JPH08264384A - Chip-type component electronic component - Google Patents

Abstract

PURPOSE: To eliminate a failure in attraction owing to a collet by forming a second protection film on an upper face of a first protection film at a recess above a thin electronic component to make the surface of a main body nearly flat. CONSTITUTION: A protection film 15 of a chip-type composite electronic component 1 is formed with insulating paste printed, while its formation range is on an electrode 13 except a part where the electrode 13 is in contact with a side electrode 20 and on a base 11 including an electrode 14, a capacitor C and a resistor R. Thickness of the component 1 is high at a part of the capacitor C which is of a laminated structure and low at a part of the resistor R, while a recess 17 is formed on the protection film 15 on the resistor R part. After paste of the same material as that of the protection film 15 is printed on the recess 17 via a screen owing to squeegee 30 so that the surface of a main body 10 is flat, the component is baked to form a passivation film 18. Thus when the component is attracted by a collet and mounted on a a subtrate, a failure in attraction can be prevented from occurring.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type composite electronic component.

[0002]

2. Description of the Related Art Conventionally, as this type of chip-type composite electronic component, one shown in FIG. 4 has been known. This composite electronic component includes a main body A, and the main body A is a plate-shaped base B.
And a pair of first electrodes E, E each having one side extending to the edge of the base B and the other side connected to a capacitor C and a resistor R formed by printing on the upper surface of the base B, respectively, and the capacitor C. And a resistance R, a second electrode F connecting the first and second electrodes E and F, a capacitor C, and a protective film G covering the surface of the base B including the resistance R, and the first electrode E. And a side surface electrode H which is connected to and is formed from the side surface of the base B to the back surface.

In such a composite electronic component, the capacitor C has a laminated structure in which a dielectric is sandwiched between the first and second electrodes E and F, while the first electrode E and another second electrode F are formed.
A resistance paste is printed directly on the surface of the substrate B so as to bridge the gap between and, and a resistance R is formed by firing, and then a protective film G is printed on the upper surfaces of the capacitors C and R. Since the protective film G is formed by printing and baking, the film thickness becomes uniform at any position of the film thickness, and as a result, the surface (first protective film) of the main body A is formed in an uneven shape. H is a side surface electrode that is connected to the first electrode and is mounted on a circuit board or the like with solder or the like.

[0004]

Generally, in the above-mentioned conventional chip-type composite electronic component, it is adsorbed by the collet I shown in FIG. 5 and mounted on a predetermined circuit board or the like. When mounted in this manner, the chip-type composite electronic component is extremely small, so that it is difficult to align it with the collet I, and if the surface of the main body A is formed in a concavo-convex shape, an extremely fine positional deviation occurs. However, as shown in FIG. 5, there is a problem that the collet I is attracted by the collet I as it is tilted, and falls off during transportation, or it cannot be properly mounted on a target circuit board or the like, resulting in mounting failure.

Due to such a problem, conventionally, the attraction force of the collet I is increased more than necessary, and the boundary between the upper part of the capacitor C and the upper part of the resistor R, which causes a step, is avoided to avoid the upper part of the capacitor C or the resistor R. A collet with an extremely small diameter was used so that it could be adsorbed only at the top, and it was handled with high precision control. However, according to the above-mentioned method, a problem such as a positioning error at the time of suction, which causes a suction failure, is not sufficient as a means for solving the lump. Further, in recent years, in the miniaturization of composite electronic parts, the above-mentioned problems are more remarkable.

A mark is always provided on the surface of such a composite electronic component, and as a method of this mark, there are generally two methods, a print mark and a laser mark. Two
In the case of the marking method as described above, if the surface of the main body A is uneven, there is a problem in that marking unevenness occurs due to uneven printing or the focal length of the laser due to the effects of unevenness. Due to such a problem, in order to reduce the influence of unevenness, there is a need to reduce the influence of unevenness.
The structures disclosed in Japanese Patent Laid-Open No. 47597 (published on February 26, 1993) and Japanese Patent Laid-Open No. 5-217715 are proposed. This structure will be described with reference to FIG. 5. A protective layer for eliminating the step with the capacitor C is formed only above the resistor R, and then both the capacitor C and the protective layer on the resistor R are formed. To form another protective layer that covers

An object of the present invention is to solve the above-mentioned problems and to provide a composite electronic component having high practicality.

[0008]

A chip-type composite electronic component according to claim 1 is a plate-shaped base, a plurality of electronic components having different thicknesses provided on the upper surface of the base, and the plurality of electronic components. A chip-type composite electronic component including a first protective film covering the surface of the second protective film, wherein a second protective film is formed on an upper part of the electronic component having a thin thickness on the upper surface of the first protective film.
The surface of the main body is configured to be substantially flat.

According to a second aspect of the present invention, a chip-type composite electronic component is connected to a plate-shaped substrate, one side extending to an edge of the substrate, and the other side connected to a capacitor and a resistor printed on the upper surface of the substrate. A first protective film for covering the surface of the base including the first and second electrodes, the capacitor, and the resistor, and a pair of first electrodes for connecting the capacitor and the resistor. In the chip-type composite electronic component, the second protective film is formed by printing on at least the upper surface of the first protective film, which covers the resistance, of the upper surface of the first protective film, and the surface of the main body is flattened. It is characterized in that it is configured into a shape.

[0010]

In the chip-type composite electronic component according to the first and second aspects, since the surface of the main body of the chip-type electronic component is made flat, for example, a predetermined circuit board or the like is attracted by the collet. Even when it is mounted on, it is possible not only to reduce the possibility that it could not be picked up due to the unevenness of the main body surface as in the past, but it is also suitable for composite electronic parts that are becoming extremely miniaturized. Play.

Further, in the chip-type composite electronic component having the above-mentioned structure, two layers of the first protective layer and the second protective layer are exposed on the surface of the component, so that, for example, the second protective layer and the first protective layer are formed. When the color of the protective layer is different from that of the protective layer, it is possible to easily determine which is the resistor or the capacitor. The details will be described in detail, but the above-mentioned JP-A-5-47597 and JP-A-5-21 by the same inventor.
It is possible to provide a chip-type composite electronic component having advantages that the No. 7715 does not have.

[0012]

Embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited to these embodiments and can be widely applied to various chip-type composite electronic components. 1 is a side sectional view of a chip-type composite electronic component according to an embodiment of the present invention, and FIG. 2 is a plan view of the chip-type composite electronic component.

In the figure, reference numeral 1 denotes a chip-type composite electronic component, which is mounted on a wiring pattern of a main body 10 and a side edge of the main body 10 and a circuit board (not shown). It is composed of side electrodes 20. The main body 10 has a capacitor C and a resistor R as electronic parts, and an electrode 1 for electrically connecting the electronic part and the side electrode 20 on a plate-shaped base 11 made of ceramic.
2 is provided, and the electronic component and the electrode 12 are insulation-coated with a first protective film 15 in a predetermined range.

The electrode 12 is composed of a first electrode 13 and a second electrode 14, and the first electrode 13 and the second electrode 14 extend from the one end edge 11A of the base 11 toward the other end edge 11B thereof. The electrode 13, the second electrode 14, and the first electrode 13 are formed in this order, and a capacitor C and a resistor R are sequentially formed between the first electrode 13 and the second electrode 13, 14. The capacitor C includes the dielectric layer 1 on the tip portion 13A of the first electrode 13.
6 is formed by printing, and one end portion 14A of the second electrode 14 is laminated on the upper surface of the dielectric layer 16.

The resistor R is formed from the other end 14B of the second electrode 14 and the other end 11B of the base 11 to one end edge 1 thereof.
It is formed by printing and baking a paste of ruthenium oxide or the like between the end portion 13B of another first electrode 13 provided toward 1A. In the present embodiment, a chip-type CR composite electronic component including a capacitor C and a resistor R is shown, but the present invention is not limited to this, and it is of course applicable to other composite electronic components such as a chip-type CL composite electronic component. .

The first protective film 15 is formed by printing an insulating paste such as glass or resin, and the forming range is such that the first electrode 13 and the side electrode 20 are in contact with each other. First first electrode 13 and second electrode 14 excluding parts
And the capacitor C and the resistor R are formed on the base 11. The first protective film 15 may be made of any of glass-based resins as long as it has an insulating property.
It is preferable to use a material that does not affect the firing temperature when forming the protective film 15, such as changing the characteristics of the other electrodes 12, the dielectric 16, the resistor R, and the capacitor C.

Next, when the first protective film 15 is formed, since the electrode 12 has a thickness of about 60 μm, the composite electronic component 1 has a high thickness in the portion of the capacitor C having the laminated structure and the resistance R. The concave portion 17 is formed on the first protective film 15 above the portion of the resistance R. The surface of the main body 10 is flattened in the recess 17 with a paste made of the same material as the first protective film 15 through a screen (not shown) by a squeegee 30 shown in phantom in FIG. The second protective film 18 is printed after being printed into a shape
Has been formed. The surface of the second protective film 18 and the surface of the first protective film 15 above the capacitor C form a flat surface 10A of the main body 10. By using the paste of the same material as described above, the first protective layer 15 and the second protective layer are made to fit well with each other, and it is possible to reduce the risk that they will be peeled off later or cracks will be generated due to the difference in thermal expansion coefficient.
Further, if different pigments are mixed into both the first protective layer 15 and the second protective layer, it is possible to easily grasp which is the resistor R and which is the capacitor C due to the difference in the color from the surface. .

The method of forming the second protective film 18 is not limited to the screen printing described above, and it is also possible to form it by other coating means such as potting a resin paste in the recess 17. However, according to the screen printing of the present invention, a scan is made from the upper part of the resistor R to the upper part of the capacitor C.
Since the printer 30 is moved and printed, the resistance R
The step portion 1 on the first protective film 15 above the boundary between the capacitor C and the capacitor C.
Even if 5A is formed, it is possible to eliminate the possibility that the squeegee 30 will fly at the stepped portion 15A and print omission will occur.

Further, in this embodiment, the second protective film 18 is used.
The insulating material made of the same material as that of the first protective film 15 is used for the above, but the material is not limited to this, and since the first protective film has an insulating property, a conductive material can also be applied. Further, in this embodiment, the portion of the recess 17 is filled with the second protective film 18, and the surface of the main body 10 is flattened by the surface of the second protective film 18 and the surface of the first protective film 15 above the capacitor C. However, the present invention is not limited to this, but after the recess 17 is filled with the second protective film 18, the second protective film 18 and the first protective film 15 are covered with a third protective film. Can also be formed. In this case, as described above, in order to mix different pigments into both protective films so that it can be grasped which is the capacitor which is the resistance, it is necessary to use a transparent third protective film containing no pigment.

FIG. 3 shows a chip-type composite electronic component 1.
The figure shows a state in which is adsorbed by a collet. In the figure, reference numeral 32 denotes a collet. The collet 32 has a pyramid-shaped concave portion suction portion 33 having the same shape as the surface 10A of the main body 10 formed at the tip of the collet 32.
At 3, the chip-type composite electronic component 1 is adsorbed. In the suctioned state, the corner portion 10B of the surface 10A is the recessed portion suction portion 33.
Since the chip-type composite electronic component 1 and the collet 32 are slightly misaligned,
The inclined portion 33A can correct the suction.

[Brief description of drawings]

FIG. 1 is a side sectional view of a chip-type composite electronic component according to an embodiment of the present invention.

FIG. 2 is a plan view of FIG.

FIG. 3 is a reference view showing a state in which the chip-type electronic component of the present invention is sucked by a collet.

FIG. 4 is a side sectional view showing a conventional chip-type composite electronic component.

FIG. 5 is a state diagram showing a state in which a conventional chip-type composite electronic component is sucked by a collet.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Chip type composite electronic component 10 Main body 11 Base body 13 First electrode 14 Second electrode 15 First protective film 17 Recess 18 Second protective film 30 Squeegee C Capacitor R Resistance

Claims (2)

[Claims] 1. A plate-shaped substrate, a plurality of electronic components having different thicknesses provided on the upper surface of the substrate, and a first protective film covering the surfaces of the plurality of electronic components and the surface of the substrate. A chip-type composite electronic component, wherein a second recess is provided in an upper portion of the thin electronic component on the upper surface of the first protective film.
A chip-type electronic component, characterized in that a protective film is formed and the surface of the main body is formed to be substantially flat. 2. A plate-shaped substrate, a pair of first electrodes extending on one side to an edge of the substrate and connected on the other side to a capacitor and a resistor printed on the upper surface of the substrate, respectively. A chip-type composite electronic component having a capacitor and a second electrode for connecting a resistor, the first and second electrodes, the capacitor, and a first protective film including a resistor and covering a surface of a substrate. Of the upper surface of the first protective film,
A chip-type composite electronic component, characterized in that a second protective film is formed by printing on a recess in the upper part of the first protective film that covers at least the resistor so that the surface of the main body is flat.