CN1803381A - Leadless soldering material and its preparation method - Google Patents

Leadless soldering material and its preparation method Download PDF

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Publication number
CN1803381A
CN1803381A CN 200610032870 CN200610032870A CN1803381A CN 1803381 A CN1803381 A CN 1803381A CN 200610032870 CN200610032870 CN 200610032870 CN 200610032870 A CN200610032870 A CN 200610032870A CN 1803381 A CN1803381 A CN 1803381A
Authority
CN
China
Prior art keywords
tin
lead
free solder
preparation
surplus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN 200610032870
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Chinese (zh)
Inventor
黄守友
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dongguan Qiandao Metal Tin Products Co., Ltd.
Original Assignee
黄守友
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 黄守友 filed Critical 黄守友
Priority to CN 200610032870 priority Critical patent/CN1803381A/en
Publication of CN1803381A publication Critical patent/CN1803381A/en
Priority to PCT/CN2007/000033 priority patent/WO2007079671A1/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Abstract

The invention relates to a leadless soldering material and its preparing process, wherein the soldering material comprises (by weight ratio) Cu 0.1-4.0%, Ag 0.1-6.0%, Ni 0.001-0.5%, P or Ga 0.0001-0.1%, and balancing Sn, or Cu 0.1-4.0%, Ag 0.1-6.0%, Ni 0.001-0.5%, P 0.0001-0.1% and balancing Sn, or Cu 0.1-4.0%, Ag 0.1-6.0%, Ni 0.001-0.5%, Ga 0.0001-0.1% and balancing Sn.

Description

Lead-free solder and preparation method thereof
Technical field
The present invention relates to welding material, relate in particular to a kind of lead-free solder and preparation method thereof.
Background technology
Along with developing rapidly of electronics industry, requirement to electronic product is more and more higher. and the used scolder kind of present electronic product is a lot, but great majority still use tin one metal scolder, because tin-lead solder is leaded to have pollution to environment, therefore two instructions of European Union's issue, the people rose and forbid using leaded tin-lead solder in electronic product on July 1st, 2006, existing lead-free solder majority is Xi-Yin, tin-copper, tin-silver-copper, tin-zinc-indium-bismuth, Xi-Yin-mishmetal is formed, the weak point of above-mentioned lead-free welding material is the fusing point height that has, the wetability that has is little, the crystallization that has is thicker, the composition multiplex (MUX) who the has complicated cost height of planting.
Summary of the invention
The objective of the invention is to for the shortcoming that overcomes above-mentioned prior art and weak point and provide that a kind of to have a fusing point low, wetability is good, the lead-free solder that cost is low, thus the welding material of high-quality is provided for the processing and manufacturing of electronic product.
Purpose of the present invention is achieved through the following technical solutions:
Lead-free solder of the present invention and preparation method thereof, the composition percentage by weight of this scolder is:
Cu0.1-4.0%, Ag0.1-6.0%, Ni0.001-0.5%, P or Ga0.0001-0.1% and Sn surplus.
The composition percentage by weight of lead-free solder is:
Cu0.1-4.0%, Ag0.1-6.0%, Ni0.001-0.5%, P0.0001-0.1% and Sn surplus.Cu0.1-4.0%, Ag0.1-6.0%, Ni0.001-0.5%, Ga0.0001-0.1% and Sn surplus.
The preparation method of lead-free solder adopts following steps:
The preparation intermediate alloy
(1) be to add crucible at 70: 30 and insert the intermediate frequency furnace melting the weight ratio of the silver ingot of the refined tin of stanniferous 99.95% and argentiferous 99.99%, vacuum nitrogen filling gas, heat up 1200 ℃, be incubated 3 hours, the tin silver intermediate alloy ingot of argentiferous 30% is cast in the cooling of coming out of the stove;
(2) be to add crucible at 70: 30 and insert the intermediate frequency furnace melting the smart copper of the refined tin of stanniferous 99.95% and cupric 99.95% by both weight ratio, vacuum nitrogen filling gas, be warming up to 900 ℃, be incubated 3 hours, the tin copper intermediate alloy ingot that cupric 30% is cast in the cooling of coming out of the stove;
(3) get tin silver intermediate alloy ingot 1.67-20.0 part of (1) item, (2) Xiang tin copper intermediate alloy ingot 1.0-10.0 part and not enough tin amount 77.42-90.0 part of adding surplus tin, add in the manganese alloy pot simultaneously and insert the intermediate frequency furnace melting, vacuum nitrogen filling gas is warming up to 450 ℃ of coolings of coming out of the stove and is cast into the lead-free solder rod and obtains product of the present invention.
The present invention compares with prior art, has following advantage and effect:
1, the material purity height of this method employing, the technical process metal loss is low;
2, metallographic is more even, and more refinement has improved wetability, elongation, welding performance;
3, this product has good welding performance to wire rod, transformer, and easier and base material (Gu material) produces good affinity, and the solder joint light is full, does not have to connect and welds phenomenon.
The specific embodiment
Embodiment lead-free solder prescription (percentage by weight)
Composition 1# 2# 3# 4# 5# 6#
Cu 0.1 0.5 4 0.1 0.5 4
Ag 0.1 3 6 0.1 3 6
Ni 0.001 0.005 0.5 0.001 0.005 0.5
P 0.001 0.01 0.1
Ga 0.001 0.01 0.1
Sn 99.798 96.485 89.4 99.798 96.485 89.4
Manufacturing process
Smelt on the successful basis at SnCu, SnAg, SnNi intermediate alloy, adopt the scheme of said ratio, after the pure tin fusing, be warming up to 480 ℃-520 ℃, drop into SnCu, SnAg, SnNi intermediate alloy fusing back stirring 15 minutes then, remove slag and cast extruding required tin slab or tin bar, stick of solder etc. after the impurity elimination.

Claims (4)

1, a kind of lead-free solder and preparation method thereof is characterized in that the composition percentage by weight of this scolder is: Cu 0.1-4.0%, Ag 0.1-6.0%, Ni 0.001-0.5%, P or Ga 0.0001-0.1% and Sn surplus.
2, lead-free solder according to claim 1 is characterized in that the composition percentage by weight of this scolder is: Cu 0.1-4.0%, Ag 0.1-6.0%, Ni 0.001-0.5%, P 0.0001-0.1% and Sn surplus.
3, lead-free solder according to claim 1 is characterized in that the composition percentage by weight of this scolder is: Cu 0.1-4.0%, Ag 0.1-6.0%, Ni 0.001-0.5%, Ga 0.0001-0.1% and Sn surplus.
4,, it is characterized in that this method adopts following steps according to the preparation method of the described lead-free solder of claim 1-3:
The preparation intermediate alloy
(1) be to add crucible at 70: 30 and insert the intermediate frequency furnace melting the weight ratio of the silver ingot of the refined tin of stanniferous 99.95% and argentiferous 99.99%, vacuum nitrogen filling gas, be warming up to 1200 ℃, be incubated 3 hours, the tin silver intermediate alloy ingot of argentiferous 30% is cast in the cooling of coming out of the stove;
(2) be to add crucible at 70: 30 and insert the intermediate frequency furnace melting the smart copper of the refined tin of stanniferous 99.95% and cupric 99.95% by both weight ratio, vacuum nitrogen filling gas, be warming up to 900 ℃, be incubated 3 hours, the tin copper intermediate alloy ingot that cupric 30% is cast in the cooling of coming out of the stove;
(3) get tin silver intermediate alloy ingot 1.67-20.0 part of (1) item, (2) Xiang tin copper intermediate alloy ingot 1.0-10.0 part and not enough tin amount 77.42-90.0 part of adding surplus tin, add in the manganese alloy pot simultaneously and insert the intermediate frequency furnace melting, vacuum nitrogen filling gas is warming up to 450 ℃ of coolings of coming out of the stove and is cast into the lead-free solder rod and obtains product of the present invention.
CN 200610032870 2006-01-11 2006-01-11 Leadless soldering material and its preparation method Pending CN1803381A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN 200610032870 CN1803381A (en) 2006-01-11 2006-01-11 Leadless soldering material and its preparation method
PCT/CN2007/000033 WO2007079671A1 (en) 2006-01-11 2007-01-08 Lead-free solder and its preparation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 200610032870 CN1803381A (en) 2006-01-11 2006-01-11 Leadless soldering material and its preparation method

Publications (1)

Publication Number Publication Date
CN1803381A true CN1803381A (en) 2006-07-19

Family

ID=36865596

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 200610032870 Pending CN1803381A (en) 2006-01-11 2006-01-11 Leadless soldering material and its preparation method

Country Status (2)

Country Link
CN (1) CN1803381A (en)
WO (1) WO2007079671A1 (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1974850A1 (en) * 2006-01-16 2008-10-01 Hitachi Metals, Ltd. Solder alloy, solder ball and solder joint using same
CN102248319A (en) * 2011-06-30 2011-11-23 哈尔滨工业大学 Low-silver Sn-Ag-Cu unleaded brazing filler metal
CN102476249A (en) * 2010-11-25 2012-05-30 中国科学院金属研究所 Sn-Ag-Cu welding flux capable of resisting atmospheric corrosion
CN101513697B (en) * 2009-04-09 2012-09-05 宏桥纳米科技（深圳）有限公司 Tin-based lead-free solder and preparing method thereof
CN104526190A (en) * 2014-12-23 2015-04-22 苏州龙腾万里化工科技有限公司 Novel tin bar manufacturing method
CN105397328A (en) * 2015-12-15 2016-03-16 瑞声光电科技(常州)有限公司 Sn-Cu lead-free brazing filler metal and manufacturing method thereof
CN109483081A (en) * 2018-12-03 2019-03-19 先导薄膜材料（广东）有限公司 Metal targets bind solder and preparation method thereof
CN112342417A (en) * 2020-11-17 2021-02-09 昆明理工大学 Tin-based solder and preparation method thereof
CN114182119A (en) * 2021-12-10 2022-03-15 云南锡业矿冶检测中心有限公司 Preparation method of tin alloy standard sample
CN114367760A (en) * 2022-02-21 2022-04-19 中山翰华锡业有限公司 High-reliability halogen-free lead-free soldering paste and preparation method thereof
CN115156755A (en) * 2022-08-12 2022-10-11 云南锡业集团（控股）有限责任公司研发中心 Sn-Ag-Cu lead-free solder containing Bi, ni and Ga and preparation method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015066155A1 (en) * 2013-10-31 2015-05-07 Alpha Metals, Inc. Lead-free, silver-free solder alloys
CN112643240A (en) * 2020-12-10 2021-04-13 东莞市清大菁玉科技有限公司 Novel low-temperature high-conductivity brazing filler metal applied to high-frequency data line welding and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980068127A (en) * 1997-02-15 1998-10-15 김광호 Lead-Free Alloys for Soldering
JP2001071173A (en) * 1999-09-06 2001-03-21 Ishikawa Kinzoku Kk Non-leaded solder
SG98429A1 (en) * 1999-10-12 2003-09-19 Singapore Asahi Chemical & Solder Ind Pte Ltd Lead-free solders
JP3786251B2 (en) * 2000-06-30 2006-06-14 日本アルミット株式会社 Lead-free solder alloy
KR20050030237A (en) * 2004-11-13 2005-03-29 삼성전자주식회사 Pb free solder alloy

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1974850A1 (en) * 2006-01-16 2008-10-01 Hitachi Metals, Ltd. Solder alloy, solder ball and solder joint using same
EP1974850A4 (en) * 2006-01-16 2009-11-11 Hitachi Metals Ltd Solder alloy, solder ball and solder joint using same
CN101513697B (en) * 2009-04-09 2012-09-05 宏桥纳米科技（深圳）有限公司 Tin-based lead-free solder and preparing method thereof
CN102476249A (en) * 2010-11-25 2012-05-30 中国科学院金属研究所 Sn-Ag-Cu welding flux capable of resisting atmospheric corrosion
CN102248319A (en) * 2011-06-30 2011-11-23 哈尔滨工业大学 Low-silver Sn-Ag-Cu unleaded brazing filler metal
CN104526190A (en) * 2014-12-23 2015-04-22 苏州龙腾万里化工科技有限公司 Novel tin bar manufacturing method
CN105397328A (en) * 2015-12-15 2016-03-16 瑞声光电科技(常州)有限公司 Sn-Cu lead-free brazing filler metal and manufacturing method thereof
CN109483081A (en) * 2018-12-03 2019-03-19 先导薄膜材料（广东）有限公司 Metal targets bind solder and preparation method thereof
CN112342417A (en) * 2020-11-17 2021-02-09 昆明理工大学 Tin-based solder and preparation method thereof
CN112342417B (en) * 2020-11-17 2022-03-15 昆明理工大学 Tin-based solder and preparation method thereof
CN114182119A (en) * 2021-12-10 2022-03-15 云南锡业矿冶检测中心有限公司 Preparation method of tin alloy standard sample
CN114367760A (en) * 2022-02-21 2022-04-19 中山翰华锡业有限公司 High-reliability halogen-free lead-free soldering paste and preparation method thereof
CN114367760B (en) * 2022-02-21 2023-08-18 中山翰华锡业有限公司 High-reliability halogen-free lead-free soldering paste and preparation method thereof
CN115156755A (en) * 2022-08-12 2022-10-11 云南锡业集团（控股）有限责任公司研发中心 Sn-Ag-Cu lead-free solder containing Bi, ni and Ga and preparation method thereof

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C06 Publication
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C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20060630

Address after: Guangdong Tangxia Town, Dongguan city forest village new industrial city 2

Applicant after: Dongguan Qiandao Metal Tin Products Co., Ltd.

Address before: Guangdong Tangxia Town, Dongguan City Industrial City Second New Forest Village

Applicant before: Huang Shouyou

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication