CN85108518A - Rare earth-tin-lead solder and preparation method - Google Patents

Rare earth-tin-lead solder and preparation method Download PDF

Info

Publication number
CN85108518A
CN85108518A CN 85108518 CN85108518A CN85108518A CN 85108518 A CN85108518 A CN 85108518A CN 85108518 CN85108518 CN 85108518 CN 85108518 A CN85108518 A CN 85108518A CN 85108518 A CN85108518 A CN 85108518A
Authority
CN
China
Prior art keywords
tin
rare earth
solder
lead
lead solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 85108518
Other languages
Chinese (zh)
Inventor
谢郴民
廖人淮
周晓冬
李都玉
曹友根
曹辛菊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHENZHOU ELECTROOPTIC SOURCE WELDING MATERIALS FACTROY
Original Assignee
CHENZHOU ELECTROOPTIC SOURCE WELDING MATERIALS FACTROY
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHENZHOU ELECTROOPTIC SOURCE WELDING MATERIALS FACTROY filed Critical CHENZHOU ELECTROOPTIC SOURCE WELDING MATERIALS FACTROY
Priority to CN 85108518 priority Critical patent/CN85108518A/en
Publication of CN85108518A publication Critical patent/CN85108518A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A kind of rare earth-tin-lead solder and preparation method.It is on the basis of the plumbous series solder of known tin, the plumbous silver-colored series solder of tin, adds alterant norium or single metallic cerium, makes grain refinement, adds P elements, improves the product antioxygenic property.Rare earth-tin-lead solder is compared with known HLSnpb39 tin-lead solder, the product light, and its stanniferous amount reduces by 5~7%.Physicochemical property, serviceability are all more superior, and scolder per ton is saved refined tin 50-70 kilogram.Be applicable to the scolder in welding of electronics industry line and the components and parts assembling.

Description

Rare earth-tin-lead solder and preparation method
The present invention relates to a kind of used in electronic industry rare earth-tin-lead solder and preparation method.
In the electronics industry, known slicken solder is with the most use with tin-lead series and tin-lead-Yin series at present.For certain welding purpose, also a small amount of golden series solder, aluminium series solder, plumbous series solder, tin series solder, indium series solder, zinc series solder of adopting.The scolder that these are serial perhaps because of price is too high, perhaps because of the reason of performance own, is restricted its purposes.Tin-lead series, tin-lead-Yin series solder, various in style, and also of many uses.But general many products with stanniferous 55~65%, the most plumbous eutectic composition of tin scolders that adopt stanniferous 61.9% on transfer matic.In recent years, because the tin valency goes up, cause the product cost of high tin content to rise.
The purpose of this invention is to provide a kind of rare earth-tin-lead solder improves the product antioxygenic property and improves welding performance.
Solution of the present invention is to add alterant norium or single metallic cerium with the intermediate alloy form, makes grain refinement; Add the antioxygen element phosphor with the intermediate alloy form and improve the product antioxygenic property.Chemical composition of the present invention is as shown in table 1.
Table 1 chemical composition of the present invention (%)
Tin Plumbous Antimony Rare earth Silver Copper Phosphorus Indium
54~55 39~45 0.09~0.1 0.003~0.01 0.013~0.05 0.08~0.1 0.003~0.008 0.005~0.02
For the accurate chemical analysis of control alloy, rare earth metal, phosphorus, copper, antimony, silver is respectively with rare earth-lead, copper phosphorus-Yin, and antimony-Xi, binary or ternary alloy three-partalloy form add.And use topped dose of multicomponent system fused salt, reduce scaling loss.
Rare earth-tin-lead solder is compared surface-brightening with known HLSnPb39 tin-lead solder, and antioxygenic property is good, and its stanniferous amount reduces by 5~7%, and scolder per ton is saved refined tin 50-70 kilogram.Compare with known HLSnPb39 tin-lead solder, the physicochemical property of rare earth-tin-lead solder and serviceability are all more superior.The physical property test result is as shown in table 2.
Table 2 physical property of the present invention
Fusing point ℃ Than gross ton/centimetre 3 Tensile strength kilogram/millimeter 2 Peel strength kilogram/millimeter 2 Diffusivity % Resistivity Europe-centimetre
183~190 8.6 5.71 12.10 >86 11.2
Optimum implementation of the present invention is: with graphite crucible with No. 1 tin of spy, a lead, 201 phosphor-coppers, cerium-2, No. one star metal is made the rare-earth-lead alloy that contains 10% rare earth respectively, the ag-cu-p alloy that contains 23% silver medal contains the antimony ashbury metal of 78.7% antimony, and these intermediate alloys are cut into small pieces.
With tin, the plumbous adding in the casting iron pan, heat fused is warming up to 300~400 ℃ and adds intermediate alloy then, stir after waiting to melt, solder of the present invention.
After rare earth-tin-lead cast rod, adopt known SS1-3 type activated rosin flux,, and pull into the welding wire of φ 0.8~φ 2.0 mm dias, be suitable for doing in the electronics industry line welding and use by single core or the moulding of multicore mould time processing.
Another embodiment of the invention is: rare earth-tin-lead solder is made the scolder of all size and shape, be suitable for using in the assembling procedure of electronics industry components and parts, and tin content also can continue to reduce.

Claims (3)

1, a kind of rare earth-tin-lead solder, it is characterized in that stanniferous 54~55% by weight, lead 39~45%, antimony 0.09~0.1%, rare earth 0.003~0.01%, silver 0.013~0.05%, copper 0.08~0.1%, phosphorus 0.003~0.008%, indium 0.005~0.02%, rare earth metal is an alterant, and phosphorus is antioxidant.
2, rare earth alloy scolder according to claim 1 is characterized in that the alterant rare earth metal is to add with rare earth-Xi bianry alloy form.Antioxidant phosphorus is to add with phosphor-copper-Xi form.
3, rare earth alloy scolder according to claim 1, it is characterized in that can be by single core or the known activated rosin flux time processing moulding of multicore mould adapted, and pulls into the active welding wire of φ 0.8~φ 2.0 mm dias.
CN 85108518 1985-10-19 1985-10-19 Rare earth-tin-lead solder and preparation method Pending CN85108518A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 85108518 CN85108518A (en) 1985-10-19 1985-10-19 Rare earth-tin-lead solder and preparation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 85108518 CN85108518A (en) 1985-10-19 1985-10-19 Rare earth-tin-lead solder and preparation method

Publications (1)

Publication Number Publication Date
CN85108518A true CN85108518A (en) 1987-04-22

Family

ID=4796047

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 85108518 Pending CN85108518A (en) 1985-10-19 1985-10-19 Rare earth-tin-lead solder and preparation method

Country Status (1)

Country Link
CN (1) CN85108518A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100366376C (en) * 2005-12-23 2008-02-06 南京航空航天大学 Leadless brazing filler metal containing cerium
CN101834217B (en) * 2006-07-14 2013-01-23 日立电线株式会社 Method for fabricating connecting lead wire used for solar battery module
CN105382443A (en) * 2015-12-18 2016-03-09 黄河水电光伏产业技术有限公司 Alloy welding flux, preparation method thereof and application thereof
CN107591460A (en) * 2017-09-27 2018-01-16 西安泰力松新材料股份有限公司 A kind of photovoltaic welding belt and preparation method thereof
CN108555472A (en) * 2017-12-29 2018-09-21 西安泰力松新材料股份有限公司 A kind of photovoltaic welding belt solder and preparation method thereof
CN108788511A (en) * 2018-06-25 2018-11-13 深圳市博士达焊锡制品有限公司 It is a kind of to have kupper solder and preparation method thereof with high anti-oxidation ability
US11285569B2 (en) 2003-04-25 2022-03-29 Henkel Ag & Co. Kgaa Soldering material based on Sn Ag and Cu

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11285569B2 (en) 2003-04-25 2022-03-29 Henkel Ag & Co. Kgaa Soldering material based on Sn Ag and Cu
CN100366376C (en) * 2005-12-23 2008-02-06 南京航空航天大学 Leadless brazing filler metal containing cerium
CN101834217B (en) * 2006-07-14 2013-01-23 日立电线株式会社 Method for fabricating connecting lead wire used for solar battery module
CN105382443A (en) * 2015-12-18 2016-03-09 黄河水电光伏产业技术有限公司 Alloy welding flux, preparation method thereof and application thereof
CN107591460A (en) * 2017-09-27 2018-01-16 西安泰力松新材料股份有限公司 A kind of photovoltaic welding belt and preparation method thereof
CN108555472A (en) * 2017-12-29 2018-09-21 西安泰力松新材料股份有限公司 A kind of photovoltaic welding belt solder and preparation method thereof
CN108788511A (en) * 2018-06-25 2018-11-13 深圳市博士达焊锡制品有限公司 It is a kind of to have kupper solder and preparation method thereof with high anti-oxidation ability

Similar Documents

Publication Publication Date Title
CN101780607B (en) Lead-free solder for electronic packaging, assembling and soldering and preparation method thereof
CN1803381A (en) Leadless soldering material and its preparation method
CN101456103A (en) Leadless soft soldering material and manufacture method thereof
CN85108518A (en) Rare earth-tin-lead solder and preparation method
CN103028863A (en) High-anti-oxidation lead-free solder
CN103978323A (en) Lead-free solder
CN100467192C (en) Pb-free solder alloy compositions comprising essentially tin, silver, copper and phosphorus
CN102500946A (en) Sn-Ag-Cu-Bi-Er low-silver and lead-free welding flux and preparation method for same
CN1203960C (en) Oxidation-inhibited lead-free welding materials
CN1235718C (en) Tin-zinc base plumbum-free solder alloy and its preparing technology
CN101081463A (en) Sn-Ag-Cu-Dy Lead-free solder alloy
CN101862925A (en) Tin-bismuth-silver series lead-free solder and preparation method
CN100408255C (en) Cadmium-free silver solder containing indium and cerium
CN1010754B (en) Copper-based polybasic alloy soldering materials
CN103934590A (en) ZnAlMgIn high temperature lead-free solder
CN101513697B (en) Tin-based lead-free solder and preparing method thereof
CN1803380A (en) Leadless soldering material and its preparation method
JPS572849A (en) Copper alloy for electronic parts
CN1762645A (en) Lead free solder
CN1239290C (en) Leadless soft brazing alloy for wave crest soldering
CN111250893A (en) Lead-free solder, preparation method and application thereof, and metal terminal
CN1281372C (en) SnZn series lead-free welding flux
JPS6254852B2 (en)
PL363120A1 (en) Copper alloy comprising zinc, tin and iron for electrical connection and a process for preparing the alloy
CN1386887A (en) Lead-free material for spraying gold and its preparing process

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
WD01 Invention patent application deemed withdrawn after publication