CN113042935A - Preparation method of solder for lead-free tin-silver-copper brazing - Google Patents
Preparation method of solder for lead-free tin-silver-copper brazing Download PDFInfo
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- CN113042935A CN113042935A CN202110549276.5A CN202110549276A CN113042935A CN 113042935 A CN113042935 A CN 113042935A CN 202110549276 A CN202110549276 A CN 202110549276A CN 113042935 A CN113042935 A CN 113042935A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C23/00—Extruding metal; Impact extrusion
- B21C23/02—Making uncoated products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Abstract
The invention discloses a preparation method of a lead-free tin-silver-copper brazing solder, which comprises the following steps of weighing Sn, Ag, Cu, Ge, Mn, Ni and a P-Cu intermediate alloy, wherein Ni accounts for 1-2% of the total mass, Ag accounts for 2.0-3.0% of the total mass, Cu accounts for 1.5-2.5% of the total mass, P accounts for 0.5-1.5% of the total mass, Ge accounts for 1-2% of the total mass, Mn accounts for 1-2% of the total mass, and the balance is Sn; uniformly mixing the weighed raw materials, smelting in a heating furnace at the temperature of 1000-1200 ℃, and casting into ingots; removing oxide skin and a riser of the cast ingot, and manufacturing the cast ingot into a wire by adopting a hot extrusion molding method; and (3) after the wire is subjected to vacuum annealing, processing the wire into a block brazing filler metal, a rod brazing filler metal, a sheet brazing filler metal or a filamentous brazing filler metal according to the use requirement. The lead-free tin-silver-copper solder prepared by the invention further improves the wettability and the oxidation resistance under the condition of ensuring good thermal property, and meets the higher requirement of electronic products on the welding spot performance.
Description
Technical Field
The invention relates to the field of solder manufacturing, in particular to a preparation method of a solder for lead-free tin-silver-copper brazing.
Background
The soft solder is a solder with a melting temperature lower than 450 ℃, and is classified into tin-based, lead-based, zinc-based, cadmium-based and the like, but a system based on tin-lead alloy is mostly adopted. The tin-lead solder has the advantages of low melting point, good welding performance and the like, and is widely applied to the electronic industry. Although lead has good softness, cold property and ductility, the lead is a heavy metal and has serious damage to human health and ecological environment, so that the lead-free solder is prohibited from being used strictly by law in various countries at present, and the development of the lead-free solder is an irreversible trend.
In recent years, lead-free solders have been extensively studied at home and abroad, and currently, the most representative lead-free solder is formed by adding an alloy of other elements to Sn as a base. The Sn-Ag solder is a substitute of Sn-Pb solder with wider application because of better comprehensive performance. Meanwhile, researches show that after a certain amount of Cu is added into the SnAg solder, the melting temperature of the solder can be reduced, the corrosion of the solder to the Cu during welding can be reduced, and the wettability of the solder and the reliability of joints can be improved. Therefore, the SnAgCu alloy has become a main alloy for replacing lead-free solder due to the excellent wetting property and mechanical property. But has poorer oxidation resistance compared with the traditional Sn-Pb solder, and is easy to form massive Ag due to higher Ag content3The Sn intermetallic compound reduces the reliability of the solder, and the higher Ag content also causes the higher cost of the Sn-Ag solder.
Disclosure of Invention
The invention aims to provide a preparation method of a lead-tin-silver-copper brazing solder with low silver content, good processability and high strength of a welded joint.
In order to achieve the purpose, the invention can adopt the following technical scheme:
the preparation method of the solder for lead-free tin-silver-copper brazing comprises the following steps:
s1, weighing raw materials of Sn, Ag, Cu, Ge, Mn, Ni and a P-Cu intermediate alloy, wherein the Ni element accounts for 1-2% of the total mass, the Ag element accounts for 2.0-3.0% of the total mass, the Cu element accounts for 1.5-2.5% of the total mass, the P element accounts for 0.5-1.5% of the total mass, the Ge element accounts for 1-2% of the total mass, the Mn element accounts for 1-2% of the total mass, and the balance is Sn element;
s2, uniformly mixing the weighed raw materials, smelting in a heating furnace at the temperature of 1000-1200 ℃, and casting into ingots;
s3, removing oxide skin and a riser of the cast ingot, and manufacturing the cast ingot into a wire by a hot extrusion molding method;
and S4, annealing the wire in vacuum, and processing the wire into block solder, rod solder, sheet solder or filamentous solder according to the use requirement.
In the brazing filler metal, the mass percent of each element is as follows: ag: 2 percent; cu: 2 percent; p: 1 percent; ge: 2 percent; mn: 1 percent; ni: 1.5 percent; the balance being Sn (90.5%).
The heating furnace is a vacuum induction heating furnace, and the vacuum degree of the heating furnace is less than 10 Pa.
When the cast ingot is pressed into a wire, the temperature of the holding furnace is 450 ℃, and the temperature of the extrusion furnace is 540 ℃.
The lead-free tin-silver-copper solder (SnAgCu) prepared by the invention further improves the wettability and the oxidation resistance under the condition of ensuring good thermal properties, improves the brightness of the surface of a welding spot, reduces crystal cracks, refines the microstructure of the solder alloy, avoids forming large intermetallic compounds at an interface, improves the strength and the toughness of a soldered joint, and meets the higher requirements of electronic products on the welding spot properties. Under the same condition, compared with the existing Sn-3.5Ag solder, the Sn-Ag-Cu solder prepared by the invention has the advantages that the wetting angle is reduced by 4-6 degrees, the oxidation resistance is improved by 12-23 percent, the shear strength is improved by 10-20 percent, and a joint with higher reliability can be obtained in brazing. The silver content in the solder is reduced, so that the production cost of the solder is reduced.
Specifically, the method comprises the following steps:
the addition of the P element can form a compact oxide film on the surface of the brazing filler metal, can improve the antioxidation of the brazing filler metal, and can effectively protect the further oxidation of the brazing filler metal at high temperature;
the addition of the Ge element effectively improves the wettability of the solder alloy, increases the spreading area and reduces the wetting angle;
the addition of the Ni element improves the corrosion resistance of the brazing alloy and improves the strength of a welding joint;
the addition of Mn element improves the strength of the brazing filler metal and the wettability of the brazing filler metal to hard alloy.
The brazing filler metal prepared by the invention has excellent process performance, and has good application prospect in the fields of food, chemical industry, air conditioning, refrigeration, household appliances and the like.
Detailed Description
The present invention is described in more detail below with reference to specific examples to facilitate understanding for those skilled in the art. The technical means of the present invention is not limited to the specific embodiments described below, and the content of each element may be appropriately adjusted within the scope of the present invention.
Example 1
The preparation method of the solder for lead-free tin-silver-copper brazing comprises the following steps:
s1, weighing raw materials of Sn, Ag, Cu, Ge, Mn, Ni and P-Cu intermediate alloy, wherein the Ni element accounts for 1% of the total mass, the Ag element accounts for 2% of the total mass, the Cu element accounts for 2.5% of the total mass, the P element accounts for 1.5% of the total mass, the Ge element accounts for 1% of the total mass, the Mn element accounts for 2% of the total mass, and the balance is Sn element (90%);
s2, mixing all the weighed raw materials, putting the mixture into a heating furnace with the temperature of 1000-1200 ℃ for smelting, wherein the heating furnace adopts a vacuum induction heating furnace, the vacuum degree is less than 10Pa, and then casting into a brazing filler metal cast ingot;
s3, removing oxide skins and risers of the brazing filler metal ingots, and then manufacturing the ingots into wires with the diameter of 2-4 mm by a hot extrusion molding method (the temperature of a holding furnace is set to be 450 ℃ by a hydraulic press, and the temperature of an extrusion furnace is set to be 540 ℃);
and S4, carrying out vacuum annealing on the prepared wire rod, and then rolling the wire rod into the specification required by users, such as block solder, rod solder, sheet solder or filamentous solder according to the use requirement.
The test shows that the prepared brazing filler metal has good wetting spreadability on welding parent metals such as Cu plates, Ni plates and ceramics, and compared with a common Sn-3.5Ag brazing filler metal, the prepared brazing filler metal has the advantages that under the same condition, the wetting angle is reduced by 4-6 degrees, the oxidation resistance is improved by 13-18 percent, the creep strength is improved by 6-9 percent, the shear strength is improved by 10-16 percent, good brazing process performance is shown, and the performance of a joint obtained by welding is excellent.
Example 2
Different from the embodiment 1, the brazing filler metal of the embodiment 2 comprises the following elements in percentage by mass:
ag: 2 percent; cu: 2 percent; p: 1 percent; ge: 2 percent; mn: 1 percent; ni: 1.5 percent; the balance being Sn (90.5%).
The preparation method is the same as example 1.
Tests prove that the brazing filler metal obtained by the embodiment has good wetting spreadability on welding parent metals such as Cu plates, Ni plates and ceramics, and compared with a common Sn-3.5Ag brazing filler metal, under the same conditions, the wetting angle is reduced by 4-6 degrees, the oxidation resistance is improved by 15-23 percent, the creep strength is improved by 6-9 percent, the shear strength is improved by 14-20 percent, good brazing process performance is shown, and the welded joint has excellent performance.
Claims (4)
1. A preparation method of solder for lead-free tin-silver-copper brazing is characterized by comprising the following steps: the method comprises the following steps:
s1, weighing raw materials of Sn, Ag, Cu, Ge, Mn, Ni and a P-Cu intermediate alloy, wherein the Ni element accounts for 1-2% of the total mass, the Ag element accounts for 2.0-3.0% of the total mass, the Cu element accounts for 1.5-2.5% of the total mass, the P element accounts for 0.5-1.5% of the total mass, the Ge element accounts for 1-2% of the total mass, the Mn element accounts for 1-2% of the total mass, and the balance is Sn element;
s2, uniformly mixing the weighed raw materials, smelting in a heating furnace at the temperature of 1000-1200 ℃, and casting into ingots;
s3, removing oxide skin and a riser of the cast ingot, and manufacturing the cast ingot into a wire by a hot extrusion molding method;
and S4, annealing the wire in vacuum, and processing the wire into block solder, rod solder, sheet solder or filamentous solder according to the use requirement.
2. The method for preparing the solder for lead-free tin-silver-copper brazing according to claim 1, characterized in that: in the brazing filler metal, the mass percent of each element is as follows: ag: 2 percent; cu: 2 percent; p: 1 percent; ge: 2 percent; mn: 1 percent; ni: 1.5 percent; the balance being Sn.
3. The method for preparing the solder for lead-free tin-silver-copper brazing according to claim 1, characterized in that: the heating furnace is a vacuum induction heating furnace, and the vacuum degree of the heating furnace is less than 10 Pa.
4. The method for preparing the solder for lead-free tin-silver-copper brazing according to claim 1, characterized in that: when the cast ingot is pressed into a wire, the temperature of the holding furnace is 450 ℃, and the temperature of the extrusion furnace is 540 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110549276.5A CN113042935A (en) | 2021-05-20 | 2021-05-20 | Preparation method of solder for lead-free tin-silver-copper brazing |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110549276.5A CN113042935A (en) | 2021-05-20 | 2021-05-20 | Preparation method of solder for lead-free tin-silver-copper brazing |
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| CN113042935A true CN113042935A (en) | 2021-06-29 |
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| CN202110549276.5A Pending CN113042935A (en) | 2021-05-20 | 2021-05-20 | Preparation method of solder for lead-free tin-silver-copper brazing |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114131239A (en) * | 2021-12-27 | 2022-03-04 | 浙江亚通焊材有限公司 | Lead-free solder for welding automobile glass |
Citations (7)
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| US5817194A (en) * | 1996-11-14 | 1998-10-06 | Fukuda Metal Foil & Powder Co., Ltd. | Tin base soldering/brazing material |
| CN101733578A (en) * | 2009-12-14 | 2010-06-16 | 郴州金箭焊料有限公司 | Lead-free solder for high-temperature soldering |
| CN101780607A (en) * | 2010-03-17 | 2010-07-21 | 华南理工大学 | Lead-free solder for electronic packaging, assembling and soldering and preparation method thereof |
| CN102319966A (en) * | 2011-08-29 | 2012-01-18 | 郑州机械研究所 | Brazing filler metal for braze welding of titanium and titanium alloy, preparation method and braze welding method |
| WO2016178000A1 (en) * | 2015-05-02 | 2016-11-10 | Alpha Metals, Inc. | Lead-free solder alloy with low melting point |
| CN106794557A (en) * | 2015-05-26 | 2017-05-31 | 千住金属工业株式会社 | Solder alloy, solder ball, shaped like chips soft solder, soldering paste and soldered fitting |
| CN110900036A (en) * | 2012-10-09 | 2020-03-24 | 阿尔法组装解决方案公司 | High-temperature reliable lead-free and antimony-free tin solder |
-
2021
- 2021-05-20 CN CN202110549276.5A patent/CN113042935A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5817194A (en) * | 1996-11-14 | 1998-10-06 | Fukuda Metal Foil & Powder Co., Ltd. | Tin base soldering/brazing material |
| CN101733578A (en) * | 2009-12-14 | 2010-06-16 | 郴州金箭焊料有限公司 | Lead-free solder for high-temperature soldering |
| CN101780607A (en) * | 2010-03-17 | 2010-07-21 | 华南理工大学 | Lead-free solder for electronic packaging, assembling and soldering and preparation method thereof |
| CN102319966A (en) * | 2011-08-29 | 2012-01-18 | 郑州机械研究所 | Brazing filler metal for braze welding of titanium and titanium alloy, preparation method and braze welding method |
| CN110900036A (en) * | 2012-10-09 | 2020-03-24 | 阿尔法组装解决方案公司 | High-temperature reliable lead-free and antimony-free tin solder |
| WO2016178000A1 (en) * | 2015-05-02 | 2016-11-10 | Alpha Metals, Inc. | Lead-free solder alloy with low melting point |
| CN106794557A (en) * | 2015-05-26 | 2017-05-31 | 千住金属工业株式会社 | Solder alloy, solder ball, shaped like chips soft solder, soldering paste and soldered fitting |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114131239A (en) * | 2021-12-27 | 2022-03-04 | 浙江亚通焊材有限公司 | Lead-free solder for welding automobile glass |
| CN114131239B (en) * | 2021-12-27 | 2023-02-28 | 浙江亚通新材料股份有限公司 | Lead-free solder for welding automobile glass |
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