CN102430872A - Sn-Cu-Bi-Ni Pb-free solder - Google Patents
Sn-Cu-Bi-Ni Pb-free solder Download PDFInfo
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- CN102430872A CN102430872A CN2011103146336A CN201110314633A CN102430872A CN 102430872 A CN102430872 A CN 102430872A CN 2011103146336 A CN2011103146336 A CN 2011103146336A CN 201110314633 A CN201110314633 A CN 201110314633A CN 102430872 A CN102430872 A CN 102430872A
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Abstract
The invention relates to Sn-Cu-Bi-Ni Pb-free solder, belonging to the technical field of the welding materials and aiming to solve the technical problems by decreasing the melting point and improving the wettability and the mechanical properties of the solder. The Sn-Cu-Bi-Ni Pb-free solder comprises 0.5-0.8% by weight of Cu, 1-3% by weight of Bi and 0.01-0.1% by weight of Ni. The Sn-Cu-Bi-Ni Pb-free solder has low melting point and good wettability and mechanical properties.
Description
Technical field
The present invention relates to the technology of welding material, particularly relate to a kind of technology of Sn-Cu-Bi-Ni lead-free solder.
Background technology
At present, employed scolder mainly is that traditional Sn-Pb (tin is plumbous) is a scolder when microelectronics Packaging and assembling.But when electronic product was dropped as general industry discarded object and house refuse, the Pb in the scolder (lead) composition can be dissolved out intrusion underground water in natural environment, thereby the environment and the mankind are caused great harm.Therefore; Many in recent years countries are numerous and confused formulate or making laws, rules; To limit the use of leaded material; Substituting traditional Sn-Pb (tin is plumbous) with lead-free solder is that solder containing pb has become the irreversible main trend of global field of microelectronic fabrication, actively seeks the vital task that nontoxic new solder also becomes current electron trade.Sn-Cu (tin copper) is that scolder also more and more receives publicity as more potential solder alloy.
In the existing lead-free solder; Sn-Cu (tin copper) is that scolder is compared the most frequently used Sn-Ag-Cu (SAC) ternary scolder; Have advantage cheaply, and can avoid compound generation between the inner strip metal of scolder, but because its fusing point is too high, wetability is relatively poor; And mechanical property is lower, thereby its application is restricted.
Summary of the invention
To the defective that exists in the above-mentioned prior art, it is low that technical problem to be solved by this invention provides a kind of fusing point, the Sn-Cu-Bi-Ni lead-free solder that wetability and mechanical property are good.
In order to solve the problems of the technologies described above; A kind of Sn-Cu-Bi-Ni lead-free solder provided by the present invention; Said scolder includes Sn and Cu, it is characterized in that: said scolder also includes Bi and Ni, and wherein to account for the percentage by weight of scolder be 0.5～0.8% to Cu; The percentage by weight that Bi accounts for scolder is 1～3%, and the percentage by weight that Ni accounts for scolder is 0.01～0.1%.
Further, to account for the percentage by weight of scolder be 1.5～2% to Bi.
Further, to account for the percentage by weight of scolder be 0.03～0.05% to Ni.
Further, said scolder also includes helper component, and said helper component is Cr and/or Al, and the percentage by weight that its total amount accounts for scolder is no more than 0.5%.
Sn-Cu-Bi-Ni lead-free solder provided by the invention has added an amount of Bi and Ni in the Sn-Cu solder hierarchy, add the wetability that Bi can improve scolder; Reduce the fusing point of scolder, strengthen the mechanical property of scolder simultaneously, add Ni and can make the inferior surface of scolder form the barrier layer; Make the antioxygenic property of scolder obviously improve, thereby improve the wetability of scolder, and the obvious refinement scolder tissue of Ni; Can improve the scolder mechanical property; The adding of Ni can also suppress solder interface IMC growth in addition, improves the scolder reliability, and Ni can also reduce scolder to stainless corrosion.
The specific embodiment
Below in conjunction with specific embodiment technical scheme of the present invention is described in further detail.
A kind of Sn-Cu-Bi-Ni lead-free solder that the embodiment of the invention provided; Said scolder includes Sn (tin) and Cu (copper); It is characterized in that: said scolder also includes Bi (bismuth) and Ni (nickel); Wherein to account for the percentage by weight of scolder be 0.5～0.8% to Cu (copper), and the percentage by weight that Bi (bismuth) accounts for scolder is 1～3%, and the percentage by weight that Ni (nickel) accounts for scolder is 0.01～0.1%; In the Sn-Cu solder hierarchy, add Bi (bismuth) and can improve the wetability of scolder, and can reduce the fusing point of scolder, strengthened the mechanical property of scolder; Adding Ni (nickel) can make the inferior surface of scolder form the barrier layer; Make the antioxygenic property of scolder obviously improve, thereby improve the wetability of scolder, and the obvious refinement scolder tissue of Ni (nickel); Can improve the scolder mechanical property; The adding of Ni (nickel) can also suppress solder interface IMC growth in addition, improves the scolder reliability, and Ni (nickel) can also reduce scolder to stainless corrosion.
The optimal case of the embodiment of the invention does; The percentage by weight that Bi (bismuth) accounts for scolder is 1.5～2%; The percentage by weight that Ni (nickel) accounts for scolder is 0.03～0.05%; Can produce solute segregation if Bi (bismuth) accounts for the percentage by weight of scolder above 3%, make scolder ductility descend and the melting range increase.
In the embodiment of the invention, said scolder also includes the helper component that is used to improve its intensity and wetability, and said helper component is Cr (chromium) and/or Al (aluminium), and the percentage by weight that its total amount accounts for scolder is no more than 0.5%.
The preparation method of the embodiment of the invention is following:
1) use the intermediate frequency electromagnetic oven to prepare Sn (tin)-Ni (nickel) intermediate alloy down at 1200 ℃ temperature environment and inert atmosphere;
2) use batch-type furnace under 600 ℃ temperature environment and air atmosphere, in the prepared Sn of step 1 (tin)-Ni (nickel) intermediate alloy, add Cu (copper), Bi (bismuth) and helper component, finished product is processed in melting.
In the scolder of first embodiment of the invention, the percentage by weight that Cu (copper) accounts for scolder is 0.7%, and the percentage by weight that Bi (bismuth) accounts for scolder is 1%; The percentage by weight that Ni (nickel) accounts for scolder is 0.05%, and the scolder of first embodiment of the invention is compared existing SnCu (tin copper) scolder through measuring; Its fusing point descends 2 ℃, and its tensile strength improves more than 10%, and its wetability improves more than 20%; Under 150 ℃ the temperature environment through 16 days aging after; Welding point interface IMC thickness is compared existing SnCu (tin copper) scolder and is reduced by 2 μ m, stainless corrosion is also obviously reduced, in said existing SnCu (tin copper) scolder; The percentage by weight that Cu (copper) accounts for scolder is 0.7%, and surplus is Sn (tin).
In the scolder of second embodiment of the invention, the percentage by weight that Cu (copper) accounts for scolder is 0.7%, and the percentage by weight that Bi (bismuth) accounts for scolder is 3%; The percentage by weight that Ni (nickel) accounts for scolder is 0.05%, and the scolder of second embodiment of the invention is compared existing SnCu (tin copper) scolder through measuring; Its fusing point descends 5 ℃, and its tensile strength improves more than 20%, and its wetability improves more than 30%; Under 150 ℃ the temperature environment through 16 days aging after; Welding point interface IMC thickness is compared existing SnCu (tin copper) scolder and is reduced by 2 μ m, stainless corrosion is also obviously reduced, in said existing SnCu (tin copper) scolder; The percentage by weight that Cu (copper) accounts for scolder is 0.7%, and surplus is Sn (tin).
The scolder that the embodiment of the invention provides can be used in a lot of fields; As make welding rod, welding wire, weld tabs, soldered ball, welding powder, soldering paste etc., these products can be used in each welding link of Electronic Packaging or assembling, form electrode salient point (Bump), chip attach like serigraphy on the Electronic Packaging chips; BGA, CSP soldered ball; SMT such as Reflow Soldering, wave-soldering assembling, various used for electronic packaging substrates, printed circuit board solder joint form, and various repairing welding, manual welding etc.
Claims (4)
1. Sn-Cu-Bi-Ni lead-free solder; Said scolder includes Sn and Cu; It is characterized in that: said scolder also includes Bi and Ni; Wherein to account for the percentage by weight of scolder be 0.5～0.8% to Cu, and the percentage by weight that Bi accounts for scolder is 1～3%, and the percentage by weight that Ni accounts for scolder is 0.01～0.1%.
2. scolder according to claim 1 is characterized in that: the percentage by weight that Bi accounts for scolder is 1.5～2%.
3. scolder according to claim 1 is characterized in that: the percentage by weight that Ni accounts for scolder is 0.03～0.05%.
4. scolder according to claim 1 is characterized in that: said scolder also includes helper component, and said helper component is Cr and/or Al, and the percentage by weight that its total amount accounts for scolder is no more than 0.5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103146336A CN102430872A (en) | 2011-10-17 | 2011-10-17 | Sn-Cu-Bi-Ni Pb-free solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103146336A CN102430872A (en) | 2011-10-17 | 2011-10-17 | Sn-Cu-Bi-Ni Pb-free solder |
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| Publication Number | Publication Date |
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| CN102430872A true CN102430872A (en) | 2012-05-02 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011103146336A Pending CN102430872A (en) | 2011-10-17 | 2011-10-17 | Sn-Cu-Bi-Ni Pb-free solder |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104395035A (en) * | 2013-05-29 | 2015-03-04 | 新日铁住金高新材料株式会社 | Solder ball and electronic member |
| CN105290652A (en) * | 2015-11-30 | 2016-02-03 | 苏州龙腾万里化工科技有限公司 | Preparation method of silver-added soldering tin |
| CN108326465A (en) * | 2012-11-12 | 2018-07-27 | 恒硕科技股份有限公司 | High-strength silver-free and lead-free soldering tin |
| CN111085798A (en) * | 2019-12-30 | 2020-05-01 | 云南锡业锡材有限公司 | High-reliability silver-free tin-based solder and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1974110A (en) * | 2006-12-12 | 2007-06-06 | 黄德欢 | Multicomponent no-lead soldering tin |
| CN101208174A (en) * | 2005-06-03 | 2008-06-25 | 千住金属工业株式会社 | Lead-free solder alloy |
| CN101569965A (en) * | 2007-05-25 | 2009-11-04 | 韩国生产技术研究院 | Quaternary Pb-free solder composition incorporating Sn-Ag-Cu-In |
| CN102085604A (en) * | 2011-03-04 | 2011-06-08 | 上海交通大学 | Sn-Ag-Cu-Bi-Cr low-silver and lead-free solder |
-
2011
- 2011-10-17 CN CN2011103146336A patent/CN102430872A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101208174A (en) * | 2005-06-03 | 2008-06-25 | 千住金属工业株式会社 | Lead-free solder alloy |
| CN1974110A (en) * | 2006-12-12 | 2007-06-06 | 黄德欢 | Multicomponent no-lead soldering tin |
| CN101569965A (en) * | 2007-05-25 | 2009-11-04 | 韩国生产技术研究院 | Quaternary Pb-free solder composition incorporating Sn-Ag-Cu-In |
| CN102085604A (en) * | 2011-03-04 | 2011-06-08 | 上海交通大学 | Sn-Ag-Cu-Bi-Cr low-silver and lead-free solder |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108326465A (en) * | 2012-11-12 | 2018-07-27 | 恒硕科技股份有限公司 | High-strength silver-free and lead-free soldering tin |
| CN104395035A (en) * | 2013-05-29 | 2015-03-04 | 新日铁住金高新材料株式会社 | Solder ball and electronic member |
| CN104395035B (en) * | 2013-05-29 | 2017-10-20 | 新日铁住金高新材料株式会社 | Solder ball and electronic component |
| CN105290652A (en) * | 2015-11-30 | 2016-02-03 | 苏州龙腾万里化工科技有限公司 | Preparation method of silver-added soldering tin |
| CN111085798A (en) * | 2019-12-30 | 2020-05-01 | 云南锡业锡材有限公司 | High-reliability silver-free tin-based solder and preparation method thereof |
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Application publication date: 20120502 |