CN1346728A - Lead-free alloy solder containing rare-earth and more alloy components - Google Patents
Lead-free alloy solder containing rare-earth and more alloy components Download PDFInfo
- Publication number
- CN1346728A CN1346728A CN 01128184 CN01128184A CN1346728A CN 1346728 A CN1346728 A CN 1346728A CN 01128184 CN01128184 CN 01128184 CN 01128184 A CN01128184 A CN 01128184A CN 1346728 A CN1346728 A CN 1346728A
- Authority
- CN
- China
- Prior art keywords
- alloy
- lead
- solder alloy
- solder
- free
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 83
- 239000000956 alloy Substances 0.000 title claims abstract description 83
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 74
- 229910052761 rare earth metal Inorganic materials 0.000 title claims abstract description 30
- 150000002910 rare earth metals Chemical class 0.000 title claims description 8
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 16
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 13
- 239000000126 substance Substances 0.000 claims description 6
- 239000004615 ingredient Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 abstract description 18
- 239000000203 mixture Substances 0.000 abstract description 6
- 238000009736 wetting Methods 0.000 abstract description 5
- 229910052777 Praseodymium Inorganic materials 0.000 abstract description 3
- 229910052779 Neodymium Inorganic materials 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 description 10
- 229910020816 Sn Pb Inorganic materials 0.000 description 8
- 229910020922 Sn-Pb Inorganic materials 0.000 description 8
- 229910008783 Sn—Pb Inorganic materials 0.000 description 8
- 229910052797 bismuth Inorganic materials 0.000 description 7
- 238000005219 brazing Methods 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000000470 constituent Substances 0.000 description 6
- 238000004100 electronic packaging Methods 0.000 description 6
- 229910052738 indium Inorganic materials 0.000 description 6
- 238000005275 alloying Methods 0.000 description 5
- 229910052787 antimony Inorganic materials 0.000 description 5
- 230000006378 damage Effects 0.000 description 5
- 230000004927 fusion Effects 0.000 description 5
- 241001062472 Stokellia anisodon Species 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229910052772 Samarium Inorganic materials 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910052688 Gadolinium Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005728 strengthening Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241001465754 Metazoa Species 0.000 description 1
- 229910000691 Re alloy Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000003916 acid precipitation Methods 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- -1 improves weldability Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000001473 noxious effect Effects 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- GOLXNESZZPUPJE-UHFFFAOYSA-N spiromesifen Chemical compound CC1=CC(C)=CC(C)=C1C(C(O1)=O)=C(OC(=O)CC(C)(C)C)C11CCCC1 GOLXNESZZPUPJE-UHFFFAOYSA-N 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
A lead-free alloy solder containing rare-earth elements and multiple other elements for electronic package contains Ag (0.1-5 wt.%), Cu (0.1-1 wt.%), Bi (0.1-8 wt.%), In (0.1-7.5 wt.%), Sb (0-8 wt.%), the mixture of La and Ce or the mixture of La, Ce and one or both of Pr and Nd (0.01-2 wt.%) and Sn (the balance). It has liquidus temp less than 210 deg.c (even 190 deg.C or lower), less than 15 deg.c for liquidus and solidus temp difference, at least 60 MPa of yield strength, at least 18% of elongation percentage, excellent wetting ability, and high soldering quality.
Description
Technical field
The invention belongs to new material technology field, particularly Electronic Packaging and assembling and soldering lead-free solder alloy are mainly used to substitute the use of Sn-Pb solder in electronics assembling and encapsulation field.This lead-free solder alloy can satisfy in the electronic industry requirement to the high-performance solder.
Background technology
At present, Sn-Pb alloy (particularly Sn-37Pb), with low cost because of it, good electrical conductivity and good mechanics and brazing property become Electronic Packaging and the topmost braze material of assembling in the present electronic industry.But Pb and contain the hazardous and noxious substances that the Pb thing is the healthy and contaminate environment of harm humans.The Sn-Pb solder is the direct harmful to human of meeting in production and use; In addition, contain the oxidized formation plumbous oxide of solder meeting of Pb in the electronic devices and components waste, the acid-respons in plumbous oxide and hydrochloric acid and the acid rain forms the compound of plumbous acid, atmosphere pollution, soil, underground water, animals and plants etc., final harm humans health.At present, the U.S. and Japan just actively consider the use by making laws and reducing and forbid harmful elements such as lead, and European Union clearly will stop using solder containing lead in 2008 years by legislation.Banning use of solder containing lead in the several years in future in the whole world electronic industry has been trend of the times.Simultaneously, the developing rapidly and continuous advancement in technology of Electronic Packaging and assembling improves constantly the performance requriements of solder.In the soldering tech of little spacing, small brazed joint, the stress that soldering point bears increases, and service condition is more abominable, and this just requires its soldering point to have higher reliability, and traditional Sn-Pb solder creep-resistant property and fatigue property etc. are relatively poor.
The lead-free brazing great majority of research are to be the alloy of base with Sn at present.At first, the fusing point of these lead-free solder alloys is higher or lower than the Sn-Pb eutectic temperature.On the one hand, the production technique of Electronic Packaging and assembling and soldering technology is based on the eutectic temperature of Sn-Pb, promptly 183 ℃ at present.On the other hand, if the soldering processes temperature is too high, the PCB of electronic component and polymer-based carbon is caused damage; If the fusing point of solder is too low, owing to be in the temperature range that creep takes place under the room temperature, creep, tired equivalent damage in use easily take place in brazed joint, influence the reliability that electron device is on active service.Lead-free solder alloy ideal melting temperature scope is 150～210 ℃ or more near 183 ℃; Liquidus line and solidus temperature difference are less, and alloy can solidify after soldering at short notice substantially like this, can reduce the contingent cracking phenomena of brazed joint.Secondly, compare with the wettability of Sn-Pb solder, the wettability on metals such as Cu, Sn, Au, Ni of these lead-free solder alloys is generally relatively poor.Above-mentioned two aspects are the subject matter that must solve before the lead-free brazing practicability.
In order to reduce the fusing point of solder alloy, add alloying elements such as Ag, Cu, Bi among the Sn.For example, U.S. Pat 5527628 report solder alloy 93.6Sn-4.7Ag-4.7Cu have 217 ℃ fusing point, but the fusing point of this invention solder alloy is still higher, fatigue resistance is medium and wettability is poor.U.S. Pat 5520752 report solder alloy (86～97%) Sn-(0.3～4.5%) Ag-(0～9.3%) Bi-(0～5%) are though the Cu fusing point is lower, and wettability is still relatively poor.U.S. Pat 6228322 B1 have reported Sn-Ag, the Sn-Ag-Bi-Cu solder alloy that contains rare earth, and rare earth element is the mixture of Sm or Gd or Sm or the mixture of Gd.Wherein the mixture of Sm comprises Sm and La, Ce, and Pr, at least a among Nd or the Gd, the mixture of Gd comprises Gd and La, Ce, Pr, at least a among Nd or the Sm, find to add the mechanical property that rare earth element has improved solder alloy in this invention, but to alloy melting point and not influence of wettability.U.S. Pat 6176947 B1 report contains the lead-free solder alloy of Sn, Cu, Ag, Bi, In, Sb, though the fusing point of solder alloy can be reduced to below 200 ℃ in this invention, the wettability of this invention solder alloy is not still improved.
Of the present inventionly contain that the no pricker of many alloys of rare earth constituent element Sn base is plumbous expects to contain many alloys constituent elements such as Ag, Cu, Bi, In and Sb in the alloy, and added La and Ce mishmetal or La and Ce mishmetal and add among Pr, the Nd one or both.6228322 B1 compare with U.S. Pat, not only contain Ag, Cu, Bi, and contain element In and Sb, can further reduce fusing point; In addition, the kind of rare earth element is also different, finds to add an amount of rare earth element (0.05～0.5 weight %) in our invention except the mechanical property of improving solder alloy, can also effectively improve the wettability of solder alloy.
The purpose that adds many alloys constituent element Ag, Cu, Bi, In and Sb among the present invention is further to reduce fusing point, utilizes each element disperse or solution strengthening matrix Sn simultaneously.Compare with patent US 6176947 B1, because adding La and Ce mishmetal or La and Ce mishmetal add one or both among Pr, the Nd, the wettability and the mechanical property of solder alloy are improved, particularly wettability among the present invention.The effect of rare earth element is a wettability of obviously improving lead-free solder alloy, improves the mechanical property of weldability, crystal grain thinning, raising solder alloy.
Summary of the invention
The objective of the invention is: a kind of Electronic Packaging and assembling and soldering lead-free solder alloy are provided, and its temperature of fusion is lower, but 190 ℃ of liquidus temperature Da Keda or lower; Liquidus temperature and solidus temperature difference are less in the solder alloy process of setting; Improved the wettability of solder alloy on metals such as Cu, Sn, Au, Ni.
The concrete purpose of the present invention provides the lead-free solder alloy with following character:
1) do not contain poisonous, deleterious element, do not contain Pb, environmental protection.
2) can use in the brazing temperature below 250 ℃, preferably 230 ℃ to 240 ℃ solderings
Temperature is used, and can prevent from brazing process electronic component to be caused damage.
3) on metals such as Cu, Sn, Au, Ni, has good braze ability.
4) between liquidus line and solidus curve, has narrow solidification temperature range.
5) carry out plastic working easily.
Technical scheme of the present invention is: lead-free solder alloy is base with Sn; Reduce the fusing point of solder alloy, the mechanical property of adjustment solder alloy with many alloyings constituent element, wherein Ag, Cu form intermetallic compound disperse distribution, and Bi, In, Sb solid solution or supersaturation are separated out; Further add an amount of La and Ce mishmetal or La and Ce mishmetal and add among Pr, the Nd one or both and improve the wettability of alloy, improve the performance of weldability, crystal grain thinning, raising alloy.
Effect of the present invention and benefit are: do not contain Pb, environmental protection; Many alloys constituent element has reduced the temperature of fusion of solder alloy, and liquidus temperature is lower, can reach 190 ℃ or lower; Poor≤15 of liquidus temperature and solidus temperature ℃; Ag, Cu form intermetallic compound dispersion-strengthened, Bi, In solution strengthening, adjust the mechanical property of alloy; Mixed rare-earth elements effectively improves the wettability of solder alloy, improves weldability, crystal grain thinning, improves the performance of solder alloy.
Embodiment
Below provide optimum implementation of the present invention:
The Sn-Ag-Cu-Bi-In-Sb-RE lead-free brazing that contains rare earth element has following chemical ingredients basically:
0.1 the Ag of～5 weight %;
0.1 the Cu of～1 weight %;
0.1 the Bi of～8 weight %;
0.1 the In of～7.5 weight %;
The Sb of 0～8 weight %;
0.01 the La of～2 weight % and Ce mishmetal or La and Ce
Mishmetal adds one or both among Pr, the Nd;
Surplus is that Sn and unavoidable impurities are formed.
Earlier with mixed rare-earth elements and Sn under 550 ℃ temperature, in vacuum oven, smelt into the alloy that contains 2.5 weight % rare earth elements among the Sn.And then add other alloying element in proportion, and in 550～600 ℃ of following vacuum ovens, smelt, be incubated 1～2 hour.At last, casting can obtain solder alloy.The solder alloy that obtains can be directly used in wave soldering; Solder alloy also can further be made welding wire, soldering paste, solder ball etc. and be used for reflow welding, manual soldering.
The optimum addition of rare earth element is in the scope of 0.05～0.5 weight %, and rare earth element is the most remarkable to the wettability raising effect of lead-free solder alloy in this scope; The adding of excessive rare earth element (1.0 weight %) reduces the wettability of solder alloy.
Embodiment
Below detailed description contains the embodiment of rare earth multicomponent lead-free solder alloy, and compares.
Table 1 is the chemical component table of four kinds of multicomponent lead-free solder alloys.Wherein first three kind lead-free solder alloy contains rare earth element, and in order to contrast, last a kind of lead-free solder alloy does not contain rare earth element.
Table 2 shows liquidus temperature, solidus temperature, tensile strength, yield strength, unit elongation and the relative reduction in area of four kinds of multicomponent lead-free solder alloys.
Associative list 1 and table 2 below are described in detail embodiments of the invention.Earlier with mixed rare-earth elements and Sn under 550 ℃ temperature, in vacuum oven, smelt into the alloy that contains 2.5 weight % rare earth elements among the Sn.The rare earth Sn-Ag-Cu-Bi-In-Sb-RE alloy that contains of three kinds of heterogeneities as shown in table 1 is added other alloying element respectively in proportion, in 550～600 ℃ of following vacuum ovens, smelt, be incubated 1～2 hour; Equally, the solder alloy that does not contain rare earth element is directly smelted.At last, casting can obtain solder alloy.The molten solder alloy is cast into the tension test rod.
Be processed into garden column tension specimen according to standard GB 6397-86, the long 25mm of the gauge length of every tension specimen, diameter 5mm are 5 * 10
-3s
-1Constant strain rate stretch down.The tensile strength of every kind of solder alloy sample, yield strength and plasticity (unit elongation, relative reduction in area) are shown in the table 2.All solder alloys shown in the table 2 have the yield strength of 60MPa and at least 18% unit elongation at least.Adding rare earth element makes the intensity of solder alloy and plasticity that increase be arranged slightly.
The chemical ingredients alloy sequence number alloying constituent (weight %) of four kinds of lead-free solder alloys of table 1
Sn Ag Cu Bi In Sb RE (mixed rare-earth elements) 1# surplus 3.5 0.7 25 0.1 0.42# surpluses 3.5 0.7 4 2.5 0.1 0.43# surpluses 3.5 0.7 45 0.1 0.44# surpluses 3.5 0.7 45 0.1 0
The temperature of fusion of four kinds of lead-free solder alloys of table 2, tensile strength, plasticity and wetting angle alloy sequence number solidus curve liquidus line tensile strength yield strength unit elongation relative reduction in area wetting angle
Temperature temperature σ
bσ
0.2δ ψ θ
(℃) (℃) (Mpa) (Mpa) (％) (％) (°)1# 202.59 207.62 95.5 68.2 31 39 29.52# 203.89 209.02 108.0 68.5 21 26 34.13# 194.56 203.91 111.0 74.0 20 23 32.44# 194.60 204.10 104.5 70.3 18 21 39.6
Table 2 also comprises the temperature of fusion of every kind of solder alloy being determined by differential scanning calorimetric analysis, i.e. solidus temperature and liquidus temperature.All solder alloys shown in the table 2 have 203～209 ℃ or lower liquidus temperature; Liquidus temperature and solidus temperature difference are less than 10 ℃.Add the temperature of fusion not influence of rare earth element to solder alloy.
Table 2 has also provided the wetting angle of solder alloy on the Cu plate, adds rare earth element and obviously reduces the wetting angle of solder alloy on the Cu plate, improves wettability.
The lead-free solder alloy that the present invention is as shown in table 1 is used for wave soldering, and the temperature of molten solder alloy remains on 240 ℃ and carries out soldering; Lead-free solder alloy shown in the table 1 is prepared into powder and is equipped with suitable solder flux, make soldering paste and be used for reflow welding; Solder alloy in the table 1 is made welding wire and is used for manual soldering.Different brazed joints is carried out fail-safe analysis to be shown: the bonding strength height of brazed joint, brazing quality are good.Lead-free solder alloy of the present invention can substitute traditional Sn-Pb alloy and be used for Electronic Packaging and assembling and soldering.
Claims (2)
1, a kind of lead-free alloy solder containing rare-earth and more alloy components is characterized in that having following chemical ingredients:
0.1 the Ag of～5 weight %;
0.1 the Cu of～1 weight %;
0.1 the Bi of～8 weight %;
0.1 the In of～7.5 weight %;
The Sb of 0～8 weight %;
0.01 the La of～2 weight % and Ce mishmetal or La and Ce
Mishmetal adds one or both among Pr, the Nd;
Surplus is Sn.
2, lead-free alloy solder containing rare-earth and more alloy components according to claim 1, it is characterized in that having following chemical ingredients: the La of 0.05～0.5 weight % and Ce mishmetal or La and Ce mishmetal add one or both among Pr, the Nd.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01128184 CN1346728A (en) | 2001-09-19 | 2001-09-19 | Lead-free alloy solder containing rare-earth and more alloy components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01128184 CN1346728A (en) | 2001-09-19 | 2001-09-19 | Lead-free alloy solder containing rare-earth and more alloy components |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1346728A true CN1346728A (en) | 2002-05-01 |
Family
ID=4668066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01128184 Pending CN1346728A (en) | 2001-09-19 | 2001-09-19 | Lead-free alloy solder containing rare-earth and more alloy components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1346728A (en) |
Cited By (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003051572A1 (en) * | 2001-12-15 | 2003-06-26 | Pfarr Stanztechnik Gmbh | Lead-free soft solder |
| CN1314512C (en) * | 2005-01-28 | 2007-05-09 | 于大全 | Leadless solder active alloy additive and leadless alloy solder |
| CN100352596C (en) * | 2005-07-22 | 2007-12-05 | 沈阳工业大学 | Lead-free soft brazing alloy containing mixed rare earth and production thereof |
| DE102006047764A1 (en) * | 2006-10-06 | 2008-04-10 | W.C. Heraeus Gmbh | Lead-free soft solder with improved properties at temperatures> 150 ° C |
| CN100453244C (en) * | 2005-12-16 | 2009-01-21 | 浙江亚通焊材有限公司 | Lead les tin solder |
| CN100464002C (en) * | 2006-07-17 | 2009-02-25 | 戴国水 | No-lead metal spraying material |
| CN101380701B (en) * | 2008-10-31 | 2010-11-03 | 河南科技大学 | High-temperature leadless soft solder and preparation method thereof |
| CN101214591B (en) * | 2008-01-18 | 2010-11-24 | 重庆工学院 | Low silver hypoeutectic Sn-Cu-Ag lead-free solder for electronic micro connection |
| CN101132881B (en) * | 2004-12-01 | 2011-02-09 | 爱尔发加热有限公司 | Solder alloy |
| CN101357423B (en) * | 2005-12-16 | 2011-03-09 | 浙江亚通焊材有限公司 | Lead-free welding material |
| CN103317252A (en) * | 2013-06-03 | 2013-09-25 | 北京科技大学 | Tin-based solder for aluminum/copper brazing and preparing method thereof |
| CN103962744A (en) * | 2009-04-20 | 2014-08-06 | 松下电器产业株式会社 | Soldering material and electronic component assembly |
| CN104870673A (en) * | 2012-12-18 | 2015-08-26 | 千住金属工业株式会社 | Lead-free solder alloy |
| CN105033497A (en) * | 2015-08-07 | 2015-11-11 | 仲恺农业工程学院 | Sn-Ag-Ti-Ce low-temperature active solder |
| CN105195914A (en) * | 2015-10-27 | 2015-12-30 | 广东中实金属有限公司 | Tin-alloy powder for preparing electronic grade silver-bearing high strength lead-free solder paste |
| CN105290636A (en) * | 2015-10-27 | 2016-02-03 | 广东中实金属有限公司 | Tin alloy powder for preparing electronic-grade, low-sliver, high-reliability and lead-free soldering paste |
| CN105290641A (en) * | 2015-11-30 | 2016-02-03 | 苏州龙腾万里化工科技有限公司 | Cleaning-free soldering tin bar |
| CN105397329A (en) * | 2015-12-16 | 2016-03-16 | 仲恺农业工程学院 | Sn-Ag-Cu low-silver lead-free brazing filler metal containing Nd, Re and In |
| WO2016185674A1 (en) * | 2015-05-19 | 2016-11-24 | パナソニックＩｐマネジメント株式会社 | Solder alloy and package structure using same |
| JP2016215277A (en) * | 2015-05-19 | 2016-12-22 | パナソニックＩｐマネジメント株式会社 | Solder alloy and mounting structure using the same |
| CN106475707A (en) * | 2016-12-30 | 2017-03-08 | 江苏科技大学 | Solder for soldering aluminium oxide ceramics and oxygen-free copper and preparation and method for welding |
| CN107073657A (en) * | 2015-03-24 | 2017-08-18 | 哈利玛化成株式会社 | solder alloy, solder paste and electronic circuit substrate |
| CN107635716A (en) * | 2015-05-05 | 2018-01-26 | 铟泰公司 | High-reliability lead-free solder alloy for harsh environment electronic device applications |
| CN108311812A (en) * | 2014-04-02 | 2018-07-24 | 千住金属工业株式会社 | Solder alloy and use its method |
| CN109732237A (en) * | 2019-01-02 | 2019-05-10 | 昆明理工大学 | A kind of SnBiCuAgNiCe low temperature lead-free solder alloy |
| CN109894768A (en) * | 2019-03-29 | 2019-06-18 | 东莞市千岛金属锡品有限公司 | A kind of low temperature leadless alloy solder and preparation method thereof |
| WO2021043437A1 (en) * | 2019-09-02 | 2021-03-11 | Alpha Assembly Solutions Inc. | High temperature ultra-high reliability alloys |
| CN113070606A (en) * | 2021-04-15 | 2021-07-06 | 云南锡业锡材有限公司 | Sn-Ag-Cu high-performance lead-free solder and preparation method thereof |
| US11229979B2 (en) | 2015-05-05 | 2022-01-25 | Indium Corporation | High reliability lead-free solder alloys for harsh environment electronics applications |
| CN114192918A (en) * | 2021-12-31 | 2022-03-18 | 北京工业大学 | Application of SnAgBiIn brazing filler metal in preparation of Sn-based brazing filler metal interconnection welding spots |
| US11285569B2 (en) | 2003-04-25 | 2022-03-29 | Henkel Ag & Co. Kgaa | Soldering material based on Sn Ag and Cu |
| CN114559179A (en) * | 2022-03-31 | 2022-05-31 | 昆明理工大学 | Sn-Ag-Cu low-melting-point lead-free solder and preparation method thereof |
| CN115476069A (en) * | 2022-10-28 | 2022-12-16 | 云南锡业集团（控股）有限责任公司研发中心 | Five-membered or six-membered lead-free tin-based solder with low Ag, high thermal stability and high toughness |
| CN114340835B (en) * | 2019-09-02 | 2024-07-12 | 阿尔法装配解决方案公司 | High temperature ultra high reliability alloy |
-
2001
- 2001-09-19 CN CN 01128184 patent/CN1346728A/en active Pending
Cited By (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003051572A1 (en) * | 2001-12-15 | 2003-06-26 | Pfarr Stanztechnik Gmbh | Lead-free soft solder |
| US11285569B2 (en) | 2003-04-25 | 2022-03-29 | Henkel Ag & Co. Kgaa | Soldering material based on Sn Ag and Cu |
| CN101132881B (en) * | 2004-12-01 | 2011-02-09 | 爱尔发加热有限公司 | Solder alloy |
| CN1314512C (en) * | 2005-01-28 | 2007-05-09 | 于大全 | Leadless solder active alloy additive and leadless alloy solder |
| CN100352596C (en) * | 2005-07-22 | 2007-12-05 | 沈阳工业大学 | Lead-free soft brazing alloy containing mixed rare earth and production thereof |
| CN100453244C (en) * | 2005-12-16 | 2009-01-21 | 浙江亚通焊材有限公司 | Lead les tin solder |
| CN101357423B (en) * | 2005-12-16 | 2011-03-09 | 浙江亚通焊材有限公司 | Lead-free welding material |
| CN100464002C (en) * | 2006-07-17 | 2009-02-25 | 戴国水 | No-lead metal spraying material |
| DE102006047764A1 (en) * | 2006-10-06 | 2008-04-10 | W.C. Heraeus Gmbh | Lead-free soft solder with improved properties at temperatures> 150 ° C |
| JP2010505625A (en) * | 2006-10-06 | 2010-02-25 | ヴェー ツェー ヘレーウス ゲゼルシャフト ミット ベシュレンクテル ハフツング | Lead-free solder with improved properties at high temperatures |
| WO2008043482A1 (en) * | 2006-10-06 | 2008-04-17 | W.C. Heraeus Gmbh | Lead-free soft solder having improved properties at elevated temperatures |
| CN101214591B (en) * | 2008-01-18 | 2010-11-24 | 重庆工学院 | Low silver hypoeutectic Sn-Cu-Ag lead-free solder for electronic micro connection |
| CN101380701B (en) * | 2008-10-31 | 2010-11-03 | 河南科技大学 | High-temperature leadless soft solder and preparation method thereof |
| CN103962744A (en) * | 2009-04-20 | 2014-08-06 | 松下电器产业株式会社 | Soldering material and electronic component assembly |
| CN103962744B (en) * | 2009-04-20 | 2016-05-18 | 松下知识产权经营株式会社 | Soldering tin material and electronic unit conjugant |
| CN104870673B (en) * | 2012-12-18 | 2016-07-06 | 千住金属工业株式会社 | Lead-free solder alloy |
| CN104870673A (en) * | 2012-12-18 | 2015-08-26 | 千住金属工业株式会社 | Lead-free solder alloy |
| CN103317252A (en) * | 2013-06-03 | 2013-09-25 | 北京科技大学 | Tin-based solder for aluminum/copper brazing and preparing method thereof |
| CN103317252B (en) * | 2013-06-03 | 2015-07-22 | 北京科技大学 | Tin-based solder for aluminum/copper brazing and preparing method thereof |
| CN108311812A (en) * | 2014-04-02 | 2018-07-24 | 千住金属工业株式会社 | Solder alloy and use its method |
| CN107073657A (en) * | 2015-03-24 | 2017-08-18 | 哈利玛化成株式会社 | solder alloy, solder paste and electronic circuit substrate |
| US10300562B2 (en) | 2015-03-24 | 2019-05-28 | Harima Chemicals, Incorporated | Solder alloy, solder paste, and electronic circuit board |
| US10213880B2 (en) | 2015-03-24 | 2019-02-26 | Harima Chemicals, Incorporated | Solder alloy, solder paste, and electronic circuit board |
| US11229979B2 (en) | 2015-05-05 | 2022-01-25 | Indium Corporation | High reliability lead-free solder alloys for harsh environment electronics applications |
| CN113146093A (en) * | 2015-05-05 | 2021-07-23 | 铟泰公司 | High reliability lead-free solder alloys for harsh environment electronic device applications |
| US11413709B2 (en) | 2015-05-05 | 2022-08-16 | Indium Corporation | High reliability lead-free solder alloys for harsh environment electronics applications |
| CN107635716A (en) * | 2015-05-05 | 2018-01-26 | 铟泰公司 | High-reliability lead-free solder alloy for harsh environment electronic device applications |
| WO2016185674A1 (en) * | 2015-05-19 | 2016-11-24 | パナソニックＩｐマネジメント株式会社 | Solder alloy and package structure using same |
| JP2016215277A (en) * | 2015-05-19 | 2016-12-22 | パナソニックＩｐマネジメント株式会社 | Solder alloy and mounting structure using the same |
| CN105033497A (en) * | 2015-08-07 | 2015-11-11 | 仲恺农业工程学院 | Sn-Ag-Ti-Ce low-temperature active solder |
| CN105195914A (en) * | 2015-10-27 | 2015-12-30 | 广东中实金属有限公司 | Tin-alloy powder for preparing electronic grade silver-bearing high strength lead-free solder paste |
| CN105290636A (en) * | 2015-10-27 | 2016-02-03 | 广东中实金属有限公司 | Tin alloy powder for preparing electronic-grade, low-sliver, high-reliability and lead-free soldering paste |
| CN105290641A (en) * | 2015-11-30 | 2016-02-03 | 苏州龙腾万里化工科技有限公司 | Cleaning-free soldering tin bar |
| CN105397329A (en) * | 2015-12-16 | 2016-03-16 | 仲恺农业工程学院 | Sn-Ag-Cu low-silver lead-free brazing filler metal containing Nd, Re and In |
| CN105397329B (en) * | 2015-12-16 | 2017-12-05 | 仲恺农业工程学院 | A kind of Sn Ag Cu low silver leadless solders containing Nd, Re, In |
| CN106475707A (en) * | 2016-12-30 | 2017-03-08 | 江苏科技大学 | Solder for soldering aluminium oxide ceramics and oxygen-free copper and preparation and method for welding |
| CN109732237A (en) * | 2019-01-02 | 2019-05-10 | 昆明理工大学 | A kind of SnBiCuAgNiCe low temperature lead-free solder alloy |
| CN109894768A (en) * | 2019-03-29 | 2019-06-18 | 东莞市千岛金属锡品有限公司 | A kind of low temperature leadless alloy solder and preparation method thereof |
| WO2021043437A1 (en) * | 2019-09-02 | 2021-03-11 | Alpha Assembly Solutions Inc. | High temperature ultra-high reliability alloys |
| CN114340835A (en) * | 2019-09-02 | 2022-04-12 | 阿尔法装配解决方案公司 | High-temperature ultrahigh-reliability alloy |
| CN114340835B (en) * | 2019-09-02 | 2024-07-12 | 阿尔法装配解决方案公司 | High temperature ultra high reliability alloy |
| CN113070606A (en) * | 2021-04-15 | 2021-07-06 | 云南锡业锡材有限公司 | Sn-Ag-Cu high-performance lead-free solder and preparation method thereof |
| CN114192918A (en) * | 2021-12-31 | 2022-03-18 | 北京工业大学 | Application of SnAgBiIn brazing filler metal in preparation of Sn-based brazing filler metal interconnection welding spots |
| CN114192918B (en) * | 2021-12-31 | 2023-09-19 | 北京工业大学 | Method for obtaining interconnection welding spot with grain orientation of cross crystal |
| CN114559179A (en) * | 2022-03-31 | 2022-05-31 | 昆明理工大学 | Sn-Ag-Cu low-melting-point lead-free solder and preparation method thereof |
| CN115476069A (en) * | 2022-10-28 | 2022-12-16 | 云南锡业集团（控股）有限责任公司研发中心 | Five-membered or six-membered lead-free tin-based solder with low Ag, high thermal stability and high toughness |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1346728A (en) | Lead-free alloy solder containing rare-earth and more alloy components | |
| Yu et al. | Investigation of interfacial microstructure and wetting property of newly developed Sn–Zn–Cu solders with Cu substrate | |
| EP3449023B1 (en) | High reliability lead-free solder alloy | |
| KR101738007B1 (en) | Lead-free and antimony-free tin solder reliable at high temperatures | |
| KR102045951B1 (en) | High impact toughness solder alloy | |
| CN108971793B (en) | Low-temperature lead-free solder | |
| JP3761678B2 (en) | Tin-containing lead-free solder alloy, cream solder thereof, and manufacturing method thereof | |
| JPH0970687A (en) | Leadless solder alloy | |
| JPH10144718A (en) | Tin group lead free solder wire and ball | |
| CN101348875A (en) | Tin, bismuth and copper type low temperature lead-free solder alloy | |
| CN1861311A (en) | Lead-free antioxidant rare earth-containing SnZn alloy solder and preparation method thereof | |
| CN1390672A (en) | Leadfree SnZn-base alloy solder containing rare-earth elements | |
| KR20220048483A (en) | High-temperature ultra-reliable alloy | |
| CN113714677B (en) | Sn-based brazing filler metal capable of realizing high-strength interconnection of CSP (chip Scale Package) devices | |
| CN112342417B (en) | Tin-based solder and preparation method thereof | |
| KR20230153507A (en) | Lead-free solder compositions | |
| CN1718796A (en) | Low melting point leadless welding flux alloy | |
| CN1840282A (en) | Pb-free solder alloy compositions comprising essentially tin, silver, copper and phosphorus | |
| CN106695161A (en) | Pb-free Sn-Bi alloy solder and preparation method thereof | |
| CN1313631C (en) | Tin silver copper nickel aluminium series leadless welding flux alloy | |
| CN101537547B (en) | Sn-Ag-Cu lead-free solder containing Nd, Ni and Co | |
| CN1788918A (en) | Leadless environment-friendly soldering | |
| CN1239291C (en) | Leadless welding flux with optimum informance and price ratio | |
| CN101564803A (en) | Leadless solder of silverless Sn-Bi-Cu system and preparation method thereof | |
| JP3346848B2 (en) | Lead-free solder alloy |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |