CN101733578A - Lead-free solder for high-temperature soldering - Google Patents
Lead-free solder for high-temperature soldering Download PDFInfo
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- CN101733578A CN101733578A CN200910226681A CN200910226681A CN101733578A CN 101733578 A CN101733578 A CN 101733578A CN 200910226681 A CN200910226681 A CN 200910226681A CN 200910226681 A CN200910226681 A CN 200910226681A CN 101733578 A CN101733578 A CN 101733578A
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Abstract
The invention relates to a lead-free solder for high-temperature soldering, which comprises the following components in percentage by weight: 2.0-4.0% of Cu, 0.1-0.5% of Ag, 0.001-0.02% of P, 0.01-0.1% of Ni, 0.001-0.05% of Ge and balance of Sn. The lead-free solder of the invention is added with the element Ge and the element Ni, prolongs the oxidation resistant time of the element P to the liquid solder, enhances the oxidation resistance and reduces the amount of tin oxide residues, thereby reducing the production cost, lighting the soldering points, inhibiting the corrosion rate of copper-containing components, avoiding the operating trouble caused by copper corrosion, improving the operating efficiency of soldering, and improving the reliability of soldering.
Description
Technical field
The invention belongs to brazing material field, be specifically related to a kind of lead-free brazing that is used for high-temperature soldering.
Background technology
Traditional tin-lead solder must be extensive use of in electronics industry circle with the performance of its high-quality and cheap cost, it is underground that yet most electron wastes are directly abandoned or are embedded in, lead wherein water by reference is absorbed by the body, deposition causes poisoning in human body, injury kidney, lung cause diseases such as anaemia, reproductive function obstacle, hypertension.In order to protect the healthy of people, it is more and more higher to prohibit plumbous cry, and European Union has also issued WEEE and RoHS instruction simultaneously, makes that prohibiting plumbous action is in full swing.For this reason, relevant both at home and abroad expert has carried out a large amount of research to lead-free brazing, waits with Sn-Ag, Sn-Bi, Sn-Cu, Sn-Zn bianry alloy and Sn-Ag-Cu, Sn-Cu-Ni, Sn-Cu-Bi ternary alloy three-partalloy to replace traditional tin-lead solder.Wherein, to be known as by industry be the best substitute of traditional tin-lead solder to Sn-Ag-Cu.But this series alloy is remaining in shortcoming aspect antioxygenic property, the corrosion of inhibition copper, especially when high temperature (380 ℃-429 ℃) welds, when containing the components and parts of enamel-covered wire as welding transformer, coil, inductance, fuse etc., the copper of enamel-covered wire is easy to corrosion in scolder, copper cash is attenuated even the disconnected and easy oxidation of tin face of erosion fully of fine copper wire quilt, cause the problem that scruff is many, solder joint turns to be yellow.
In order to overcome the defective of Sn-Cu-Ag brazing filler metal alloy antioxygenic property difference, the relevant expert has carried out a large amount of research, and some patented technologies have been announced, as in the patent of invention ZL03110895.4 of bulletin on September 3rd, 2003, having disclosed a kind of Sn-Cu-Ag-P oxidation resistant lead-free solder, improve the antioxygenic property of solder surface by the kelvin effect of P on the solder alloy solution surface.The antioxygenic property of this lead-free brazing can satisfy instructions for use substantially, but its antioxygenic property can only be in certain limit.
Summary of the invention
The technical problem to be solved in the present invention provides and a kind ofly can suppress the corrosion speed of copper and the lead-free brazing of high-efficiency antioxidant under high temperature (380 ℃-429 ℃) operation.
In order to solve the problems of the technologies described above, the present invention is the Ge that has added minor N i and trace in existing lead-free brazing Sn-Cu-Ag-P, and is to adopt following weight percentage formulated: Cu2.0-4.0%, Ag0.1-0.5%, P0.001-0.02%, Ni0.01-0.1%, Ge0.001-0.05% and surplus Sn.
The present invention by improving copper content and added a small amount of Ag and Ni, suppress the corrosion speed of copper; By P, the Ge that adds trace, antioxygenic property, the minimizing scruff amount that scolder usually improves in Ni unit.
The lead-free brazing of lead-free brazing of the present invention and following compositions has carried out the comparison of antioxygenic property, solder joint brightness, copper cash dissolution extent, and it the results are shown in Table 1:
Table 1
| Composition | Heating-up temperature (℃) | Retention time (h) | Scruff rate % | Solder joint brightness | The copper cash dissolution extent |
| Comparative Examples Sn4Cu0.5Ag0.002P | ??380 | ??24 | ??1.763 | Light | Slight corrosion |
| Comparative Examples Sn4Cu0.5Ag0.1Ni | ??380 | ??24 | ??1.822 | The slightly little Huang of dead color | Slight corrosion |
| Comparative Examples Sn4Cu0.5Ag0.05Ge | ??380 | ??24 | ??1.851 | Dark coloured surface is coarse | Serious corrosion |
| Comparative Examples Sn4Cu0.5Ag0.02P0.1Ni | ??380 | ??24 | ??1.426 | Bright | Slight corrosion |
| Comparative Examples Sn4Cu0.5Ag0.02P0.05Ge | ??380 | ??24 | ??1.402 | Bright | Slight corrosion |
| Comparative Examples Sn4Cu0.5Ag0.02Ni0.05Ge | ??380 | ??24 | ??1.624 | Light | Slight corrosion |
| Comparative Examples Sn1Cu0.5Ag0.02P0.02Ni0.05Ge | ??380 | ??24 | ??0.895 | Metallic luster | Serious corrosion |
| Sn4Cu0.5Ag0.02P0.02Ni0.05Ge of the present invention | ??380 | ??24 | ??0.862 | Metallic luster | No corrosion |
Annotate: 1) the solder consumption is 100Kg, and the contact area of solder and atmosphere is 2700cm
2
2) the scruff rate is calculated as follows:
Owing to adopted technique scheme to make the present invention compared with the prior art, following advantage and effect arranged:
1) the present invention adds element Ge and element Ni, improves the anti oxidation time of element P liquid towards solder, has strengthened antioxygenic property, has reduced the quantity of oxidation scruff, thereby has reduced production cost and solder joint light.
When 2) the present invention is used for high-temperature soldering, suppressed the corrosion speed of cupric components and parts, thereby avoided the corrosion of copper to improve the operating efficiency of welding, improved welding reliability to the puzzlement that operation brings.
The specific embodiment
Below in conjunction with specific embodiment the present invention is described in further detail, but content of the present invention is not limited to embodiment.
Embodiment 1
To contain Sn and be 99.95% refined tin 70Kg and contain Cu is that 99.90% smart copper 30Kg adds in the manganese crucible and inserts in the intermediate frequency furnace, is heated to 1100 ℃, stirs and makes LIQUID Sn-Cu alloy, leaves standstill to be cast into after 1 hour that to contain Cu be the 30%Sn-Cu alloy.To contain Sn and be 99.95% refined tin 95 and contain Ag is that 99.99% silver ingot 5Kg adds in the manganese crucible and inserts in the intermediate frequency furnace, is heated to 1000 ℃, stirs and makes LIQUID Sn-Ag alloy, leaves standstill to be cast into after 1 hour that to contain Ag be the 5%Sn-Ag alloy.To contain Sn and be 99.95% refined tin 98 and contain Cu is that 99.90% smart nickel 2Kg adds in the manganese crucible and inserts in the intermediate frequency furnace, is heated to 1500 ℃, stirs and makes LIQUID Sn-Ni alloy, leaves standstill to be cast into after 1 hour that to contain Ni be the 2%Sn-Ni alloy.To contain Sn and be 99.95% refined tin 90Kg and contain Ge is that 99.90% germanium metal 2Kg adds in the manganese crucible and inserts in the intermediate frequency furnace, is heated to 1000 ℃, stirs and makes LIQUID Sn-Ge alloy, leaves standstill to be cast into after 1 hour that to contain Ge be the 2%Sn-Ge alloy.With 10KgP, a certain amount of plant ash with to contain Cu be that 99.90% smart copper 90Kg adds in the manganese crucible and inserts in the intermediate frequency furnace, be heated to 600 ℃-800 ℃, stir and make liquid Cu-P intermediate alloy, leave standstill and be cast into after 1 hour that to contain P be the 2%Cu-P alloy.Get above-mentioned Sn-Cu intermediate alloy 9.755kg, Sn-Ag intermediate alloy 2kg, Cu-P intermediate alloy 0.05Kg, Sn-Ni intermediate alloy 0.5kg, Sn-Ge intermediate alloy 0.05kg and add tin amount 87.695Kg and add in the manganese crucible and place in the intermediate frequency is warming up to 450 ℃, makes that alloy melts fully, mixing, cast, cool off, promptly obtain containing the lead-free brazing of the present invention of Sn97.888%, Cu2%, Ag0.1%, P0.001%, Ni0.01%, Ge0.001%.
Embodiment 2
Get the Sn-Cu intermediate alloy ingot 15.1Kg of embodiment 1, Sn-Ag intermediate alloy 10Kg, Sn-Ni intermediate alloy 5Kg, Sn-Ge intermediate alloy 2.5Kg, Cu-P intermediate alloy 1Kg and add tin amount 67.4Kg and add the manganese crucible and place the intermediate frequency furnace melting is heated to 450 ℃, makes that alloy melts fully, mixing, cast, cool off, promptly obtain containing the lead-free brazing of the present invention of Sn95.33%, Cu4.0%, Ag0.5%, P0.02%, Ni0.1%, Ge0.05%.
Embodiment 3
Get the Sn-Cu intermediate alloy ingot 12.775Kg of embodiment 1, Sn-Ag intermediate alloy 4Kg, Sn-Ni intermediate alloy 2Kg, Sn-Ge intermediate alloy 0.25Kg, Cu-P intermediate alloy 0.25Kg and add tin amount 80.975Kg and add the manganese crucible and place the intermediate frequency furnace melting is heated to 450 ℃, makes that alloy melts fully, mixing, cast, cool off, promptly obtain containing the lead-free brazing of the present invention of Sn96.95%, Cu2.8%, Ag0.2%, P0.005%, Ni0.04%, Ge0.005%.
Embodiment 4
Get the Sn-Cu intermediate alloy ingot 13.55Kg of embodiment 1, Sn-Ag intermediate alloy 6Kg, Sn-Ni intermediate alloy 3Kg, Sn-Ge intermediate alloy 0.4Kg, Cu-P intermediate alloy 0.5Kg and add tin amount 77.05Kg and add the manganese crucible and place the intermediate frequency furnace melting is heated to 450 ℃, makes that alloy melts fully, mixing, cast, cool off, promptly obtain containing the lead-free brazing of the present invention of Sn96.719%, Cu3.2%, Ag0.3%, P0.01%, Ni0.06%, Ge0.008%.
Embodiment 5
Get the Sn-Cu intermediate alloy ingot 14.325Kg of embodiment 1, Sn-Ag intermediate alloy 8Kg, Sn-Ni intermediate alloy 4Kg, Sn-Ge intermediate alloy 1.5Kg, Cu-P intermediate alloy 0.75Kg and add tin amount 72.175Kg and add the manganese crucible and place the intermediate frequency furnace melting is heated to 450 ℃, and constantly stir, make that alloy melts fully, mixing, casting, cooling promptly obtain containing the lead-free brazing of the present invention of Sn95.875%, Cu3.6%, Ag0.4%, P0.015%, Ni0.08, Ge0.03%.
Claims (1)
1. lead-free brazing that is used for high-temperature soldering is characterized in that: its adopts following weight percentages to make: Cu2.0-4.0%, Ag0.1-0.5%, P0.001-0.02%, Ni0.01-0.1%, Ge0.001-0.05% and surplus Sn.
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| Application Number | Priority Date | Filing Date | Title |
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| CN200910226681A CN101733578A (en) | 2009-12-14 | 2009-12-14 | Lead-free solder for high-temperature soldering |
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| Application Number | Priority Date | Filing Date | Title |
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| CN200910226681A CN101733578A (en) | 2009-12-14 | 2009-12-14 | Lead-free solder for high-temperature soldering |
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| CN101733578A true CN101733578A (en) | 2010-06-16 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103586599A (en) * | 2013-11-12 | 2014-02-19 | 宁波市鄞州恒迅电子材料有限公司 | Lead-free soldering tin wire |
| CN111636004A (en) * | 2020-07-17 | 2020-09-08 | 昆山联德电子科技有限公司 | Smelting method of binary alloy material with high and low melting points |
| CN106271187B (en) * | 2016-09-12 | 2020-10-09 | 东莞市千岛金属锡品有限公司 | Lead-free high-temperature oxidation-resistant solder and preparation method thereof |
| CN113042935A (en) * | 2021-05-20 | 2021-06-29 | 江苏德誉环保设备科技有限公司 | Preparation method of solder for lead-free tin-silver-copper brazing |
| TWI812401B (en) * | 2021-08-27 | 2023-08-11 | 日商千住金屬工業股份有限公司 | Solder Alloys and Solder Joints |
-
2009
- 2009-12-14 CN CN200910226681A patent/CN101733578A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103586599A (en) * | 2013-11-12 | 2014-02-19 | 宁波市鄞州恒迅电子材料有限公司 | Lead-free soldering tin wire |
| CN106271187B (en) * | 2016-09-12 | 2020-10-09 | 东莞市千岛金属锡品有限公司 | Lead-free high-temperature oxidation-resistant solder and preparation method thereof |
| CN111636004A (en) * | 2020-07-17 | 2020-09-08 | 昆山联德电子科技有限公司 | Smelting method of binary alloy material with high and low melting points |
| CN111636004B (en) * | 2020-07-17 | 2022-04-26 | 联德电子科技(常熟)有限公司 | Smelting method of binary alloy material with high and low melting points |
| CN113042935A (en) * | 2021-05-20 | 2021-06-29 | 江苏德誉环保设备科技有限公司 | Preparation method of solder for lead-free tin-silver-copper brazing |
| TWI812401B (en) * | 2021-08-27 | 2023-08-11 | 日商千住金屬工業股份有限公司 | Solder Alloys and Solder Joints |
| US11992902B2 (en) | 2021-08-27 | 2024-05-28 | Senju Metal Industry Co., Ltd. | Solder alloy and solder joint |
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Application publication date: 20100616 |