CN1788918A - Leadless environment-friendly soldering - Google Patents
Leadless environment-friendly soldering Download PDFInfo
- Publication number
- CN1788918A CN1788918A CN 200510048208 CN200510048208A CN1788918A CN 1788918 A CN1788918 A CN 1788918A CN 200510048208 CN200510048208 CN 200510048208 CN 200510048208 A CN200510048208 A CN 200510048208A CN 1788918 A CN1788918 A CN 1788918A
- Authority
- CN
- China
- Prior art keywords
- alloy
- content
- soldering
- solder
- environment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The present invention is one kind of no-lead green welding flux and belongs to the field of surface mount technology in microelectronic industry. The welding flux is one kind of alloy comprising Ag 1-2.5 wt%; Cu 0.5-1.0 wt%; and one of a, b, c and d, where a is Sb 0.3-3 wt%, b is Ni 0.05 and Ga 0.01-0.03 wt%, c is Ni 0.01-0.03 wt%, and d is Ni 0.01-0.03 wt% and In 0.04-0.06 wt%; except Sn. The no-lead green welding flux has no harm on human body and environment , low cost, good combination with substrate, excellent wettability, high antioxidant property, high conductivity, good flowability and high welding strength. It may be used in different welding methods, especially fusing wave soldering for soldering electronic elements onto printed circuit board.
Description
Technical field
The invention belongs to microelectronic industry surface-assembled field, relate to a kind of leadless environment-friendly soldering particularly.
Background technology
Traditional welding Sn-Pb alloy mainly adopts Sn-Pb eutectic composition, wherein contains Sn63%, and surplus is Pb.The eutectic temperature of this terne metal is 183 ℃, has good braze ability, solder wettability and low cost, uses widely industrial having obtained.But this scolder not only directly endangers people's health in production, use, even more serious is along with the discarded of a large amount of electron wastes or buries, toxic component lead in the alloy finally causes expendable environmental pollution to natural environment, soil, natural water body and animals and plants biological chain gradually by the aqueous corrosion in the natural environment, dissolving, diffusion and enrichment.
World major industrialized country recognizes these harm gradually at present, and producing and selling and the use home of solder containing pb and electronic product thereof forbidden in legislation respectively.People are spending a large amount of effort, and research and development is used for substituting the lead-free solder of tin-lead solder, and therefore, lead-free solder has been inevitable in microelectronic industry surface installation technique Application for Field.
In the relevant patent of lead-free solder, the patent that the multinomial SnAgCu of relating to alloy series is arranged, present universally recognized SnAgCu series leadless scolder has U.S. Pat 5527628 (February 24 nineteen ninety-five applying date, open day on June 18th, 1996), wherein Ag content is weight ratio 3.5-7.7%; Japan Patent JP05-050286 (in March, 1996 applying date), wherein Ag content is weight ratio 3-5%, above-mentioned two patents, and the Sn-3.9Ag-O.6Cu of European Union's recommendation, the weight percentage of Ag all is not less than 3.0%, not only can cause the cost of alloy higher; Also, have a strong impact on the mechanical property of cored solder and joint, reduce the reliability of joint because of increasing of Ag content wherein; In addition because Ag helps the generation of ELECTROMIGRATION PHENOMENON, so cause the bridge joint short circuit easily.
Summary of the invention
Technical problem to be solved by this invention provides a kind of leadless environment-friendly soldering, human body and environment are not produced harm, Ag content is low, can reduce the cost of alloy, product and substrate are combined, have good wetability, non-oxidizability, electric conductivity, water conservancy diversion and weld strength, the inner pore-free of solder joint.
It is as follows that the present invention will solve the technical scheme that above-mentioned technical problem takes:
A kind of leadless environment-friendly soldering, by an alloy composition, its composition has four kinds of modes: represent with percentage by weight, comprise 1-2.5%Ag, 0.5-1.0%Cu, and comprise a kind of in the represented composition of a, b, c or d, surplus is Sn, wherein
A is 0.3-3%Sb;
B is 0.02-0.05%Ni and 0.01-0.03%Ga;
C is 0.01-0.03%Ni;
D is 0.01-0.03%Ni and 0.04-0.06%In.
As the improvement of a kind of mode of the present invention, the described alloy of being made up of Ag, Cu, Sn, Sb contains 0.4-1%Sb.
As the further improvement of aforesaid way, contain 0.5%Sb in the alloy of forming by Ag, Cu, Sn, Sb.
As the improvement of another kind of mode of the present invention, the described alloy of being made up of Ag, Cu, Sn, Ni, Ga contains 0.03-0.04%Ni and 0.015-0.025%Ga.
As the further improvement of aforesaid way, contain 0.035%Ni and 0.02%Ga in the above-mentioned alloy of forming by Ag, Cu, Sn, Ni, Ga.
As the improvement of the third mode of the present invention, contain 0.015-0.025%Ni in the described alloy of forming by Ag, Cu, Sn, Ni.
As the further improvement of aforesaid way, contain 0.02%Ni in the above-mentioned alloy of forming by Ag, Cu, Sn, Ni.
As the improvement of the 4th kind of mode of the present invention, contain 0.015-0.025%Ni and 0.045-0.055%In in the described alloy of forming by Ag, Cu, Sn, Ni, In.
As the further improvement of aforesaid way, contain 0.02%Ni and 0.05%In in the above-mentioned alloy of forming by Ag, Cu, Sn, Ni, In.
The scolder of above-mentioned composition provided by the present invention because do not contain lead composition, so human body and environment are not produced harm, is a kind of environment-friendly type scolder.It is a base-material with Sn, is added with 1-2.5%Ag and 0.5-1.0%Cu.Wherein the adding of Ag can reach the fusing point that reduces scolder, mechanical property and the creep resistant fatigue behaviour that improves scolder, but addition is less than 0.5%, above-mentioned effect is not obvious, addition surpasses 5%, not only cost of alloy can improve greatly, and can cause the liquidus temperature of solder alloy sharply to raise, thereby fire damage may take place electronic component, Ag content of the present invention is preferably 1-2.5%; The adding of Cu can reduce the fusing point of SnAgCu alloy, also can improve the wetability and the scolder intensity of alloy.Compared with prior art, not only have good mechanical performance, and its composition compares Ag content with the U.S., European Union's patent and obviously reduce, can significantly reduce the cost of material.
In addition, the present invention has more performance in order to make alloy, has also added from a, b, c, d four simultaneously and has selected one altered contents:
A is 0.3-3%Sb.
Add the Sb element, can improve the mechanical strength of alloy, improve the wetability of solder, further reduce fusing point, but and disperse or solution strengthening matrix Sn.But the content of Sb is too low, and its effect is not obvious, and content surpasses and 6% can cause the solder hardening, become fragile, and wetability and spreading ability descend, and easily are corroded.So its content is controlled at 0.3-3%; Be preferably 0.4-1%; The best is 0.5%.
The leadless environment-friendly soldering of being made up of Ag, Cu, Sn, Sb provided by the present invention has good wetting property.
B is 0.02-0.05%Ni and 0.01-0.03%Ga.
Add the Ni element, can improve the intensity of material, help to solve the solder joint bridging, increase the spreading property of solder; Add the Ga element, can improve the non-oxidizability of material, and improve spreading property.Two kinds of elements of Ni, Ga cooperate, and can reach good in oxidation resistance, the effect of firm welding.But the content of Ni is too low, can cause the alloy segregation, and the too high meeting of content causes the metal hardening, becomes fragile, is difficult to processing.So the content of Ni is controlled at 0.02-0.05%; Be preferably 0.03-0.04%; The best is 0.035%.And the content of Ga is too low, can make solder joint in conjunction with not firm, and the too high cost that can cause again of content is too high.So the content of Ga is controlled at 0.01-0.03%; Be preferably 0.015-0.025%; The best is 0.02%.
The alloy of being made up of Ag, Cu, Sn, Ni, Ga provided by the present invention can reduce the all-in resistance rate of solder, improves the electric conductivity of alloy.
C is 0.01-0.03%Ni.
Add the Ni element, can improve the intensity of material, and improve weldability, help to solve the solder joint bridging, but the content of Ni is too low, can heat endurance reduce, and content too high (surpassing 5%) can cause viscosity to increase, processing difficulties.So the content of Ni is controlled at 0.01-0.03%; Be preferably 0.015-0.025%; The best is 0.02%.
The alloy of being made up of Ag, Cu, Sn, Ni provided by the present invention can improve the spreading property of solder, and solder is had no adverse effects.
D is 0.01-0.03%Ni and 0.04-0.06%In.
Add Ni, In element, can improve the intensity of material, increase the shearing strength of solder; Adding In element can also further reduce fusing point but the content of Ni is too low, heat endurance is reduced, and the too high meeting of content causes the viscosity increase, is difficult to processing.So the content of Ni is controlled at 0.01-0.03%; Be preferably 0.015-0.025%; The best is 0.02%.And the content of In is too low, can cause fusing point to raise, and the too high meeting of content causes material cost to improve, and In very easily oxidation takes place and forms oxide in addition, can overslaugh weld at the melting solder near surface, causes sealing-off.So the content of In is controlled at 0.04-0.06%; Be preferably and 0.045-0.055%; The best is 0.05%.
The alloy of being made up of Ag, Cu, Sn, Ni, In provided by the present invention can improve the shearing strength of solder.
Above-mentioned leadless environment-friendly soldering provided by the present invention can have different profiles and form, including, but not limited to: bar, discoid, metal wire, packing ring, ribbon, spherolite, ball and other shape and powder.
Leadless environment-friendly soldering of the present invention can be applicable to different welding methods, especially is applicable to the flow brazing that comprises molten wave soldering, soaks soldering and use scolder molten bath, more is specially adapted to the molten wave soldering at the printed substrate soldering of electronic components.
The present invention is further described below in conjunction with specific embodiment.
The specific embodiment
| Embodiment | Component (Wt%) | ||||||
| Sn | Ag | Cu | Sb | In | Ni | Ga | |
| Embodiment 1 | Surplus | 1 | 0.8 | 0.3 | |||
| Embodiment 2 | Surplus | 1.8 | 1 | 3 | |||
| Embodiment 3 | Surplus | 2.5 | 0.5 | 0.5 | |||
| Embodiment 4 | Surplus | 2.5 | 1 | 0.05 | 0.01 | ||
| Embodiment 5 | Surplus | 1.9 | 0.5 | 0.02 | 0.03 | ||
| Embodiment 6 | Surplus | 1 | 0.7 | 0.035 | 0.02 | ||
| Embodiment 7 | Surplus | 2.1 | 0.5 | 0.03 | |||
| Embodiment | Component (Wt%) | ||||||
| Sn | Ag | Cu | Sb | In | Ni | Ga | |
| Embodiment 8 | Surplus | 1 | 0.6 | 0.02 | |||
| Embodiment 9 | Surplus | 2.5 | 1 | 0.01 | |||
| Embodiment 10 | Surplus | 1 | 1 | 0.05 | 0.02 | ||
| Embodiment 11 | Surplus | 1.6 | 0.5 | 0.06 | 0.01 | ||
| Embodiment 12 | Surplus | 2.5 | 0.65 | 0.04 | 0.03 | ||
Claims (9)
1, a kind of leadless environment-friendly soldering is characterized in that: it is by an alloy composition, and this alloy is represented with percentage by weight, comprises 1-2.5%Ag, 0.5-1.0%Cu, and comprise a kind of in the represented composition of a, b, c or d, surplus is Sn, wherein
A is 0.3-3%Sb;
B is 0.02-0.05%Ni and 0.01-0.03%Ga;
C is 0.01-0.03%Ni;
D is 0.01--0.03%Ni and 0.04--0.06%In.
2, leadless environment-friendly soldering according to claim 1 is characterized in that: described alloy is made up of Ag, Cu, Sn, Sb, wherein contains 0.4-1%Sb.
3, leadless environment-friendly soldering according to claim 2 is characterized in that: wherein contain 0.5%Sb.
4, leadless environment-friendly soldering according to claim 1 is characterized in that: described alloy is made up of Ag, Cu, Sn, Ni, Ga, wherein contains 0.03-0.04%Ni and 0.015-0.025%Ga.
5, leadless environment-friendly soldering according to claim 4 is characterized in that: wherein contain 0.035%Ni and 0.02%Ga.
6 leadless environment-friendly solderings according to claim 1 is characterized in that: described alloy is made up of Ag, Cu, Sn, Ni, wherein contains 0.015--0.025%Ni.
7, leadless environment-friendly soldering according to claim 6 is characterized in that: wherein contain 0.02%Ni.
8 leadless environment-friendly solderings according to claim 1 is characterized in that: described alloy is made up of Ag, Cu, Sn, Ni, In, wherein contains 0.015--0.025%Ni and 0.045--0.055%In.
9, leadless environment-friendly soldering according to claim 8 is characterized in that: wherein contain 0.02%Ni and 0.05%In.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510048208 CN1788918A (en) | 2005-12-20 | 2005-12-20 | Leadless environment-friendly soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510048208 CN1788918A (en) | 2005-12-20 | 2005-12-20 | Leadless environment-friendly soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1788918A true CN1788918A (en) | 2006-06-21 |
Family
ID=36787136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510048208 Pending CN1788918A (en) | 2005-12-20 | 2005-12-20 | Leadless environment-friendly soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1788918A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103402694A (en) * | 2012-05-10 | 2013-11-20 | 千住金属工业株式会社 | Solder alloy for acoustic device |
| CN103476541A (en) * | 2011-04-15 | 2013-12-25 | 日本斯倍利亚社股份有限公司 | Lead-free solder alloy |
| CN108941969A (en) * | 2018-07-20 | 2018-12-07 | 广东中实金属有限公司 | A kind of lead-free solder and preparation method thereof suitable for varistor |
| CN110461534A (en) * | 2017-04-07 | 2019-11-15 | 株式会社京浜 | Solder |
| CN114161023A (en) * | 2014-04-30 | 2022-03-11 | 日本斯倍利亚股份有限公司 | Lead-free solder alloy |
-
2005
- 2005-12-20 CN CN 200510048208 patent/CN1788918A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103476541A (en) * | 2011-04-15 | 2013-12-25 | 日本斯倍利亚社股份有限公司 | Lead-free solder alloy |
| US9339893B2 (en) | 2011-04-15 | 2016-05-17 | Nihon Superior Co., Ltd. | Lead-free solder alloy |
| CN103402694A (en) * | 2012-05-10 | 2013-11-20 | 千住金属工业株式会社 | Solder alloy for acoustic device |
| CN103402694B (en) * | 2012-05-10 | 2015-03-25 | 千住金属工业株式会社 | Solder alloy for acoustic device |
| CN114161023A (en) * | 2014-04-30 | 2022-03-11 | 日本斯倍利亚股份有限公司 | Lead-free solder alloy |
| CN110461534A (en) * | 2017-04-07 | 2019-11-15 | 株式会社京浜 | Solder |
| CN108941969A (en) * | 2018-07-20 | 2018-12-07 | 广东中实金属有限公司 | A kind of lead-free solder and preparation method thereof suitable for varistor |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20180290244A1 (en) | High Impact Solder Toughness Alloy | |
| JP4225165B2 (en) | Lead-free solder alloy | |
| CN1390672A (en) | Leadfree SnZn-base alloy solder containing rare-earth elements | |
| CN100462183C (en) | Lead-free anti-oxidation rare-earth-contg. type SnZn alloy welding flux, and its prepn. method | |
| CN1346728A (en) | Lead-free alloy solder containing rare-earth and more alloy components | |
| CN101348875A (en) | Tin, bismuth and copper type low temperature lead-free solder alloy | |
| CN103737195B (en) | The application of Sn-Zn-Bi base leadless solder alloy in aluminum bronze solder | |
| CN113714677B (en) | Sn-based brazing filler metal capable of realizing high-strength interconnection of CSP (chip Scale Package) devices | |
| CN1788918A (en) | Leadless environment-friendly soldering | |
| CN102085604A (en) | Sn-Ag-Cu-Bi-Cr low-silver and lead-free solder | |
| CN101585119A (en) | Oxidation resistant lead-free solder alloy in low silver | |
| CN1840282A (en) | Pb-free solder alloy compositions comprising essentially tin, silver, copper and phosphorus | |
| CN101927410A (en) | Sn-Ag-Zn-Bi-Cr lead-free solder | |
| CN1203960C (en) | Oxidation-inhibited lead-free welding materials | |
| CN1293985C (en) | Oxidation resistant stannum-cuprum eutectic alloy leadless solder | |
| CN1239290C (en) | Leadless soft brazing alloy for wave crest soldering | |
| CN103934590A (en) | ZnAlMgIn high temperature lead-free solder | |
| CN101537547B (en) | Sn-Ag-Cu lead-free solder containing Nd, Ni and Co | |
| CN1317101C (en) | Tin and silver co-crystal solder without lead against oxidation | |
| CN1718354A (en) | Sn-Ag-Cu-Cr alloy leadless parent metal | |
| CN1718797A (en) | Tin silver copper nickel aluminium series leadless welding flux alloy | |
| CN102430872A (en) | Sn-Cu-Bi-Ni Pb-free solder | |
| CN1562553A (en) | Tin-zinc-copper solder with no lead | |
| CN1803376A (en) | Leadless soft soldering material | |
| CN1586793A (en) | SnZn series lead-free welding flux |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20060621 |