CN101862921A - Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga - Google Patents
Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga Download PDFInfo
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- CN101862921A CN101862921A CN 201010209531 CN201010209531A CN101862921A CN 101862921 A CN101862921 A CN 101862921A CN 201010209531 CN201010209531 CN 201010209531 CN 201010209531 A CN201010209531 A CN 201010209531A CN 101862921 A CN101862921 A CN 101862921A
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- 229910052733 gallium Inorganic materials 0.000 title claims abstract description 51
- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 title claims abstract description 48
- 229910000679 solder Inorganic materials 0.000 title abstract description 121
- 238000005219 brazing Methods 0.000 claims abstract description 58
- 239000000203 mixture Substances 0.000 claims abstract description 17
- 229910052712 strontium Inorganic materials 0.000 claims description 25
- 229910052802 copper Inorganic materials 0.000 claims description 22
- 229910052777 Praseodymium Inorganic materials 0.000 claims description 18
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 238000000034 method Methods 0.000 abstract description 28
- 238000003466 welding Methods 0.000 abstract description 15
- 238000005476 soldering Methods 0.000 abstract description 9
- 239000000126 substance Substances 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 abstract description 2
- 238000012360 testing method Methods 0.000 description 39
- 238000009736 wetting Methods 0.000 description 34
- 239000010949 copper Substances 0.000 description 25
- 239000011135 tin Substances 0.000 description 22
- 229910052761 rare earth metal Inorganic materials 0.000 description 20
- 229910045601 alloy Inorganic materials 0.000 description 18
- 239000000956 alloy Substances 0.000 description 18
- 230000000694 effects Effects 0.000 description 15
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- 230000008569 process Effects 0.000 description 14
- 238000010008 shearing Methods 0.000 description 13
- 239000013078 crystal Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 239000000945 filler Substances 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 150000002910 rare earth metals Chemical class 0.000 description 10
- 229910020888 Sn-Cu Inorganic materials 0.000 description 7
- 229910019204 Sn—Cu Inorganic materials 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 7
- 238000010998 test method Methods 0.000 description 7
- 238000007654 immersion Methods 0.000 description 6
- 229910052745 lead Inorganic materials 0.000 description 6
- 238000003892 spreading Methods 0.000 description 6
- 230000007480 spreading Effects 0.000 description 6
- 229910052718 tin Inorganic materials 0.000 description 6
- 239000011573 trace mineral Substances 0.000 description 6
- 235000013619 trace mineral Nutrition 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 230000033228 biological regulation Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910000765 intermetallic Inorganic materials 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 230000012010 growth Effects 0.000 description 4
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 4
- 229910017944 Ag—Cu Inorganic materials 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- 229910020816 Sn Pb Inorganic materials 0.000 description 3
- 229910020922 Sn-Pb Inorganic materials 0.000 description 3
- 229910008783 Sn—Pb Inorganic materials 0.000 description 3
- 230000003026 anti-oxygenic effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 229910020938 Sn-Ni Inorganic materials 0.000 description 2
- 229910020994 Sn-Zn Inorganic materials 0.000 description 2
- 229910008937 Sn—Ni Inorganic materials 0.000 description 2
- 229910009069 Sn—Zn Inorganic materials 0.000 description 2
- 230000003064 anti-oxidating effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 230000002079 cooperative effect Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910002058 ternary alloy Inorganic materials 0.000 description 2
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910052765 Lutetium Inorganic materials 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 241001062472 Stokellia anisodon Species 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 229910000905 alloy phase Inorganic materials 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 230000002929 anti-fatigue Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000003556 assay Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 230000007773 growth pattern Effects 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052746 lanthanum Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005272 metallurgy Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007585 pull-off test Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910006640 β-Sn Inorganic materials 0.000 description 1
- 229910006632 β—Sn Inorganic materials 0.000 description 1
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Abstract
The invention relates to a Sn-Cu-Ni lead-free solder containing Pr, Sr and Ga, belonging to the metal material and the brazing material in the metallurgical field. The solder comprises the following chemical compositions by weight percent: 0.07-2.5% of Cu, 0.01-1.5% of Ni, 0.001-0.5% of Pr, 0.001-0.1% of Sr, 0.001-0.1% of Ga and the balance Sn. The solder has good wettability and soldering point (brazing seam) mechanical property and extremely good creep resistance, and is suitable for the welding methods such as wave-soldering, dip-soldering, manual welding and reflow soldering in the electronic industry.
Description
Technical field
The present invention relates to the Sn-Cu-Ni lead-free brazing of a kind of Pr of containing, Sr and Ga, belong to the brazing material of class of metal materials and field of metallurgy.Being mainly used in surface-assembled and encapsulation field, is that a kind of brazing property (as wettability) is good, novel green, the environment-friendly type lead-free solder of solder joint (brazed seam) good mechanical performance.
Background technology
Along with coming into force of RoHS (The Restriction of the Use of certain Hazardous Substance inElectrical and Electronic Equipment) instruction, the substitution problem of tin-lead solder has become the focus of electron trade technical staff research.At present representative lead-free brazing has alloy systems such as Sn-Ag-Cu, Sn-Cu, Sn-Zn, Sn-Ag-Cu brazing filler metal fusing point height wherein, and price is expensive, has restricted its extensive use; Sn-Cu brazing filler metal low price, cost only are 1.3 times of the plumbous eutectic solder of tin, and near tin-lead solder, but wettability is compared with tin-lead solder and still had a certain distance; Sn-Zn brazing filler metal fusing point is very near tin-lead solder, but its wetability is relatively poor, also is difficult to be applied to suitability for industrialized production at present.
A large amount of discovers, adds an amount of Ni and form the Sn-Cu-Ni ternary alloy system in the Sn-Cu brazing filler metal, and the wetability of solder obtains improvement to a certain degree, and the postwelding residue is few, and the microstructure of alloy obtains refinement, can also improve the plasticity of solder.The most important thing is that Sn-Cu-Ni brazing filler metal cost has greater advantage than the Sn-Ag-Cu brazing filler metal alloy, easily produce and reclaim, and electronic product is had compatibility preferably, thereby be subjected to electron trade users' favor.The Sn-Cu-Ni solder has good comprehensive performances, moderate cost, and application prospect good [U.S. Pat 6180055B1, Chinese patent ZL99800339.5], but still have the perfect place of a lot of needs.The researcher mainly further optimizes the performance [Chinese patent ZL200610151104.8] of Sn-Cu-Ni brazing filler metal by adding some trace elements by alloying at present, optimize the also rarely seen report of external publication of Sn-Cu-Ni solder performance by adding rare earth element, mainly concentrate on China, representational publication achievement mainly contains Sn-Cu-Ni-Pb-(0.001-0.1%) Ce[ZL200510022563.1] etc.Owing to also have many technological difficulties still unresolved, to be badly in need of new achievement in research and to come perfectly, additional, this invention " the Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga " is promptly finished under this technical background.
Summary of the invention
It is good to the purpose of this invention is to provide a kind of wettability, and antioxygenic property is strong, and brazed seam mechanical property especially creep-resistant property is good, is applicable to the lead-free brazing of welding methods such as electron trade wave-soldering, reflow welding, immersed solder, manual welding.
To achieve the object of the present invention, the Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga of the present invention, through optimizing the chemical composition of determining the back be: 0.07～2.5% Cu by the mass percent proportioning, 0.01～1.5% Ni, 0.001～0.5% Pr, 0.001～0.1% Sr, 0.001～0.1% Ga, surplus is Sn.
Adopt conventional method to prepare solder; promptly use commercially available tin slab, cathode copper, metallic nickel, Preparation of Metallic Strontium, gallium, metal praseodymium; various raw metals are proportioning on demand; add during smelting through optimizing screening definite " coverture " or adopting " inert gas " protection to smelt, cast, can obtain bar.By extruding, drawing, promptly obtain a material (also can add scaling powder, make " flux-cored wire ").Plumbous (being Pb) element is as " impurity element " in the raw material such as tin slab, cathode copper, total amount (mass percent) is controlled in 0.001～0.1% scope, (stipulates Pb≤0.1wt.%) in the standard to satisfy the regulation meet State Standard of the People's Republic of China GB/T 20422-2006 " lead-free brazing ".
Consider that the gallium fusing point is low, the very easily oxidation of metal praseodymium also can be smelted into intermediate alloy in advance with metal praseodymium, gallium according to producing needs, with the form adding of Sn-Ga and Sn-Pr, to guarantee the accuracy of micro-gallium and praseodymium composition in solder.
Technical characterstic of the present invention is compound interpolation trace element Pr, Sr and Ga and utilize its " cooperative effect " to improve heat endurance, solder joint mechanical property and the creep resisting ability of interior tissue in Sn-Cu-Ni series leadless solder wettability, the military service process in the Sn-Cu-Ni series leadless solder.The solder cost that the present invention obtains is moderate, has good processing characteristics, the solder even tissue, and wettability is good, good mechanical performance, antioxygenic property and creep resisting ability significantly improve, and combination property approaches the Sn-Pb solder.Can be processed into different shape,, adapt to the needs of different working conditions as tin bar, tin bar, soldering silk, soldered ball.
Description of drawings
Fig. 1 a is the tensile force schematic diagram of four limit flat package device solder joints of different Pr content.
Fig. 1 b is the shearing resistance schematic diagram of the solder joint that obtains of the Sn-Cu-Ni-Pr-Sr-Ga lead-free brazing soldering plate resistor of different Pr content.
Fig. 2 a is the solder wetting power schematic diagram of different Pr content.
Fig. 2 b is the solder wetting time diagram of different Pr content.
Fig. 3 is the creep fatigue life-span schematic diagram of different filler composition in the table 1.
Fig. 4 is the metallographic microstructure figure that does not add the Sn-Cu-Ni lead-free solder alloy of Sr and Ga and rare earth Pr.
Fig. 5 is the metallographic microstructure figure of the Sn-Cu-Ni lead-free solder alloy of interpolation Sr and Ga and 0.1wt.% rare earth Pr.
Fig. 6 is the metallographic microstructure figure of the Sn-Cu-Ni lead-free solder alloy of interpolation Sr and Ga and 0.5wt.% rare earth Pr.
Fig. 7 a is not for adding the unleaded welding point interface of the Sn-Cu-Ni micro-organization chart of Sr, Ga and rare earth Pr.
Fig. 7 b is for adding the unleaded welding point interface of the Sn-Cu-Ni micro-organization chart of Sr, Ga and 0.5wt% rare earth Pr.
Specific embodiments
This invention has mainly solved following critical problem:
1) by optimizing the chemical composition of Pr, Sr and Ga and Sn, Cu, Ni, because " cooperative effect " of the trace element that adds obtained, solder joint mechanical property (σ good to the mother metal wettability
b, τ), the Sn-Cu-Ni-Pr-Sr-Ga lead-free brazing (referring to accompanying drawing 1a, Fig. 1 b, Fig. 2 a, Fig. 2 b and Fig. 3) of creep-resistant property and thermal fatigue property excellence, and its fusing point is controlled in 220 ℃～227 ℃ scopes of being less than or equal to 227 ℃ of Sn-Cu-Ni ternary alloy three-partalloys.
Table 1: typical Sn-Cu-Ni-Pr-Sr-Ga lead-free solder alloy composition (wt.%)
2) experimental study is found, in the composition range of the selected Sn-Cu-Ni-Pr-Sr-Ga lead-free brazing of the present invention, the rare earth element Pr that adds, because " surface-active " effect can reduce the surface tension of liquid solder, thereby influence the reaction wet processes that liquid effect of mass transmitting suppresses solder and substrate simultaneously, significantly improve the brazing property of Sn-Cu-Ni-Pr-Sr-Ga solder, overcome the defective (referring to accompanying drawing 2a and Fig. 2 b) of Sn-Cu brazing filler metal wetability difference; Experimental study is the result also find, rare earth element Pr is " rotten ability " the strongest rare earth element (with respect to La, Ce, Lu, Y, Er (referring to accompanying drawing 4,5,6)) in the Sn-Cu series leadless solder up to the present, and its effect is not only the effect of past people " crystal grain thinning " thought.Test shows that the addition of rare earth element Pr (mass percent) was less than 0.001% o'clock, and it is very little that the Sn-Cu-Ni-Pr-Sr-Ga solder performance is changed influence; After addition surpasses 0.5%,, also can obviously weaken the wetability of Sn-Cu-Ni-Pr-Sr-Ga lead-free brazing, the optimization effect of solder joint mechanical property because oxidation is serious and the Sn-Pr compound of generation bulk.
Discover, the Sn-Cu-Ni-Pr-Sr-Ga solder is in process of setting during grain growth, adsorbed the Pr atom on the interface of its growth step, changed its growth pattern, and caused the final change of the pattern of Sn primary crystal, thereby make the Sn-Cu-Ni-Pr-Sr-Ga lead-free brazing have excellent mechanical property.(referring to accompanying drawing 4,5,6) as can be seen from the test results: the adding of Pr has obviously changed the pattern of solder microscopic structure, and the Pr content in the alloy must reach certain concentration (promptly 〉=0.001% o'clock) and just can show tangible metamorphism.In the brazing filler metal alloy process of setting, the Pr element is poly-partially on crystal boundary, and produces with elements such as Sr, Ga and Ni and to interact, and causes the variation of chemical composition, energy and the structure of crystal boundary, influence the nucleation of elemental diffusion and cenotype and grows up.Because there is certain difference in the adsorbance of different crystal face rare earth element Pr, thus the relative growth rate of each crystal face when changing crystal growth in the process of setting, and two kinds of final forms that change crystal grain of effect make that the solder grain size is littler, organize more even.Because rare earth element Pr effectively hinders the alligatoring of crystal grain in the enrichment of crystal boundary, makes the heat endurance of solder tissue also be significantly improved.
3) test the adding that studies show that micro-Sr among the present invention, can optimize the microstructure of Sn-Cu-Ni-Pr-Sr-Ga solder, suppress molten solder Sn-Cu in process of setting, Sn-Ni, excessively separating out of Sn-Cu-Ni intermetallic compound, to reduce with these metallic compounds is the generation of the scum silica frost of nuclear, reaches excellent anti-Cu erosion performance.A more outstanding characteristic is after adding Sr: Sr and Pr interact, and have reduced the interface energy of alloy phase, the Cu that can produce suitable quantity most effectively and have the fine microstructure size
6Sn
5Particle makes the creep-resistant property of the excellence that solder joint had thus.
Experimental study shows that the content of the micro-Sr among the present invention should be controlled in 0.001～0.1% scope.
4) experimental study shows, the addition of Ga is in 0.001～0.1% scope, can improve the oxidation resistance on liquid solder surface, improve the wettability (with reference to patent ZL 200810100797.7) of solder, it is very short that but in the present invention, the Ga element is kept this good oxidation resistant action time.The fusing point of Ga has only 29.8 ℃, can reduce the fusing point of solder after the interpolation, makes it more approach the process window of Sn-Pb solder.But test finds that in " alloy system " of the present invention, the effect of Ga is compared with existing result of study and had significant difference.In Sn-Cu-Ni-Pr-Sr-Ga lead-free brazing of the present invention, when the compound interpolation of Pr, Sr and Ga makes the duration of Ga antioxidation longer, also make solder joint (brazed seam) interfacial brittle intermetallic compounds layer thickness obviously reduce (referring to Fig. 7 a, Fig. 7 b), thereby improved the reliability of solder joint (brazed seam).
Compare with former studies, creativeness of the present invention is:
One,, determined to have the new alloy system of premium properties: the Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga through a large amount of contrast tests.Through the chemical composition of Orthogonal Experiment and Design optimization solder, determined the content range of each constituent element respectively.
Find that by theoretical research Pr, Sr and the modifying function of the effect of Ga element in Sn-Cu-Ni lead-free brazing trace element in the past in solder have " evident difference ": the compound interpolation of three kinds of trace elements has produced the optimization effect of " 1+1+1＞3 " to the performance of solder.Under the synergy of three kinds of elements, trace element Sr can optimize Sn-Cu-Ni-Pr-Sr-Ga lead-free brazing matrix structure, suppress Sn-Cu in the molten solder, Sn-Ni, excessively separating out of Sn-Cu-Ni intermetallic compound, to reduce with these metallic compounds is the generation of the scum silica frost of nuclear, reaches excellent anti-Cu erosion performance; The adding of rare earth element Pr improves the wettability of solder on the one hand as surface active element, on the other hand its " metamorphism " can obviously change " tissue topography " of Sn-Cu-Ni-Pr-Sr-Ga solder, the raising of mechanical property especially croop property is had bigger contribution.While its " close Sn effect " can be optimized the size of the intermetallic compound of solder matrix and welding point interface; The interaction of Sr and Pr has reduced the interface energy of crystal, the Cu that can produce suitable quantity most effectively, have the fine microstructure size
6Sn
5Particle has improved the creep-resistant property (referring to accompanying drawing 3) of solder joint thus.The adding one side of element Ga is at the liquid solder surface enrichment of fusion, to reduce the surface tension of solder, improve wetting, avoid oxidation, the antioxygenic property of Sn-Cu-Ni-Pr-Sr-Ga lead-free brazing further is improved, can also reduce the fusing point of solder on the other hand, make its process window more near with traditional Sn-Pb solder.The adding of Ga can also form second particle mutually that contains Ga quite uniformly with Sr, Pr in the solder matrix, improve the anti-fatigue performance of solder.
Two, good wettability is the important prerequisite condition that can solder obtain practical application, also is the bottleneck that lead-free brazing runs in evolution.Mensuration to Sn-Cu-Ni-Pr-Sr-Ga lead-free brazing wettability, consider the multiple factor that influences the solder wetting performance, do not adopt the method for sprawling test in traditional stove to measure, but adopt Japanese Rhesca company produces, most advanced in the world, SolderChecker SAT-5100 type solderability tester the most accurately at present, carry out according to Nippon Standard JISZ 3198:2003 " lead-free solder test method the 4th part: " based on the wettability test method of wettability equilibrium method and contact horn cupping.The wetability of neoteric lead-free brazing has been carried out the evaluation of " wetting power ", " wetting time ".Great number tested data shows, compare with other Sn-Cu-Ni series leadless solder, lead-free brazing of the present invention is because the compound interpolation of Pr, Sr and Ga makes the duration of Ga antioxidation longer, thereby makes neoteric lead-free brazing have better wetting, spreading property.Result of the test shows: the Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga of the present invention, cooperate commercially available no-clean scaling powder (RMA type), wetability, spreadability good (referring to Fig. 2 a and Fig. 2 b) on red copper and pcb board, go for high efficiency welding process (as wave-soldering or reflow welding), the integrality and the reliability of solder joint are controlled, brazing product yield rate height.
Fig. 1 a and Fig. 1 b are the mechanical property of heterogeneity alloy in the table 1 ( alloy 1,2,3,4,5,6).Wherein Fig. 1 a is four limit flat package devices (Quad Flat Package is called for short QFP) solder joint (nonageing and the 150 ℃ of timeliness 500h) tensile force of different Pr content.Fig. 1 b is the shearing resistance (according to the general requirement regulation of electronic device, tensile force and shearing resistance are the bigger the better) of the solder joint that obtains of the Sn-Cu-Ni-Pr-Sr-Ga lead-free brazing soldering plate resistor (nonageing and 150 ℃ of timeliness 500h) of different Pr content.
As can be seen from the figure, the solder joint of neoteric Sn-Cu-Ni-Pr-Sr-Ga lead-free brazing (brazed seam) mechanical property after postwelding and Ageing Treatment all is better than not containing the common Sn-Cu-Ni solder of Pr, and the optimum content of Pr is between 0.05wt.%～0.2wt.%.
Fig. 2 a and Fig. 2 b are the wetting power and the wetting time of heterogeneity alloy in the table 1 ( alloy 1,2,3,4,5,6).Wherein Fig. 2 a is the solder wetting power of different Pr content.Fig. 2 b is the solder wetting time (according to the general requirement regulation of electronic device, solder " maximum " wetting power is the bigger the better, and the solder wetting time is short more good more) of different Pr content.
Wherein: wetting test carries out according to Nippon Standard JISZ 3198:2003 " lead-free solder test method the 4th part: based on the wettability test method of wettability equilibrium method and contact horn cupping ".Concrete test parameters is: the test specimen immersion depth is 2mm, and immersion speed is 4mm/s, and the immersion time is 10s, 260 ℃ of test temperatures.
Fig. 3 is the creep fatigue life-span (according to the general requirement regulation of electronic device, the longer the better fatigue life for the creep resistant of solder joint) of different filler composition in the table 1 ( solder 1,2,3,4,5,6).
Fig. 4 is the metallographic microstructure (contain 0.7wt.%Cu, 0.05wt.%Ni, surplus is the solder microscopic structure (100 *) of Sn (not adding rare earth element)) of the Sn-Cu-Ni lead-free solder alloy that do not add Sr and Ga and rare earth Pr.
Fig. 5 is the metallographic microstructure (* 100) of the Sn-Cu-Ni lead-free solder alloy of interpolation Sr and Ga and 0.1wt.% rare earth Pr.Comparing common Sn-Cu-Ni lead-free brazing " there is pattern in eutectic structure " obviously changes, primary crystal β-Sn ratio obviously reduces in the tissue, even tissue (contains 0.1wt.%Pr, 0.05wt.%Sr, 0.05wt.%Ga, 0.7wt.%Cu, 0.05wt.%Ni,, surplus is the solder microscopic structure (100 *) of Sn).
Fig. 6 is the metallographic microstructure (* 100) of the Sn-Cu-Ni lead-free solder alloy of interpolation Sr and Ga and 0.5wt.% rare earth Pr, the eutectic structure ratio obviously increases, structure refinement (contains 0.5wt.%Pr, 0.05wt.%Sr, 0.05wt.%Ga, 0.7wt.%Cu, 0.05wt.%Ni, surplus is the solder microscopic structure (100 *) of Sn).
Fig. 7 a and Fig. 7 b are welding point interface microscopic structure (150 ℃ of timeliness 500h).Wherein Fig. 7 a for do not add Sr, Ga and rare earth Pr the unleaded welding point interface microscopic structure of Sn-Cu-Ni (contain 3.8wt.%Ag, 0.7wt.%Cu, surplus is the welding point interface microscopic structure (150 ℃ of timeliness 500h) of Sn (not adding rare earth element); Fig. 7 b is for adding Sr, the unleaded welding point interface microscopic structure of the Sn-Cu-Ni of Ga and 0.5wt% rare earth Pr (contains 0.5wt.%Pr, 0.05wt.%Sr, 0.05wt.%Ga, 0.7wt.%Cu, 0.05wt.%Ni, surplus is the welding point interface microscopic structure (150 ℃ of timeliness 500h) of Sn, interfacial brittle intermetallic compounds layer thickness is compared the unleaded solder joint of common Sn-Cu-Ni and is obviously reduced, and illustrates that neoteric lead-free solder alloy system compares the quality degradation that solder joint that common Sn-Cu-Ni lead-free brazing constituted is driven by dynamic process in the process under arms, the degradation problem has obtained inhibition under the performance.
Embodiment:
According to the quality proportioning of " the Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga " of the present invention, narration the specific embodiment of the present invention.The process of the test of solder fusion temperature is according to the JIS Z 3198-1 of Japanese Industrial Standards, and the regulation of " lead-free brazing test method-first: fusion temperature scope assay method " is carried out.Solder sample to be measured is put into the sample room of Pyris 1DSC differential scanning calorimetric analysis system, charge into argon gas to the sample room, sample is heated up with the initial heating rate of 10 ℃/min with the flow of 25ml/min.When temperature rises to when differing about 30 ℃ with lead-free brazing solidus temperature to be measured, programming rate is reduced to 2 ℃/min, measure the beginning fusion temperature of sample, i.e. solidus temperature.Cool to molten solder with the furnace room temperature subsequently, the liquidus temperature of test solder in the process of cooling.Wetting test carries out according to Nippon Standard JISZ 3198:2003 " lead-free solder test method the 4th part: based on the wettability test method of wettability equilibrium method and contact horn cupping ".Concrete test parameters is: the test specimen immersion depth is 2mm, and immersion speed is 4mm/s, and the immersion time is 10s, 260 ℃ of test temperatures.The tensile strength of solder joint and shearing strength are according to the JIS Z3198-6-2003 of Japanese Industrial Standards, " lead-free brazing test method-Di six parts: the miter angle pull-off test method of QFP pin solder joint " and " lead-free brazing test method-Di seven parts: the shearing test method of slice component solder joint ", test and the shearing force of assessment resistance spot weld and the tensile force of QFP pin.Adopt the form of the little lap joint of copper sheet, carry out the life-span of creep rupture test, under room temperature, 12.5MPa load, carry out, the time in the process of the test when record start and fracture.All tests all repeat 10 times and average.
Embodiment one
A kind of Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga is pressed the mass percent proportioning, and its composition is: 0.07%Cu, and 1.5%Ni, 0.001%Pr, 0.03%Sr, 0.01%Ga, 0.001%Pb, surplus is Sn.Solidus temperature is about 220 ℃ for " the Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga " that the mentioned component proportioning obtains, and liquidus temperature (has been considered test error) about 227 ℃.The wettability of wettability equilibrium method test solder on copper plate, maximum wetting power is 2.9mN, and wetting time is 0.72s, and the wetting and spreading effect is good.The tensile force 9.1N of QFP solder joint, plate resistor shearing strength 60N, creep resistant 145h fatigue life of solder joint.
Embodiment two
A kind of Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga is pressed the mass percent proportioning, and its composition is:, 2.5%Cu, 0.01%Ni, 0.05%Pr, 0.05%Sr, 0.05%Ga, 0.05%Pb, surplus is Sn.Solidus temperature is about 217 ℃ for " the Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga " that the mentioned component proportioning obtains, and liquidus temperature (has been considered test error) about 225 ℃.The wettability of wettability equilibrium method test solder on copper plate, maximum wetting power is 3.2mN, and wetting time is 0.58s, and the wetting and spreading effect is good.The tensile force 9.4N of QFP solder joint, plate resistor shearing strength 62N, creep resistant 162h fatigue life of solder joint.
Embodiment three
A kind of Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga is pressed the mass percent proportioning, and its composition is: 0.5%Cu, and 0.06%Ni, 0.001%Pr, 0.1%Sr, 0.001%Ga, 0.05%Pb, surplus is Sn.Solidus temperature is about 219 ℃ for " the Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga " that the mentioned component proportioning obtains, and liquidus temperature (has been considered test error) about 227 ℃.The wettability of wettability equilibrium method test solder on copper plate, maximum wetting power is 3.4mN, and wetting time is 0.69s, and the wetting and spreading effect is good.The tensile force 9.3N of QFP solder joint, plate resistor shearing strength 57N, creep resistant 147h fatigue life of solder joint.
Embodiment four
A kind of Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga is pressed the mass percent proportioning, and its composition is: 1.0%Cu, and 0.8%Ni, 0.35%Pr, 0.001%Sr, 0.1%Ga, 0.1%Pb, surplus is Sn.Solidus temperature is about 221 ℃ for " the Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga " that the mentioned component proportioning obtains, and liquidus temperature (has been considered test error) about 227 ℃.The wettability of wettability equilibrium method test solder on copper plate, maximum wetting power is 3.0mN, and wetting time is 0.65s, and the wetting and spreading effect is good.The tensile force 9.3N of QFP solder joint, plate resistor shearing strength 56N, creep resistant 169h fatigue life of solder joint.
Embodiment five
A kind of Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga is pressed the mass percent proportioning, and its composition is: 0.5%Cu, and 0.01%Ni, 0.5%Pr, 0.07%Sr, 0.03%Ga, 0.05%Pb, surplus is Sn.Solidus temperature is about 219 ℃ for " the Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga " that the mentioned component proportioning obtains, and liquidus temperature (has been considered test error) about 225 ℃.The wettability of wettability equilibrium method test solder on copper plate, maximum wetting power is 2.9mN, and wetting time is 0.74s, and the wetting and spreading effect is good.The tensile force 8.9N of QFP solder joint, plate resistor shearing strength 58N, creep resistant 168h fatigue life of solder joint.
For the ease of contrast, the present invention has chosen the Sn-Cu-Ni solder that does not add Pr, Sr and Ga and has carried out the test of correlated performance index.Its composition (mass percent) is: 2.0% Cu, and 0.5% Ni, 0.05%Pb, surplus is Sn.Test determination goes out its solidus temperature about 224 ℃, and liquidus temperature (has been considered test error) about 228 ℃; The wettability of wettability equilibrium method test solder on copper plate, maximum wetting power is 2.5mN, wetting time is 0.84s.The tensile force 7.8N of QFP solder joint, plate resistor shearing strength 47N, creep resistant 140h fatigue life of solder joint.
Can find that from embodiment contain the Sn-Cu-Ni solder of Pr, Sr and Ga, its solidus temperature is about 217 ℃, liquidus temperature (has been considered test error) about 227 ℃.The maximum wetting power that the wettability equilibrium method is measured is in 2.9mN～3.2mN scope (all being higher than 2.5mN), and wetting time is 0.58s～0.74s scope (all being shorter than 0.84s).The tensile force of QFP solder joint is at 8.9N～9.4N scope (all greater than 7.8N), and the plate resistor shearing strength is at 56N～60N scope (all greater than 47N), and creep resistant fatigue life of solder joint is at 145h～169N scope (all greater than 140h).
Claims (1)
1. Sn-Cu-Ni lead-free brazing that contains Pr, Sr and Ga, it is characterized in that: composition by the mass percent proportioning is: 0.07～2.5% Cu, 0.01～1.5% Ni, 0.001～0.5% Pr, 0.001～0.1% Sr, 0.001～0.1% Ga, surplus is Sn.
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| CN102554504A (en) * | 2011-12-28 | 2012-07-11 | 常熟市华银焊料有限公司 | Self-soldering silver solder containing praseodymium, zirconium and gallium |
| CN102825396A (en) * | 2012-09-18 | 2012-12-19 | 金华市双环钎焊材料有限公司 | Sn-Zn leadless brazing filler metal containing Pr, Ga and Te |
| CN102848099A (en) * | 2012-10-10 | 2013-01-02 | 南京航空航天大学 | Low-silver Sn-Ag-Cu lead-free brazing filler metal containing Pr, Ga and Se |
| CN102848096A (en) * | 2012-09-18 | 2013-01-02 | 南京航空航天大学 | Sn-Zn lead-free solder containing Pr, Ga and Se |
| CN102862001A (en) * | 2012-10-10 | 2013-01-09 | 浙江高博焊接材料有限公司 | Sn-Ag-Cu lead-free solder containing Nd, Te and Ga |
| RU2477206C1 (en) * | 2011-08-03 | 2013-03-10 | Государственное образовательное учреждение высшего профессионального образования Северо-Кавказский горно-металлургический институт (государственный технологический университет) (СКГМИ (ГТУ) | Solder for tinning aluminium film on silicon |
| CN102974954A (en) * | 2012-12-17 | 2013-03-20 | 南京航空航天大学 | Tin-copper-nickel (Sn-Cu-Ni) lead-free solder containing ferrum (Fe) and praseodymium (Pr) |
| CN106271181A (en) * | 2015-05-13 | 2017-01-04 | 广西民族大学 | A kind of Sn-Sb-X system high-temperature oxidation resistant lead-free brazing |
| CN109048114A (en) * | 2018-09-20 | 2018-12-21 | 南京理工大学 | Sn-Cu-Ni lead-free brazing containing Ga and Nd |
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| RU2477206C1 (en) * | 2011-08-03 | 2013-03-10 | Государственное образовательное учреждение высшего профессионального образования Северо-Кавказский горно-металлургический институт (государственный технологический университет) (СКГМИ (ГТУ) | Solder for tinning aluminium film on silicon |
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| CN102825396A (en) * | 2012-09-18 | 2012-12-19 | 金华市双环钎焊材料有限公司 | Sn-Zn leadless brazing filler metal containing Pr, Ga and Te |
| CN102825396B (en) * | 2012-09-18 | 2015-06-03 | 金华市双环钎焊材料有限公司 | Sn-Zn leadless brazing filler metal containing Pr, Ga and Te |
| CN102848096A (en) * | 2012-09-18 | 2013-01-02 | 南京航空航天大学 | Sn-Zn lead-free solder containing Pr, Ga and Se |
| CN102848096B (en) * | 2012-09-18 | 2015-05-20 | 南京航空航天大学 | Sn-Zn lead-free solder containing Pr, Ga and Se |
| CN102862001B (en) * | 2012-10-10 | 2015-04-01 | 浙江高博焊接材料有限公司 | Sn-Ag-Cu lead-free solder containing Nd, Te and Ga |
| CN102848099B (en) * | 2012-10-10 | 2015-05-20 | 南京航空航天大学 | Low-silver Sn-Ag-Cu lead-free brazing filler metal containing Pr, Ga and Se |
| CN102862001A (en) * | 2012-10-10 | 2013-01-09 | 浙江高博焊接材料有限公司 | Sn-Ag-Cu lead-free solder containing Nd, Te and Ga |
| CN102848099A (en) * | 2012-10-10 | 2013-01-02 | 南京航空航天大学 | Low-silver Sn-Ag-Cu lead-free brazing filler metal containing Pr, Ga and Se |
| CN102974954B (en) * | 2012-12-17 | 2015-03-11 | 南京航空航天大学 | Tin-copper-nickel (Sn-Cu-Ni) lead-free solder containing ferrum (Fe) and praseodymium (Pr) |
| CN102974954A (en) * | 2012-12-17 | 2013-03-20 | 南京航空航天大学 | Tin-copper-nickel (Sn-Cu-Ni) lead-free solder containing ferrum (Fe) and praseodymium (Pr) |
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| CN109048114A (en) * | 2018-09-20 | 2018-12-21 | 南京理工大学 | Sn-Cu-Ni lead-free brazing containing Ga and Nd |
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