CN114559179A - Sn-Ag-Cu low-melting-point lead-free solder and preparation method thereof - Google Patents
Sn-Ag-Cu low-melting-point lead-free solder and preparation method thereof Download PDFInfo
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- CN114559179A CN114559179A CN202210337678.3A CN202210337678A CN114559179A CN 114559179 A CN114559179 A CN 114559179A CN 202210337678 A CN202210337678 A CN 202210337678A CN 114559179 A CN114559179 A CN 114559179A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 66
- 229910017944 Ag—Cu Inorganic materials 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims abstract description 8
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 43
- 239000000956 alloy Substances 0.000 claims abstract description 43
- 238000002844 melting Methods 0.000 claims abstract description 34
- 230000008018 melting Effects 0.000 claims abstract description 34
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 19
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 229910052718 tin Inorganic materials 0.000 claims abstract description 10
- 229910052709 silver Inorganic materials 0.000 claims abstract description 8
- 229910020938 Sn-Ni Inorganic materials 0.000 claims abstract description 7
- 229910008937 Sn—Ni Inorganic materials 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- 238000003723 Smelting Methods 0.000 claims description 16
- 239000002994 raw material Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 6
- 238000005303 weighing Methods 0.000 claims description 6
- 238000009461 vacuum packaging Methods 0.000 claims description 5
- 239000000155 melt Substances 0.000 claims description 3
- 238000010309 melting process Methods 0.000 claims description 3
- 238000003756 stirring Methods 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 239000010453 quartz Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 230000006698 induction Effects 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 45
- 238000005219 brazing Methods 0.000 description 17
- 239000000945 filler Substances 0.000 description 15
- 239000013078 crystal Substances 0.000 description 7
- 238000003466 welding Methods 0.000 description 6
- 229910020816 Sn Pb Inorganic materials 0.000 description 5
- 229910020922 Sn-Pb Inorganic materials 0.000 description 5
- 229910008783 Sn—Pb Inorganic materials 0.000 description 5
- 230000005496 eutectics Effects 0.000 description 5
- 238000003892 spreading Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 230000002195 synergetic effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 229910001092 metal group alloy Inorganic materials 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- 235000013619 trace mineral Nutrition 0.000 description 2
- 239000011573 trace mineral Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 229910018471 Cu6Sn5 Inorganic materials 0.000 description 1
- 208000012868 Overgrowth Diseases 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000001427 coherent effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical group [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009661 fatigue test Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005501 phase interface Effects 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 229910021654 trace metal Inorganic materials 0.000 description 1
- 229910006640 β-Sn Inorganic materials 0.000 description 1
- 229910006632 β—Sn Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/264—Bi as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3033—Ni as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a Sn-Ag-Cu low-melting-point lead-free solder and a preparation method thereof. The lead-free solder is characterized in that Bi, Ni and Ce are doped in Sn-Ag-Cu solder, and the lead-free solder comprises the following components in percentage by mass: 2.00-4.00% of Ag, 0.10-1.00% of Cu, 2.00-4.00% of Bi, 0.01-0.05% of Ni, 0.01-0.05% of Ce and the balance of Sn. And preparing Sn-Ni and Sn-Ce binary intermediate alloy by adopting vacuum induction melting, and adding the intermediate alloy into a mixture of Sn, Ag, Cu and Bi to obtain the low-melting-point lead-free solder. The Sn-Ag-Cu low-melting-point lead-free solder containing Bi, Ni and Ce has a lower melting point, and good wettability, conductivity, mechanical property and thermal stability.
Description
Technical Field
The invention relates to a Sn-Ag-Cu low-melting-point lead-free solder and a preparation method thereof, belonging to the technical field of solders.
Background
In the context of current global lead-free electronic packages, of the various tin-based lead-free solders, eutectic and near-eutectic Sn-Ag-cu (sac) alloys have been identified as the primary candidate for replacement of Sn-Pb alloys, the most widely used solders. SAC alloys also maintain good performance in thermal fatigue tests and are superior to Sn-Pb alloys under non-extreme thermal cycling conditions; in addition, SAC solder alloys are more resistant to thermal embrittlement than Sn-Pb solders; the reliability of the soldered assembly depends on the microstructure of the interconnect, the evolution of which is strongly influenced by temperature, stress and current density; the research of lead-free solder has made a series of progress, but the following problems may also exist: (1) the melting point of the brazing filler metal rises, the melting range is increased, the welding performance of the brazing filler metal is influenced, and component segregation and holes in the longer solidification process are easy to grow. (2) The problem of IMC preferential growth in a wetting reaction and the problem of IMC overgrowth in a service process of a solder joint interface can bring influence to the mechanical property of the solder. (3) The problem of too fast growth of whiskers of solder welding spots brings short circuit hidden trouble to circuits. (4) Poor wettability of the solder, etc. Therefore, new components are added into the brazing filler metal alloy, the components of the components are changed, the multi-component alloy is formed, the microstructure is improved, the melting point is reduced, and the oxidation resistance is improved, so that the aims of improving the mechanical property and the reliability of the brazing filler metal are fulfilled.
The inventor finds that the microstructure can be improved by doping trace metal elements such as Bi, Ni and Ce into the Sn-Ag-Cu brazing filler metal, so that the growth of IMC between metal matrixes of the brazing filler metal is inhibited, and the Sn-Pb brazing filler metal has a melting point and a melting temperature zone similar to those of the traditional Sn-Pb brazing filler metal, and has good wettability, conductivity, oxidation resistance and lower density.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide the Sn-Ag-Cu low-melting-point lead-free solder containing Bi, Ni and Ce, which has good performance and excellent welding spot mechanical property, wherein the lead-free solder comprises the following raw materials in percentage by mass: 1.00-4.00 percent of Ag, 0.1-0.50 percent of Cu, 2.0-4.0 percent of Bi, 0.01-0.10 percent of Ni and 0.01-0.05 percent of Ce.
The invention also aims to provide a preparation method of the Sn-Ag-Cu low-melting-point lead-free solder, which comprises the following steps:
(1) weighing pure metal raw materials Sn, Ni and Ce, and calculating the amount of the intermediate alloy required by the total amount of the prepared melt according to the control standard required by elements in the melt and the standard content of the intermediate alloy; smelting by a 16-channel heat treatment furnace, ensuring the alloy components to be uniform under the action of electromagnetic stirring, and preparing the Sn-Ni and Sn-Ce intermediate alloy.
(2) And (2) weighing the Sn-Ni and Sn-Ce intermediate alloy prepared in the step (1) and raw materials Sn, Ag, Cu and Bi, simultaneously putting the intermediate alloy and the raw materials Sn, Ag, Cu and Bi into a quartz tube, carrying out vacuum packaging, smelting and uniformly mixing, and taking out the molten alloy after cooling to room temperature in a furnace.
(3) And putting the taken test tube into a 16-channel heat treatment furnace for smelting, taking out and air-cooling to obtain the Sn-Ag-Cu low-melting-point lead-free solder containing Bi, Ni and Ce.
Preferably, the vacuum melting conditions in step (1) of the present invention are: the melting temperature is 950 ℃, and the vacuum degree is 10-3Pa, the smelting time is 4 hours.
Preferably, the smelting in step (2) of the invention comprises the following specific processes: vacuum packaging the raw materials with glass tube at vacuum degree of 10-4Pa, putting the glass tube filled with the raw materials into a 16-channel heat treatment furnace with a swinging function, wherein the melting temperature is 850 ℃, the melting time is 3 hours, and the furnace body swings back and forth in the melting process at an amplitude of 3-8 degrees/min to ensure the uniformity of alloy components.
Preferably, the melting conditions in the step (3) of the invention are as follows: the smelting temperature is 800 ℃, the smelting time is 2 hours, and the molten alloy is cooled to 300 ℃ in the furnace.
The trace element Bi in the Sn-Ag-Cu low-melting-point lead-free solder can be uniformly distributed in the molten composite solder, so that a small amount of fine and dispersedly distributed partial hexagons (Cu, Ni) are generated in the primary phase and the reticular eutectic structure of the solder6Sn5And (4) phase(s). Thereby changing the microstructure of the solder structure and improving the mechanical property of the Sn-Ag-Cu lead-free solder. Meanwhile, the elongation of the solder alloy is obviously reduced, on the premise of the existence of Bi, the elongation of the solder can be obviously improved by adding the rare earth element Ce, and the rare earth element Ce can be preferentially adsorbed at a crystal boundary or a phase interface to block crystal grains and Cu6Sn5And Ag3The growth of Sn makes the crystal shape tend to be round and refined, and the toughness of the solder is increased. By BiAnd the effect of Ce makes the solder have more excellent performance than Sn-Ag-Cu, but the addition of Bi and Ni does not obviously reduce the melting point of the solder. The inventor finds that the addition of the trace element Ni can obviously lower the melting point of the solder under the premise of the existence of Bi and Ce, the crystal structure of Sn is a tetragonal structure, the lattice constant is 0.5831nm, the lattice constant is c 0.3182nm, the atomic radius is 0.158nm, the crystal structure of Ni is a face-centered cubic structure, the lattice constant is a b-c-0.3525 nm, the atomic radius is 0.1246nm, the atomic arrangement and the crystal structure of Ni are greatly different from that of Sn, a non-coherent interface is formed, the melting temperature is reduced, and the formation of a reliable connecting welding spot in the soldering process is facilitated.
Compared with the prior art, the invention has the following beneficial effects:
(1) through a large number of comparative tests, a new brazing alloy system with excellent performance is determined, and through component optimization tests, the content ranges of all elements are respectively determined; in the Sn-Ag-Cu lead-free solder alloy system, the structural form of the Sn-Ag-Cu lead-free solder is changed and the wettability of the lead-free solder is obviously improved through the synergistic effect of Bi, Ni and Ce.
(2) Through the synergistic effect of Bi, Ni and Ce, the primary phase and the reticular eutectic structure of the brazing filler metal generate a small amount of fine and dispersedly distributed partial hexagons (Cu, Ni)6Sn5And the tensile strength and the elongation of the lead-free solder can be obviously improved.
(3) The addition of low-melting-point elements Bi and Ni can reduce the melting point, the solidus temperature and the liquidus temperature of the Sn-Ag-Cu lead-free solder alloy, and the melting range is slightly enlarged; the melting range becomes larger because the solder gradually deviates from the eutectic point composition; with the increase of the content of the element Ce, the melting point and the melting range of the solder are almost kept unchanged, which shows that trace amount of Ce has little influence on the melting characteristic of the solder.
Drawings
FIG. 1 is a drawing schematic.
FIG. 2 is a microstructure diagram of solder alloys prepared in example 3, comparative example 1, comparative example 2, and comparative example 3.
Fig. 3 is a graph comparing tensile strengths of the solders of example 3, comparative example 1, comparative example 2, comparative example 3, and comparative example 4.
Fig. 4 is a graph comparing the electrical resistivity of the solders of example 3, comparative example 1, comparative example 2, comparative example 3, and comparative example 4.
FIG. 5 is a DSC curve comparison chart of the brazing filler metals of example 3, comparative example 1, comparative example 2, comparative example 3 and comparative example 4.
Fig. 6 is a comparative graph of solder spreading areas of example 3, comparative example 1, comparative example 2, comparative example 3, and comparative example 4.
Detailed Description
In order to make the technical solutions of the present invention better understood, those skilled in the art will further describe the present invention with reference to the accompanying drawings.
The preparation method of the Sn-Ag-Cu low-melting-point lead-free solder provided by the embodiment of the invention specifically comprises the following steps:
(1) weighing pure metal raw materials Sn, Ni and Ce, and calculating the amount of the intermediate alloy required by the total amount of the prepared melt according to the control standard required by elements in the melt and the standard content of the intermediate alloy; smelting by adopting a 16-channel heat treatment furnace, ensuring the components of the alloy to be uniform under the action of electromagnetic stirring, and preparing the Sn-Ni and Sn-Ce intermediate alloy.
(2) Weighing the Sn-Ni and Sn-Ce intermediate alloy prepared in the step (1) and raw materials Sn, Ag, Cu and Bi, and simultaneously carrying out vacuum packaging by using a glass tube, wherein the vacuum degree is 10-4Pa, putting the glass tube filled with the raw materials into a 16-channel heat treatment furnace with a swinging function, wherein the melting temperature is 850 ℃, the melting time is 3 hours, the furnace body swings back and forth in the melting process, the amplitude is 3-8 degrees/min, so as to ensure the uniformity of alloy components, and the molten alloy is taken out after being cooled to room temperature in the furnace.
(3) Putting the taken test tube into a 16-channel heat treatment furnace for smelting, taking out and air-cooling to obtain Sn-Ag-Cu low-melting-point lead-free solder containing Bi, Ni and Ce; wherein the smelting temperature is 800 ℃, the smelting time is 2 hours, and the molten alloy is cooled to 300 ℃ in the furnace and taken out.
In different examples, the contents of the elements are different, and are specifically shown in table 1.
TABLE 1 contents of the elements in the different examples
| Ag | Cu | Bi | Ni | Ce | Sn | |
| Example 1 | 1.00％ | 0.10％ | 2.00％ | 0.01％ | 0.01％ | Balance of |
| Example 2 | 2.50％ | 0.20％ | 2.50％ | 0.02％ | 0.05％ | Balance of |
| Example 3 | 3.00％ | 0.30％ | 3.00％ | 0.03％ | 0.03％ | Balance of |
| Example 4 | 3.50％ | 0.40％ | 3.50％ | 0.04％ | 0.04％ | Balance of |
| Example 5 | 4.00％ | 0.50％ | 4.00％ | 0.1％ | 0.05％ | Balance of |
| Comparative example 1 | 3.00％ | 0.30％ | ---- | ---- | ---- | Balance of |
| Comparative example 2 | 3.00％ | 0.30％ | 3.00％ | ---- | ---- | Balance of |
| Comparative example 3 | 3.00％ | 0.30％ | 3.00％ | 0.03％ | ---- | Allowance of |
| Comparative example 4 | 3.00％ | 0.30％ | ---- | ---- | 0.05％ | Balance of |
The properties of the Sn-Ag-Cu low melting point lead-free solders described in the different examples are shown in Table 2:
TABLE 2 data of melting point, tensile strength, elongation, resistivity, and spreading area of the above lead-free solder
As shown in Table 2, the SnAg-Cu low-melting-point lead-free solder containing Bi, Ni and Ce has the advantages that the melting point and the resistivity are lower than those of SAC303 through the synergistic effect of the added elements, and the tensile strength, the elongation and the spreading area are obviously better than those of SAC 303.
Performance analysis:
FIG. 2 is a microstructure diagram of a solder alloy of example 3, comparative example 1, comparative example 2, and comparative example 3; as can be seen from the figure, after the addition of the trace Bi element, the microstructure of the solder is changed, and the size of the primary phase of the solder structure is different from the form of the intermetallic compound; meanwhile, when the elements Bi, Ni are added, the distribution of the eutectic structure is more uniform, and when the elements Bi, Ni and Ce are added, the primary beta-Sn phase is refined, thereby being beneficial to improving the mechanical property of the brazing filler metal.
Fig. 3 is a graph showing the comparison of the tensile strengths of the solders according to example 3, comparative example 1, comparative example 2, comparative example 3 and comparative example 4. Bi element can be dispersed and precipitated in a simple substance form in the cooling process, so that the growth of crystal grains is hindered, the matrix structure is refined, the effects of solid solution strengthening and dispersion strengthening are achieved, and the tensile strength of the brazing filler metal alloy is improved; meanwhile, when elements Bi and Ni are added, the intermetallic compound is changed into small particles from blocks, so that the toughness of the brazing filler metal is improved; when Bi, Ni and Ce are added simultaneously, the grains are refined, and the elongation rate tends to be slightly increased.
Fig. 4 is a graph comparing the electrical resistivity of the solders of example 3, comparative example 1, comparative example 2, comparative example 3 and comparative example 4. As can be seen from the figure, the solder alloy of the invention has lower resistivity, so that the solder alloy has better conductivity in the service process.
FIG. 5 is a DSC curve comparison chart of the brazing filler metal of example 3, comparative example 1, comparative example 2, comparative example 3 and comparative example 4; as can be seen from the figure, the addition of Bi, Ni and Ce elements obviously reduces the melting point of the brazing filler metal, and is beneficial to forming reliable connecting welding spots in the brazing process.
FIG. 6 is a comparative graph of solder spreading areas of example 3, comparative example 1, comparative example 2, comparative example 3 and comparative example 4; as can be seen from the figure, the solder alloy of the invention has good wetting ability on a Cu substrate, no obvious oxidation phenomenon on the surface of a welding spot and stable size.
Claims (5)
1. The Sn-Ag-Cu low-melting-point lead-free solder is characterized by comprising the following components in parts by weight: the lead-free solder comprises the following raw materials in percentage by mass: 1.00-4.00 percent of Ag, 0.1-0.50 percent of Cu, 2.0-4.0 percent of Bi, 0.01-0.10 percent of Ni and 0.01-0.05 percent of Ce.
2. The method for preparing the Sn-Ag-Cu low-melting-point lead-free solder as claimed in claim 1, which comprises the following steps:
(1) weighing pure metal raw materials Sn, Ni and Ce, and calculating the amount of the intermediate alloy required by the total amount of the prepared melt according to the control standard required by elements in the melt and the standard content of the intermediate alloy; smelting by adopting a 16-channel heat treatment furnace, ensuring the alloy components to be uniform under the action of electromagnetic stirring, and preparing and obtaining Sn-Ni and Sn-Ce intermediate alloys;
(2) weighing the Sn-Ni and Sn-Ce intermediate alloy prepared in the step (1) and raw materials Sn, Ag, Cu and Bi, simultaneously putting the intermediate alloy and the raw materials Sn, Ag, Cu and Bi into a quartz tube, carrying out vacuum packaging, smelting and uniformly mixing, and taking out the molten alloy after cooling to room temperature in a furnace;
(3) and putting the taken test tube into a 16-channel heat treatment furnace for smelting, taking out and air-cooling to obtain the Sn-Ag-Cu low-melting-point lead-free solder containing Bi, Ni and Ce.
3. The preparation method of the Sn-Ag-Cu low-melting-point lead-free solder according to claim 2, characterized by comprising the following steps: the vacuum melting conditions in the step (1) are as follows: the melting temperature is 950 ℃ and the vacuum degree is 10-3Pa, the smelting time is 4 hours.
4. The preparation method of the Sn-Ag-Cu low-melting-point lead-free solder according to claim 2, characterized by comprising the following steps: the smelting process in the step (2) comprises the following steps: vacuum packaging the raw materials with glass tube at vacuum degree of 10-4Pa, putting the glass tube filled with the raw materials into a 16-channel heat treatment furnace with a swinging function, wherein the melting temperature is 850 ℃, the melting time is 3 hours, and the furnace body swings back and forth in the melting process at an amplitude of 3-8 degrees/min to ensure the uniformity of alloy components.
5. The method for preparing the Sn-Ag-Cu low-melting-point lead-free solder according to claim 2, is characterized in that: the melting conditions in the step (3) of the invention are as follows: the melting temperature is 800 ℃, the melting time is 2 hours, and the molten alloy is cooled to 300 ℃ in the furnace.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114986023A (en) * | 2022-06-02 | 2022-09-02 | 杭州华光焊接新材料股份有限公司 | Process for prefabricating low-melting-point brazing filler metal, low-melting-point brazing filler metal and preparation method thereof |
| CN115156755A (en) * | 2022-08-12 | 2022-10-11 | 云南锡业集团（控股）有限责任公司研发中心 | Sn-Ag-Cu lead-free solder containing Bi, ni and Ga and preparation method thereof |
| CN115365699A (en) * | 2022-09-19 | 2022-11-22 | 云南锡业锡材有限公司 | Sn-Ag-Cu series lead-free solder alloy without microcracks at welding spots and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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