CN102371439A - Sn-Cu-Bi-Cr lead-free solder - Google Patents
Sn-Cu-Bi-Cr lead-free solder Download PDFInfo
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- CN102371439A CN102371439A CN2011103146317A CN201110314631A CN102371439A CN 102371439 A CN102371439 A CN 102371439A CN 2011103146317 A CN2011103146317 A CN 2011103146317A CN 201110314631 A CN201110314631 A CN 201110314631A CN 102371439 A CN102371439 A CN 102371439A
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Abstract
The invention provides Sn-Cu-Bi-Cr lead-free solder, relating to the technical field of soldering materials and aiming to solve the technical problems of reducing the melting point and improving the wettability and mechanical property. The solder comprises Sn, Cu, Bi and Cr, wherein Cu accounts for 0.5-0.8% of the solder by weight; Bi accounts for 1-3% of the solder by weight; and Cr accounts for 0.01-0.1% of the solder by weight. The solder provided by the invention has low melting point and good wettability and mechanical property.
Description
Technical field
The present invention relates to the technology of welding material, particularly relate to a kind of technology of Sn-Cu-Bi-Cr lead-free solder.
Background technology
At present, employed scolder mainly is that traditional Sn-Pb (tin is plumbous) is a scolder when microelectronics Packaging and assembling.But when electronic product was dropped as general industry discarded object and house refuse, the Pb in the scolder (lead) composition can be dissolved out intrusion underground water in natural environment, thereby the environment and the mankind are caused great harm.Therefore; Many in recent years countries are numerous and confused formulate or making laws, rules; To limit the use of leaded material; Substituting traditional Sn-Pb (tin is plumbous) with lead-free solder is that solder containing pb has become the irreversible main trend of global field of microelectronic fabrication, actively seeks the vital task that nontoxic new solder also becomes current electron trade.Sn-Cu (tin copper) is that scolder also more and more receives publicity as more potential solder alloy.
In the existing lead-free solder; Sn-Cu (tin copper) is that scolder is compared the most frequently used Sn-Ag-Cu (SAC) ternary scolder; Have advantage cheaply, and can avoid compound generation between the inner strip metal of scolder, but because its fusing point is too high, wetability is relatively poor; And mechanical property is lower, thereby its application is restricted.
Summary of the invention
To the defective that exists in the above-mentioned prior art, it is low that technical problem to be solved by this invention provides a kind of fusing point, the Sn-Cu-Bi-Cr lead-free solder that wetability and mechanical property are good.
In order to solve the problems of the technologies described above; A kind of Sn-Cu-Bi-Cr lead-free solder provided by the present invention; Said scolder includes Sn and Cu, it is characterized in that: said scolder also includes Bi and Cr, and wherein to account for the percentage by weight of scolder be 0.5～0.8% to Cu; The percentage by weight that Bi accounts for scolder is 1～3%, and the percentage by weight that Cr accounts for scolder is 0.01～0.1%.
Further, to account for the percentage by weight of scolder be 1.5～2% to Bi.
Further, to account for the percentage by weight of scolder be 0.03～0.05% to Cr.
Further, said scolder also includes helper component, and said helper component is Ni and/or Al, and the percentage by weight that its total amount accounts for scolder is no more than 0.5%.
Sn-Cu-Bi-Cr lead-free solder provided by the invention has added an amount of Bi and Cr in the Sn-Cu solder hierarchy, add the wetability that Bi can improve scolder; Reduce the fusing point of scolder, strengthen the mechanical property of scolder simultaneously, add Cr and can make the inferior surface of scolder form the barrier layer; Make the antioxygenic property of scolder obviously improve, thereby improve the wetability of scolder, and the obvious refinement scolder tissue of Cr; Can improve the scolder mechanical property; The adding of Cr can also suppress solder interface IMC growth in addition, improves the scolder reliability, and Cr can also reduce scolder to stainless corrosion.
The specific embodiment
Below in conjunction with specific embodiment technical scheme of the present invention is described in further detail.
A kind of Sn-Cu-Bi-Cr lead-free solder that the embodiment of the invention provided; Said scolder includes Sn (tin) and Cu (copper); It is characterized in that: said scolder also includes Bi (bismuth) and Cr (chromium); Wherein to account for the percentage by weight of scolder be 0.5～0.8% to Cu (copper), and the percentage by weight that Bi (bismuth) accounts for scolder is 1～3%, and the percentage by weight that Cr (chromium) accounts for scolder is 0.01～0.1%; In the Sn-Cu solder hierarchy, add Bi (bismuth) and can improve the wetability of scolder, and can reduce the fusing point of scolder, strengthened the mechanical property of scolder; Adding Cr (chromium) can make the inferior surface of scolder form the barrier layer; Make the antioxygenic property of scolder obviously improve, thereby improve the wetability of scolder, and the obvious refinement scolder tissue of Cr (chromium); Can improve the scolder mechanical property; The adding of Cr (chromium) can also suppress solder interface IMC growth in addition, improves the scolder reliability, and Cr (chromium) can also reduce scolder to stainless corrosion.
The optimal case of the embodiment of the invention does; The percentage by weight that Bi (bismuth) accounts for scolder is 1.5～2%; The percentage by weight that Cr (chromium) accounts for scolder is 0.03～0.05%; Can produce solute segregation if Bi (bismuth) accounts for the percentage by weight of scolder above 3%, make scolder ductility descend and the melting range increase.
In the embodiment of the invention, said scolder also includes the helper component that is used to improve its intensity and wetability, and said helper component is Ni (nickel) and/or Al (aluminium), and the percentage by weight that its total amount accounts for scolder is no more than 0.5%.
The preparation method of the embodiment of the invention is following:
1) use the intermediate frequency electromagnetic oven to prepare Sn (tin)-Cr (aluminium) intermediate alloy down at 1200 ℃ temperature environment and inert atmosphere;
2) use batch-type furnace under 600 ℃ temperature environment and air atmosphere, in the prepared Sn of step 1 (tin)-Cr (aluminium) intermediate alloy, add Cu (copper), Bi (bismuth) and helper component, finished product is processed in melting.
In the scolder of first embodiment of the invention, the percentage by weight that Cu (copper) accounts for scolder is 0.7%, and the percentage by weight that Bi (bismuth) accounts for scolder is 1%; The percentage by weight that Cr (chromium) accounts for scolder is 0.05%, and the scolder of first embodiment of the invention is compared existing SnCu (tin copper) scolder through measuring; Its fusing point descends 2 ℃, and its tensile strength improves more than 10%, and its wetability improves more than 20%; Under 150 ℃ the temperature environment through 16 days aging after; Welding point interface IMC thickness is compared existing SnCu (tin copper) scolder and is reduced by 3 μ m, stainless corrosion is also obviously reduced, in said existing SnCu (tin copper) scolder; The percentage by weight that Cu (copper) accounts for scolder is 0.7%, and surplus is Sn (tin).
In the scolder of second embodiment of the invention, the percentage by weight that Cu (copper) accounts for scolder is 0.7%, and the percentage by weight that Bi (bismuth) accounts for scolder is 3%; The percentage by weight that Cr (chromium) accounts for scolder is 0.05%, and the scolder of second embodiment of the invention is compared existing SnCu (tin copper) scolder through measuring; Its fusing point descends 5 ℃, and its tensile strength improves more than 20%, and its wetability improves more than 30%; Under 150 ℃ the temperature environment through 16 days aging after; Welding point interface IMC thickness is compared existing SnCu (tin copper) scolder and is reduced by 3 μ m, stainless corrosion is also obviously reduced, in said existing SnCu (tin copper) scolder; The percentage by weight that Cu (copper) accounts for scolder is 0.7%, and surplus is Sn (tin).
The scolder that the embodiment of the invention provides can be used in a lot of fields; As make welding rod, welding wire, weld tabs, soldered ball, welding powder, soldering paste etc., these products can be used in each welding link of Electronic Packaging or assembling, form electrode salient point (Bump), chip attach like serigraphy on the Electronic Packaging chips; BGA, CSP soldered ball; SMT such as Reflow Soldering, wave-soldering assembling, various used for electronic packaging substrates, printed circuit board solder joint form, and various repairing welding, manual welding etc.
Claims (4)
1. Sn-Cu-Bi-Cr lead-free solder; Said scolder includes Sn and Cu; It is characterized in that: said scolder also includes Bi and Cr; Wherein to account for the percentage by weight of scolder be 0.5～0.8% to Cu, and the percentage by weight that Bi accounts for scolder is 1～3%, and the percentage by weight that Cr accounts for scolder is 0.01～0.1%.
2. scolder according to claim 1 is characterized in that: the percentage by weight that Bi accounts for scolder is 1.5～2%.
3. scolder according to claim 1 is characterized in that: the percentage by weight that Cr accounts for scolder is 0.03～0.05%.
4. scolder according to claim 1 is characterized in that: said scolder also includes helper component, and said helper component is Ni and/or Al, and the percentage by weight that its total amount accounts for scolder is no more than 0.5%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103146317A CN102371439A (en) | 2011-10-17 | 2011-10-17 | Sn-Cu-Bi-Cr lead-free solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103146317A CN102371439A (en) | 2011-10-17 | 2011-10-17 | Sn-Cu-Bi-Cr lead-free solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102371439A true CN102371439A (en) | 2012-03-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011103146317A Pending CN102371439A (en) | 2011-10-17 | 2011-10-17 | Sn-Cu-Bi-Cr lead-free solder |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107999994A (en) * | 2017-11-22 | 2018-05-08 | 深圳市福英达工业技术有限公司 | Micrometer/nanometer granule enhancement type composite solder and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1895837A (en) * | 2005-07-12 | 2007-01-17 | 北京有色金属研究总院 | Sn-Cu-Cr lead-free soldering material and its preparation |
| CN1927525A (en) * | 2006-08-11 | 2007-03-14 | 北京有色金属研究总院 | Silver-free tin-bismuth-copper leadless solder and preparation method |
| CN102066042A (en) * | 2008-04-23 | 2011-05-18 | 千住金属工业株式会社 | Lead-free solder |
-
2011
- 2011-10-17 CN CN2011103146317A patent/CN102371439A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1895837A (en) * | 2005-07-12 | 2007-01-17 | 北京有色金属研究总院 | Sn-Cu-Cr lead-free soldering material and its preparation |
| CN1927525A (en) * | 2006-08-11 | 2007-03-14 | 北京有色金属研究总院 | Silver-free tin-bismuth-copper leadless solder and preparation method |
| CN102066042A (en) * | 2008-04-23 | 2011-05-18 | 千住金属工业株式会社 | Lead-free solder |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107999994A (en) * | 2017-11-22 | 2018-05-08 | 深圳市福英达工业技术有限公司 | Micrometer/nanometer granule enhancement type composite solder and preparation method thereof |
| WO2019100445A1 (en) * | 2017-11-22 | 2019-05-31 | 深圳市福英达工业技术有限公司 | Micro/nano particle reinforced composite solder and preparation method therefor |
| CN107999994B (en) * | 2017-11-22 | 2020-10-23 | 深圳市福英达工业技术有限公司 | Micron/nano particle reinforced composite solder and preparation method thereof |
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Application publication date: 20120314 |