CN102085604A - Sn-Ag-Cu-Bi-Cr low-silver and lead-free solder - Google Patents
Sn-Ag-Cu-Bi-Cr low-silver and lead-free solder Download PDFInfo
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- CN102085604A CN102085604A CN 201110051691 CN201110051691A CN102085604A CN 102085604 A CN102085604 A CN 102085604A CN 201110051691 CN201110051691 CN 201110051691 CN 201110051691 A CN201110051691 A CN 201110051691A CN 102085604 A CN102085604 A CN 102085604A
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- scolder
- free solder
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- lead
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Abstract
The invention provides a Sn-Ag-Cu-Bi-Cr low-silver and lead-free solder in the technical field of welding materials, which comprises the following components: 0.005-1 wt percent of Cr, 0.5-3 wt percent of Ag, 0-2 wt percent of Cu, 0.5-10 wt percent of Bi and the balance of Sn. Compared with the prior art, the solder cost is reduced, mechanical behaviors, such as the resistance to oxidation, the corrosion resistance, the extensibility, the fatigue durability and the like are improved, and the corrosion to a stainless steel soldering tin groove and the like is remarkably weakened.
Description
Technical field
What the present invention relates to is a kind of scolder of technical field of welding materials, specifically is a kind of Sn-Ag-Cu-Bi-Cr low-silver lead-free solder.
Background technology
Up to the present, the scolder that is used for microelectronics Packaging and assembling in a large number mainly is that traditional Sn-Pb is a scolder.Yet when electronic product, equipment were dropped as general industry discarded object and house refuse, the Pb in natural environment in the scolder became branch to be dissolved out, and invades underground water, thereby the environment and the mankind are caused great harm.Therefore, comprise in recent years many countries of China numerous and confused formulate or making laws, rules, restriction contains the use of Pb material, substituting traditional Sn-Pb with lead-free solder is that solder containing pb has become the irreversible main trend of global field of microelectronic fabrication, actively seeks the vital task that nontoxic new solder also becomes current electron trade.Up to now, the lead-free solder kind of having developed is a lot, but all exists such and such problem, has the also few of actual application value.Wherein, near eutectic composition is Sn-3.5Ag-0.75Cu Sn-Ag-Cu ternary alloy three-partalloy, fusing point is 217 ℃, compare with other lead-free solder, wetability is good, the mechanical strength height, have higher endurance and thermal shock, practical value is bigger, is that current generally acknowledged tool substitutes the lead-free solder of Sn-Pb conventional solder, and might becomes the lead-free solder of standard from now on.
Retrieval through the prior art document finds, existing Sn-Ag-Cu be scolder not only price is more expensive, fusing point is higher; Form thick Ag3Sn intermetallic compound simultaneously easily, cause fragility to increase, plasticity reduces, decrease of fatigue strength; When welding, generate Cu in addition easily with the Cu substrate
6Sn
5Intermetallic compound causes soldering reliability to reduce; Have, Sn-Ag-Cu such as BGA soldered ball are alloy product again, placing or easily oxidation jaundice of surface in corrosive environment, cause welding performance to descend.Also usefulness is serious to equipment corrosions such as stainless steel solder baths when being used for wave-soldering, has to change into expensive titanium or titanium alloy material.Above problem will have a strong impact on the application that this is a scolder as not solving.
Summary of the invention
The present invention is directed to the prior art above shortcomings, a kind of Sn-Ag-Cu-Bi-Cr low-silver lead-free solder is provided, reduced the scolder cost compared to existing technology, simultaneously mechanical performances such as non-oxidizability, corrosion resistance, ductility, fatigue durability improve, and the corrosiveness to stainless steel solder bath etc. obviously weakens simultaneously.
The present invention is achieved by the following technical solutions, and the component of scolder of the present invention comprises: the Cu of the Cr of 0.005-1wt%, the Ag of 0.5-3wt%, 0-2wt%, the Bi of 0.5-10wt%, surplus is Sn.
Described Cr element preferred mass percentage is 0.01-0.8%, more preferably 0.02-0.5%.
Further contain Ni, Ga, In and P in the described scolder, its total amount accounts for the 0-0.5wt% of described scolder.
The present invention is by adding Bi, thereby guaranteeing to reduce under the situation that the scolder fusing point does not improve the cost that Ag content has reduced scolder, but Bi content surpasses at 3% o'clock easily in the segregation of crystal boundary place, causes the decline of mechanical performance.Add the influence of back to the scolder mechanical performance for fear of Bi in addition, the present invention has improved the mechanical performance of scolder by adding Cr.Experiment shows, the adding by Cr not only refinement the microstructure of scolder, can also form the intermetallic compound that disperse distributes simultaneously, therefore improved the mechanical performance of scolder; The affiliation that adds of Cr simultaneously forms the Cr barrier layer between surperficial Sn, Cu oxide layer and base metal, in high temperature or corrosive environment, this barrier layer can stop Sn, Cu to external diffusion, thereby has improved the antioxygenic property and the decay resistance of scolder; The adding of Cr can suppress Ag in the scolder in addition
3Sn and Cu
6Sn
5The growth of intermetallic compound, thus the performance degradation of solder alloy prevented; Have, the Cr existence in the scolder can reduce scolder greatly to containing the dissolution velocity of Cr alloy again, avoids or improves corrosion to stainless steel solder bath material.When Cr content less than 0.005% the time, no dispersion-strengthened action is difficult to form the barrier layer of Cr near solder surface, improve not enough to the chemical property and the mechanical performance of scolder; When content is higher than 1%, easily cause the segregation of composition, this segregation makes the Cr barrier layer inhomogeneous, and sunburner is bigger to the negative effect of wetability and mechanical performance etc.If the content of Cr is when the 0.02-0.5% scope in the control scolder, barrier layer thickness is even, moderate, can produce dispersion-strengthened action, reduces the corrosion to stainless steel etc., do not have tangible segregation phenomena again, make the chemical property of scolder and mechanical performance all be in optimum state.Because the reduction of Ag content can cause the mechanical strength of scolder to descend, Ga that adds among the present invention and In not only can improve the wettability of scolder, can generate CrGa with Cr simultaneously
4, Cr
5Ga
6, CrIn
2Deng intermetallic compound, in alloy, play the effect of dispersion-strengtherning, thereby improve the mechanical strength of scolder.And the adding of Ni not only can suppress Ag
3The growth of Sn intermetallic compound, the plasticity of raising scolder, the while can also be improved the deelectric transferred ability of scolder.The adding of P has improved the antioxygenic property of scolder, thereby has improved the wetability of scolder.Compare the Sn-Ag-Cu scolder, the present invention has not only reduced cost, improves on mechanical performances such as non-oxidizability, corrosion resistance, ductility, fatigue durability simultaneously, and the corrosiveness of stainless steel solder bath etc. is obviously weakened.
Scolder provided by the invention can be used in a lot of fields, as makes welding rod, welding wire, weld tabs, soldered ball, welding powder, soldering paste etc.These products can be used in each welding link of Electronic Packaging or assembling, form electrode salient point (Bump), chip attach as serigraphy on the Electronic Packaging chips, BGA, CSP soldered ball, SMT such as Reflow Soldering, wave-soldering assembling, various used for electronic packaging substrates, printed circuit board solder joint form, and various repairing welding, manual welding etc.In a word, scolder provided by the invention, its application is wide.
The specific embodiment
Below embodiments of the invention are elaborated, present embodiment is being to implement under the prerequisite with the technical solution of the present invention, provided detailed embodiment and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
Embodiment 1
Component of the present invention and mass percent thereof are: Cr=0.1%, and Ag=1%, Cu=0.5%, Bi=3%, surplus is Sn, makes the Sn-1Ag-0.5Cu-3Bi-0.1Cr solder by direct smelting process or substep smelting process.
Various performance measurements show: compare the low silver solder of market Sn-1Ag-0.5Cu (SAC105) commonly used, the fusing point of this scolder descends 2 ℃.Tensile strength improves more than 50%, but that ductility reduces is about 20%, and the ravine wet performance improves 16%.At 85 ℃, humidity be under 85% the etching condition through after the experiment in 24 hours, yellowing phenomenon reduces, and through after 250 ℃ of x25 hour high-temperature oxydations experiments, glossiness is better than the SAC105 scolder; Simultaneously 304 stainless steel corrosions are obviously reduced.Find in the solder joint performance test that in addition this scolder can obviously suppress interface I MC growth, solder interface IMC thickness slightly reduces than SAC105 after backflow.
Embodiment 2
Component of the present invention and mass percent thereof are: Cr=0.3%, and Ag=1%, Cu=0.5%, Bi=3%, surplus is Sn, makes the Sn-1Ag-0.5Cu-3Bi-0.3Cr solder by direct smelting process or substep smelting process.
Various performance measurements show: compare the low silver solder of market Sn-1Ag-0.5Cu (SAC105) commonly used, the fusing point of this scolder descends 2 ℃.Tensile strength improves more than 50%, but that ductility reduces is about 30%, and the ravine wet performance improves 21%.At 85 ℃, humidity be under 85% the etching condition through after the experiment in 24 hours, yellowing phenomenon further reduces, and through after 250 ℃ of x25 hour high-temperature oxydations experiments, glossiness also is better than the SAC105 scolder; Simultaneously 304 stainless steel corrosions are further reduced.Find in the solder joint performance test that in addition this scolder has more obviously suppressed interface I MC growth, reduced by 1 μ m than SAC105 solder interface IMC thickness.
Embodiment 3
Component of the present invention and mass percent thereof are: Cr=0.3%, and Ag=1%, Cu=0.5%, Bi=3%, Ni=0.5%, surplus is Sn, makes the Sn-1Ag-0.5Cu-3Bi-0.3Cr-0.5Ni solder by direct smelting process or substep smelting process.
Compare with embodiment 2, this set of dispense has been than having reduced the segregation of Cr in the scolder by adding Ni, improved percentage elongation under the constant substantially situation of tensile strength, compares SAC105 scolder percentage elongation and descends 15%.Other performances are substantially the same manner as Example 2.
Claims (7)
1. a Sn-Ag-Cu-Bi-Cr low-silver lead-free solder is characterized in that, the component of described scolder comprises: Cr, Ag, Cu, Bi and Sn.
2. Sn-Ag-Cu-Bi-Cr low-silver lead-free solder according to claim 1 is characterized in that, the content of described scolder is: the Cu of the Cr of 0.005-1wt%, the Ag of 0.5-3wt%, 0-2wt%, the Bi of 0.5-10wt%, surplus is Sn.
3. Sn-Ag-Cu-Bi-Cr low-silver lead-free solder according to claim 1 and 2 is characterized in that, the mass percent of described Cr element is 0.01-0.8%.
4. Sn-Ag-Cu-Bi-Cr low-silver lead-free solder according to claim 1 and 2 is characterized in that, the mass percent of described Cr element is 0.02-0.5%.
5. according to the described Sn-Ag-Cu-Bi-Cr low-silver lead-free solder of above-mentioned arbitrary claim, it is characterized in that, contain Ni, Ga, In and P in the described scolder.
6. Sn-Ag-Cu-Bi-Cr low-silver lead-free solder according to claim 5 is characterized in that, the total amount of described Ni, Ga, In and P accounts for the 0-0.5wt% of described scolder.
7. the preparation method according to the described Sn-Ag-Cu-Bi-Cr low-silver lead-free solder of above-mentioned arbitrary claim is characterized in that, makes by direct smelting process or substep smelting process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110051691 CN102085604A (en) | 2011-03-04 | 2011-03-04 | Sn-Ag-Cu-Bi-Cr low-silver and lead-free solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110051691 CN102085604A (en) | 2011-03-04 | 2011-03-04 | Sn-Ag-Cu-Bi-Cr low-silver and lead-free solder |
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| CN102085604A true CN102085604A (en) | 2011-06-08 |
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| CN 201110051691 Pending CN102085604A (en) | 2011-03-04 | 2011-03-04 | Sn-Ag-Cu-Bi-Cr low-silver and lead-free solder |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102371438A (en) * | 2011-10-17 | 2012-03-14 | 上海交通大学 | Sn-Cu-Bi-Al lead-free solder |
| CN102430872A (en) * | 2011-10-17 | 2012-05-02 | 上海交通大学 | Sn-Cu-Bi-Ni Pb-free solder |
| CN103008905A (en) * | 2012-12-13 | 2013-04-03 | 郴州金箭焊料有限公司 | Sn-Ag-Cu-Ce-Bi-Cr lead-free solder |
| CN107931883A (en) * | 2017-11-29 | 2018-04-20 | 广西厚思品牌策划顾问有限公司 | A kind of solder alloy and preparation method thereof |
| CN108044254A (en) * | 2017-12-13 | 2018-05-18 | 柳州智臻智能机械有限公司 | A kind of electronic component welding solder alloy and preparation method thereof |
| CN109732237A (en) * | 2019-01-02 | 2019-05-10 | 昆明理工大学 | A kind of SnBiCuAgNiCe low temperature lead-free solder alloy |
| CN112135918A (en) * | 2018-05-23 | 2020-12-25 | 阿鲁比斯斯托尔伯格股份有限公司 | Copper strip for producing electrical contacts and process for producing copper strip and connector |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1034376A (en) * | 1996-07-26 | 1998-02-10 | Nippon Genma:Kk | Lead-free solder |
| CN1895837A (en) * | 2005-07-12 | 2007-01-17 | 北京有色金属研究总院 | Sn-Cu-Cr lead-free soldering material and its preparation |
| CN1895838A (en) * | 2005-07-12 | 2007-01-17 | 北京有色金属研究总院 | Sn-Ag-Cu-Cr-X lead-free soldering material and its preparation |
| CN101132881A (en) * | 2004-12-01 | 2008-02-27 | 爱尔发加热有限公司 | Solder alloy |
| CN101733576A (en) * | 2009-11-26 | 2010-06-16 | 上海大学 | Sn-Ag-Cu-Bi-Cr quinary alloy lead-free solder |
-
2011
- 2011-03-04 CN CN 201110051691 patent/CN102085604A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1034376A (en) * | 1996-07-26 | 1998-02-10 | Nippon Genma:Kk | Lead-free solder |
| CN101132881A (en) * | 2004-12-01 | 2008-02-27 | 爱尔发加热有限公司 | Solder alloy |
| CN1895837A (en) * | 2005-07-12 | 2007-01-17 | 北京有色金属研究总院 | Sn-Cu-Cr lead-free soldering material and its preparation |
| CN1895838A (en) * | 2005-07-12 | 2007-01-17 | 北京有色金属研究总院 | Sn-Ag-Cu-Cr-X lead-free soldering material and its preparation |
| CN101733576A (en) * | 2009-11-26 | 2010-06-16 | 上海大学 | Sn-Ag-Cu-Bi-Cr quinary alloy lead-free solder |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102371438A (en) * | 2011-10-17 | 2012-03-14 | 上海交通大学 | Sn-Cu-Bi-Al lead-free solder |
| CN102430872A (en) * | 2011-10-17 | 2012-05-02 | 上海交通大学 | Sn-Cu-Bi-Ni Pb-free solder |
| CN103008905A (en) * | 2012-12-13 | 2013-04-03 | 郴州金箭焊料有限公司 | Sn-Ag-Cu-Ce-Bi-Cr lead-free solder |
| CN107931883A (en) * | 2017-11-29 | 2018-04-20 | 广西厚思品牌策划顾问有限公司 | A kind of solder alloy and preparation method thereof |
| CN108044254A (en) * | 2017-12-13 | 2018-05-18 | 柳州智臻智能机械有限公司 | A kind of electronic component welding solder alloy and preparation method thereof |
| CN112135918A (en) * | 2018-05-23 | 2020-12-25 | 阿鲁比斯斯托尔伯格股份有限公司 | Copper strip for producing electrical contacts and process for producing copper strip and connector |
| CN109732237A (en) * | 2019-01-02 | 2019-05-10 | 昆明理工大学 | A kind of SnBiCuAgNiCe low temperature lead-free solder alloy |
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Application publication date: 20110608 |