458 in addition.The leading-in conductor 460 of coil 452 passes the through hole 456 on the flange part 454 respectively.The front end of coil lead conductor 460 for example is combined on the electrode 458 with conductive paste.

Like this, if adopt present embodiment, then coil lead conductor 460 is inserted in the flange part 454, rather than is located on the side of flange part 454.Therefore, can reduce the effect of external force, can keep well and the combining of electrode 458 coil lead conductor 460.In addition, because the side of flange part 454 can flatly keep well, so can also combine well with substrate-side conductor fig (not shown).In addition, through hole 456 is near more from core 450, and external force is low more to the influence of coil lead conductor 460, can also prevent coil lead conductor 460 broken strings.

Secondly, with reference to Figure 23 another embodiment is described.At first, describe from the embodiment shown in this figure (A), form the groove 472 that its section takes the shape of the letter U respectively in the side of flange part 470, side and the end face at flange part 470 forms electrode 474 in addition.And, in the present embodiment, form concavo-convex 476 on the surface of electrode 474.For example adopt methods such as blasting treatment, selective etch, just can form concavo-convex 476.Coil lead conductor (not shown) is crimped on the electrode 474 in groove 472.At this moment, concavo-convex 476 of electrode 474 plays a part to collude tight, improves both bond strengths.In addition,, all forming concavo-convexly aspect leading-in conductor side and the electrode side two, then can further improve both bond strengths if with the embodiment among this embodiment and Figure 18 combination.

In addition, as mentioned above, owing to formed groove 472, the faying face of leading-in conductor and electrode 474 increases, and also can increase bond strength thus.In addition, leading-in conductor is housed in the groove 472, can reduce from the outstanding degree of electrode.Therefore can improve with substrate (not shown) on the binding ability of electrode pattern, installation is also stablized.

Secondly, the embodiment shown in this figure (B) is described.On flange part 480, form groove 482, on its side and end face, form electrode 484.In this embodiment, the front end of coil lead conductor 486 is positioned at the inboard of the end face 480A of flange part 480, is bonded on the electrode 484.If the front end of coil lead conductor 486 is in the end face 480A place of flange part 480, when then electroplating or during integral installation, because the fore-end friction, coil lead 486 might be peeled off from electrode 484, if but adopted present embodiment, then could prevent this peeling off well.

Secondly, the embodiment among this figure (C) is described.On flange part 490, form groove 492, on its side and end face, form electrode 494.In this embodiment, the front end of coil lead conductor 496 highlights from groove 492, and the bight that is R shape of its front end edge flange part 490 bends to end face one side, is combined on the electrode 494.Because the front end of coil lead conductor 496 bends to the flange part end face,, can improve both bond strengths so increase with the bonded area of electrode 494.Therefore, can prevent well during plating or when installing that the fore-end of coil lead conductor 496 from peeling off.

Secondly, the embodiment of the flatness that improves packed part is described with reference to Figure 24.The section behind the encapsulated layer in the present embodiment has been implemented in this figure (A) expression.In the figure, on the end of the core 512 of bobbin 510 central authorities, be respectively equipped with square flange part 514.On each side of flange part 514 and end face, form the electrode 516 that coil lead connects usefulness.Coil 518 is wrapped on the core 512, and the lead-in wire 520 at its two ends utilizes methods such as thermo-compressed to be combined on the electrode 516 respectively.On the surface of electrode 516, form the electrodeposited coating 522 that constitutes by Ni etc. again.

, in the present embodiment, on coil 512, form encapsulation coating 524 with coating or resin.Side in (A) has been shown in this figure (B), and this encapsulated layer 524 is outstanding laterally more many than electrodeposited coating 522.Under this state, in the present embodiment,, will remove from electrodeposited coating 522 outstanding parts with methods such as grinding processing encapsulation coating 524, carry out planarization.Therefore, improve the flatness of each side of square column type, can adsorb well, can improve the stability on substrate simultaneously.In addition, if to the encapsulation coating 524 grind deeplyer than the survey face of flange part 514, then can form accurately and substrate between the interval.The method that improves flatness is not limited to grinding described here, can also adopt the method for the injection ester moulding that for example uses metal pattern.

Figure 24 (C) shows the form when installing, and forms interval 526 by encapsulation coating 524.And, the coil type electronic component is installed like this, make that other part 530 on the substrate 528 is positioned at interval 526.In addition, in this example, how many encapsulation coatings 524 keeps in flange part one side, forms interval 526.This be for the lead-in wire 520 of coil 518 and electrode 516 in conjunction with the time, the attrition process by the encapsulation coating does not produce obstacle.

Next, the example among Figure 25 (A), (B) is the embodiment about the ratio of the flat of encapsulation coating.As mentioned above, from the viewpoint of adsorptivity and stability, the encapsulation coating is preferably smooth, but its integral body not necessarily must be smooth.That is, (A) being plane graph, (B) is that coil 541 is wrapped on the core 539 along #4-#4 line in (A) and the section of seeing along the direction of arrow, and the electrode part 540 at two ends is flat column., the ratio of the width W P of the tabular surface 544 of each side of the encapsulation coating 542 of central authorities is 30% of side overall width WT., even the clear and definite planarization that reaches this degree also can be adsorbed well, and can maintain stability on the substrate.In addition, even if say so tabular surface, but needn't be the plane fully also, more or less curvature also can.

Embodiment shown in this figure (C) is that to make on the coil between the flange part 550 552 surface of the encapsulation coating 554 that forms be the example of matsurface (concavo-convex).As the method that obtains such matsurface be: (1) uses the coating of the high coating of viscosity as the encapsulation coating, and the concavo-convex of coil 552 can be presented; (2) be mixed in the encapsulation coating by filler, make the surface of encapsulation coating very coarse the regulation particle diameter, or the like.Like this, small concavo-convex by on the surface of encapsulation coating 554, forming, when supplying with in large quantities, can reduce the fricative static between part and the part.The skew of the part position that produces in the time of in addition, can also reducing the adsorption mouth vibration during installation.

Secondly, the embodiment shown in Figure 25 (D) is the example about the conductive paste on the substrate, for example scolding tin.As shown in the drawing, if adopt this example, on each side of electrode part 560, form groove 562 respectively.And coil lead (not shown) is combined in arbitrarily in the groove 562.If part is placed on the substrate 564, be the state shown in Figure 25 (D) just.Under this state, if enclose scolding tin 566, then scolding tin 566 is introduced in the groove 562, even a spot of scolding tin also can form good angle welding, can obtain big bond strength.Therefore, be well suited for miniaturization, lightweight.If make entire electrode portion 560 be with scolding tin resembling in the past, then owing to the influence of this scolding tin, bad phenomenon such as crackle can take place in part, but in the present embodiment, can improve this bad phenomenon well.

Secondly, the embodiment shown in Figure 26 (A) is the example of part flattening, and the end surface shape of the flange part 570 of bobbin is rectangle.And shown in the section of seeing along the #5-#5 in (A) and along the direction of arrow among this figure (B), the core 572 between these flange parts 570 is ellipticity.In addition, form the groove 574 that coil lead connects usefulness respectively in the side of flange part 570.Dispose to such an extent that contact by side, can seek the flattening of part with real estate with long limit one side of flange part 570.In addition, dispose to such an extent that contact, can reduce the special-purpose area of part with real estate by side with minor face one side of flange part 570.If adopt this example, then can use same part neatly according to the different purposes flat, that erection space is little.In addition, be ellipticity, can guarantee the area of core by making the core section.

Embodiment shown in this figure (C) is the example that forms fuse 588 at the bound fraction of the lead-in wire 586 of the electrode 582 of flange part 580 and coil 584.In this embodiment, form electrode, can reach the function of fuse 588 fully with thicker film.Fuse 588 designs to such an extent that just fuse more than rated current, can protective circuit.In addition, owing to do not need to install in addition fuse, so help miniaturization, lightweight.In addition, except fuse, can also form other circuit element, for example resistance or capacitor.If on flange part 580, form such recesses such as groove, in this recess, form circuit element again, then can be well suited for installing.

In addition, in the above-described embodiments, for example carry out sintering, form bobbin with ferrite or aluminium oxide.And the electrode that forms on the surface of the flange part of end is to be formed by the electrodeposited coating that is the thin layer of 1～60 μ m of main component or thick film layers and 1～10 μ m that is made of Ni, Sn, Sn-Pb etc. that forms on it with Ag, Ag-Pd, Ag-Pt, Cu etc.In addition, if provide one of size example, then the length of bobbin is 1.6mm, and wide and high is about 0.8mm.The diameter of the core of bobbin central authorities is 0.2～0.7mm, and the width of flange part 16 is 0.2～0.5mm.

As previously discussed, if adopt the above embodiments, then has following effect.

(1) owing to the encapsulated layer that on coil, has formed surface, so when being installed on the printed circuit board (PCB), can attract mouth to adsorb easily and reliably and mobile part with it with automatic mounting machine with planarization.

(2) because part integral body is prism-shaped, on printed circuit board (PCB), do not roll the situation of tubular bobbin so can not resemble with round flange, install easily.

(3) owing to form at bobbin and to illustrate top concavo-convexly,, can increase work efficiency simultaneously so can carry out high-precision processing with blank.

(4) owing to form electrode, form precision so can improve it by cut.

(5) owing to cap being installed in the end of bobbin, so can be adapted to different shape well with blank.

(6) owing to coating is pressed in the coil, so can improve insulation property.

(7) owing to making the core of bobbin become dried matsurface, so can prevent the offset of coil.

(8) owing to the bound fraction at flange part and core forms slick and sly part, so can improve intensity.

(9) can reduce needed operation when making, improve working condition, can produce coil type electronic component expeditiously with the multifrequency nature that can be adapted to various circuit.

(10) owing to being connected with respect to bobbin, lead-in wire vertically is positioned on the above-mentioned electrode of deviation post, so can adjust L and Q.

(11) use encapsulated layer owing to form protection,, can improve quality and production efficiency so can prevent broken string etc.

(12) since with at least one faying face of coil lead conductor or electrode on form concavo-convex, so can increase both adhesions.In addition,,, further increased adhesion, made the flange side planarization simultaneously, be suitable for installing so both bonded areas increase owing to be provided with groove at the flange part of bobbin.

(13) when forming electrode with conductive paste, owing to adjust the concentration of bonding agent so that the concentration of flange part one side concentration big, leading-in conductor one side is little, so the bond strength between flange part and electrode, electrode and the arbitrary coil lead conductor all increases.

(14) owing to make the groove on the flange part be back taper, so the coil lead conductor is embedded in the groove, can increase bond strength, prevent that conductor from peeling off, make the flange side planarization simultaneously, can install well.

(15) owing on flange part, be provided with through hole, make the coil lead conductor pass this through hole, peel off, can directly keep the flattened side of flange part simultaneously, be suitable for installing so can prevent conductor.

(16), or be positioned at agley on the flange part end face owing to make the front end of coil lead conductor be positioned at the inboard of the groove of flange part slightly, thus when electroplating or when installation can prevent peeling off of conductor well.

(17) owing to the encapsulation coating that will exceed electrode part formation is removed the shape that is processed into regulation,, can improve mounting condition so can realize complanation accurately.If necessary, can also form desirable interval accurately.

(18) owing to make the encapsulation coating surface be matsurface,, can improve mounting condition so can reduce the generation of static and the skew of position.

(19) owing to form groove in the electrode part side, thus with a spot of scolding tin or conductive paste with regard to can obtain and substrate between high bond strength, can improve mounting condition.

(20) the square column shape that is rectangle owing to the end face that makes flange part is so can seek flattening and reduce erection space.

(21) owing between coil lead and electrode, form circuit element,, can further improve mounting condition so can reduce the part number.

The present invention has multiple example, according to above explanation, can carry out multiple variation.For example comprise following form.

(1) in the above-described embodiments, show the bobbin that core central authorities are cylindric, flange part is square, but also might as well make the bobbin that makes the core central portion be different shapes such as flat column.For example, also can adopt the coil type electronic component that only has the longitudinal type of flange part at an end of core.Whether the flange part side has groove all the same.Also can the groove of connecting coil lead-in wire usefulness be arranged a position on flange part, but also can divide the side that is located at flange part, be suitable for installing and carrying out the characteristic adjustment.The material that each several part uses also can suitably be selected as required.

(2) also the foregoing description can be combined.

(3) in the above-described embodiments, mainly be that the present invention is used for inductor, but in addition, also can be applied to universal choke, transformer, array of cores various coil type electronic components such as (PVC-ズアレイ).

(4) in the above-described embodiments, formed electrode with silver-colored paste etc., but also can adopt plating, the whole bag of tricks such as sputter, evaporation.In addition, except silver-colored paste, also can use paste or electroconductive resins such as Cu, Ni, Ni-Cr.

Claims

1. coil type electronic component is characterized in that having:

Comprise core and be located at the bobbin of the flange at its two ends;

The outer electrode that on the end face of above-mentioned flange and side, forms;

On above-mentioned core, lead-in wire is connected coil on the said external electrode;

The groove that is formed at least one side of above-mentioned flange, above-mentioned lead-in wire is accommodated;

The encapsulated layer that flat surfaces is arranged that on above-mentioned coil, forms.

2. coil type electronic component according to claim 1 is characterized in that: the said external electrode comprise with the face of above-mentioned connecting airtight property of flange height and with the face of the high associativity of above-mentioned lead-in wire.

3. coil type electronic component according to claim 1 is characterized in that: above-mentioned groove is back taper.

4. coil type electronic component according to claim 1 is characterized in that: in any one side of above-mentioned flange, have the front end of above-mentioned lead-in wire and the joint portion of said external electrode combination.

5. coil type electronic component according to claim 1 is characterized in that: have form on the surface of above-mentioned encapsulating material small concavo-convex.

6. coil type electronic component according to claim 1 is characterized in that: above-mentioned core be ellipticity with the vertically vertical section of bobbin, being rectangle of above-mentioned flange with the vertically vertical section of bobbin.

7. coil type electronic component according to claim 1 is characterized in that: have the lead-in wire that is arranged on above-mentioned coil and the circuit element between the said external electrode.

8. the manufacture method of a coil type electronic component is characterized in that comprising following operation:

The processing bobbin comprises the operation of the bobbin of core and flange with blank, acquisition;

On the end face of above-mentioned flange and side, form the operation of outer electrode;

With coil on above-mentioned core, its lead-in wire is connected operation on the said external electrode simultaneously;

The encapsulating material of resin is located on the above-mentioned coil, and above-mentioned encapsulating material is pressed into operation between the coil; With

Operation with above-mentioned encapsulating material planarization.

9. the manufacture method of coil type electronic component according to claim 8, it is characterized in that: form recess or the protuberance that the center of aligning is used on the end face of blank at above-mentioned bobbin, with these recesses or protuberance is the center, and bobbin is processed to obtain the above-mentioned bobbin that comprises core and flange with the blank rotation.

10. the manufacture method of coil type electronic component according to claim 8, it is characterized in that: form the lead-in wire that the center of aligning is used on the end face of blank at above-mentioned bobbin, with this lead-in wire is the center, and bobbin is processed to obtain the above-mentioned bobbin that comprises core and flange with the blank rotation.

11. the manufacture method of coil type electronic component according to claim 8, it is characterized in that: the recess or the protuberance that form maintenance usefulness at above-mentioned bobbin with the side of blank, utilize these recesses or protuberance to keep the bobbin blank, its rotation is processed to obtain the above-mentioned bobbin that comprises core and flange.

12. the manufacture method of coil type electronic component according to claim 8 is characterized in that: form electrode at above-mentioned bobbin on blank, add and man-hour its part is removed.

13. the manufacture method of coil type electronic component according to claim 8 is characterized in that: the cap that will process usefulness is installed on the above-mentioned flange, after being combined in above-mentioned coil on the said external electrode, above-mentioned cap is removed simultaneously.

14. the manufacture method of coil type electronic component according to claim 8 is characterized in that: the cap that will play above-mentioned flange or said external electrode is installed in above-mentioned bobbin with on the end face of blank.

15. the manufacture method of coil type electronic component according to claim 8 is characterized in that: make above-mentioned bobbin be matsurface with the surface of the above-mentioned core of blank.

16. the manufacture method of coil type electronic component according to claim 8 is characterized in that: the binding site at above-mentioned core and above-mentioned flange forms curvature portion.

17. the manufacture method of coil type electronic component according to claim 8 is characterized in that: utilize the high maceration extract of viscosity, adopt dipping method to form the said external electrode.

18. the manufacture method of coil type electronic component according to claim 8 is characterized in that: above-mentioned resin is coated on the above-mentioned coil several times.

19. the manufacture method of coil type electronic component according to claim 8 is characterized in that:

Apply above-mentioned resin on above-mentioned coil, make it be projected into the outer side surface of said external electrode; And

The desirable shape with flat surfaces is removed and is processed on the surface of the encapsulating material that will form by the coating of resin.