CN101690995A - Low-temperature lead-free solder - Google Patents
Low-temperature lead-free solder Download PDFInfo
- Publication number
- CN101690995A CN101690995A CN200910308183A CN200910308183A CN101690995A CN 101690995 A CN101690995 A CN 101690995A CN 200910308183 A CN200910308183 A CN 200910308183A CN 200910308183 A CN200910308183 A CN 200910308183A CN 101690995 A CN101690995 A CN 101690995A
- Authority
- CN
- China
- Prior art keywords
- free solder
- low
- lead
- percent
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
The invention discloses low-temperature lead-free solder, which comprises the following compositions in percentage by weight: 8 to 20 percent of bismuth (Bi), 0.5 to 3 percent of copper (Cu), 0.001 to 3 percent of stibium (Sb), 0.0 to 3 percent of indium (In), 0.0 to 3 percent of argentum (Ag), and the balance of tin. The melting point of obtained low-temperature lead-free solder alloy is between 190 and 210 DEG C, and is reduced by 20-40 DEG C compared with the conventional Sn-Cu series lead-free solder; and the low-temperature lead-free solder has thermal and electrical performance equivalent to those of conventional alloys, and has good wettability and oxidation resistance. Because of the adding of phosphor, the oxidation of the solder alloy during the soldering can be avoided, the formation of chips is inhibited, and the soldering performance is improved. The low temperature lead-free solder can be obtained without changing the traditional production method, so the investment and production cost can be saved.
Description
Technical field
The present invention relates to welding material, be specifically related to a kind of Pb-free solder that is suitable for electronics assembling and encapsulation and electronics, electrical equipment, Communication Equipment, automobile, five metals field brazing solder.
Background technology
In the evolution of scolder (solder), leypewter is being top quality, cheap welding material aspect technology and the cost always, no matter is that the welding quality or the reliability of postwelding can both reach instructions for use.But along with the reinforcement of human environmental consciousness, lead and compound thereof are more and more paid attention to by the mankind to the harm of human body and to the pollution of environment.Environmental Protection Agency (EPA) with lead and compound thereof qualitative be one of the chemical substance of 17 kinds of serious harm human longevities and natural environment, countries in the world on a large scale numerous and confused legislation forbid the use of leaded material.On February 13rd, 2003, European Union issued RoHS (" forbidding using the special harmful substance instruction in electric/electronic device ") and two instructions of WEEE (" The EU Directive on Waste of Electric and Electronic Equipment "), and in formal enforcement on July 1 in 2006.China issues similar rules " electronics and IT products prevention and cure of pollution management method " on February 28th, 2006, should " way " regulation from March 1st, 2007, list in the product that electronics and IT products pollute the keypoint control catalogue and must not contain lead, mercury, cadmium, Cr VI, polymerization bromination benzene (PBB), polymerization bromination biphenyl ether (PBDE) and other poisonous and harmful substance
Along with environmental protection concept deeply and the promulgation of above-mentioned relevant decree, traditional SnPb is that scolder has become the irreversible main trend of global field of microelectronic fabrication with the Pb-free solder replacement.Scolding tin is unleaded to have developed into global environmental requirement, and becomes the basic fundamental door of information electronic industry, and this will produce great impact to industries such as the assembling of conditional electronic part, SMT scolding tin, wave-solderings.
A main difficulty that runs in the unleaded process of solder is: widely used already at present lead-free brazing fusing point and welding procedure temperature drift make many electronic devices and components and material use cost and technical facing the challenge.Present lead-free solder mainly is Sn-Ag (comprising a Sn-Ag-Cu) series, as Sn3.5Ag, Sn3.0Ag0.5Cu, Sn3.8Ag0.7Cu and Sn3.9AgCu etc., though all have favorable mechanical performance and hot property, but it is obvious than the Sn-Pb gap in the copper wettability of the surface, and its disadvantage is that minimum fusing point still has 217 ℃.The Sn-Cu scolder, as Sn0.7Cu, though the low slightly wetability of price is good slightly, its fusing point is higher, reaches 227 ℃.Though the lower lead-free alloy of existing now temperature exists, as SnZn is alloy, its solidus has only about 199 ℃, have favorable mechanical performance and suitable price, very approaching, but the battery corrosion effect of the easily oxidizable of zinc and pad has become its fatal weakness with 183 ℃ of Sn-37Pb.And for example SnBi is an alloy, and its solidus has only about 140 ℃, can't realize production and processing but SnBi is an alloy because of its fragility, and solderability is very poor.
Generally in fact Pb-free solder of Shi Yonging such as Sn-Ag (comprising Sn-Ag-Cu), Sn-Cu scolding tin need just can carry out under 267～277 ℃ of conditions the technology welding.Under so high temperature, near and surpassed the resistance to extreme temperature of the machinery equipment of many electronic devices and components, PCB and production, if will promote heat resistance, just mean that will significantly promote cost removes to seek new substitute.So high welding temperature also can be quickened the oxidation of scolder and mother metal, simultaneously when scolder when higher temperature melts, can quicken the dissolving of parent metal in scolder, form thicker intermetallic compound, finally reduce the reliability of solder joint.
Summary of the invention
Technical problem to be solved by this invention is to overcome the above-mentioned deficiency of prior art and the weldering of lower, the environment amenable low-temperature lead-free of a kind of fusing point is provided, for use in welding to the more sensitive electronic component of temperature, and continue to continue to use old production equipment, reduce expenses.
The present invention solves the problems of the technologies described above the technical scheme that is adopted:
A kind of low-temperature and lead-free tin soldering, the percentage by weight of each component is: bismuth (Bi) 8～20%, copper (Cu) 0.5～3%, antimony (Sb) 0.001～3%, indium (In) 0.0～3%, silver (Ag) 0.0～3%, surplus is a tin.
The present invention selects Bi as the main element that reduces the soldering alloy fusing point, the Sn-Bi eutectic temperature is 139 ℃, eutectic composition is 42Sn58Bi, favourable for stable on heating electronic component welding, keep stability, can use the scaling powder identical substantially with SnPb scolding tin to weld in atmosphere, wetability is good.Weak point is to increase along with the addition of Bi, and it is hard, crisp that scolding tin becomes, and processing characteristics descends significantly, and soldering reliability degenerates, and after Bi content was above 21%, its liquid-solid line interval sharply enlarged, and therefore, must control its addition in suitable atmosphere.
The present invention adds Cu in soldering alloy, can pass through the concentration balance principle, the speed of slowing down Cu diffusion dissolution in solder alloy, thin copper wire such as lead are when welding, the Cu that incorporates the soldering alloy from thin copper wire reduces, and its result attenuates with regard to the inhibition thin copper wire and can guarantee mechanical strength.
The present invention adds antimony in soldering alloy, the thinning microstructure structure stops grain growth, and can suppress Cu and spread in solder alloy, improves the processing characteristics of soldering alloy.
The present invention can be chosen in and add an amount of silver in the soldering alloy, can increase the wettability of scolding tin, improves the weld strength of scolding tin and the ductility of solder joint.
The present invention can be chosen in and add an amount of indium in the soldering alloy, but the thinning microstructure structure, and the fusing point of reduction soldering alloy improves wetability, improves the compactness of soldered fitting, improves the antioxygenic property of scolder.
Above-mentioned low-temperature and lead-free tin soldering also can add 0.001～0.1% phosphorus, can improve the oxidation resistance of Pb-free solder.
Compared with prior art, the invention has the advantages that:
The low-temperature and lead-free tin soldering alloy melting point that the present invention obtains is 190～210 ℃, and Sn-Cu series lead-free soldering tin commonly used reduces by 20～40 ℃, and heat, electric property are suitable with conventional alloys, and wetability and antioxygenic property are good.Compare with 217 ℃ of eutectic temperatures of the 183 ℃ of eutectic temperatures of traditional Sn-Pb and current SnAgCu, the low-temperature and lead-free tin soldering that this patent obtains has had significantly to 183 ℃ of eutectic temperatures to be drawn close.
In the present invention, also, when welding, can prevent the soldering alloy oxidation, suppress the formation of chip, improve welding performance owing to add phosphorus.
The present invention also need not change existing production method and obtain low-temperature and lead-free tin soldering, therefore can reduce investment outlay and production cost
The specific embodiment
Below in conjunction with embodiment the present invention is further described.
Embodiment 1
With pure Bi, pure Cu, pure Sb, pure In, pure P, pure Sn is raw material, disposes 1kg alloy amount by weight percentage, wherein 150gBi, 8gCu, 20gSb, 5gIn, 0.1gP, and all the other are Sn and unavoidable impurities.Alloy material is packed in the vacuum induction melting furnace, and exhaust charges into argon gas then, is warming up to 950 ℃ of beginning meltings, is cast into ingot after dissolving.
The composition of above-mentioned Pb-free solder sample is 15%Bi, 0.8%Cu, 2%Sb, 0.5%In, 0.01%P, and all the other are unavoidable impurities.
Use differential scanning calorimeter (DSC) to carry out the fusing point test, the melt temperature of this alloy (liquidus point) is 203 ℃.
Embodiment 2
With pure P, pure Sn is raw material, in the tin phosphorus intermediate alloy of 400 ℃ of configuration Sn95P5 in vacuum melting furnace; Dispose 1kg alloy amount by weight percentage, wherein 200gBi, 15gCu, 10gSb, 10gAg, 10gIn, 4gSnP alloy, all the other are Sn and unavoidable impurities.Water on tin after the salt-mixture heat fused with 120g potassium chloride and 100g lithium chloride, heating tin also is warming up to 300～400, the intermediate alloy Sn-Sn-P of tin and Ag, Sb, In, Bi, Cu are joined in the tin liquor of fusion, constantly stir simultaneously, insulation, come out of the stove after leaving standstill, solidify the salt-mixture that the surface is removed in the back.
The composition of above-mentioned Pb-free solder sample is Sn20Bi1.5Cu1Sb1In1Ag0.02P.
Use differential scanning calorimeter (DSC) to carry out the fusing point test, the melt temperature of this alloy (liquidus point) is 191 ℃.
Embodiment 3
Pb-free solder alloy is made of by Sn Bi, the Sb of 1% weight, Cu, the P of 0.001% weight of 0.8% weight, the remainder of 11% weight.
Use differential scanning calorimeter (DSC) to carry out the fusing point test, the melt temperature of this alloy (liquidus point) is 208 ℃.
Embodiment 4
Pb-free solder alloy is made of by Sn Bi, the Sb of 3% weight, Cu, the Ag of 0.3% weight of 3% weight, the remainder of 8% weight.Use differential scanning calorimeter (DSC) to carry out the fusing point test, the melt temperature of this alloy (liquidus point) is 210 ℃.
Claims (2)
1. low-temperature and lead-free tin soldering, it is characterized in that: the percentage by weight of each component is: bismuth (Bi) 8～20%, copper (Cu) 0.5～3%, antimony (Sb) 0.001～3%, indium (In) 0.0～3%, silver (Ag) 0.0～3%, surplus is a tin.
2. low-temperature and lead-free tin soldering according to claim 1 is characterized in that: the phosphorus that also adds 0.001～0.1% weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910308183A CN101690995A (en) | 2009-10-12 | 2009-10-12 | Low-temperature lead-free solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910308183A CN101690995A (en) | 2009-10-12 | 2009-10-12 | Low-temperature lead-free solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101690995A true CN101690995A (en) | 2010-04-07 |
Family
ID=42079737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910308183A Pending CN101690995A (en) | 2009-10-12 | 2009-10-12 | Low-temperature lead-free solder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101690995A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102500948A (en) * | 2011-11-04 | 2012-06-20 | 浙江亚通焊材有限公司 | Lead-free high-temperature soft solder and preparation method thereof |
| CN106216872A (en) * | 2016-08-11 | 2016-12-14 | 北京康普锡威科技有限公司 | A kind of SnBiSb series low-temperature leadless solder and preparation method thereof |
| CN112643241A (en) * | 2020-12-10 | 2021-04-13 | 昆明理工大学 | Sn-Bi-Cu-Ag-Ni-Sb low-temperature high-mechanical-property lead-free solder alloy |
| CN114012303A (en) * | 2021-10-28 | 2022-02-08 | 宁波佳明金属制品有限公司 | Low-temperature solder and preparation method thereof |
| CN115647645A (en) * | 2021-12-14 | 2023-01-31 | 昇贸科技股份有限公司 | Lead-free copper-free tin alloy and solder ball for ball grid array package |
-
2009
- 2009-10-12 CN CN200910308183A patent/CN101690995A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102500948A (en) * | 2011-11-04 | 2012-06-20 | 浙江亚通焊材有限公司 | Lead-free high-temperature soft solder and preparation method thereof |
| CN106216872A (en) * | 2016-08-11 | 2016-12-14 | 北京康普锡威科技有限公司 | A kind of SnBiSb series low-temperature leadless solder and preparation method thereof |
| CN112643241A (en) * | 2020-12-10 | 2021-04-13 | 昆明理工大学 | Sn-Bi-Cu-Ag-Ni-Sb low-temperature high-mechanical-property lead-free solder alloy |
| CN114012303A (en) * | 2021-10-28 | 2022-02-08 | 宁波佳明金属制品有限公司 | Low-temperature solder and preparation method thereof |
| CN115647645A (en) * | 2021-12-14 | 2023-01-31 | 昇贸科技股份有限公司 | Lead-free copper-free tin alloy and solder ball for ball grid array package |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105195915B (en) | Low-temperature lead-free solder alloy | |
| CN100462183C (en) | Lead-free anti-oxidation rare-earth-contg. type SnZn alloy welding flux, and its prepn. method | |
| CN101417375B (en) | Leadless welding alloy for welding electronic elements | |
| CN105215569A (en) | A kind of leadless welding alloy | |
| CN101780607B (en) | Lead-free solder for electronic packaging, assembling and soldering and preparation method thereof | |
| CN101348875A (en) | Tin, bismuth and copper type low temperature lead-free solder alloy | |
| CN101700606B (en) | Sn-Ag-Cu misch metal lead-free solder with low content of Cu and preparation method thereof | |
| CN102699563A (en) | Low-silver lead-free soft solder | |
| CN100453244C (en) | Lead les tin solder | |
| CN101380701B (en) | High-temperature leadless soft solder and preparation method thereof | |
| CN103406686A (en) | Co-included Sn-Bi-based high-strength lead-free low-temperature welding flux | |
| JP2024009991A (en) | Lead-free solder composition | |
| CN102172805B (en) | Low-cost anti-aging brazing filler material used for electronic packaging and preparation method thereof | |
| CN101690995A (en) | Low-temperature lead-free solder | |
| CN101927410B (en) | Sn-Ag-Zn-Bi-Cr lead-free solder | |
| CN108465974A (en) | A kind of low-silver copper-base high-performance solder and preparation method thereof | |
| CN102152022A (en) | Corrosion-resistant Sn-Zn-based lead-free solder with high oxidation resistance | |
| CN101844280A (en) | Tin-bismuth solder with low melting point and preparation method thereof | |
| CN102500946A (en) | Sn-Ag-Cu-Bi-Er low-silver and lead-free welding flux and preparation method for same | |
| CN102642097A (en) | Low-silver lead-free solder alloy | |
| CN1718797A (en) | Tin silver copper nickel aluminium series leadless welding flux alloy | |
| JP2001287082A (en) | Solder | |
| CN102337422B (en) | A kind of high temperature bends down the unleaded application warding off tin alloy of corrode | |
| CN101357421B (en) | Lead-free welding material | |
| CN100593448C (en) | Soft soldering material with no lead |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20100407 |